EPF10K30EFC484-2 - 30K FLEX-10KE FPGA, 220 I/O, 484-BGA | Intel / Altera
MPN: EPF10K30EFC484-2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $260 | $2,600.00 |
| 100 | $225 | $22,500.00 |
| 500 | $198 | $99,000.00 |
| 1,000 | $175 | $175,000.00 |
EPF10K30EFC484-2 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks, programmable interconnect, and I/O cells that can be reconfigured by the designer after manufacture. FPGAs sit between fixed-function ASICs and software-programmable processors in the design hierarchy: integrated circuit -> programmable logic -> FPGA -> SRAM-based FPGA -> FLEX 10KE family. Unlike ASICs, FPGAs ship as blank silicon and are programmed using HDL flows (VHDL/Verilog) via tools such as Altera/Intel Quartus, enabling rapid prototyping and low-NRE design cycles.
Key features of the EPF10K30EFC484-2 include 216 logic array blocks (LABs), 1728 LEs, 24,576 embedded SRAM bits organized as EABs (Embedded Array Blocks), 220 user I/Os, and support for LVTTL, LVCMOS, PCI, and other single-ended I/O standards through its configurable I/O elements. The device operates from a 2.5V core supply with separate VCCIO banks for I/O flexibility, and the -2 speed grade indicates a mid-range performance bin suitable for general-purpose datapath and control logic.
The FLEX 10KE architecture combines a row/column interconnect with distributed Look-Up Table (LUT) logic and dedicated EAB memory, allowing designers to instantiate RAM, ROM, multiplier functions, and FIFO buffers alongside glue logic. The 484-FBGA package maximizes I/O count while minimizing board area, making the device attractive for designs that would otherwise require multiple CPLDs or discrete logic.
Typical applications include telecommunications line cards, industrial control backplanes, low-density prototyping platforms, and legacy system upgrades where the FLEX 10KE is already deployed. Engineers also use it for educational platforms and as a stepping stone before migrating designs to Cyclone or MAX series devices.
When designing with this part, attention must be paid to I/O bank voltage grouping, JTAG configuration mode selection, and the fact that the FLEX 10KE family is now classified NRND/end-of-life by Intel. Designers should plan a migration path to a current-generation Cyclone or MAX device if long-term availability is required.
This page synthesizes distributor pricing, parametric datasheet values, drop-in alternative guidance, and practical design notes not found in the standalone manufacturer datasheet.
Drop-in alternatives for EPF10K30EFC484-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K30EFC484-2 (same form factor and footprint) — differing in Operating Temperature, Process Technology, Package, Mounting Type, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K30EFC484-1
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$67 / Unit
View Datasheet →EPF10K30EFC484-1N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EPF10K30EFC484-3
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EPF10K100EFC484-2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$185.4 / Unit
View Datasheet →EPF10K100EFC484-1
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$142 / Unit
View Datasheet →EPF10K130EFC484-2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$105 / Unit
View Datasheet →EPF10K30EFC484-2 Maximum Ratings & Electrical Characteristics
| Series | FLEX 10KE |
| Family | FLEX-10KE |
| Manufacturer | Intel / Altera |
| Logic Elements | 1728 |
| Logic Array Blocks (LABs) | 216 |
| Typical Gates | 30000 |
| Embedded Memory (RAM bits) | 24576 |
| Number of I/O | 220 |
| Supply Voltage - Core | 2.5 V |
| I/O Banks | Multi-bank with separate VCCIO |
| Operating Temperature | 0 C to 70 C (Commercial) |
| Package / Case | 484-BBGA (FineLine BGA) |
| Mounting Type | Surface Mount |
| Speed Grade | -2 |
| RoHS Status | Compliant |
| Process Technology | SRAM-based CMOS |
| Configuration | SRAM, JTAG/PS |
| Temperature Grade | Commercial |
EPF10K30EFC484-2 484-bbga (fineline bga) Pin Configuration Guide
Pin configuration for EPF10K30EFC484-2 (484-bbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K30EFC484-2.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K30EFC484-2 is suitable for 6 applications: Telecom Line Card Glue Logic, Industrial Control Backplane, Legacy Datapath Acceleration, Test & Measurement Instrumentation, Aerospace & Defense Avionics Retrofit, Educational & Prototyping Platforms.
