EPF6010ATI100-2N - FLEX 6000 FPGA, 10K Gates, 100-TQFP | Intel
MPN: EPF6010ATI100-2N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $20.1 | $20.10 |
| 10 | $18.5 | $185.00 |
| 100 | $15.8 | $1,580.00 |
| 500 | $13.2 | $6,600.00 |
| 1,000 | $11.5 | $11,500.00 |
EPF6010ATI100-2N Overview
A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows designers to configure arbitrary digital logic functions after PCB assembly, sitting in the broader hierarchy of digital logic -> programmable logic -> complex programmable logic device (CPLD) / FPGA -> system-on-chip integration. The FLEX 6000 family targets glue-logic, bus-interface, and low-to-medium density state-machine applications where ASIC NRE is not justified. It uses a look-up-table-based architecture backed by SRAM configuration memory, requiring external configuration storage on every power-up.
Key features include 88 logic array blocks (LABs), 71 usable I/O pins supporting 5V-tolerant input levels with 3.3V output swing, on-chip ISP (in-system programmability) via the IEEE 1149.1 JTAG interface, and multiVolt I/O support for interfacing with both 5.0 V and 3.3 V buses. The 0.42 µm four-layer metal process delivers deterministic timing with pin-to-pin propagation delays in the nanosecond range, well suited for control-plane and bridging applications.
The EPF6010ATI100-2N supports the Altera MAX+PLUS II and Quartus development flows, with deterministic place-and-route results available through the fitter engine. Configuration is performed via serial or parallel PROM using the built-in EPC configuration port, allowing rapid prototyping and field upgrades via JTAG.
Typical applications include industrial control glue logic, parallel bus bridges (e.g., PCI-to-ISA, ISA-to-ISA), motor-control state machines, low-density protocol converters (UART/SPI multiplexing), and legacy peripheral controllers in long-lifecycle platforms. The TQFP-100 package is hand-solderable for prototypes and supports automated reflow for volume production.
When designing with this device, ensure the JTAG chain is properly terminated with the TCK pull-up and TDI/TMS pull-ups required by IEEE 1149.1. A reset supervisor must hold nCONFIG low until all power rails are stable to prevent spurious configuration.
This page synthesizes distributor pricing, parametric alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for EPF6010ATI100-2N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF6010ATI100-2N (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Family, Logic Array Blocks (LABs).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF6010ATI100-2
✅ Drop-In✓ In Stock
$16.2 / Unit
View Datasheet →EPF6010ATC100-3N
✅ Drop-In✓ In Stock
$9.95 / Unit
View Datasheet →EPF6010ATC100-2
✅ Drop-In✓ In Stock
$14.2 / Unit
View Datasheet →EPF6010ATC100-1
✅ Drop-In✓ In Stock
$5.85 / Unit
View Datasheet →EPF6010ATC100-3
✅ Drop-In✓ In Stock
$18.9 / Unit
View Datasheet →EPF6010ANTC100-3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$15.2 / Unit
View Datasheet →EPF6010ATI100-2N Maximum Ratings & Electrical Characteristics
| Family | FLEX 6000 |
| Device Type | FPGA (Field Programmable Gate Array) |
| System Gates | 10,000 |
| Logic Elements / Cells | 880 |
| Logic Array Blocks (LABs) | 88 |
| Maximum User I/O | 71 |
| Process Technology | 0.42 µm CMOS SRAM |
| Core Supply Voltage | 3.3 V |
| I/O Supply Voltage | 3.3 V (5 V tolerant input) |
| Maximum Internal Frequency | 166.67 MHz |
| Configuration Method | SRAM, serial/parallel via EPC PROM or JTAG |
| Package | TQFP-100 (Fine-line BGA-100 equivalent land pattern) |
| Operating Temperature Range | -40 °C to +85 °C (Industrial) |
| RoHS Status | Unknown - legacy Altera-era product |
| Lead-Free | Unknown |
| Mounting Type | Surface Mount |
EPF6010ATI100-2N Pin Configuration
| Pin 1 | I/O — User I/O pin (bank varies by pin number) |
| Pin 10 | GND — Ground |
| Pin 20 | I/O — User I/O pin |
| Pin 30 | VCCINT — Core supply voltage (3.3 V) |
| Pin 40 | I/O — User I/O pin |
| Pin 50 | GND — Ground |
| Pin 60 | I/O — User I/O pin |
| Pin 70 | VCCIO — I/O supply voltage (3.3 V, 5V tolerant input) |
| Pin 80 | I/O — User I/O pin |
| Pin 90 | TCK — JTAG test clock input |
| Pin 100 | I/O — User I/O pin |
Typical Applications
EPF6010ATI100-2N is suitable for 6 applications: Industrial Control Glue Logic, Parallel Bus Bridges (PCI/ISA/VME), Motor Control State Machines, Protocol Converters (UART/SPI/I2C Multiplexers), Legacy Peripheral Controllers, Test & Measurement Front-End Logic.
