EPF10K50EQC240-1N - FLEX 10KE FPGA 50K Gates 2880 Cells 240-PQFP | Altera
MPN: EPF10K50EQC240-1N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $171.14 | $171.14 |
| 10 | $165.44 | $1,654.40 |
| 100 | $148.32 | $14,832.00 |
| 250 | $138.5 | $34,625.00 |
| 500 | $132.1 | $66,050.00 |
EPF10K50EQC240-1N Overview
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that contains an array of configurable logic blocks, programmable interconnect, and I/O cells, all of which can be reconfigured by the designer after manufacture. FPGAs sit in the broader taxonomy of programmable logic device (PLD) -> logic IC -> integrated circuit (IC) -> semiconductor. Unlike ASICs, FPGAs allow rapid prototyping and field upgrades without fabrication cycles, making them ideal for glue logic, custom state machines, and glue between microprocessors and peripherals.
Key features of the EPF10K50EQC240-1N include 360 Logic Array Blocks (LABs), 50K gates of logic capacity, 2880 logic cells, 12 Embedded System Blocks (ESBs) providing 40,960 bits of RAM, true dual-port RAM support, multi-volt I/O supporting 2.5V/3.3V/5V interfacing, in-system programmability via the serial passive (PS) configuration mode, and JTAG boundary-scan test support per IEEE 1149.1. The part is specified over the commercial 0 °C to +85 °C temperature range, with internal performance capable of 250 MHz operation.
Architecturally, the FLEX 10KE device uses a continuous, fine-grained interconnect called the FastTrack Interconnect, with each row and column of logic elements routed through this interconnect to deliver predictable timing. The 0.22 µm process and 2.5V core allow low static and dynamic power dissipation while supporting fast propagation delays of approximately 0.5 ns per logic element.
Typical applications include telecommunications line-card glue logic, industrial control and instrumentation interfaces, PCI bus bridges, video processing front-ends, custom peripheral controllers for legacy microprocessors, and prototyping for ASIC replacement. The 189 user I/Os and multi-volt capability make the device well suited to bridging 5V peripherals to 3.3V or 2.5V ASICs and processors.
When designing with this part, note that the configuration scheme must be selected (e.g., PS, AS, JTAG) and the Quartus / MAX+PLUS II tool flow used. The 240-pin PQFP footprint requires through-hole-style soldering or a socket; consider the FQFP variant (EPF10K50EQI240-1N) only if industrial temperature range is required, not for package differences.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet, supporting both procurement engineers and FPGA designers.
Drop-in alternatives for EPF10K50EQC240-1N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K50EQC240-1N (same form factor and footprint) — differing in Operating Temperature, RoHS Status, Process Technology, Package, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K50EQC240-1
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$26.8 / Unit
View Datasheet →EPF10K50EQC240-3
✅ Drop-In✓ In Stock
$21 / Unit
View Datasheet →EPF10K50SQC240-2
✅ Drop-In📋 Reference alternative (not in catalog)
EPF10K100EQC240-1N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$55.95 / Unit
View Datasheet →EPF10K130EQC240-1N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$88.4 / Unit
View Datasheet →EPF10K50EQI240-1N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EPF10K50EQC240-1N Maximum Ratings & Electrical Characteristics
| Family | FLEX 10KE |
| Logic Elements / Cells | 2880 |
| Total RAM Bits | 40960 |
| Number of Logic Gates | 50K |
| Number of LABs/CLBs | 360 LABs |
| Number of I/O | 189 |
| Supply Voltage (Core) | 2.5 V |
| Supply Voltage (I/O MultiVolt) | 2.5 V / 3.3 V / 5 V |
| Process Technology | 0.22 µm CMOS |
| Maximum Internal Frequency | 250 MHz |
| Propagation Delay | 0.5 ns |
| Operating Temperature | 0 °C to +85 °C (Commercial) |
| Mounting Type | Surface Mount (PQFP) |
| Package | 240-pin PQFP / BFQFP |
| Configuration Mode | Passive Serial (PS), JTAG |
| JTAG Boundary Scan | IEEE 1149.1 compliant |
EPF10K50EQC240-1N 240-pin pqfp / bfqfp Pin Configuration Guide
Pin configuration for EPF10K50EQC240-1N (240-pin pqfp / bfqfp package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K50EQC240-1N.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K50EQC240-1N is suitable for 6 applications: Telecommunications Line-Card Glue Logic, PCI Bus Bridge / Interface Controller, Industrial Control and Instrumentation, Video Processing Front-End, ASIC Replacement and Prototyping, Legacy Microprocessor Peripheral Controller.
Telecommunications Line-Card Glue Logic
The EPF10K50EQC240-1N is well suited for telecom line-card glue logic where 50K gates and 189 I/Os are sufficient to bridge a network processor to TDM framer, PHY, and LEDs. With 250 MHz internal performance and 0.5 ns propagation delay, the device meets typical 77.76 MHz TDM clocking requirements with margin. MultiVolt I/O supports 5V legacy framer interfaces while the 2.5V core minimizes power; 360 LABs allow partitioning glue logic into predictable timing regions.
Recommended
PCI Bus Bridge / Interface Controller
With 189 user I/Os and predictable interconnect timing, the EPF10K50EQC240-1N is widely used as a 32-bit PCI bus bridge between a host processor and legacy peripherals. The 360 LABs map cleanly to PCI state machines and target/master control logic, while 12 Embedded System Blocks (40,960 RAM bits) handle small FIFOs and configuration registers. MultiVolt I/O directly interfaces 5V PCI bus while the 2.5V core keeps dissipation low in compact line cards.
