EPF10K30EFC256-2 - FLEX 10KE FPGA, 30K Gates, 256-FBGA | Altera
MPN: EPF10K30EFC256-2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.75 | $167.50 |
| 100 | $14.95 | $1,495.00 |
| 500 | $13.2 | $6,600.00 |
| 1,000 | $12.1 | $12,100.00 |
EPF10K30EFC256-2 Overview
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory that designers can re-configure in-system via SRAM lookup tables. Within the broader hierarchy, FPGAs sit alongside CPLDs (Complex Programmable Logic Devices) as the high-density branch of programmable logic; the FLEX 10KE family is a 0.22 um CMOS SRAM-based architecture that pioneered embedded array block (EAB) integration, foreshadowing modern System-on-a-Programmable-Chip (SoPC) designs. The EPF10K30E distinguishes itself with embedded dual-port RAM blocks, a 2.5 V core, and PCI compliance for bus-interface applications.
Key features include 1728 logic elements, 24,576 RAM bits distributed across embedded array blocks (EABs), 216 logic array blocks (LABs), 176 usable I/O pins, and a peak operating frequency around 200 MHz according to family specifications. The FLEX 10KE architecture supports in-system programmability via the IEEE 1149.1 JTAG interface and passive serial configuration, enabling rapid prototyping. With SRAM-based configuration, the device must be reconfigured at each power-up using an external configuration PROM such as the EPC2 or EPC8 series.
The EPF10K30E combines look-up-table (LUT)-based logic cells with embedded dual-port RAM, making it suitable for glue logic, bus interfaces, custom state machines, and moderate-density signal processing front-ends. Its embedded array blocks can implement FIFOs, ROM tables, and small DSP functions without consuming general-purpose logic. The 0.22 um CMOS process at 2.5 V core gives it better power efficiency than earlier 5 V FLEX 10K devices while preserving a familiar Quartus/MAX+PLUS II design flow.
Typical applications include PCI bus interfaces, telecommunications line cards, industrial control logic, glue logic for ASIC/ASSP replacement, and prototype systems that need a moderate gate count and a high I/O count. The 176 I/O pins accommodate wide data buses and parallel peripheral interfaces, while the embedded RAM blocks enable protocol buffering and lookup-table acceleration.
When designing with this FPGA, ensure the configuration PROM is sized appropriately for the bitstream and that JTAG chain integrity is validated before relying on in-system updates. Because the FLEX 10KE family is a mature, mature-generation part, lead-time risk is significant; verify distributor stock and lifecycle status before committing to a long-lifecycle design.
Drop-in alternatives for EPF10K30EFC256-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K30EFC256-2 (same form factor and footprint) — differing in Operating Temperature, Speed Grade, Package, Process Technology, Core Supply Voltage.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K30EFC256-2N
✅ Drop-In✓ In Stock
$48.57 / Unit
View Datasheet →EPF10K30EFC256-1
✅ Drop-In✓ In Stock
$69.5 / Unit
View Datasheet →EPF10K30EFC256-1X
✅ Drop-In✓ In Stock
$95.6 / Unit
View Datasheet →EPF10K30EFC256-2X
✅ Drop-In✓ In Stock
$17.95 / Unit
View Datasheet →EPF10K30EFC256-3N
✅ Drop-In✓ In Stock
$58 / Unit
View Datasheet →EPF10K30EFC256-2 Maximum Ratings & Electrical Characteristics
| Family | FLEX 10KE |
| Logic Elements / Cells | 1728 |
| System Gates | 30,000 |
| Embedded RAM Bits | 24,576 |
| Logic Array Blocks (LABs) | 216 |
| User I/Os | 176 |
| Package | 256-FBGA (17x17 mm) |
| Core Supply Voltage | 2.375 V to 2.625 V (typ 2.5 V) |
| Internal Operating Frequency | 80 MHz |
| Propagation Delay | 0.6 ns |
| Technology Node | 0.22 um CMOS |
| Operating Temperature | 0 C to 70 C (commercial) |
| Configuration Method | SRAM, JTAG (IEEE 1149.1), Passive Serial |
| Speed Grade | -2 (commercial, mid-speed) |
EPF10K30EFC256-2 Pin Configuration
| Pin A1 | I/O — User I/O pin (bank 1) |
| Pin B2 | I/O — User I/O pin (bank 1) |
| Pin C3 | I/O — User I/O pin (bank 2) |
| Pin D4 | VCCIO — I/O supply voltage |
| Pin E5 | I/O — User I/O pin (bank 3) |
| Pin F6 | I/O — User I/O pin (bank 4) |
| Pin G7 | GND — Ground |
| Pin H8 | VCCINT — Core supply voltage 2.5 V |
| Pin J9 | I/O — User I/O pin (bank 5) |
| Pin K10 | I/O — User I/O pin (bank 5) |
| Pin L11 | I/O — User I/O pin (bank 6) |
| Pin M12 | I/O — User I/O pin (bank 6) |
| Pin N13 | VCCIO — I/O supply voltage |
| Pin P14 | I/O — User I/O pin (bank 7) |
| Pin R15 | I/O — User I/O pin (bank 7) |
| Pin T16 | I/O — User I/O pin (bank 8) |
Typical Applications
EPF10K30EFC256-2 is suitable for 6 applications: PCI Bus Interface Bridge, Telecommunications Line Card Logic, Industrial Control Glue Logic, ASIC/ASSP Prototype Replacement, DSP and Signal Processing Front-End, Legacy System Modernization.
