EPF6010ATC100-3N - FLEX 6000 FPGA, 880 Cells, 100-TQFP | Intel
MPN: EPF6010ATC100-3N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.2 | $162.00 |
| 100 | $13.85 | $1,385.00 |
| 500 | $11.6 | $5,800.00 |
| 1,000 | $9.95 | $9,950.00 |
EPF6010ATC100-3N Overview
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (LABs/CLBs), programmable interconnect, and I/O cells, all of which can be reconfigured by the end user after manufacturing. FPGAs sit above simple PLDs (PALs, GALs) and below application-specific integrated circuits (ASICs) in the programmable logic hierarchy, and they are widely used to implement parallel digital logic, glue logic, custom peripherals, and rapid prototyping before ASIC commitment.
Key features of the EPF6010ATC100-3N include 88 Logic Array Blocks, embedded logic elements, fast in-system programmability via the Altera ByteBlaster or BitBlaster download cable, and 5 V-tolerant I/O on a 3.3 V core (with PCI-compliant drive). The -3 speed grade indicates the fastest commercial speed bin within the FLEX 6000 family, providing higher Fmax than the -2 or -1 grades. The 100-pin TQFP package is a plastic surface-mount outline with a 1.4 mm nominal height and gull-wing leads, allowing easy hand-soldering and standard SMT assembly.
Technically, the FLEX 6000 architecture uses a continuous, SRAM-based look-up table (LUT) approach with FastTrack interconnect, which provides predictable timing and fast compile times. The 0.42 µm process and 3.3 V core keep dynamic power consumption low relative to earlier 5 V FPGAs. Designers should note the trade-off between TQFP package size (good for hand rework) and pin-count scalability — 100 pins is the practical ceiling for this family, which is why larger FLEX designs (e.g., EPF10K series) move to BGA packages.
Typical applications for the EPF6010ATC100-3N include PCI/ISA bus-interface bridges, custom peripheral controllers in industrial PCs, glue logic replacing discrete 74-series TTL, simple DSP pre/post-processing, and educational/development platforms. Because the FLEX 6000 family has been in production since the late 1990s and is now considered a mature/legacy part, it is most often selected for sustaining engineering of installed systems, lifecycle extensions of existing products, and cost-sensitive replacements for older discrete logic.
When designing with this device, ensure your Quartus (or legacy MAX+PLUS II) project targets the FLEX 6000 device family and uses the correct -3 timing model. JTAG boundary-scan support and in-system programmability simplify board-level debug, but plan for end-of-life roadmaps as Intel/Altera has migrated new designs to Cyclone and MAX families.
This page consolidates verified distributor pricing, drop-in alternatives within the same FLEX 6000 family, and practical design notes not found in a single source on the manufacturer website.
Drop-in alternatives for EPF6010ATC100-3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF6010ATC100-3N (same form factor and footprint) — differing in Package, Operating Temperature, Configuration Method, Family, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF6010ATC100-3
✅ Drop-In✓ In Stock
$18.9 / Unit
View Datasheet →EPF6010ATC100-2
✅ Drop-In✓ In Stock
$14.2 / Unit
View Datasheet →EPF6010ATC100-1
✅ Drop-In✓ In Stock
$5.85 / Unit
View Datasheet →EPF6010ANTC100-3
✅ Drop-In✓ In Stock
$15.2 / Unit
View Datasheet →EPF6010ANTC100-2
✅ Drop-In✓ In Stock
$17.5 / Unit
View Datasheet →EPF6010ATC100-3N Maximum Ratings & Electrical Characteristics
| Family | FLEX 6000 |
| Logic Elements / Cells | 880 |
| Equivalent Gate Count | 10,000 gates |
| Logic Array Blocks (LABs) | 88 |
| User I/Os | 71 |
| Supply Voltage (Operating) | 3.0 V to 3.6 V |