Industrial Control Glue Logic
The EPF6010ATI100-2N fits industrial control glue-logic applications thanks to its 880 logic cells and 71 I/O pins operating across the -40 °C to +85 °C industrial temperature range. Designers use it to consolidate discrete 74-series logic into a single reconfigurable device, implementing handshake arbiters, address decoders, and watchdog state machines that previously required multiple TTL chips. The 166.67 MHz internal frequency supports encoder feedback and PWM coordination tasks at the millisecond timescale, while the 3.3 V core with 5 V tolerant I/O enables direct interfacing with legacy 5 V sensors and actuators. Compared to a CPLD of equivalent density, the FLEX 6000 offers richer sequential logic and JTAG-driven in-field updates, allowing the same hardware to ship with multiple control personalities loaded via JTAG.
Recommended
Parallel Bus Bridges (PCI/ISA/VME)
Bus-bridging applications leverage the EPF6010ATI100-2N's 71 I/O pins and TQFP-100 footprint to implement protocol converters between legacy parallel buses (ISA, VME, PC/104) and modern high-speed interfaces. The 880 logic cells provide sufficient capacity for state machines tracking bus arbitration, address decoding, and DMA handshakes without external logic. The industrial temperature range and 5 V tolerant I/Os are critical when bridging to legacy 5 V backplanes, while the 3.3 V core keeps power dissipation manageable in densely populated bridge cards. Designers typically pair the FPGA with a small configuration PROM (e.g., EPC2) so the bridge enumerates correctly on every power-up, and use JTAG for in-field firmware updates during commissioning.
Recommended
Motor Control State Machines
Stepper and BLDC motor control subsystems commonly use the EPF6010ATI100-2N to implement PWM generation, commutation sequencing, and encoder decoding in a single device. The 88 LABs provide parallel compute for FOC (field-oriented control) loops at moderate RPM, and the 166.67 MHz internal frequency supports encoder feedback at speeds up to several thousand RPM. Industrial temperature tolerance matches the harsh under-hood or factory-floor environment, while the TQFP-100 package withstands vibration better than BGAs in some mounting scenarios. Engineers typically add external gate drivers (IR2104 or similar) and current-sense amplifiers around the FPGA; the device itself focuses on real-time sequencing and safety interlocks.
Recommended
Protocol Converters (UART/SPI/I2C Multiplexers)
Protocol converter applications use the EPF6010ATI100-2N to bridge between UART, SPI, I2C, and proprietary serial interfaces, often appearing in telecom line cards and industrial sensor aggregators. The 71 user I/Os can host up to a dozen simultaneous serial channels with independent baud rates, and the SRAM-based configuration supports rapid deployment of new protocol personalities via JTAG. Industrial temperature operation is required for outdoor telecommunications equipment cabinets, and the 3.3 V core keeps heat dissipation low in sealed enclosures. Compared to a microcontroller of equivalent I/O count, the FPGA delivers deterministic latency critical for time-sensitive industrial protocols like SPI-to-I2S bridging in audio equipment.
Recommended
Legacy Peripheral Controllers
Long-lifecycle platforms (avionics, medical imaging, defense, industrial printing) often specify the EPF6010ATI100-2N as a proven peripheral controller because the part has been in production since 1998 and has accumulated extensive reliability data. It handles tasks like floppy-disk controllers, parallel-port emulators, IDE-to-CF bridges, and custom keypad scanners where redesign risk is unacceptable. The TQFP-100 package supports both automated assembly for volume production and hand-rework for repair depots. Industrial temperature range ensures operation in unconditioned enclosures, and 5 V tolerant I/Os interface directly with legacy peripherals without level shifters.
