EPF10K200EGC599-3 - FLEX 10KE 200K FPGA, 599-BCPGA | Altera
MPN: EPF10K200EGC599-3 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $49.03 | $49.03 |
| 10 | $47.2 | $472.00 |
| 100 | $44.5 | $4,450.00 |
| 500 | $41.8 | $20,900.00 |
| 1,000 | $39.2 | $39,200.00 |
EPF10K200EGC599-3 Overview
A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic fabric, routing, and I/O can be configured by the end user to implement arbitrary digital circuits. The FLEX 10KE family specifically targets embedded system-on-a-programmable-chip (SOPC) integration by combining a general-purpose logic array with embedded array blocks (EABs) for efficient memory and specialized I/O functions. Within Altera's broader product taxonomy, the part sits at FPGA -> programmable logic -> programmable logic device -> digital IC -> semiconductor, and is one of the highest-density members of the legacy FLEX 10K generation.
Key features include 9,984 logic elements, 470 user I/O pins, 98,304 RAM bits organized in embedded array blocks, and pin-to-pin propagation delays as fast as 0.8 ns for the -3 speed grade. The 599-BCPGA ceramic package provides excellent thermal and mechanical robustness for legacy through-hole designs, although surface-mount alternatives (BGA, QFP) exist in the family. The device supports in-system programmability via the IEEE 1149.1 JTAG interface and is configuration-compatible with the Quartus design toolchain.
Typical applications include telecommunications infrastructure, industrial control systems, military and aerospace legacy systems, ASIC prototyping, glue-logic consolidation, and high-speed bus interfaces. The part remains in long-term supply through Rochester Electronics for designs requiring form-fit-function continuity with the original Altera silicon. When designing with this FPGA, ensure JTAG chain integrity, validate I/O voltage compatibility with adjacent peripherals, and account for the substantial I/O count (470) when planning PCB routing.
Drop-in alternatives for EPF10K200EGC599-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K200EGC599-3 (same form factor and footprint) — differing in Mounting Type, Package, Process Technology, RoHS Status, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K200EGC599-2
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View Datasheet →EPF10K200EGC599-1
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View Datasheet →EPF10K200EBC600-3
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View Datasheet →EPF10K200EBC600-2
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View Datasheet →EPF10K200EFC672-3
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View Datasheet →EPF10K200EBI600-2
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View Datasheet →EPF10K200EGC599-3 Maximum Ratings & Electrical Characteristics
| Manufacturer | Altera (Intel) |
| Series | FLEX-10KE |
| Family | FLEX 10KE |
| Device Type | FPGA (Field Programmable Gate Array) |
| Logic Elements | 9984 |
| System Gates | 200000 (approx.) |
| Total RAM Bits | 98304 |
| Maximum User I/O | 470 |
| Number of Terminals | 599 |
| Package | 599-BCPGA (62.48 x 62.48 mm) |
| Package Code | PGA (Ceramic Pin Grid Array) |
| Mounting Type | Through Hole (Pin/Peg) |
| Operating Temperature Grade | Commercial |
| Core Supply Voltage | 2.375 V to 2.625 V (typical 2.5 V) |
| Process Technology | 0.22 µm SRAM CMOS |
| Maximum Frequency | 166.67 MHz |
| Speed Grade | -3 (0.8 ns) |
| Propagation Delay | 0.8 ns |
| Programming Interface | JTAG (IEEE 1149.1) |
| Configuration Memory | SRAM-based (volatile) |
EPF10K200EGC599-3 Pin Configuration
| Pin 1 | I/O — User I/O pin (function depends on configuration) |
| Pin 150 | I/O — User I/O pin (function depends on configuration) |
| Pin 300 | I/O — User I/O pin (function depends on configuration) |
| Pin 450 | I/O — User I/O pin (function depends on configuration) |
| Pin 599 | I/O — User I/O pin (function depends on configuration) |
Typical Applications
EPF10K200EGC599-3 is suitable for 6 applications: Telecommunications Infrastructure, Industrial Control and Factory Automation, ASIC Prototyping and Emulation, Military and Aerospace Legacy Systems, Medical Imaging and Diagnostic Equipment, High-Speed Bus Interface and Glue Logic.
Telecommunications Infrastructure
The EPF10K200EGC599-3's 9,984 logic elements and 470 user I/O pins support legacy telecom equipment such as TDM backplane controllers, ATM/SONET framer glue logic, and high-density channelized line-interface boards. The -3 speed grade's 166.67 MHz maximum frequency comfortably handles 155 MHz OC-3 / STM-1 parallel side-band processing. Embedded array blocks (EABs) provide efficient implementation of small FIFOs and lookup tables for traffic shaping without external memory.
Recommended
Industrial Control and Factory Automation
The 470 I/O count and 599-BCPGA's robust ceramic packaging make the EPF10K200EGC599-3 well-suited to PLC backplanes, motor-control glue logic, and CNC machine controllers. The -3 speed grade handles 100 MHz encoder feedback and high-speed serial protocol bridging (SSI, Biss, EnDat) with timing margin. The 0.22 µm CMOS core tolerates the wider industrial thermal range, and the ceramic PGA withstands the vibration profile of factory-floor equipment better than plastic packages.
