EPF6010ANTC100-2 - FLEX 6000 FPGA, 880 LEs, 71 I/O, 100-TQFP | Intel
MPN: EPF6010ANTC100-2 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.3 | $253.00 |
| 100 | $22.1 | $2,210.00 |
| 500 | $19.75 | $9,875.00 |
| 1,000 | $17.5 | $17,500.00 |
EPF6010ANTC100-2 Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that engineers can configure after manufacturing to implement arbitrary digital logic functions. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> programmable logic -> digital logic ICs -> semiconductors, occupying the high-density end of this hierarchy. FPGAs complement ASICs by offering lower NRE cost and faster time-to-market, and complement microcontrollers by providing parallel hardware execution at deterministic nanosecond-scale latency. The FLEX 6000 family uses a look-up-table (LUT)-based logic element architecture with continuous interconnect, optimized for cost-sensitive applications requiring modest logic capacity.
Key features of the EPF6010ANTC100-2 include 880 logic elements, 71 user I/O pins, 5V core tolerance (FLEX 6000A variants), in-system programmability via the IEEE 1149.1 (JTAG) boundary-scan interface, and a 100-pin TQFP surface-mount package measuring 14x14 mm with 0.5 mm pitch. The device supports asynchronous, synchronous, and level-sensitive memory architectures and integrates dedicated carry chains for arithmetic functions and cascade chains for wide fan-in logic.
The EPF6010ANTC100-2 employs a SRAM-based configuration cell that allows unlimited reconfiguration, supported by the Altera MAX+PLUS II and Quartus design tools. The on-chip logic array is organized into Logic Array Blocks (LABs), each containing ten logic elements with local interconnect. Global routing resources include row and column channels that distribute clocks, clears, and high-fan-out signals across the device.
Typical applications include peripheral bus interfacing (PCI, ISA, VME bridge logic), industrial control glue logic, telecommunication line-card glue functions, ASIC prototyping and emulation, and custom DSP pre/post-processing front-ends. With 71 I/O available, the part accommodates wide parallel buses and multi-protocol bridging scenarios.
When designing with the EPF6010ANTC100-2, ensure that the configuration memory is loaded from a valid source (EPROM, microcontroller, or JTAG) at every power-up. Note that the FLEX 6000 family has reached end-of-life status from Intel PSG; consult PCN documents before new designs and verify long-term availability for production runs.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone - giving engineers a faster path to sourcing and second-source selection for legacy FLEX 6000 designs.
Drop-in alternatives for EPF6010ANTC100-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF6010ANTC100-2 (same form factor and footprint) — differing in Package, Operating Temperature, Family, Speed Grade, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF6010ANTC100-1
✅ Drop-In✓ In Stock
$8.5 / Unit
View Datasheet →EPF6010ATC100-2
✅ Drop-In✓ In Stock
$14.2 / Unit
View Datasheet →EPF6010ATC100-1
✅ Drop-In✓ In Stock
$5.85 / Unit
View Datasheet →EPF6010AQC100-2
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EPF6010ANTC100-2 Maximum Ratings & Electrical Characteristics
| Family | FLEX 6000 / FLEX 6000A |
| Logic Elements | 880 |
| Programmable I/O Pins | 71 |
| Package | 100-pin TQFP (14x14 mm, 0.5 mm pitch) |
| Speed Grade | -2 |
| Operating Temperature | Commercial (0C to +70C) |
| Configuration Method | SRAM (volatile), in-system programmable |
| Programming Interface | IEEE 1149.1 (JTAG) / passive serial / EPC configuration device |
| Supply Voltage (VCCINT) | 5.0 V (FLEX 6000A); 3.3 V (FLEX 6000) |
| I/O Standards Supported | TTL, CMOS, PCI (with clamping diodes) |
| Mounting Type | Surface Mount |
| MSL Level | 3 (168 hours) |
| Packaging | Tray (per Altera packing standard) |
EPF6010ANTC100-2 100-pin tqfp (14x14 mm, 0.5 mm pitch) Pin Configuration Guide
Pin configuration for EPF6010ANTC100-2 (100-pin tqfp (14x14 mm, 0.5 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF6010ANTC100-2.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF6010ANTC100-2 is suitable for 6 applications: Peripheral Bus Bridge Logic (PCI/ISA/VME), Industrial Control Glue Logic, ASIC Prototyping and Emulation, Telecommunication Line-Card Glue Functions, Custom State Machine and DSP Front-End, Legacy System Maintenance and Field Upgrades.