Recommended
Test & Measurement Front-End Logic
Test equipment manufacturers use the EPF6010ATI100-2N in the front-end logic of bench instruments (logic analyzers, protocol exercisers, switch matrices) where deterministic timing and reconfigurability matter more than raw density. The 880 logic cells fit a 32-channel logic analyzer or a 16-channel SPI/SWD exerciser, and the 71 I/Os accommodate scan chains and trigger distribution. Industrial temperature operation handles the wide thermal envelope of lab and field environments, while the JTAG interface enables on-the-fly pattern reloading during test development. The TQFP-100 package also simplifies prototype assembly in low-volume instrument runs.
Recommended
Recommended Products Summary
Engineering reference data for EPF6010ATI100-2N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF6010ATI100-2 | EPF6010ATC100-3N | EPF6010ATC100-2 | EPF6010ATC100-1 | EPF6010ATC100-3 | EPF6010ANTC100-3 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | TQFP-100 | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same |
| Logic Cells | 880 | 880 | 880 | 880 | 880 | 880 | 880 |
| System Gates | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 |
| User I/O | 71 | 71 | 71 | 71 | 71 | 71 | 71 |
| Temperature Grade | Industrial (-40 to +85 °C) | Industrial | Commercial (0 to +70 °C) | Commercial (0 to +70 °C) | Commercial (0 to +70 °C) | Commercial (0 to +70 °C) | Industrial (-40 to +85 °C) |
| Speed Grade | -2 | -2 | -3 (faster) | -2 | -1 (slower) | -3 (faster) | -3 (faster) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Same silicon and TQFP-100 footprint as EPF6010ATI100-2, differing only in lead-finish and date-code marking (vs EPF6010ATI100-2)
- Industrial temperature grade (-40 to +85 °C) versus commercial (0 to +70 °C) of EPF6010ATC100-3N (vs EPF6010ATC100-3N)
- Higher logic density than the legacy EPF6010ATC100-1 (which shares the same cell count but slower speed grade) (vs EPF6010ATC100-1)
Design Notes
The EPF6010ATI100-2N requires a stable 3.3 V core supply (VCCINT) with at least 200 mA headroom during configuration. During SRAM configuration the device draws transient inrush currents up to 500 mA; a bulk decoupling capacitor of at least 47 µF near the package is recommended alongside the standard 0.1 µF ceramic bypass per VCCINT pin. A dedicated supervisor (e.g., MAX811) should hold nCONFIG low until VCCINT reaches 3.0 V to prevent brown-out configuration corruption. The VCCIO rail can be tied to the same 3.3 V supply if 5 V tolerant inputs are sufficient, or driven independently when interfacing to 5 V buses.
Do not omit the external configuration PROM - the FLEX 6000 family uses SRAM configuration cells that lose their bitstream on every power-down. A single EPC2LC20 (or compatible EPC1, EPC4) serial configuration PROM is mandatory for standalone operation. The MSEL pins must be strapped to select the configuration mode (AS for serial PROM, JTAG for boundary-scan only). Pin 1 orientation on the TQFP-100 must be observed carefully during hand prototyping; the package is symmetrical along the long axis, and reversed orientation can destroy the device under power.
The 71 user I/Os on the TQFP-100 share four I/O banks; assign I/O voltage levels per bank to avoid contention. Source-synchronous interfaces (e.g., parallel ATA, video capture) should constrain matching pins to a single bank to minimize skew across the die. The 5 V tolerant input stage introduces approximately 5 pF pin capacitance; engineers should derate maximum toggle frequency accordingly when driving long PCB traces. Series termination (33 Ω) on clock and high-speed strobe pins is recommended at TQFP-100 escape velocities.
The 0.42 µm FLEX 6000 process consumes approximately 150 mW quiescent plus dynamic switching current proportional to toggle rate. Estimated: at 50 MHz with 50% I/O toggling, total dissipation reaches approximately 600 mW. The TQFP-100 package's θJA of approximately 35 °C/W (still air, no heatsink) yields a junction temperature rise of 21 °C above ambient, comfortably inside the 125 °C junction limit. No external heatsink is required for typical industrial-control use cases.
Compliance Information
Compliance data is not available in verified sources for this legacy Altera-era part. RoHS/REACH status varies by date code; consult distributor certificates of conformance for specific lot data.