PCI Bus Interface Bridge
The EPF10K30EFC256-2 is well-suited for PCI bus interface bridges thanks to its 176 user I/Os and FLEX 10KE PCI-compliant I/O structure. The 1728 logic elements handle address decoding, transaction forwarding, and bus arbitration while the 24,576 RAM bits provide FIFO buffering for write/read data paths. Operating at 2.5 V core with 3.3/5.0 V PCI I/O tolerance, it directly interfaces to PCI slots without external level shifters. Designers can implement a 32-bit/33 MHz PCI target or master in a single device, replacing discrete TTL glue logic. Its 0.6 ns propagation delay ensures register-to-pin timing margins within the 33 MHz PCI specification, while the JTAG configuration interface simplifies in-system firmware updates during bridge bring-up.
Recommended
Telecommunications Line Card Logic
Telecommunications line cards benefit from the EPF10K30EFC256-2's embedded dual-port RAM blocks and 30K system gate density. The EABs implement small protocol FIFOs, HDLC framer lookup tables, and channel-associated signalling buffers without consuming LUT resources. With 176 user I/Os, the device routes directly to T1/E1 framers, LIUs, and backplane connectors. The 2.5 V core plus commercial 0-70 C temperature range fits central-office equipment thermal envelopes. Its 80 MHz internal frequency supports aggregate data rates up to 160 Mbps on parallel TDM buses. JTAG-based in-system programming accelerates line-card bring-up and field upgrades across deployed telecom infrastructure.
Recommended
Industrial Control Glue Logic
The EPF10K30EFC256-2 replaces multiple 17xx-series TTL/CMOS glue-logic chips in industrial control systems, integrating address decoding, custom state machines, and bus arbitrators into one SRAM-programmable device. Its 1728 logic elements typically absorb what would otherwise be 8-12 discrete 74-series packages, saving board area and improving noise immunity. The 176 I/Os handle multi-axis motor encoder inputs, parallel DAC/ADC interfaces, and CAN/RS-485 transceiver handshaking. The 2.5 V core plus 5.0 V-tolerant I/Os simplify mixed-voltage retrofits into existing 5 V industrial designs. JTAG configuration lets field engineers update control firmware without removing the board from service.
Recommended
ASIC/ASSP Prototype Replacement
Designers use the EPF10K30EFC256-2 as a fast-turn prototype before committing to an ASIC/ASSP mask set, validating control logic, data paths, and timing on real hardware within weeks. With 30K system gates and embedded RAM, the device closely emulates mid-complexity custom silicon, while the 256-FBGA package fits standard 17x17 mm land patterns used by many production ASICs. Iterative design changes are downloaded via JTAG in seconds versus ASIC re-spins costing months. Once volume justifies NRE, the verified HDL migrates directly to a foundry target, accelerating time-to-market. The mature Quartus/MAX+PLUS II toolchain lowers the entry barrier for legacy design teams.
