Intel

EPF10K50EQC240-2N - FLEX 10KE FPGA 50K Gates 240-PQFP | Intel / Altera

MPN: EPF10K50EQC240-2N ✗ End of Life
In Stock Ships in 1-3 business days
2.5 V Vdss PCI, LVTTL, LVCMOS (5.0 V / 3.3 V / 2.5 V) Rds(on) 240-pin PQFP / BFQFP Package
From $87.2 USD / Unit
MOQ: 1 |
Price updated: 2026-09-11
Volume Pricing
Qty Unit Price Extended
1 $145 $145.00
10 $128.5 $1,285.00
100 $112 $11,200.00
500 $98.75 $49,375.00
1,000 $87.2 $87,200.00
ℹ️ All prices are in USD

EPF10K50EQC240-2N Overview

The Intel / Altera EPF10K50EQC240-2N is a member of the FLEX 10KE family of embedded programmable logic devices, integrating 50,000 typical gates, 2,880 logic elements (LEs) and 360 Logic Array Blocks (LABs) into a 240-pin Plastic Quad Flat Pack (PQFP / BFQFP) package. According to the Altera datasheet, the device is fabricated on a 0.22 µm CMOS process, operates from a 2.5 V internal supply, and offers 189 user I/Os with 40,960 bits of embedded SRAM. It is rated for the commercial temperature range of 0 °C to 70 °C and supports in-circuit reconfigurability via JTAG or external configuration devices.

A Field Programmable Gate Array (FPGA) is a type of integrated circuit containing an array of programmable logic blocks, configurable interconnects, and embedded memory that can be customized after manufacturing to implement arbitrary digital logic. FPGAs sit in the broader programmable-logic hierarchy between simple PLDs (CPLDs) and fixed-function ASICs, and are widely used for glue logic, prototyping, DSP front-ends, and small-to-medium gate-count glue replacement. The FLEX 10KE family was Altera's first embedded-array family offering megafunction-class memory alongside general-purpose logic, enabling System-on-a-Programmable-Chip (SOPC) integration.

Key features of the EPF10K50EQC240-2N include its 50K-gate logic capacity, 0.22 µm process node, 200 MHz internal performance, dedicated clock-distribution trees with low skew, pull-up resistors on I/O pins during configuration, and PCI-SIG compliance. The device supports multi-volt I/O interfacing with 5.0 V, 3.3 V and 2.5 V environments through programmable I/O standards, which is critical when bridging legacy and modern logic families on the same board.

Architecturally, the FLEX 10KE combines a fine-grained Look-Up Table (LUT) based logic fabric with embedded array blocks (EABs) used to implement RAM, ROM, multiplier, or state-machine megafunctions. The 2,880 LEs are arranged into 360 LABs of 8 LEs each, and the four EABs supply the 40,960 bits of SRAM (equivalent to 5,120 bytes) that can be configured as single-port RAM, dual-port RAM, ROM, or content-addressable memory.

Typical applications include industrial control and factory-automation boards, telecommunications glue logic and channel cards, military/aerospace ruggedized controllers, prototyping for ASIC replacement, and PCI bus interface cards. The 240-pin PQFP footprint remains convenient for hand-rework and prototype builds where a BGA would be impractical.

When designing with the EPF10K50EQC240-2N, plan I/O bank assignment carefully because the 2.5 V core and multi-voltage I/O require separate power rails (VCCINT and VCCIO), and unused pins must be left floating or driven to a defined state after configuration. Configuration storage should use an Altera EPC-series configuration PROM or JTAG download cable.

This page synthesizes distributor pricing, lifecycle status, drop-in alternatives from the Site MPN list, and practical design notes not consolidated on a single manufacturer datasheet, giving engineers a faster path to a sourcing decision for legacy FLEX 10KE designs.

Drop-in alternatives for EPF10K50EQC240-2N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EPF10K50EQC240-2N (same form factor and footprint) — differing in Process Technology, Package, Family, Operating Temperature, Mounting Type.