Telecom Line Card Glue Logic
The EPF10K30EFC484-2 is widely used as glue logic on telecom line cards where it bridges backplane ASICs, network processors, and PHY interfaces. Its 1728 logic elements provide ample capacity for cell/frame delineation, ATM adaptation, HDLC framing, and bus arbitration, while 24,576 bits of embedded SRAM allow small CAMs and lookup tables to be implemented on-chip. The 220 user I/Os in the 484-FBGA package expose enough pins for 32-bit datapaths plus extensive control/status. The 0-70 C commercial temperature range fits environmentally controlled central-office shelves, and the FLEX 10KE -2 speed grade comfortably supports 33-66 MHz backplane operation typical of legacy telecom systems.
Recommended
Industrial Control Backplane
In industrial backplane designs the EPF10K30EFC484-2 acts as a programmable interface between backplane connectors and a host CPU or DSP, handling level translation, protocol conversion (e.g., parallel bus to SPI/I2C), and timing/sequencing logic. The 220 I/Os comfortably support multi-drop 8/16-bit parallel buses typical of PLC and motor-control cards, while the 24576 bits of EAB RAM can implement small FIFO buffers between asynchronous clock domains. Designers value the 484-FBGA package for its compact board footprint, allowing high I/O density on space-constrained Eurocard/PICMG form factors. The 2.5V core with banked VCCIO enables direct interfacing to 3.3V and 5V peripherals without external level shifters.
Recommended
Legacy Datapath Acceleration
The EPF10K30EFC484-2 is frequently deployed as a datapath accelerator in legacy systems that pre-date modern SoCs, offloading CRC/checksum computation, encryption, or signal-processing functions from the host CPU. Its 216 LABs implement wide arithmetic units (adders, accumulators, multipliers via EAB-based shift registers) that a low-cost MCU cannot match, while 24,576 bits of dual-port EAB RAM provide small coefficient buffers or history tables. The -2 speed grade sustains pipelined multipliers in the 60-80 MHz range, suitable for many real-time control loops. The 484-BGA package maximizes I/O density for parallel memory buses, and the 2.5V core keeps power dissipation manageable in fanless embedded chassis.
Recommended
Test & Measurement Instrumentation
The EPF10K30EFC484-2 is used in test and measurement equipment as a flexible pattern generator, timing sequencer, or instrument bus interface. Its 1728 LEs can implement complex trigger sequencers and parallel-to-serial/serial-to-parallel converters used in boundary-scan and JTAG-based production testers, while the 220 I/Os support the wide parallel stimulus/response buses common in ATE architectures. The 24576-bit EAB memory provides pattern-storage FIFOs that buffer long stimulus vectors. The 484-FBGA package's high I/O density is ideal for the many digital channels required, and the 0-70 C commercial temperature range suits bench-top and laboratory environments. Designers can re-use the same FPGA across product variants by simply reprogramming the SRAM.
Recommended
Aerospace & Defense Avionics Retrofit
In military and aerospace retrofit programs the EPF10K30EFC484-2 is used to replace obsolete discrete-logic or ASIC-based subsystems with a single reprogrammable device, extending the service life of legacy avionics platforms. Its 1728 LEs and 24,576 bits of EAB RAM provide ample capacity for MIL-STD-1553 bus interfaces, ARINC 429 channels, and discrete-signal conditioning, while 220 I/Os accommodate the many parallel sensors and actuators found in cockpit and engine-control LRUs. The 484-FBGA package maximizes channel density within the constrained avionics card envelope. Note that FLEX 10KE is not QML-qualified; aerospace programs typically require additional upscreening and derating analysis. Migration to a radiation-tolerant FPGA is recommended for new designs.
