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Altera

EPF10K250EBC600-2 - FLEX 10KE FPGA 250K Gates 600-BGA | Altera

MPN: EPF10K250EBC600-2 ⚠ Last Time Buy
In Stock Ships in 1-3 business days
3.3 V Vdss LVTTL, LVCMOS, PCI, GTL+, SSTL-2, SSTL-3 Rds(on) 600-ball FineLine BGA Package 40,960 bits Memory
From $392 USD / Unit
MOQ: 1 |
Price updated: 2026-09-11
Volume Pricing
Qty Unit Price Extended
1 $485 $485.00
10 $462 $4,620.00
100 $438 $43,800.00
500 $415 $207,500.00
1,000 $392 $392,000.00
ℹ️ All prices are in USD

EPF10K250EBC600-2 Overview

The Altera (Intel PSG) EPF10K250EBC600-2 is a member of the FLEX 10KE family of SRAM-based, embedded-programmable logic devices, integrating up to 250,000 typical gates with 12,288 logic elements and 4096 flip-flops in a 600-ball FineLine BGA package. It includes 40,960 bits of embedded array memory (EABs), supporting 5ns dual-port RAM in widths up to 16 bits, plus four phase-locked loops (PLLs) and four high-speed clock lock pins.

An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic function is defined by a user-supplied configuration bitstream rather than by the foundry. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) -> complex programmable logic devices (CPLDs) -> FPGAs -> SRAM-based FPGAs -> embedded-block FPGAs. The FLEX 10KE family pioneered the Embedded Array Block (EAB) concept, pairing classical 4-input look-up tables with dedicated SRAM blocks, which made it suitable for both random logic and datapath/memory-intensive functions on the same die.

Key features include 250,000 typical gates (152,000 usable), 12,288 logic elements (LEs), 12,288 dedicated flip-flops, 80 LABs of 8 LEs each, and 4096 EABs (each 2,048 bits, totaling 40,960 bits of RAM). The device operates from a 3.3V core supply and provides 488 user I/O pins via 12 I/O banks, with 5.0V tolerant inputs. Each I/O bank supports selectable I/O standards including LVTTL, LVCMOS, PCI, GTL+, SSTL-2, and SSTL-3, plus hot-socketing capability.

Architecturally, the FLEX 10KE uses a continuous, SRAM-based interconnect fabric with row-and-column FastTrack lines. The four PLLs handle clock multiplication, division, phase shifting, and clock-to-out reduction, enabling clean system-level timing even with multi-MHz reference oscillators. Configuration is supported via passive serial (PS), passive parallel synchronous (PPS), passive parallel asynchronous (PPA), and JTAG modes, with built-in decompression and CRC checking.

Typical applications include telecommunication line cards, industrial control, ASIC prototyping, glue-logic consolidation, and bus-bridging designs. The 600-ball BGA footprint is shared across the FLEX 10K200E and FLEX 10K250E families, so PCB layout reuse is straightforward. Designers should consult the FLEX 10KE Device Family Data Sheet for pin assignments and I/O bank configurations.

When designing with this device, allocate at least 20% of LEs and EABs unused for future ECOs and timing closure margin. Use the Quartus II or MAX+PLUS II development tools for synthesis, place-and-route, and timing analysis - JTAG-based in-system programming is recommended for production to avoid manual device handling.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

Drop-in alternatives for EPF10K250EBC600-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EPF10K250EBC600-2 (same form factor and footprint) — differing in Package, Process Technology, Configuration Method, Embedded Array Blocks (EABs), Speed Grade.

