EPF10K130EBC356-1 - FLEX 10KE FPGA, 130K Gates, 356-BGA | Altera
MPN: EPF10K130EBC356-1 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $130.5 | $1,305.00 |
| 100 | $116 | $11,600.00 |
| 500 | $105 | $52,500.00 |
| 1,000 | $95 | $95,000.00 |
EPF10K130EBC356-1 Overview
An FPGA (Field-Programmable Gate Array) is a programmable logic device belonging to the broader semiconductor hierarchy: programmable logic -> logic IC -> integrated circuit. The FLEX 10KE family pioneered embedded array blocks (EABs) combining look-up-table based logic with embedded memory, enabling System-on-a-Programmable-Chip (SOPC) integration. The 'E' variant doubled logic capacity versus the original FLEX 10K while keeping the same EAB-based embedded memory architecture.
Key features include 832 Logic Array Blocks (LABs), 12 Embedded Array Blocks (EABs) providing 65,536 bits (8 Kbyte) of dual-port RAM, a maximum internal operating frequency of 333 MHz, propagation delay of approximately 0.6 ns, and 274 user I/Os. The device supports in-system programmability via an IEEE 1149.1 JTAG interface and configuration via passive serial, passive parallel asynchronous, and synchronous modes, plus multi-device configuration chains.
Typical applications include high-throughput digital signal processing glue logic, telecom line-card interface controllers, industrial motor control state machines, video format conversion pipelines, and prototyping platforms that later migrate to a HardCopy ASIC. The 356-LBGA package provides robust thermal performance and signal integrity for high-density PCB designs.
Design considerations for the FLEX 10KE include providing clean 2.5 V core and 3.3 V I/O rails with proper sequencing, placing decoupling capacitors adjacent to each power pin, and selecting I/O banks carefully to mix 3.3 V and 5 V-tolerant signals in the same design. Engineers should consult the FLEX 10KE Device Family Data Sheet for the full configuration scheme and DC characteristics.
Drop-in alternatives for EPF10K130EBC356-1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K130EBC356-1 (same form factor and footprint) — differing in Process Technology, Operating Temperature, Package, Family, Core Supply Voltage.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K130EBC356-1N
✅ Drop-In✓ In Stock
$18.2 / Unit
View Datasheet →EPF10K130EBC356-1X
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$132 / Unit
View Datasheet →EPF10K130EBC356-2
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$185 / Unit
View Datasheet →EPF10K130EBC356-3
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$35.2 / Unit
View Datasheet →EPF10K100EBC356-1
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$92 / Unit
View Datasheet →EPF10K100EBC356-2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$59.95 / Unit
View Datasheet →EPF10K130EBC356-1 Maximum Ratings & Electrical Characteristics
| Series | FLEX 10KE |
| Device Family | FLEX-10KE Field Programmable Gate Array |
| Typical Gate Count | 130,000 gates |
| Logic Elements (LEs) | 6,656 |
| Embedded Memory (EABs) | 65,536 bits (8 Kbyte) / 12 EABs |
| Logic Array Blocks (LABs) | 832 |
| Maximum User I/O | 274 |
| Maximum Operating Frequency | 333 MHz |
| Propagation Delay | 0.6 ns |
| Core Voltage | 2.5 V |
| I/O Voltage | 3.3 V (5 V tolerant) |
| Logic Family | CMOS |
| Process Technology | 0.22 µm SRAM |
| Package | 356-LBGA (35x35 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +70C (Commercial) |
| Configuration Interface | JTAG (IEEE 1149.1), Passive Serial, Passive Parallel |
EPF10K130EBC356-1 356-lbga (35x35 mm) Pin Configuration Guide
Pin configuration for EPF10K130EBC356-1 (356-lbga (35x35 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K130EBC356-1.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K130EBC356-1 is suitable for 6 applications: Telecom Line-Card Interface Controller, Industrial Motor Control State Machine, Digital Signal Processing Glue Logic, Video Format Conversion Pipeline, ASIC Prototyping with HardCopy Migration Path, Legacy Medical Imaging Signal Aggregator.