Intel
Operating Temperature: 0 °C to 70 °C (Commercial)
Mounting Type: Surface Mount (Gull Wing)
Compare with EPF10K50EQC240-2N →
Altera
Operating Temperature: 0 °C to +85 °C (Commercial)
Mounting Type: Surface Mount (PQFP)
Compare with EPF10K50EQC240-2N →
Intel
Package: 240-BFQFP / PQFP-240 (34.6 × 34.6 mm, 0.5 mm pitch)
Family: FLEX-10KE
Mounting Type: Surface Mount (gull-wing leads)
Compare with EPF10K50EQC240-2N →
Altera
Process Technology: 0.22 um CMOS
Operating Temperature: 0 C to +70 C (Commercial)
Mounting Type: Surface Mount (PQFP)
Compare with EPF10K50EQC240-2N →
Intel
Process Technology: 0.22 µm CMOS SRAM
Family: FLEX 10K
Compare with EPF10K50EQC240-2N →
Intel
Process Technology: 0.22 µm CMOS, SRAM-based
Operating Temperature: -40 °C to +85 °C (Industrial)
Mounting Type: Surface Mount (SMD/SMT)
Compare with EPF10K50EQC240-2N →
Altera
Process Technology: 0.42 µm
Package: 240-BFQFP Exposed Pad (RQFP)
Family: FLEX 10K (FPGA)
Compare with EPF10K50EQC240-2N →
Intel
Process Technology: 0.22 micrometer CMOS
Package: 240-PQFP / 240-BFQFP (32 x 32 mm)
Family: FLEX 10KS
Compare with EPF10K50EQC240-2N →
Intel
Package: 240-BFQFP (PQFP-240)
Operating Temperature: 0 °C to 70 °C (commercial)
Compare with EPF10K50EQC240-2N →
Altera
Package: 240-pin PQFP (Power Quad Flat Pack), 34.60 x 34.6 mm, 0.5 mm pitch
Operating Temperature: 0 °C to 70 °C (Commercial)
Compare with EPF10K50EQC240-2N →
Altera
Process Technology: 0.42 micrometer CMOS, 4-layer metal
Package: 240-BFQFP (240-PQFP / FQFP / QFP-240)
Family: FLEX 10K
Compare with EPF10K50EQC240-2N →
Intel
Process Technology: 0.42 µm CMOS
Family: FLEX 10K (FLEX 10KE)
Compare with EPF10K50EQC240-2N →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EPF10K50EQC240-2

✅ Drop-In
Intel
📦 240-Pin PQFP
FLEX-10KE · 2,880 · 50,000 (40,960 typical) · 360 · 12 · 20,480 bits · 189 · 200 MHz

✓ In Stock

$65 / Unit

View Datasheet →

EPF10K50EQC240-1N

✅ Drop-In
Altera
📦 240-Pin PQFP
FLEX 10KE · 2880 · 40960 · 50K · 360 LABs · 189 · 2.5 V · 2.5 V / 3.3 V / 5 V

✓ In Stock

$132.1 / Unit

View Datasheet →

EPF10K50EQC240-1

✅ Drop-In
Intel
📦 240-Pin PQFP
FLEX 10KE · EPF10K50E · 2880 · 50000 · 360 · 40960 · 189 · 240

✓ In Stock

$26.8 / Unit

View Datasheet →

EPF10K50EQC240-2N Maximum Ratings & Electrical Characteristics

Family FLEX 10KE
Logic Elements (LEs) 2,880
Logic Array Blocks (LABs) 360
Typical Gates 50,000
Embedded SRAM 40,960 bits (5,120 bytes)
Embedded Array Blocks (EABs) 4
Maximum User I/Os 189
Package 240-pin PQFP / BFQFP
Process Technology 0.22 µm CMOS
Internal Supply Voltage (VCCINT) 2.5 V
Internal Performance 200 MHz
Propagation Delay 0.6 ns
Operating Temperature 0 °C to +70 °C (commercial)
Configuration Method JTAG / external EPC PROM / intelligent controller
I/O Standards Supported PCI, LVTTL, LVCMOS (5.0 V / 3.3 V / 2.5 V)
Mounting Type Surface Mount
PCI Compliance PCI-SIG compliant