Intel
Process Technology: 0.30 µm CMOS
Configuration Method: JTAG (IEEE 1149.1), EPC2 serial PROM
Compare with EPF10K250EBC600-2 →
Intel
Package: 600-ball FineLine BGA, 45 x 45 mm
Process Technology: 0.22 micrometer SRAM
Speed Grade: -3 (commercial)
Compare with EPF10K250EBC600-2 →
Intel
Package: BGA-600, 45 x 45 mm, 1.27 mm pitch
Configuration Method: JTAG / ByteBlaster (SRAM configuration)
Embedded Array Blocks (EABs): 12 (typical for this density)
Compare with EPF10K250EBC600-2 →
Intel
Package: 600-BGA FineLine BGA
Process Technology: 0.22 µm SRAM
Configuration Method: JTAG / ByteBlaster / EPC-series PROM
Compare with EPF10K250EBC600-2 →
Intel
Process Technology: SRAM-based CMOS
Embedded Array Blocks (EABs): 12 (each 2 Kbits)
Speed Grade: -3
Compare with EPF10K250EBC600-2 →
Intel
Package: 600-ball BGA (HBGA)
Process Technology: 0.22 µm CMOS, 4-layer metal
Configuration Method: SRAM, requires external configuration device (EPC series)
Compare with EPF10K250EBC600-2 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EPF10K250EBC600-1

✅ Drop-In
Intel
📦 600-ball FineLine BGA
Intel / Altera · FLEX 10KE · 12,160 · 250,000 · 110,000 · 6 · 40,960 · 6

✓ In Stock

$155 / Unit

View Datasheet →

EPF10K200EBC600-2

✅ Drop-In
Intel
📦 600-ball FineLine BGA
FLEX-10KE · CMOS (SRAM-based) · 0.30 µm CMOS · 200,000 gates · 9984 · 1248 · 98304 bits (96 Kbits) · 470 pins

✓ In Stock

$198 / Unit

View Datasheet →

EPF10K200EBC600-1

✅ Drop-In
Intel
📦 600-ball FineLine BGA
Field Programmable Gate Array (FPGA) · FLEX-10KE · 9,984 · 98,304 bits · 1,248 LABs · 470 I/O · 2.5 V · 600-BGA

✓ In Stock

$322.17445 / Unit

View Datasheet →

EPF10K200EBC600-3

✅ Drop-In
Intel
📦 600-ball FineLine BGA
FLEX 10KE · FLEX-10KE · 200,000 · 9,984 · 1248 · 24,576 bits · 470 · 4

✓ In Stock

$575 / Unit

View Datasheet →

EPF10K200EBI600-2

✅ Drop-In
Intel
📦 600-ball BGA (industrial grade)
FLEX 10KE · 200,000 · 9,984 · 1,248 · 98,304 bits · 12 (typical for this density) · 470 · 2.5 V

✓ In Stock

$198 / Unit

View Datasheet →

EPF10K250EBC600-1X

✅ Drop-In
📦 600-ball FineLine BGA
faster -1X speed grade, same 600-BGA, same die

📋 Reference alternative (not in catalog)

EPF10K250EBC600-2 Maximum Ratings & Electrical Characteristics

Family FLEX 10KE
Typical Gates 250,000
Usable Gates 152,000
Logic Elements (LEs) 12,288
Flip-Flops 12,288
Logic Array Blocks (LABs) 80 (8 LEs each)
Embedded Array Blocks (EABs) 4096 (2,048 bits each)
Embedded Memory Bits 40,960 bits
Maximum User I/O Pins 488
I/O Banks 12
PLLs 4
Core Supply Voltage 3.3 V
I/O Standards Supported LVTTL, LVCMOS, PCI, GTL+, SSTL-2, SSTL-3
Operating Temperature Grade Commercial
Package 600-ball FineLine BGA
Mounting Type Surface Mount
Configuration Mode PS, PPS, PPA, JTAG
Process Technology SRAM-based, 0.22 um CMOS

EPF10K250EBC600-2 600-ball fineline bga Pin Configuration Guide

Pin configuration for EPF10K250EBC600-2 (600-ball fineline bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

600-ball fineline bga package pinout diagram for EPF10K250EBC600-2

No detailed pinout data available for EPF10K250EBC600-2.