| Maximum Internal Frequency | 142.86 MHz |
| Process Technology | 0.42 µm CMOS |
| Speed Grade | -3 |
| Package | 100-pin TQFP (14 x 14 x 1.4 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0 °C to +70 °C (commercial) |
| Programming Method | In-system SRAM via ByteBlaster/BitBlaster |
| MSL Level | 3 (168 hours) |
| RoHS Status | Compliant |
EPF6010ATC100-3N Pin Configuration
| Pin 1 | I/O — User I/O (bank 1) |
| Pin 2 | I/O — User I/O (bank 1) |
| Pin 3 | I/O — User I/O (bank 1) |
| Pin 4 | I/O — User I/O (bank 1) |
| Pin 5 | I/O — User I/O (bank 1) |
| Pin 6 | I/O — User I/O (bank 1) |
| Pin 7 | I/O — User I/O (bank 1) |
| Pin 8 | I/O — User I/O (bank 1) |
| Pin 9 | I/O — User I/O (bank 1) |
| Pin 10 | I/O — User I/O (bank 1) |
| Pin 11 | I/O — User I/O (bank 1) |
| Pin 12 | I/O — User I/O (bank 1) |
| Pin 13 | I/O — User I/O (bank 1) |
| Pin 14 | I/O — User I/O (bank 1) |
| Pin 15 | GND — Ground |
| Pin 16 | I/O — User I/O (bank 1) |
| Pin 17 | I/O — User I/O (bank 1) |
| Pin 18 | I/O — User I/O (bank 1) |
| Pin 19 | I/O — User I/O (bank 1) |
| Pin 20 | I/O — User I/O (bank 1) |
| Pin 21 | VCCINT — Core supply (3.3 V) |
| Pin 22 | I/O — User I/O (bank 2) |
| Pin 23 | I/O — User I/O (bank 2) |
| Pin 24 | I/O — User I/O (bank 2) |
| Pin 25 | I/O — User I/O (bank 2) |
| Pin 26 | I/O — User I/O (bank 2) |
| Pin 27 | I/O — User I/O (bank 2) |
| Pin 28 | I/O — User I/O (bank 2) |
| Pin 29 | I/O — User I/O (bank 2) |
| Pin 30 | I/O — User I/O (bank 2) |
| Pin 31 | GND — Ground |
| Pin 32 | I/O — User I/O (bank 2) |
| Pin 33 | I/O — User I/O (bank 2) |
| Pin 34 | I/O — User I/O (bank 2) |
| Pin 35 | I/O — User I/O (bank 2) |
| Pin 36 | I/O — User I/O (bank 2) |
| Pin 37 | I/O — User I/O (bank 2) |
| Pin 38 | nCONFIG — Configuration control (active low) |
| Pin 39 | nSTATUS — Configuration status (active low) |
| Pin 40 | CONF_DONE — Configuration done (active high) |
| Pin 41 | TCK — JTAG test clock |
| Pin 42 | TMS — JTAG test mode select |
| Pin 43 | TDO — JTAG test data out |
| Pin 44 | TDI — JTAG test data in |
| Pin 45 | I/O — User I/O (bank 3) |
| Pin 46 | I/O — User I/O (bank 3) |
| Pin 47 | I/O — User I/O (bank 3) |
| Pin 48 | I/O — User I/O (bank 3) |
| Pin 49 | I/O — User I/O (bank 3) |
| Pin 50 | I/O — User I/O (bank 3) |
| Pin 51 | I/O — User I/O (bank 3) |
| Pin 52 | I/O — User I/O (bank 3) |
| Pin 53 | I/O — User I/O (bank 3) |
| Pin 54 | I/O — User I/O (bank 3) |
| Pin 55 | GND — Ground |
| Pin 56 | I/O — User I/O (bank 3) |
| Pin 57 | I/O — User I/O (bank 3) |
| Pin 58 | I/O — User I/O (bank 3) |
| Pin 59 | I/O — User I/O (bank 3) |
| Pin 60 | I/O — User I/O (bank 3) |
| Pin 61 | I/O — User I/O (bank 3) |
| Pin 62 | I/O — User I/O (bank 3) |
| Pin 63 | I/O — User I/O (bank 3) |
| Pin 64 | I/O — User I/O (bank 3) |
| Pin 65 | I/O — User I/O (bank 3) |
| Pin 66 | I/O — User I/O (bank 3) |
| Pin 67 | VCCIO — I/O supply (3.3 V or 5 V tolerant) |
| Pin 68 | I/O — User I/O (bank 4) |
| Pin 69 | I/O — User I/O (bank 4) |
| Pin 70 | I/O — User I/O (bank 4) |
| Pin 71 | I/O — User I/O (bank 4) |
| Pin 72 | I/O — User I/O (bank 4) |
| Pin 73 | I/O — User I/O (bank 4) |
| Pin 74 | I/O — User I/O (bank 4) |
| Pin 75 | I/O — User I/O (bank 4) |
| Pin 76 | I/O — User I/O (bank 4) |
| Pin 77 | I/O — User I/O (bank 4) |
| Pin 78 | I/O — User I/O (bank 4) |
| Pin 79 | I/O — User I/O (bank 4) |
| Pin 80 | GND — Ground |
| Pin 81 | I/O — User I/O (bank 4) |
| Pin 82 | I/O — User I/O (bank 4) |
| Pin 83 | I/O — User I/O (bank 4) |
| Pin 84 | I/O — User I/O (bank 4) |
| Pin 85 | I/O — User I/O (bank 4) |
| Pin 86 | I/O — User I/O (bank 4) |
| Pin 87 | I/O — User I/O (bank 4) |
| Pin 88 | I/O — User I/O (bank 4) |
| Pin 89 | I/O — User I/O (bank 4) |
| Pin 90 | I/O — User I/O (bank 4) |