EPF10K50EQC240-2N 240-pin pqfp / bfqfp Pin Configuration Guide

Pin configuration for EPF10K50EQC240-2N (240-pin pqfp / bfqfp package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

240-pin pqfp / bfqfp package pinout diagram for EPF10K50EQC240-2N

No detailed pinout data available for EPF10K50EQC240-2N.

Refer to the datasheet for full pin configuration.

Typical Applications

EPF10K50EQC240-2N is suitable for 6 applications: Industrial Control & Factory Automation, Telecommunications Glue Logic & Channel Cards, ASIC Prototyping & Logic Replacement, Military & Aerospace Ruggedized Controllers, PCI Bus Interface Cards, Legacy System Sustenance & Drop-in Replacement.

🏭

Industrial Control & Factory Automation

The EPF10K50EQC240-2N is well suited to industrial control and factory automation boards where the 240-pin PQFP package is preferred for hand-rework and prototype-friendly assembly. With 2,880 logic elements, 189 user I/Os, and 4 embedded array blocks providing 40 Kbits of fast on-chip SRAM, the device can implement multiple machine-state controllers, encoder interfaces and serial-protocol bridges in a single chip. Its 2.5 V core and multi-voltage I/O banks let designers interface to legacy 5 V sensors as well as 3.3 V microcontrollers without external level shifters. The 0.6 ns propagation delay and 200 MHz internal Fmax are sufficient for deterministic control-loop logic, and PCI-SIG compliance simplifies integration with industrial-PCI backplanes used in factory PCs and motion controllers.

🌐

Telecommunications Glue Logic & Channel Cards

Telecommunications channel cards historically used FLEX 10KE devices as flexible glue logic between DSP processors, framers and backplane transceivers. The EPF10K50EQC240-2N fits this role with 360 LABs for state-machine-rich protocols such as HDLC, UART and custom serial interfaces, while the 4 EABs (40 Kbits of SRAM) provide the small but fast FIFOs and lookup tables required for rate adaptation. The 240-pin PQFP footprint delivers 189 user I/Os — enough to bond out multiple parallel data buses plus JTAG, clock-distribution trees and interrupt lines. PCI compliance enables direct connection to telecom-PCI mezzanine cards, and the 0.22 µm CMOS process combined with the 2.5 V core supply keeps dynamic power well below that of older FLEX 10K parts, which is valuable in always-on central-office equipment.

🔧

ASIC Prototyping & Logic Replacement

Engineers prototyping an ASIC design or replacing obsolete discrete-logic boards frequently adopt the EPF10K50EQC240-2N as a target device. Its 50,000 typical gates and 360 LABs offer sufficient capacity for medium-complexity ASICs, while the 4 EABs supply the small embedded RAMs and ROMs that would otherwise require a separate companion chip. The 240-pin PQFP package allows quick board spins without the X-ray inspection required for BGA packages, accelerating development cycles. PCI-SIG compliance means prototype boards can drop straight into PCI evaluation slots, and the 2.5 V core with multi-voltage I/O lets prototypes talk to legacy 5 V peripherals exactly as the production ASIC would. Once the ASIC tape-out is complete, the FLEX 10KE device continues to serve as a low-volume production substitute.

✈️

Military & Aerospace Ruggedized Controllers

Within extended-temperature systems the EPF10K50EQC240-2N is sometimes deployed alongside its industrial-grade siblings (e.g. EPF10K50VRC240-4) in subsystems that operate at controlled ambient temperatures. The device's 189 user I/Os make it suitable for backplane buffering, ARINC-429 channel aggregation and discrete-signal monitoring in ruggedized controllers. Embedded array blocks supply 40 Kbits of SRAM for small event logs or built-in-test result storage, reducing the need for external SRAM in space-constrained chassis. PCI compliance eases integration with ruggedized single-board computers using the PCI bus. Designers must still validate the commercial 0-70 °C range against their specific mission profile and de-rate appropriately if the system is exposed to wider temperature swings.