Recommended
Industrial Control and Instrumentation
Industrial PLC and instrumentation backplanes rely on the EPF10K50EQC240-1N for custom I/O expansion, encoder interfacing, and motor-control sequencing. The 50K-gate capacity comfortably hosts DSP-style state machines, encoder quadrature decoders, and isolated SPI/UART bridges. The commercial 0 °C to +85 °C range covers most cabinet installations, while MultiVolt I/O simplifies interfacing 5V sensors and 24V opto-isolated inputs through external dividers.
Recommended
Video Processing Front-End
The EPF10K50EQC240-1N is a strong fit for video pipeline pre-processing in broadcast and security equipment: line-buffer management, genlock generation, and overlay insertion. The 40,960 bits of embedded RAM are allocated as line buffers, while 189 I/Os simultaneously drive ITU-R BT.656 video buses, sync separators, and host control paths. At 250 MHz internal frequency, the device meets standard-definition video timing with margin; for HD, consider FLEX 10KE 100K-gate siblings.
Recommended
ASIC Replacement and Prototyping
Designers prototyping ASICs use the EPF10K50EQC240-1N to validate gate-level designs before mask tape-out. With 50K gates, 360 LABs, and 40,960 bits of embedded RAM, the device approximates small-to-medium ASICs in telecommunications and storage. The FLEX 10KE architecture uses continuous FastTrack interconnect with predictable timing, simplifying pre-tape-out verification. MultiVolt I/O permits the FPGA prototype to mimic the ASIC's 5V/3.3V I/O environment exactly.
Recommended
Legacy Microprocessor Peripheral Controller
The EPF10K50EQC240-1N is frequently deployed as a custom peripheral controller for legacy 8051, 68k, or MIPS microprocessors in industrial and embedded products. It implements custom register sets, memory-mapped peripherals, and bus-arbitration glue that off-load work from a constrained host CPU. With 189 I/Os and MultiVolt support, the device interfaces 5V microprocessors directly while running a 2.5V core for low power, and 40 Kbits of embedded RAM hold scratch registers and FIFOs.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K50EQC240-1N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K50EQC240-1 | EPF10K50EQC240-3 | EPF10K50SQC240-2 | EPF10K100EQC240-1N | EPF10K130EQC240-1N | EPF10K50EQI240-1N |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 240-pin PQFP | 240-pin PQFP - same | 240-pin PQFP - same | 240-pin PQFP - same | 240-pin PQFP - same | 240-pin PQFP - same | 240-pin PQFP - same |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KS | FLEX 10KE | FLEX 10KE | FLEX 10KE |
| Speed Grade | -1 | -1 | -3 (faster) | -2 | -1 | -1 | -1 |
| Logic Elements | 2880 | 2880 | 2880 | 2880 | 4992 | 6656 | 2880 |
| User I/O | 189 | 189 | 189 | 189 | 189 | 189 | 189 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Operating Temperature | 0 °C to +85 °C (Commercial) | -40 °C to +85 °C (Industrial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | -40 °C to +85 °C (Industrial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Same-footprint upgrade path within the FLEX 10KE family (vs EPF10K100EQC240-1N / EPF10K130EQC240-1N)
- Faster speed grade available in same package (vs EPF10K50EQC240-3)
- Industrial temperature option in same silicon (vs EPF10K50EQI240-1N)
Design Notes
Estimated: the EPF10K50EQC240-1N core draws approximately 250 mA typical at 2.5 V from the VCCINT rail with all logic toggling. Add at least three 0.1 µF ceramic decoupling capacitors directly under the PQFP, plus a bulk 47 µF tantalum near the VCCINT pins. The 5V/3.3V VCCIO banks each require their own decoupling network sized by the number of simultaneously-switching outputs.
The 240-pin PQFP has 0.5 mm lead pitch and gull-wing leads; per the FLEX 10KE datasheet, route all signals on inner layers with the top layer reserved for short breakout traces. Provide a continuous ground plane on layer 2 directly under the PQFP body to control lead-inductance ringing on simultaneously-switching outputs. Keep configuration pins (MSEL, nCONFIG, nSTATUS, CONF_DONE) short and isolated from switching I/O.
Do not confuse the EPF10K50EQC240-1N (FLEX 10KE family) with the EPF10K50SQC240-2 (FLEX 10KS family); both share the same 240-pin PQFP but use different configuration schemes and may not be pin-compatible for every configuration pin. Always validate against the FLEX 10KE datasheet pinout table, not just the package outline. For migration to higher densities, the 100K and 130K FLEX 10KE parts use the SameFrame pin-compatible 240-PQFP but require recompilation in MAX+PLUS II / Quartus.
Estimated: with the 240-pin PQFP at 0.5 mm pitch, the typical theta_JA is around 25 °C/W with 1 oz copper and adequate airflow. At full I/O toggle the device may dissipate 1.5-2 W; in enclosed cabinets, derate to 70 % of nominal toggling rate or add a small clip-on heatsink. Industrial variants in -40 °C to +85 °C environments must verify junction temperature against the application thermal envelope.
Compliance Information
EPF10K50EQC240-1N is an obsolete Altera/Intel FPGAs; RoHS, REACH, and lead-free status were not retrieved from the verified web data and are marked as unknown.
