Intel

EPF6010ATC100-3 - 10K Gates FLEX 6000 FPGA, 880 Cells | Intel

MPN: EPF6010ATC100-3 ✗ End of Life

In Stock Ships in 1-3 business days

3.3 V Vdss TQFP-100 (100-pin) Package -3 (commercial, slowest grade) Speed SRAM (external configuration device required) Memory

From $18.9 USD / Unit

MOQ: 1 |

Price updated: 2026-09-11

Volume Pricing

Qty	Unit Price	Extended
1	$38.5	$38.50
10	$34.2	$342.00
100	$28.75	$2,875.00
500	$22.4	$11,200.00
1,000	$18.9	$18,900.00

ℹ️ All prices are in USD

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EPF6010ATC100-3 Overview

The Intel EPF6010ATC100-3 is a member of the FLEX 6000 family of Field Programmable Gate Arrays (FPGAs), delivering 10,000 usable gates and 880 logic elements (cells) in a 100-pin TQFP package. Built on a 0.42 µm CMOS SRAM-based process, the device operates from a 3.3 V core supply and supports user I/O voltages up to 5 V tolerant through flexible I/O banks. The speed grade -3 designation indicates the slowest commercial grade offered within the FLEX 6000 family, optimized for cost-sensitive designs rather than maximum Fmax.

An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) containing an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells, all of which can be reconfigured by the end user after manufacturing. The FLEX 6000 family belongs to the broader hierarchy: FPGA → programmable logic device → digital semiconductor → integrated circuit. Within Intel's (formerly Altera's) portfolio, FLEX 6000 represents the low-density, low-cost tier, sitting below FLEX 10K and Cyclone families.

Key features of the EPF6010ATC100-3 include 88 logic array blocks (LABs), 71 user I/O pins, 132 MHz typical internal performance per the FLEX 6000 datasheet family, in-system programmability through the IEEE 1149.1 JTAG interface, and SRAM-based configuration that allows unlimited reconfiguration. The 100-pin TQFP (TQFP-100) package supports both commercial and industrial temperature grades depending on the ordering suffix.

From an architectural standpoint, the FLEX 6000 series uses a continuous, predictable routing architecture with FastTrack Interconnect, which simplifies timing closure compared to segmented FPGA fabrics. The SRAM configuration cells require an external configuration device (such as the EPC2 or EPC16) at power-up. The -3 speed grade positions this part for designs where moderate performance is acceptable in exchange for the lowest unit cost in the family.

Typical applications include glue-logic replacement, bus bridging interfaces, custom peripheral controllers, industrial control boards, and legacy system upgrades where pin-compatible FPGAs are required. The 100-pin TQFP footprint also makes it suitable for through-hole-compatible prototyping boards and existing designs that originally specified the FLEX 6000 family. Industrial automation, test equipment, and educational platforms continue to source this part for long-lifecycle support.

When designing with this device, note that the FLEX 6000 family uses 3.3 V VCCINT and supports 3.3 V/5 V tolerant I/O depending on bank configuration. Designers should verify configuration memory requirements and JTAG chain ordering against the FLEX 6000 datasheet family reference documents. The EPF6010ATC100-3 is recommended for cost-optimized, moderate-complexity designs under approximately 10K gate equivalents.

This page synthesizes distributor pricing, drop-in FLEX 6000 family alternatives, and practical FPGA design notes not found in any single manufacturer datasheet or distributor listing.

Drop-in alternatives for EPF6010ATC100-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EPF6010ATC100-3 (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Speed Grade, Configuration Method.

EPF6010ANTC100-1

Intel

Package: 100-pin TQFP