🖥️

PCI Bus Interface Cards

The EPF10K50EQC240-2N is fully PCI-SIG compliant, which made it a popular choice for custom PCI add-in cards such as data-acquisition boards, DSP accelerator cards and industrial I/O cards. The 240-pin PQFP footprint gives designers 189 user I/Os — sufficient to expose the 32-bit/33 MHz PCI bus plus a wide external local bus to the host-side connector. Embedded array blocks (40 Kbits) act as small DMA FIFOs, while 360 LABs implement the PCI target/master state machines plus the application's glue logic in a single device. Multi-voltage I/O allows the local bus to operate at 3.3 V or 5 V independent of the PCI segment, simplifying mixed-voltage designs.

💡

Legacy System Sustenance & Drop-in Replacement

Many defense, medical and industrial OEMs still maintain field-deployed systems built around the FLEX 10KE family. The EPF10K50EQC240-2N is itself a drop-in for the EPF10K50EQC240-2 (same die, same footprint), and it can be cross-stocked with EPF10K50EQC240-1N variants for less timing-critical subassemblies. With 2,880 logic elements and 189 user I/Os, the device covers the gate counts typical of legacy controller cards. Designers sustaining older equipment should pair the EPF10K50EQC240-2N with the same Altera Quartus II design flow (legacy support branch) and EPC-series configuration PROMs to ensure bitstream compatibility. For new designs, migrating to a Cyclone IV E or Cyclone 10 LP equivalent is recommended to escape the FLEX 10KE end-of-life roadmap.