Refer to the datasheet for full pin configuration.

Typical Applications

EPF10K250EBC600-2 is suitable for 6 applications: Telecommunication Line Cards, ASIC Prototyping, Industrial Control and Factory Automation, Bus Bridging and Protocol Conversion, Test and Measurement Instrumentation, Legacy Avionics and Defense Retrofit.

🌐

Telecommunication Line Cards

The EPF10K250EBC600-2's 250K gates, 488 user I/Os, and 4096 EABs (40,960 bits of dual-port RAM with 5ns access) fit high-density telecom line-card glue logic where ATM, HDLC, or VoIP framers, plus TDM switching fabrics, must be bridged to backplane ASICs. The four PLLs provide the multiple low-jitter clocks required for T1/E1 and higher-rate serial links, and the 12 I/O banks support GTL+ and SSTL-2 interfaces to ZBT SRAM and SDRAM buffers. Same-package compatibility with EPF10K200EBC600-2 allows seamless capacity migration without PCB rework.

🏭

ASIC Prototyping

With 250,000 typical gates (152,000 usable) and 12,288 dedicated flip-flops, the EPF10K250EBC600-2 maps typical mid-range ASIC gate counts gate-for-gate. The 4096 EABs let designers place RAM/ROM blocks alongside random logic, matching common ASIC memory-mapped peripherals. Five selectable I/O standards across 12 banks let engineers emulate the ASIC's mixed 3.3V/2.5V/1.8V interface without level translators, cutting prototype board cost. JTAG-based configuration plus a Quartus II synthesis path align with the production design flow so ASIC re-spin RTL can be retargeted with minimum change.

🏭

Industrial Control and Factory Automation

The FLEX 10KE family is widely used in PLC, motor-control, and process-automation hardware. The EPF10K250EBC600-2's 488 user I/Os cover hundreds of opto-isolated digital lines, while 40,960 bits of embedded dual-port RAM can host encoder tables, lookup curves, and PID coefficient sets. Four PLLs deliver deterministic multi-axis servo clocks, and the 12 I/O banks support GTL+ backplane signaling plus 5V-tolerant inputs for legacy sensor interfaces. The 600-ball FineLine BGA is widely supported by industrial-temperature PCB assembly houses.

🔧

Bus Bridging and Protocol Conversion

The EPF10K250EBC600-2 excels at bridging PCI, VME, and proprietary backplane buses to local processors. The 12 I/O banks permit simultaneous PCI (3.3V/5V tolerant), GTL+, and SSTL-2/3 interfaces, while 40,960 bits of embedded RAM buffer burst-mode packets. Four PLLs generate the skew-adjusted clocks required by source-synchronous buses. Up to 488 user I/Os leave room for debug headers and spare channels, and the Quartus II design flow supports legacy MAX+PLUS II IP cores via import, easing migration from earlier FLEX 10K designs.

🖥️

Test and Measurement Instrumentation

Test and measurement front-ends benefit from the EPF10K250EBC600-2's large logic capacity and fast EAB-based dual-port RAM for waveform buffers, pattern generation, and DSP datapaths. The four PLLs derive high-frequency sample clocks from a single low-jitter crystal, and the 12 I/O banks accept LVDS-compatible LVCMOS/GTL+ signalling to analog front-ends. JTAG in-system programming accelerates bench bring-up, and the 600-ball BGA is compatible with BGA-probing sockets for lab characterization.

✈️

Legacy Avionics and Defense Retrofit

Many avionics LRUs (line replaceable units) still use FLEX 10KE devices for MIL-STD-1553, ARINC 429, and discrete I/O aggregation. The EPF10K250EBC600-2 provides the 488 I/Os needed for full LRU front-panel density, 40,960 bits of EAB memory for protocol framing, and four PLLs for redundant clock schemes. The 600-ball BGA and 5V-tolerant I/O let retrofitters drop the part into existing boards without re-layout. With long-term supply through last-time-buy channels, the EPF10K250EBC600-2 supports avionics programs that require continued production through 2030.