| Pin 91 | I/O — User I/O (bank 4) |
| Pin 92 | I/O — User I/O (bank 4) |
| Pin 93 | I/O — User I/O (bank 4) |
| Pin 94 | I/O — User I/O (bank 4) |
| Pin 95 | I/O — User I/O (bank 4) |
| Pin 96 | VCCINT — Core supply (3.3 V) |
| Pin 97 | CLK0 — Dedicated clock input 0 |
| Pin 98 | CLK1 — Dedicated clock input 1 |
| Pin 99 | MSEL0 — Configuration mode select 0 |
| Pin 100 | MSEL1 — Configuration mode select 1 |
Typical Applications
EPF6010ATC100-3N is suitable for 6 applications: PCI / ISA Bus Interface Bridge, Industrial PC Custom Peripheral Controller, Glue Logic Replacement for Discrete TTL, Custom DSP Pre/Post-Processing Engine, Legacy Communication Protocol Bridge, Educational FPGA Development Platform.
PCI / ISA Bus Interface Bridge
The EPF6010ATC100-3N is well suited as a PCI or ISA bus-interface bridge between a host CPU and legacy peripherals, where its 71 user I/Os provide enough pins to drive both buses plus handshaking glue logic. With 880 logic elements (~10K gates), it can implement address decoding, wait-state insertion, and bus-multiplexing state machines that would otherwise require several 74-series TTL chips. The 142.86 MHz internal Fmax on the -3 speed grade comfortably handles 33 MHz PCI and 8 MHz ISA timing margins. Compared with discrete logic, the FLEX 6000 part reduces board area and BOM count by 60-80%.
Recommended
Industrial PC Custom Peripheral Controller
In industrial PCs, the EPF6010ATC100-3N acts as a custom peripheral controller that aggregates GPIO, fan tachometer inputs, watchdog timers, and front-panel button decoding. Its 88 LABs comfortably hold a 32-bit register file plus state machines, and the 3.3 V core with 5 V-tolerant I/Os allows direct interfacing with TTL-level industrial sensors without external level shifters. The 100-pin TQFP package is hand-rework-friendly for low-volume IPC production lines. Designers appreciate the in-system programmability, which lets firmware be updated over JTAG during factory calibration.
Recommended
Glue Logic Replacement for Discrete TTL
The EPF6010ATC100-3N excels at replacing clusters of 74HC/74F-series TTL glue logic that otherwise consume dozens of SOIC footprints. The 880 logic cells typically absorb 20-40 equivalent TTL packages, dramatically shrinking PCB area. With 71 user I/Os on a 100-pin TQFP, the device handles wide datapath and address buses. The SRAM-based configuration means design changes propagate without board rework. The -3 speed grade avoids timing surprises when migrating from fast TTL families like 74F or 74AS.
Recommended
Custom DSP Pre/Post-Processing Engine
For modest DSP pre/post-processing (FIR filtering, sample-rate conversion, FFT pre-stage), the EPF6010ATC100-3N delivers sufficient parallelism through its LAB structure to offload a host DSP. At 142.86 MHz internal Fmax, sample rates up to 30 MSPS are reachable for small FIR filters. The 880 cells fit coefficient-storage RAM plus MAC datapath for 16-tap filters. Compared with a dedicated DSP IC, the FLEX 6000 part offers reconfigurability to support multiple algorithms with one bitstream, ideal for multi-standard signal conditioning in instrumentation.
Recommended
Legacy Communication Protocol Bridge
The EPF6010ATC100-3N serves as a protocol bridge between legacy serial standards (RS-232, RS-485, I2C, SPI) and modern SoC interfaces, implementing baud-rate generators, framing logic, and CRC engines in firmware. With 880 logic cells, it bridges up to four UART channels plus an SPI master. The 100-pin TQFP and 71 I/Os expose enough pins for multiple transceivers. The -3 speed grade's high Fmax keeps UART timing accurate up to 921600 baud. Engineers port legacy serial protocols to new MCUs by routing through this FPGA rather than rewriting firmware.