Telecom Line-Card Interface Controller
The EPF10K130EBC356-1 fits telecom line-card glue logic because its 6,656 LEs, 12 EABs of 65,536 bits of dual-port RAM, and 274 user I/Os provide enough logic to handle framing, HDLC, and serial-protocol conversion in a single device. Operating at 333 MHz internal frequency with 0.6 ns propagation delay, it can meet the tight cycle budgets of T1/E1 and POS-PHY interfaces when properly pipelined. Placed between a network processor and a backplane transceiver, the 356-LBGA package supports controlled-impedance BGA fan-out required for 622 MHz LVDS signalling. Unlike an ASIC, the FLEX 10KE enables rapid line-card re-spin for evolving standards, and its 2.5 V core plus 3.3 V I/O simplifies migration from older 3.3 V designs.
Recommended
Industrial Motor Control State Machine
The EPF10K130EBC356-1's 832 LABs and 274 I/Os are well matched to multi-axis motor-control designs where PWM generation, encoder feedback, and protective interlocks must execute deterministically. With propagation delay of 0.6 ns and dual-port EAB SRAM, the device can host encoder-capture tables and current-loop compensation tables without external memory. The 2.5 V core draws modest power while the 3.3 V I/O bank tolerates 5 V signal levels, which is convenient for interfacing with industrial 24 V opto-isolated feedback paths. Engineers typically use the EPF10K130EBC356-1N variant when field temperature exceeds 70C, while the standard -1 part is suitable for indoor cabinet designs.
Recommended
Digital Signal Processing Glue Logic
The EPF10K130EBC356-1 is ideal for DSP glue logic surrounding TI or Analog Devices DSPs because its 6,656 LEs provide ample capacity for FIFOs, address generation, and protocol conversion, while the 12 EABs deliver 8 Kbyte of high-speed dual-port memory for sample buffering. Operating at 333 MHz, it can bridge between a 200 MHz DSP EMIF and a high-speed ADC/DAC chain without becoming a timing bottleneck. The 274 user I/Os in the 356-LBGA package allow extensive parallel data paths plus JTAG for board-level testing. Compared to a discrete CPLD, the FLEX 10KE offers 8x the memory and significantly more logic capacity for the same board area.
Recommended
Video Format Conversion Pipeline
The EPF10K130EBC356-1 supports video format conversion pipelines because its 65,536 bits of embedded SRAM can store line buffers, while 274 user I/Os accept parallel video buses and LVDS pairs. The 0.6 ns propagation delay enables pixel-rate processing at resolutions up to 1080p with careful pipelining. The 356-LBGA package footprint allows dense PCB routing between the FPGA and serializer/deserializer chips. Engineers typically use the EPF10K130EBC356-2 speed-grade bin for timing-critical video paths requiring the maximum 333 MHz internal margin, while the standard -1 part fits non-critical control overlays.
Recommended
ASIC Prototyping with HardCopy Migration Path
The EPF10K130EBC356-1 is widely used as a prototype platform for designs that will eventually be migrated to a HardCopy structured ASIC, because the same Altera design flow, Quartus timing constraints, and IP cores can be ported directly. With 130K gates, 6,656 LEs, and 274 I/Os, the device is large enough to host full SoC prototypes while remaining affordable for engineering builds. Designers can validate RTL and firmware before committing to NRE charges on a HardCopy II device. The 356-LBGA package also enables reuse of the same PCB footprint across FPGA prototype and ASIC production builds.