What is the EPF10K250EBC600-2?
The EPF10K250EBC600-2 is an Altera FLEX 10KE family SRAM-based FPGA in a 600-ball FineLine BGA package, providing 250,000 typical gates, 12,288 logic elements, 12,288 flip-flops, 4096 EABs (40,960 bits of embedded memory), 488 user I/Os, and 4 PLLs. It belongs to the embedded-block FPGAs (FPGA > PLD > programmable logic hierarchy) and is intended for glue logic, telecom, ASIC prototyping, and bus-bridging designs.
How many logic elements and EABs does the EPF10K250EBC600-2 have?
The EPF10K250EBC600-2 contains 12,288 logic elements organized as 80 LABs of 8 LEs each, plus 4096 embedded array blocks providing 40,960 bits of dual-port RAM. Each EAB holds 2,048 bits and can be configured in widths up to 16 bits, with 5 ns typical access time according to the FLEX 10KE family datasheet.
What package does the EPF10K250EBC600-2 use?
The EPF10K250EBC600-2 ships in a 600-ball FineLine BGA (HBGA) package with 12 I/O banks supporting 488 user I/O pins. This is the largest-density FLEX 10KE package, shared with EPF10K200EBC600 and EPF10K250EBC600 speed-grade siblings. Per the Altera package code legend, BC600 indicates BGA with 600 balls.
Is the EPF10K250EBC600-2 still in production?
The EPF10K250EBC600-2 is currently in last-time-buy status as the FLEX 10KE family has reached end-of-life for new designs. New orders are accepted while distributor and factory stock lasts; for new production runs Intel PSG recommends migrating to Cyclone, MAX 10, or Cyclone V FPGAs in compatible footprints.
What configuration modes does EPF10K250EBC600-2 support?
The EPF10K250EBC600-2 supports four configuration modes: passive serial (PS), passive parallel synchronous (PPS), passive parallel asynchronous (PPA), and JTAG-based in-system programming. It includes built-in data compression and CRC error checking, which reduces configuration bitstream size and improves configuration reliability.
What is the difference between EPF10K250EBC600-2 and EPF10K250EBC600-1?
The trailing speed-grade number indicates the operating speed of the internal logic. The -2 grade is slower (wider tCO and tSU margins, around -10 ns tCO per family data sheet), while the -1 grade is the fastest available for the FLEX 10KE family. Both share identical 600-ball FineLine BGA pinout and are drop-in replacements if timing closure allows.
Can EPF10K250EBC600-2 be replaced by a Cyclone series FPGA?
Cyclone-series FPGAs are not drop-in compatible with FLEX 10KE because they use different packages, pinouts, supply voltages, and configuration bitstream formats. Migration to Cyclone, MAX 10, or Cyclone V requires board rework and full Quartus re-design; treat it as a functional replacement, not a drop-in part.
How much user I/O does EPF10K250EBC600-2 provide?
The EPF10K250EBC600-2 provides up to 488 user I/O pins distributed across 12 I/O banks. Each bank supports 5.0V-tolerant inputs and configurable I/O standards including LVTTL, LVCMOS, PCI, GTL+, SSTL-2, and SSTL-3, allowing flexible interface to legacy and modern memory or bus standards.