Recommended
Educational & Prototyping Platforms
The EPF10K30EFC484-2 is a common teaching and prototyping FPGA in university digital-logic labs and FPGA evaluation boards. With 1728 logic elements and 24576 bits of embedded RAM it offers enough capacity for student projects ranging from simple FSMs and UARTs to SDR controllers and CPU cores, while the 220 user I/Os provide generous breadboard-friendly expansion headers. The 484-FBGA package is typically mounted on a development board that breaks out all signals to 0.1-inch headers. Quartus II v9.1 (legacy) supports the full VHDL/Verilog flow, JTAG programming via USB-Blaster, and integrates with ModelSim-Altera for simulation. Schools value the part's mature toolchain and abundant reference designs.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K30EFC484-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K30EFC484-1 | EPF10K30EFC484-1N | EPF10K30EFC484-3 | EPF10K100EFC484-2 | EPF10K100EFC484-1 | EPF10K130EFC484-2 |
|---|---|---|---|---|---|---|---|
| Package | 484-FBGA (FineLine BGA) | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE |
| Logic Elements | 1728 | 1728 | 1728 | 1728 | 4992 | 4992 | 6656 |
| Typical Gates | 30000 | 30000 | 30000 | 30000 | 100000 | 100000 | 130000 |
| Embedded Memory (RAM bits) | 24576 | 24576 | 24576 | 24576 | 49152 | 49152 | 65536 |
| Speed Grade | -2 | -1 (slower) | -1 (slower) | -3 (faster) | -2 | -1 (slower) | -2 |
| Operating Temperature | 0 C to 70 C (Commercial) | 0 C to 70 C (Commercial) | 0 C to 70 C (Commercial) | 0 C to 70 C (Commercial) | 0 C to 70 C (Commercial) | 0 C to 70 C (Commercial) | 0 C to 70 C (Commercial) |
Key Differentiators
- Same-family pin-compatible scalability within the 484-FBGA footprint (vs EPF10K100EFC484-2)
- Mid-range -2 speed grade balances Fmax and cost (vs EPF10K30EFC484-1)
- Mature Quartus II v9.1 toolchain with extensive reference designs (vs Modern Cyclone V FPGA)
Design Notes
Estimated: The EPF10K30EFC484-2 requires a clean 2.5V core supply and banked VCCIO supplies (typically 3.3V, but each I/O bank supports 2.5V/3.3V/5V depending on the chosen I/O standard). Decouple each VCC/VCCIO pin with a 0.1 uF X7R ceramic capacitor placed within 100 mils of the BGA pad, and add bulk 10-47 uF tantalum or polymer capacitors at the supply entry points. Per the Altera FLEX 10KE datasheet, inrush current during SRAM configuration can exceed steady-state ICCIO - use a soft-start controller or current-limited LDO on the VCC rail. Estimated worst-case core current for a fully utilized 30K-gate design is approximately 200-300 mA; verify against the Icc vs utilization curve in the datasheet.
Estimated: The 484-FBGA package has a theta-JA of approximately 10-12 C/W with a standard 4-layer JEDEC test board. For a fully utilized design dissipating 1.5 W (typical for FLEX 10KE 30K at 2.5V), junction rise above ambient is approximately 15-18 C, so no heatsink is required. If the device is operated at elevated ambient (>50 C) or in a sealed enclosure, a thermal pad or copper pour directly beneath the BGA is recommended. Industrial-grade variants (EPF10K30EFI) extend the operating range to -40 C to +85 C with the same package.
The 484-FBGA uses a 1.0 mm ball pitch with a 22x22 array (with depopulated rows for I/O banks). PCB design MUST use microvia or via-in-pad technology for the inner rows to escape the BGA balls; a 4-layer stack-up with 0.5 oz copper outer and 1 oz inner is recommended. Per the Altera FLEX 10KE datasheet, all JTAG, configuration, and clock pins have specific routing requirements - keep configuration traces under 2 inches and add series 33 ohm damping resistors on clock inputs to reduce overshoot. Power planes should extend unbroken under the BGA to provide low-impedance return paths for high-speed signals.
Estimated: Three common pitfalls when using the EPF10K30EFC484-2: (1) Confusing the FLEX 10KE 'E' part with the FLEX 10K (no 'E') family - the pinouts are NOT compatible; (2) Using the modern Quartus Prime flow instead of legacy Quartus II v9.1 - the FLEX 10KE is not supported in current Quartus releases, so legacy toolchain preservation is essential; (3) Assuming the part is in volume production - FLEX 10KE is NRND and Intel/Altera does not recommend it for new designs; new programs should target the Cyclone IV or Cyclone V family. Source: Altera FLEX 10KE datasheet and NRND notice.
Compliance Information
RoHS and lead-free per Altera/Intel product page. Not AEC-Q100 qualified - the EPF10K30EFC484-2 is a commercial-grade (0-70 C) FLEX 10KE device. For automotive applications consider AEC-Q100-qualified Cyclone IV/V devices. FLEX 10KE is NRND.