What is the EPF10K50EQC240-2N and which family does it belong to?
The EPF10K50EQC240-2N is a member of the Intel / Altera FLEX 10KE family of embedded programmable logic devices. According to the Altera datasheet, it integrates 2,880 logic elements (50,000 typical gates), 360 LABs, 4 Embedded Array Blocks (EABs) and 189 user I/Os in a 240-pin PQFP package, fabricated on a 0.22 µm CMOS process with a 2.5 V core supply.
How much embedded memory does the EPF10K50EQC240-2N provide?
The EPF10K50EQC240-2N integrates 40,960 bits of embedded SRAM organized across 4 Embedded Array Blocks (EABs). Each EAB can be configured as single-port RAM, dual-port RAM, ROM, multiplier logic, or content-addressable memory, providing roughly 5,120 bytes of fast on-chip storage distributed throughout the logic fabric.
What package does the EPF10K50EQC240-2N ship in?
The EPF10K50EQC240-2N is supplied in a 240-pin Plastic Quad Flat Pack (PQFP / BFQFP) measuring approximately 32 mm × 32 mm with 0.5 mm pin pitch. The PQFP footprint is convenient for prototype and hand-rework builds because gull-wing leads are accessible with standard soldering tools, unlike BGA alternatives.
Is the EPF10K50EQC240-2N still in production?
No. According to the Altera (now Intel) FLEX 10KE product family page, the EPF10K50EQC240-2N is obsolete (lifecycle_status = obsolete). Remaining inventory is available through distributors such as DigiKey and Mouser, but no new factory production is planned for the FLEX 10KE family.
Where can I buy the EPF10K50EQC240-2N today?
The EPF10K50EQC240-2N can be sourced from authorized distributors including DigiKey, Mouser, Arrow, TrustedParts and Octopart-listed brokers. Pricing varies from approximately $145 at qty-1 to $87 at qty-1000 as of 2026-09-11, with lead times typically 4-12 weeks because the part is no longer factory-fresh.
What is the price of the EPF10K50EQC240-2N?
According to Octopart distributor data as of 2026-09-11, the EPF10K50EQC240-2N lists from approximately $145 in single-piece quantities, dropping to about $87 per unit at qty-1000. Because the part is obsolete, expect brokers to apply price premiums when factory stock is exhausted.
What is the lead time for the EPF10K50EQC240-2N?
Lead time for the EPF10K50EQC240-2N is typically 4-12 weeks as of 2026-09-11 because the FLEX 10KE family is obsolete. Stock is fragmentary across distributors, and brokers may extend lead times significantly when sourcing from decommissioned factory lots.
EPF10K50EQC240-2N vs EPF10K50EQC240-1N - what is the difference?
The EPF10K50EQC240-2N is the speed-grade -2 variant (commercial, ~200 MHz internal performance), while the EPF10K50EQC240-1N is the slower -1 speed grade. Both share the same 240-pin PQFP package, 2,880 LEs and 189 user I/Os, so they are pin-compatible but the -2 offers higher internal Fmax for timing-critical designs.
EPF10K50EQC240-2N vs EPF10K30EQC240-2 - which is better for a 30K-gate design?
For a 30K-gate design the EPF10K30EQC240-2 is typically sufficient and more cost-effective, while the EPF10K50EQC240-2N provides 67 % more logic capacity (50K vs 30K typical gates) plus more headroom for future feature growth. Choose EPF10K50EQC240-2N when margin for design iteration is needed; choose the EPF10K30EQC240-2 when unit cost dominates.
When should I choose the EPF10K50EQC240-2N over the EPF10K50VRC240-4?
Choose the EPF10K50EQC240-2N when you need the enhanced FLEX 10KE architecture (more EAB memory and 2.5 V core) in a commercial temperature range. Choose the EPF10K50VRC240-4 when your design requires the industrial or military temperature range (-40 °C to +100 °C) and a higher speed grade than -2.
What is the best drop-in replacement for the EPF10K50EQC240-2N?
The best drop-in replacements for the EPF10K50EQC240-2N are same-package FLEX 10KE variants on the Altera/Intel roadmap, namely the EPF10K50EQC240-2 (commercial, same die) and the EPF10K50EQC240-1N (speed-grade -1, same footprint). For modern designs, migration to a Cyclone IV or Cyclone 10 LP device is recommended.
Where to download the EPF10K50EQC240-2N datasheet PDF?
The EPF10K50EQC240-2N datasheet can be downloaded from Octopart's datasheet portal at https://octopart.com/datasheet/altera/EPF10K50EQC240-2N or from the AlteraSemi mirror. Both host the full original FLEX 10KE datasheet including pinout, timing, and configuration details.
Where to find the EPF10K50EQC240-2N pinout diagram?
The EPF10K50EQC240-2N pinout is documented on page 7 of the FLEX 10KE datasheet (240-pin PQFP / BFQFP). The package_svg_key on this page renders the standard QFP-240 pin numbering starting at pin 1 in the top-left corner with the dot marker.
Hey Google, can the EPF10K50EFC256-3 replace the EPF10K50EQC240-2N?
No. The EPF10K50EFC256-3 ships in a 256-pin Fine-pitch Ball Grid Array (FBGA) with a different footprint than the 240-pin PQFP of the EPF10K50EQC240-2N. Although both are FLEX 10KE family members with the same 2,880 LEs, the FBGA package requires a completely new PCB land pattern and is therefore not a drop-in replacement.
What are the key specifications of the EPF10K50EQC240-2N that engineers should know?
Key specifications: 2,880 logic elements (50,000 typical gates), 360 LABs, 4 EABs providing 40,960 bits of embedded SRAM, 189 user I/Os, 240-pin PQFP package, 2.5 V core supply, 0.22 µm CMOS process, 200 MHz internal performance, PCI-SIG compliance, and commercial 0 °C to +70 °C operating range. The part is obsolete but still available through authorized distributors as of 2026-09-11.

Engineering reference data for EPF10K50EQC240-2N — comparison, design guidance, and compliance information.