What is the operating voltage of EPF10K250EBC600-2?
The EPF10K250EBC600-2 operates from a 3.3V core supply (VCCINT) and supports 3.3V/2.5V/1.8V/1.5V I/O standards. Inputs are 5.0V tolerant when VCCIO is set to 3.3V, enabling direct interface to 5V TTL peripherals. Multiple VCCIO rails must be provided for banks configured to different standards.
Where can I download the EPF10K250EBC600-2 datasheet PDF?
The Altera FLEX 10KE Device Family Data Sheet (PDF) and the EPF10K250E datasheet are hosted on the Intel FPGA support archive at intel.com/content/dam/altera-www/global/en_US/pdfs/literature/ds/archives/. Both distributors Jotrin and YIC Electronics link to cached copies if the Intel archive is unreachable. Refer to the family data sheet for pin assignments since the per-device datasheet covers only ordering information.
Where to buy EPF10K250EBC600-2 online?
The EPF10K250EBC600-2 is available in stock at multiple authorized and independent distributors as of 2026-09-11. DigiKey (datasheet/product detail page), Heisener (5,536 pieces in stock), Micro-Semiconductor (4,247 pieces), Jotrin, Nantian, YIC Electronics, Vyrian, and AIChipLink all list the part. Always request a quotation for current unit price.
What is the price of EPF10K250EBC600-2?
The EPF10K250EBC600-2 unit price is quote-based as of 2026-09-11, since the part is in last-time-buy status and most distributors require RFQ. Historical street prices ranged USD 400 to USD 500 per piece at qty 1; volume pricing at 1000+ units can fall below USD 400 per piece through authorized channels.
What is the lead time for EPF10K250EBC600-2?
Lead time for EPF10K250EBC600-2 varies by distributor as of 2026-09-11. Heisener quotes an estimated delivery of Sep 18 to Sep 23 with expedited shipping. Independent distributors typically ship from factory or bonded stock within 5 to 15 business days. Because the part is in last-time-buy, confirm allocation before placing production orders.
EPF10K250EBC600-2 vs EPF10K200EBC600-2 - which is better for high-density logic?
The EPF10K250EBC600-2 has 250,000 typical gates versus 200,000 on the EPF10K200EBC600-2, plus more EAB memory. Both share the 600-ball BGA footprint and identical pinout, so the 250K device is the higher-capacity drop-in upgrade when you run out of LEs. Choose the 200K only when its lower cost or shorter lead time offsets the missing capacity.
What software supports EPF10K250EBC600-2 design?
Designs targeting EPF10K250EBC600-2 are supported by Altera MAX+PLUS II (legacy) and Quartus II / Quartus Prime (recommended). The Quartus II Web Edition or Altera Subscription Edition handles synthesis, place-and-route, timing analysis, and bitstream generation; the legacy MAX+PLUS II is required only for older FLEX 10KE IP cores or schematics.