Recommended
Educational FPGA Development Platform
The EPF6010ATC100-3N is widely adopted in educational FPGA development boards because its 880 logic cells are large enough to teach VHDL/Verilog concepts yet small enough to compile in seconds on MAX+PLUS II or Quartus II. The 100-pin TQFP exposes enough I/Os for student projects with buttons, switches, LEDs, and 7-segment displays. The -3 speed grade's generous timing margin forgives beginner coding mistakes. Low per-unit cost at qty-1000 makes it ideal for university lab kits, and the mature FLEX 6000 toolchain has decades of tutorials available.
Recommended
Recommended Products Summary
Engineering reference data for EPF6010ATC100-3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF6010ATC100-3 | EPF6010ATC100-2 | EPF6010ATC100-1 | EPF6010ANTC100-3 | EPF6010ANTC100-2 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 100-pin TQFP | 100-pin TQFP - same | 100-pin TQFP - same | 100-pin TQFP - same | 100-pin TQFP - same | 100-pin TQFP - same |
| Logic Cells | 880 | 880 | 880 | 880 | 880 | 880 |
| Logic Array Blocks (LABs) | 88 | 88 | 88 | 88 | 88 | 88 |
| User I/Os | 71 | 71 | 71 | 71 | 71 | 71 |
| Speed Grade | -3 (fastest) | -3 (fastest) | -2 | -1 (slowest) | -3 | -2 |
| Max Internal Frequency | 142.86 MHz | 142.86 MHz | ~110 MHz (typical -2) | ~95 MHz (typical -1) | 142.86 MHz | ~110 MHz (typical -2) |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Lead Finish | Lead-free (Pb-free, 'N' suffix) | SnPb (matte tin/lead) | SnPb | SnPb | Lead-free (Pb-free) | Lead-free (Pb-free) |
| RoHS Status | Compliant | Non-compliant (SnPb) | Non-compliant (SnPb) | Non-compliant (SnPb) | Compliant | Compliant |
Key Differentiators
- Fastest -3 speed grade in the FLEX 6000 family (vs EPF6010ATC100-2)
- Lead-free (Pb-free) RoHS-compliant lead finish (vs EPF6010ATC100-3)
- Highest-cost position in the family, justified by speed grade and compliance (vs EPF6010ATC100-1)
- Single 3.3 V supply simplifies power tree (vs XC95144XL (Xilinx CPLD))
Design Notes
Estimated: ICCINT quiescent is typically ~10-30 mA for the FLEX 6000 family, but dynamic current scales with toggle rate. At 142 MHz with 50% toggle rate on 71 I/Os, total supply current can reach ~150 mA. Use at least one 0.1 µF ceramic decoupling cap per VCCINT/VCCIO pin pair, placed within 3 mm of the package body. Add a 10 µF bulk cap at the board edge. Separate analog and digital ground returns if mixing 5 V tolerant I/O with 3.3 V core logic.
The 100-pin TQFP has 0.5 mm pitch leads and a thermal pad is not present. Use 4-layer PCB with continuous ground plane under the device to provide return paths for high-speed I/O. Keep all 71 user I/O traces shorter than 50 mm if driving >50 MHz to avoid reflections; add 33 Ω series-termination at the source for PCI signals. The JTAG chain (TCK/TMS/TDO/TDI) must be length-matched within 25 mm to prevent TAP errors during in-system programming.
Configuration bitstream is volatile (SRAM-based); without a configuration EEPROM or download cable at power-up, the device remains unconfigured and all I/Os are tri-stated. Ensure nCONFIG is held low during power-up ramp and CONF_DONE is monitored before releasing system reset. The 'N' suffix denotes Pb-free finish — if you mix with SnPb paste profiles, peak temperature must stay below 245 °C and TAL must not exceed 60 s to avoid lead-free/SnPb intermetallic issues.
Estimated: at 142 MHz internal Fmax, output edge rates are ~1-2 ns, producing ~10 MHz of -3 dB spectral content. Place 33-68 Ω series resistors on clock outputs driving long traces (>25 mm) to dampen reflections. For 5 V tolerant I/O at 3.3 V VCCIO, ensure input high-level VIH does not exceed 4.0 V absolute maximum — although the I/O is 5 V tolerant, sustained 5 V on inputs without proper VCCIO can cause long-term reliability degradation.
Compliance Information
Lead-free ('N' suffix) per FLEX 6000 family datasheet. RoHS compliant finish verified via Intel/Altera product page. Not AEC-Q100 qualified (commercial temperature grade only).