Recommended
ASIC Prototyping and Emulation
With 200K system gates and embedded array blocks, the EPF10K200EGC599-3 served as a primary prototype vehicle for ASIC emulation in the late 1990s and early 2000s. Designers partition large ASIC RTL across multiple FLEX 10KE devices for full-chip emulation. The 0.8 ns propagation delay (-3 grade) lets emulation run at near-real-time clock rates, while 470 I/O per device supports the high pin-count needed for ASIC-to-FPGA partitioning.
Recommended
Military and Aerospace Legacy Systems
The 599-BCPGA ceramic package, military pedigree of the FLEX 10KE family, and continued long-term supply via Rochester Electronics make the EPF10K200EGC599-3 a sustaining component for avionics, radar signal processing, and naval combat-system retrofits. The SRAM-based configuration supports in-field firmware updates via JTAG IEEE 1149.1, while the 470 I/O count handles MIL-STD-1553, ARINC 429, and legacy parallel data buses common in defense platforms.
Recommended
Medical Imaging and Diagnostic Equipment
Ultrasound front-ends, MRI gradient controllers, and X-ray detector read-out boards from the 2000s often used the EPF10K200EGC599-3 for channel-level processing and high-speed data aggregation. The 470 I/O pins support multi-channel analog-front-end aggregation, while the 166.67 MHz -3 grade processes real-time beamforming datapaths. Long-term availability through Rochester is critical for medical equipment requiring 15-20 year service-life support.
Recommended
High-Speed Bus Interface and Glue Logic
The EPF10K200EGC599-3's 470 I/O and 166.67 MHz -3 speed grade excel at multi-bus bridging - converting between PCI, VME, RapidIO, and proprietary backplane protocols. Embedded array blocks implement bus protocol FIFOs and address decoding tables efficiently. Designers use the FLEX 10KE family to consolidate discrete 74-series glue logic, reducing board area and improving timing margins in legacy system upgrades.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K200EGC599-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K200EGC599-2 | EPF10K200EGC599-1 | EPF10K200EBC600-3 | EPF10K200EBC600-2 | EPF10K200EFC672-3 | EPF10K200EBI600-2 |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 599-BCPGA | 599-BCPGA - same | 599-BCPGA - same | 600-BCPGA - closely related PGA ceramic | 600-BCPGA - closely related PGA ceramic | 672-FBGA - different footprint, SMT | 600-BGA - different footprint, SMT |
| Speed Grade | -3 (fastest, 0.8 ns) | -2 | -1 | -3 | -2 | -3 | -2 |
| Logic Elements | 9984 | 9984 | 9984 | 9984 | 9984 | 9984 | 9984 |
| System Gates | 200000 | 200000 | 200000 | 200000 | 200000 | 200000 | 200000 |
| Total RAM Bits | 98304 | 98304 | 98304 | 98304 | 98304 | 98304 | 98304 |
| Core Voltage | 2.5 V (2.375-2.625 V) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Temperature Grade | Commercial | Commercial | Commercial | Commercial | Commercial | Commercial | Industrial |
Key Differentiators
- Highest-density FLEX 10KE in 599-BCPGA ceramic package (vs EPF10K200EBC600-3)
- Faster -3 speed grade versus slower -1 and -2 grades (vs EPF10K200EGC599-1)
- SRAM-based reprogrammability for in-field firmware updates (vs EPF10K130VGC599-3)
Design Notes
The FLEX 10KE core draws from a 2.5 V supply at 2.375-2.625 V tolerance. Per the family datasheet, estimated Icc for a fully utilized EPF10K200E is in the 200-500 mA range depending on toggle rate and clock frequency. Decouple with 100 µF bulk + 0.1 µF + 0.01 µF ceramic capacitors placed within 5 mm of the VCCINT pins. The 599-BCPGA package has multiple VCCINT and GND pins distributed across the array - all must be connected for stable operation.
Estimated: at full 470 I/O utilization toggling at 100 MHz, the EPF10K200EGC599-3 dissipates approximately 1.5-2.0 W. The 599-BCPGA ceramic package has θJA of approximately 12-15 °C/W (typical for ceramic PGA with bottom heat-spreader contact), giving a junction temperature rise of 18-30 °C above ambient - well within commercial range. For long-term reliability, provide thermal vias beneath the package central heat slug and consider a heatsink for closed-enclosure industrial deployments.
The 599-BCPGA through-hole footprint requires 0.018-0.020 inch (0.46-0.51 mm) plated through-holes on a 2.54 mm (100 mil) pitch grid. Pin 1 is identified by a chamfered corner or notch per JEDEC MS-018. Pin assignment depends on user configuration and is documented in the FLEX 10KE family datasheet - verify against your compiled Quartus/MAX+PLUS II pinout file before board fab. The 62.48 mm body requires clearance for the IC extraction tool.
Do not assume the EPF10K200EGC599-3 is configuration-compatible with newer FPGAs - it uses the Altera Passive Parallel Asynchronous (PPA) or Passive Serial (PS) configuration schemes from the FLEX 10K era, NOT the modern Cyclone/Stratix schemes. JTAG chain length must account for the FLEX 10KE's TCK-to-TDO propagation delay (per datasheet). The SRAM-based configuration is volatile - any brownout of VCCINT requires full re-configuration, so add a supervisor reset and proper POR sequencing.
Compliance Information
Compliance data not explicitly stated in distributor listings. Ceramic PGA packages from the FLEX 10KE era typically contain lead-based ceramic and are often non-RoHS - verify with Rochester Electronics for the specific date code / lot. AEC-Q100 not applicable (not automotive).
