Altera

EPF6010ATC100-1 - FLEX 6000 FPGA 880 Cells 100-TQFP | Altera

MPN: EPF6010ATC100-1 ✗ End of Life

In Stock Ships in 1-3 business days

3.3 V Vdss 100-pin TQFP Package SRAM Memory

From $5.85 USD / Unit

MOQ: 1 |

Price updated: 2026-09-11

Volume Pricing

Qty	Unit Price	Extended
1	$8.49	$8.49
10	$7.95	$79.50
100	$7.1	$710.00
500	$6.4	$3,200.00
1,000	$5.85	$5,850.00

ℹ️ All prices are in USD

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EPF6010ATC100-1 Overview

The Altera (Intel) EPF6010ATC100-1 is a member of the FLEX 6000 family of SRAM-based Field Programmable Gate Arrays, delivering approximately 10,000 typical gates, 880 logic elements, and 71 user I/O in a 100-pin Thin Quad Flat Pack (TQFP) package. Built on a 0.42 µm CMOS process, the device supports a maximum toggle rate of 200 MHz and operates from a 3.3 V core supply, making it suitable for glue-logic, bus-interface, and state-machine consolidation in cost-sensitive industrial designs.

A Field Programmable Gate Array (FPGA) is a programmable logic device that combines the integration density of an application-specific integrated circuit (ASIC) with the flexibility of in-system reconfiguration. FPGAs sit within the digital semiconductor hierarchy as programmable ASIC alternatives: FPGA → programmable logic device (PLD) → logic IC → integrated circuit → semiconductor. The FLEX 6000 series specifically targets low-to-moderate density designs that previously required multiple discrete PLDs or complex CPLD arrays, providing a single-chip upgrade path with faster timing and lower board area.

Key features of the EPF6010ATC100-1 include 88 Logic Array Blocks (LABs), 16 Logic Elements per LAB, 71 maximum user I/O, 5 V tolerant I/O with 3.3 V core operation, an in-system programmability (ISP) interface via the serial Passive Serial (PS) configuration mode, and an industrial temperature grade. The 100-pin TQFP package provides a 1.0 mm lead pitch and a low profile suitable for standard SMT assembly, with thermal resistance in line with other 100-pin TQFP plastic packages of this generation.

Architecturally, the FLEX 6000 family uses a sea-of-LABs fabric with continuous routing channels called FastTrack Interconnect, providing predictable timing closure across 0.42 µm process geometry. The SRAM configuration memory supports unlimited reconfiguration cycles, allowing design updates during prototype bring-up or in-field firmware upgrades. A built-in JTAG (IEEE 1149.1) interface enables boundary-scan test and programming verification on production lines.

Typical applications for the EPF6010ATC100-1 include industrial control glue logic, communication bridge and protocol conversion cards, legacy peripheral interfacing, custom state machines for motor control, test and measurement front-end signal routing, and education/hobby platforms where the device remains supported by the legacy Altera MAX+PLUS II and Quartus design tools.

When designing with the EPF6010ATC100-1, ensure the Quartus or MAX+PLUS II toolchain version supports the FLEX 6000 device family (this is a mature family with long-standing support). The device is no longer recommended for new designs (NRND) and is best used for maintenance of legacy systems or as a drop-in replacement for obsolete discrete PLD clusters. Verify long-term supply through authorized distributors or authorized aftermarket partners such as Rochester Electronics.

Drop-in alternatives for EPF6010ATC100-1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EPF6010ATC100-1 (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Speed Grade, Family.

EPF6010ANTC100-1

Intel

Package: 100-pin TQFP