Peripheral Bus Bridge Logic (PCI/ISA/VME)
The EPF6010ANTC100-2's 880 logic elements and 71 user I/O pins make it a cost-effective glue-logic bridge between legacy peripheral buses such as PCI, ISA, and VME and modern processor interfaces. With its 5V-tolerant I/O (FLEX 6000A variants), the device connects directly to older bus signaling without external level shifters, while the LUT-based architecture implements address decoding, bus arbitration, and wait-state generation in parallel hardware at sub-50 ns latency. Designers can synthesize custom state machines for bus-master handshakes and DMA control, and the SRAM-based configuration supports in-field firmware updates. Quartus Prime or MAX+PLUS II development tools provide mature synthesis libraries for legacy bus protocols, enabling rapid porting of existing VHDL/Verilog IP.
Recommended
Industrial Control Glue Logic
In industrial control cabinets, the EPF6010ANTC100-2 replaces dozens of 74-series TTL gates and PAL/GAL devices with a single programmable IC, reducing PCB area and BOM cost. Its 71 I/O pins accommodate parallel encoder inputs, PWM outputs, opto-isolated digital I/O, and serial communication channels (RS-232/RS-485). The commercial temperature range (0C to +70C) suits enclosed control panels, while the JTAG boundary-scan interface simplifies in-system test and on-board diagnostics. Designers implement custom safety interlocks, motor-control sequencing, and real-time event counters with deterministic latency that microcontrollers cannot match. The 100-TQFP package is hand-solderable for prototype builds and supports standard SMT lines for volume manufacturing.
Recommended
ASIC Prototyping and Emulation
Engineers use the EPF6010ANTC100-2 to prototype and emulate small-to-medium ASIC designs before committing to mask tooling, leveraging its 880 LEs and JTAG-based configuration for fast design iteration. The SRAM-based fabric is reconfigurable in seconds via the ByteBlaster or USB-Blaster cable, allowing HDL code changes to be validated in real hardware within the same development cycle. With 71 user I/O pins, designers replicate ASIC pad-out for functional verification at near-ASIC clock rates. The Quartus Prime toolchain synthesizes standard-cell ASIC RTL to LUT-based FPGA netlists, and the timing analyzer provides realistic pre-silicon timing closure data. Multiple FLEX 6000 devices can be chained for larger ASIC emulation at low cost.
Recommended
Telecommunication Line-Card Glue Functions
Telecommunication line cards require extensive glue logic between framers, serializers, network processors, and backplane interfaces - a role the EPF6010ANTC100-2 fills efficiently with its 880 LEs and 71 programmable I/O pins. The device implements HDLC controllers, time-slot interchangers, custom framing logic, and clock-domain crossing FIFOs at deterministic hardware latency. Its JTAG interface supports boundary-scan for board-level test in high-density backplane designs, while the 100-TQFP package fits the standard line-card form factor. Legacy telecom infrastructure still in service today relies on FLEX 6000 family parts for protocol conversion and alarm monitoring, with last-time-buy inventory keeping these systems operational.