Selection Guide

Choose the EPF10K50EQC240-2N when sustaining a legacy FLEX 10KE design that was originally compiled against the -2 speed grade and uses the 240-pin PQFP footprint. For new designs with no legacy constraints, migrate to a Cyclone IV E or Cyclone 10 LP equivalent to escape the FLEX 10KE end-of-life roadmap. Pick the EPF10K50EQC240-1N if your timing analysis closes with significant margin and you want a slightly cheaper -1 speed-grade drop-in. Pick the EPF10K50EQC240-2 (no 'N' suffix) for the cleanest commercial BOM line when the datasheet marking variant is acceptable. All three alternatives share the same 240-pin PQFP footprint and 2,880 logic-element fabric, so PCB layout and Quartus II pin assignments are fully reusable.

Comparison with Alternatives

Parameter This Product EPF10K50EQC240-2 EPF10K50EQC240-1N EPF10K50EQC240-1
Brand Intel (formerly Altera) Intel Intel Intel
Package 240-Pin PQFP / BFQFP 240-Pin PQFP — same 240-Pin PQFP — same 240-Pin PQFP — same
Logic Elements 2,880 2,880 2,880 2,880
Speed Grade -2 -2 -1 (slower Fmax) -1 (slower Fmax)
Embedded SRAM 40,960 bits 40,960 bits 40,960 bits 40,960 bits
User I/Os 189 189 189 189
Process / Core Voltage 0.22 µm / 2.5 V 0.22 µm / 2.5 V 0.22 µm / 2.5 V 0.22 µm / 2.5 V
Lifecycle Status Obsolete Obsolete Obsolete Obsolete

Key Differentiators

  • Speed grade -2 with ~200 MHz internal Fmax (vs EPF10K50EQC240-1N)
  • Commercial temperature grade with extended Altera/Intel support (vs EPF10K50VRC240-4)
  • 240-pin PQFP for hand-rework-friendly prototyping (vs EPF10K50EFC256-3)

Design Notes

The EPF10K50EQC240-2N requires two separate power rails: VCCINT at 2.5 V for the core logic and VCCIO for the I/O banks (2.5 V / 3.3 V / 5.0 V depending on the bank). Decouple each VCCINT pin with a 0.1 µF ceramic capacitor placed as close as possible to the package, and add a bulk 33 µF tantalum or polymer capacitor near the PQFP's power-pad pins to suppress transient currents during configuration and global-clock switching.

Place a low-impedance ground plane directly under the 240-pin PQFP footprint and stitch vias around the perimeter to minimize ground bounce on the high-speed clock distribution trees. Route the dedicated CLK0/CLK1 inputs with 50 Ω controlled impedance and series-terminate at the source if the trace exceeds about 25 mm, otherwise the low-skew clock network can introduce timing violations on the LAB registers.

Estimated: configuration bitstream compatibility — the EPF10K50EQC240-2N is pin-compatible with EPF10K50EQC240-2 (same die) but NOT bitstream-compatible with EPF10K50VRC240-4 (industrial variant). Recompile the Quartus II project when migrating between commercial and industrial temperature grades. Also, unused I/O pins must be left floating or set to tri-state input with weak pull-up; driving them low during configuration can interfere with the JTAG / EPC configuration handshake.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

FLEX 10KE is a legacy family originally released by Altera in the late 1990s; RoHS/REACH compliance was not specified in the verified distributor data. AEC-Q100 is not applicable (FPGA, not an automotive-qualified simple IC). Marked [DATA_NEEDED] in specs for RoHS.

Data verified on: 2026-09-11 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera EPF10K50EQC240-2N EPF10K50EQC240-2 EPF10K50EQC240-1N EPF10K50EQC240-1 FLEX 10KE FPGA Field Programmable Gate Array PLD Logic Element Logic Array Block Embedded Array Block PQFP BFQFP PCI-SIG JTAG 0.22 µm CMOS 2.5 V core supply embedded SRAM Quartus II EPC configuration PROM industrial automation ASIC prototyping telecommunications
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