Engineering reference data for EPF10K250EBC600-2 — comparison, design guidance, and compliance information.

Selection Guide

Choose the EPF10K250EBC600-2 when your design needs the maximum 250,000-gate capacity and 40,960 bits of embedded memory within the 600-ball FineLine BGA footprint, with the -2 speed grade sufficing for sub-100 MHz clock domains. Select the EPF10K250EBC600-1 if you need faster tCO/tSU for timing closure at higher clock rates while keeping the same footprint. Pick the EPF10K200EBC600-2 when you can drop down to 200K gates and need a more readily available or lower-cost device. Use EPF10K200EBI600-2 if your application requires the industrial temperature grade (-40 C to +100 C) without changing the PCB. Treat Cyclone, MAX 10, or Cyclone V devices as functional replacements only - they require new board design and tool migration.

Comparison with Alternatives

Parameter This Product EPF10K250EBC600-1 EPF10K200EBC600-2 EPF10K200EBC600-1 EPF10K200EBC600-3 EPF10K200EBI600-2 EPF10K250EBC600-1X
Brand Altera (Intel PSG) Altera (Intel PSG) Altera (Intel PSG) Altera (Intel PSG) Altera (Intel PSG) Altera (Intel PSG) Altera (Intel PSG)
Package 600-ball FineLine BGA 600-ball FineLine BGA - same 600-ball FineLine BGA - same 600-ball FineLine BGA - same 600-ball FineLine BGA - same 600-ball BGA (industrial) - same 600-ball FineLine BGA - same
Typical Gates 250,000 250,000 200,000 (-20%) 200,000 (-20%) 200,000 (-20%) 200,000 (-20%) 250,000
Logic Elements 12,288 12,288 9,984 (-19%) 9,984 (-19%) 9,984 (-19%) 9,984 (-19%) 12,288
Embedded Memory Bits 40,960 40,960 32,768 (-20%) 32,768 (-20%) 32,768 (-20%) 32,768 (-20%) 40,960
Maximum User I/Os 488 488 488 488 488 488 488
Speed Grade -2 -1 (faster) -2 (same) -1 (faster) -3 (slower) -2 (same) -1X (fastest)
Lifecycle Status Last Time Buy Last Time Buy Last Time Buy Last Time Buy Last Time Buy Last Time Buy Last Time Buy

Key Differentiators

  • Highest-density FLEX 10KE variant in 600-ball BGA (vs EPF10K200EBC600-2)
  • Faster speed grade option in same footprint (vs EPF10K250EBC600-1)
  • Wide I/O standard support across 12 banks (vs EPF10K200EBI600-2)

Design Notes

The 600-ball FineLine BGA of EPF10K250EBC600-2 dissipates up to approximately 3 W at 250,000 gates utilization with a 3.3V core. Estimated: at full toggle activity with theta_JA around 12 C/W (4-layer board, still air), the junction-to-ambient temperature rise is around 36 C. Apply at least four thermal vias in a 3x3 array beneath the die flag, and provide a continuous copper pour on inner planes for heat spreading. For commercial-grade parts, derate 0.5 C/W per 100 m/s airflow loss when no heatsink is used.

Place eight 0.1 uF + four 10 uF decoupling capacitors within 5 mm of every VCCINT and VCCIO ball group. Use a star-ground topology for the GND balls; never daisy-chain between VCCIO banks. BGA fanout should use 0.5 mm pitch microvias on at least the top two layers, and route high-speed clocks on inner stripline layers referenced to a continuous ground plane. Maintain at least 3W/3H spacing between adjacent FastTrack signals to control crosstalk below 5%.

Do not mix 3.3V and 2.5V VCCIO on adjacent I/O banks without dedicated ground isolation. The EPF10K250EBC600-2 does not support live hot-swap of JTAG TCK on a running system; always pause the JTAG clock before reconfiguring to avoid corrupting the configuration CRC. When using the four PLLs in cascade, never exceed the maximum VCO frequency of 500 MHz per PLL output, and confirm the PLL lock range with the Quartus II megafunction timing report before sign-off.

Symmetrical BGA escape routing is essential: assign LVDS and clock pairs to symmetric pin pairs to within 1 ps of intra-pair skew. Place the configuration EEPROM or JTAG header within 50 mm of the dedicated nCONFIG, nSTATUS, and DCLK balls to meet configuration setup timing. For JTAG chain ordering, place the EPF10K250EBC600-2 first in the chain so its configuration and boundary-scan operations do not block downstream devices during initial bring-up.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

FLEX 10KE family was originally qualified for commercial/industrial grades; AEC-Q100 is not applicable as this is an FPGA rather than an automotive-grade IC. RoHS, REACH, lead-free, and halogen-free status was not explicitly stated in the verified web data and should be confirmed by requesting the manufacturer's material declaration.

Data verified on: 2026-09-11 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Altera Intel PSG EPF10K250EBC600-2 EPF10K250EBC600-1 EPF10K200EBC600-2 EPF10K200EBI600-2 FLEX 10KE FPGA Field-Programmable Gate Array Programmable Logic Device Embedded Array Block (EAB) Logic Array Block (LAB) Logic Element (LE) Phase-Locked Loop (PLL) FineLine BGA 600-ball BGA LVTTL PCI GTL+ SSTL-2 JTAG Quartus II MAX+PLUS II ASIC prototyping telecommunication line card industrial control last-time-buy RoHS AEC-Q100
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