Recommended
Custom State Machine and DSP Front-End
The EPF6010ANTC100-2 excels at implementing custom state machines and DSP pre/post-processing front-ends for signal conditioning, FIR/IIR filters, and protocol decoders where deterministic latency and parallel hardware execution are required. Each logic element contains dedicated carry chains for arithmetic operations, allowing efficient implementation of adders, multipliers, and accumulator circuits. The 71 I/O pins accommodate multi-channel ADC/DAC interfaces with synchronized sampling. Designers benefit from the FPGA's deterministic nanosecond-scale response time, which is critical for real-time control loops and high-speed data acquisition. Quartus Prime provides pre-optimized DSP megafunctions that map efficiently to FLEX 6000 architecture.
Recommended
Legacy System Maintenance and Field Upgrades
The EPF6010ANTC100-2 is widely used for sustaining legacy industrial, military, and telecommunications equipment that was designed around the FLEX 6000 family in the late 1990s and early 2000s. Field engineers use the JTAG interface to perform in-system reconfiguration when firmware updates are required, while the SRAM-based configuration memory allows unlimited reprogram cycles without removing the device from the board. With the family now under last-time-buy from Intel PSG, distributors maintain buffer stock specifically to support these long-lifecycle maintenance programs. The 100-TQFP package remains compatible with existing board designs, eliminating the need for costly PCB rework when replacing failed units in installed equipment.
Recommended
Recommended Products Summary
Engineering reference data for EPF6010ANTC100-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF6010ANTC100-1 | EPF6010ATC100-2 | EPF6010ATC100-1 | EPF6010AQC100-2 |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | TQFP-100 | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same |
| Logic Elements | 880 | 880 | 880 | 880 | 880 |
| User I/O Pins | 71 | 71 | 71 | 71 | 71 |
| Speed Grade | -2 | -1 (faster) | -2 | -1 (faster) | -2 |
| VCCINT (Core Voltage) | 3.3 V | 3.3 V | 5.0 V | 5.0 V | 5.0 V |
| Family | FLEX 6000 | FLEX 6000 | FLEX 6000A | FLEX 6000A | FLEX 6000A |
| Configuration Method | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) |
Key Differentiators
- Faster speed grade option in same package (vs EPF6010ANTC100-1)
- 3.3V core for modern low-voltage systems (vs EPF6010ATC100-2)
- Industry-standard TQFP-100 footprint (vs EPF6010AQI100-2 (PQFP-100 variant))
Design Notes
The EPF6010ANTC100-2 uses SRAM-based configuration memory that is volatile - the FPGA loses its configuration at every power-down. A configuration source (EPC series configuration PROM, microcontroller, or JTAG) must load the bitstream at every power-up within the tCF parameter window (typically 100 ms). Designs that omit the configuration source will fail to initialize and appear completely dead at first power-up.
Place decoupling capacitors as close as possible to every VCCINT and VCCIO pin - typically 0.1 uF ceramic for high-frequency noise and 10 uF tantalum or aluminum polymer for bulk holdup. The TQFP-100 package has limited thermal dissipation capability; for designs approaching the commercial temperature ceiling, consider adding a copper pour under the exposed die-attach pad area if available, or a small clip-on heatsink for hot-spot mitigation.
Route all clock signals on inner PCB layers with continuous ground reference and impedance-controlled traces (typically 50 ohm single-ended). Keep clock traces as short as possible and avoid crossing power-plane splits. For high-speed outputs (>50 MHz toggle rate), use series damping resistors near the FPGA output to reduce overshoot and ringing on the TQFP lead inductance.
Estimated: At a sustained internal toggle rate of 50 MHz with 50% logic utilization (440 active LEs), the EPF6010ANTC100-2 consumes approximately 200-300 mW from VCCINT. The TQFP-100 package has a theta_JA of approximately 35-40 C/W on a standard JEDEC test board, giving a junction temperature rise of 7-12 C above ambient. For sealed enclosures without airflow, derate logic utilization or add forced cooling.
Compliance Information
Compliance data not provided in verified web data. The FLEX 6000 family was originally released in the late 1990s, before modern RoHS compliance became mandatory for many product categories. Contact Intel PSG or distributor for specific compliance documentation.