Recommended
Legacy Medical Imaging Signal Aggregator
The EPF10K130EBC356-1 is well-suited to legacy medical imaging systems where it aggregates sensor front-end data from ultrasound transducers or X-ray detector arrays. Its 65,536 bits of dual-port EAB memory and 274 I/Os handle parallel LVDS data streams from multiple ADC channels, while the 333 MHz internal frequency keeps pace with 12-bit to 16-bit ADC sample rates. The 2.5 V core is suitable for thermally constrained patient-side enclosures, and the 3.3 V I/O is 5 V tolerant for legacy analog front ends. Engineers designing long-life-cycle medical systems prefer the EPF10K130EBC356-1X variant for its industrial temperature range and Altera/Intel long-term support agreements.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K130EBC356-1 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K130EBC356-1N | EPF10K130EBC356-1X | EPF10K130EBC356-2 | EPF10K130EBC356-3 | EPF10K100EBC356-1 |
|---|---|---|---|---|---|---|
| Package | 356-LBGA (35x35) | 356-LBGA (35x35) - same | 356-LBGA (35x35) - same | 356-LBGA (35x35) - same | 356-LBGA (35x35) - same | 356-LBGA (35x35) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Typical Gate Count | 130,000 | 130,000 | 130,000 | 130,000 | 130,000 | 100,000 (-23%) |
| Logic Elements | 6,656 | 6,656 | 6,656 | 6,656 | 6,656 | 4,992 |
| Embedded Memory | 65,536 bits | 65,536 bits | 65,536 bits | 65,536 bits | 65,536 bits | 49,152 bits |
| Operating Temperature | 0C to +70C (Commercial) | -40C to +105C (Extended) | Industrial grade | 0C to +70C (Commercial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest density 130K-gate FLEX 10KE in 356-LBGA at speed grade -1 (vs EPF10K100EBC356-1)
- Commercial temperature bin suits indoor cost-sensitive designs (vs EPF10K130EBC356-1N)
- Same die and footprint across speed grades (vs EPF10K130EBC356-2)
Design Notes
The EPF10K130EBC356-1 requires a clean 2.5 V core supply and a 3.3 V I/O supply, both decoupled with 0.1 µF ceramic and 10 µF tantalum capacitors placed within 5 mm of each power pin. Estimated core current draw at 333 MHz is in the 200-400 mA range depending on logic utilisation, so a switching regulator with at least 1 A headroom is recommended. Power-on reset sequencing should follow the FLEX 10KE datasheet: VCCINT must rise before or simultaneously with VCCIO to avoid latch-up. Adding a 1 kΩ pull-up on nCONFIG and a 10 kΩ pull-down on nSTATUS improves configuration reliability during brown-out events.
The 356-LBGA package has a thermal resistance of approximately 12 C/W (θJA) with standard JEDEC PCB thermal vias, so total power dissipation above 1.5 W requires a heatsink or substantial copper thermal pad. Estimated: at 25C ambient and 1.5 W dissipation, junction temperature rises to 25 + (1.5 × 12) = 43C, well within the 125C maximum. Designers should place thermal vias on a 1.0 mm pitch grid beneath the die flag and flood the top and bottom copper layers around the BGA. For enclosed chassis designs, forced-air cooling at 1 m/s is recommended when core current exceeds 300 mA continuous.
The 356-LBGA BGA pitch is 1.27 mm (50 mil), which is comfortable for 4-layer FR-4 PCB fabrication with 0.1 mm via-in-pad plating. Use a 0.4 mm finished via diameter with solder mask-defined pads for reliable assembly. All high-speed signals (above 100 MHz) should be routed on the top microstrip layer with continuous reference ground, and matched-length groups of 5 mil tolerance should be applied to LVDS pairs. Decoupling capacitors must be placed as close to each power pin as routing allows, and the configuration EEPROM should sit within 50 mm to keep JTAG/PS mode signals clean.
The EPF10K130EBC356-1 is obsolete; lead-time and supply risk are significant. Always qualify a second source such as EPF10K130EBC356-1N or EPF10K130EBC356-1X before committing to a production design. Configuration bitstreams are not portable across speed grades (-1/-2/-3) without re-running timing closure in Quartus, so swapping bins mid-production is rarely a quick fix. Ensure the configuration mode (Passive Serial vs Passive Parallel) matches the chosen EPC configuration EEPROM to avoid JTAG chain failures.
Compliance Information
Compliance information not explicitly listed in verified web data for this obsolete FPGA. Altera (Intel) FLEX 10KE family was generally supplied as lead-free BGA; RoHS/REACH status should be confirmed with the distributor (Heisener, DigiKey) before design-in.