Recommended
DSP and Signal Processing Front-End
The EPF10K30EFC256-2's 24,576 RAM bits and 1728 logic elements support small DSP front-end functions such as digital filters, FFT twiddle-factor ROMs, and sample-rate converters. Each EAB implements 256x8 or 512x4 dual-port memories, enabling coefficient storage for FIR filters or data buffering between cascaded processing stages. At 80 MHz, the device sustains 80 MSPS on 16-bit datapaths, suitable for instrumentation and baseband processing. Designers implement multipliers via LUT-based shift-and-add trees or pair the FPGA with an external multiplier IC. Its SRAM configurability allows algorithm tuning in-system without board rework.
Recommended
Legacy System Modernization
The EPF10K30EFC256-2 is commonly deployed to extend the life of legacy systems whose original FPGAs have reached end-of-life or supply exhaustion. Maintenance teams use it to replicate obsolete 17-series logic arrays in industrial controllers, medical instrumentation, and military electronics. Its 256-FBGA footprint and standard FLEX 10KE pinout fit many legacy board layouts, enabling drop-in retrofits. Rochester Electronics and authorized brokers maintain traceable inventory for programs requiring long-term support. By standardizing on this mature family, designers secure parts through 2030+ for sustaining engineering programs that cannot tolerate re-design cycles.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K30EFC256-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K30EFC256-2N | EPF10K30EFC256-1 | EPF10K30EFC256-1X | EPF10K30EFC256-2X | EPF10K30EFC256-3N |
|---|---|---|---|---|---|---|
| Package | 256-FBGA (17x17 mm) | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE |
| Logic Elements | 1728 | 1728 | 1728 | 1728 | 1728 | 1728 |
| Speed Grade | -2 (commercial, mid-speed) | -2 (lead-free) | -1 (slower) | -1 industrial option | -2X (faster) | -3 (slowest) |
| Core Voltage | 2.5 V (2.375-2.625 V) | 2.5 V (2.375-2.625 V) | 2.5 V (2.375-2.625 V) | 2.5 V (2.375-2.625 V) | 2.5 V (2.375-2.625 V) | 2.5 V (2.375-2.625 V) |
| User I/Os | 176 | 176 | 176 | 176 | 176 | 176 |
| Lead-Free | No | Yes (Pb-free) | No | No | No | Yes (Pb-free) |
| Lifecycle Status | Obsolete / Mature | Obsolete / Mature | Obsolete / Mature | Obsolete / Mature | Obsolete / Mature | Obsolete / Mature |
Key Differentiators
- Balanced -2 speed grade for commercial timing (vs EPF10K30EFC256-1)
- Standard SnPb terminal finish (vs Pb-free -2N) (vs EPF10K30EFC256-2N)
- Mature FLEX 10KE family with broad third-party support (vs EPF10K30ATC144-3)
Design Notes
Estimated: The EPF10K30EFC256-2 draws approximately 150-300 mA from the 2.5 V core supply at full activity (1728 LEs active, 80 MHz toggling). Add a 10 uF bulk plus 0.1 uF ceramic decoupling capacitor pair per VCCINT ball and a similar network on each VCCIO bank. Sequence VCCINT before VCCIO during power-up per Altera's FLEX 10KE handbook to prevent I/O latch-up. The 256-FBGA package has excellent thermal performance but still requires thermal vias under the center balls for designs sustaining >85% utilization.
Use a 256-ball BGA land pattern on the PCB with 1.0 mm pitch (17x17 mm body). Route signals on inner layers using microstrip/stripline topology with 50 ohm controlled impedance. Provide a solid ground plane on layer 2 directly beneath the device to minimize return-path inductance. JTAG signals (TDI, TDO, TMS, TCK, TRST) must be guarded with series 33 ohm resistors near the FPGA pins and should not exceed 4 inches total trace length to ensure reliable IEEE 1149.1 boundary-scan operation.
Critical: The FLEX 10KE is SRAM-based - the configuration is lost on power-down. Always pair this FPGA with a configuration PROM (EPC2 or EPC8 series) or external microcontroller to load the bitstream at every power-up. Do not assume JTAG programming is sufficient for production; field returns from unprogrammed devices are common. Also verify the configuration mode (Passive Serial vs JTAG) MSEL pin strapping matches your design intent before committing to layout - mismatches cause silent configuration failures.
Compliance Information
RoHS and REACH compliance data not provided in verified sources. The -2 suffix indicates standard SnPb finish (not lead-free); the -2N variant is the lead-free equivalent. AEC-Q100 not applicable for commercial-grade FPGA. Designers needing Pb-free compliance should select EPF10K30EFC256-2N.
