EPF6016ATI100-2 - FLEX 6000 FPGA 16K Gates 81 I/O 100-TQFP | Altera
MPN: EPF6016ATI100-2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $26.4 | $26.40 |
| 10 | $24.8 | $248.00 |
| 100 | $22.5 | $2,250.00 |
| 500 | $19.9 | $9,950.00 |
| 1,000 | $17.4 | $17,400.00 |
EPF6016ATI100-2 Overview
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that combines the high integration of a gate array with the design flexibility of in-system programmability. In the broader system hierarchy, the FLEX 6000 family sits between simple SPLDs/CPLDs and high-density SRAM-based FPGAs such as the FLEX 10K and APEX families, targeting cost-sensitive applications that previously required fixed gate arrays. The FLEX 6000 architecture uses Look-Up Tables (LUTs), embedded array blocks (EABs), and FastTrack interconnect to deliver deterministic timing at low cost.
Key features of the EPF6016ATI100-2 include 132 LABs (Logic Array Blocks), an industrial operating temperature range of 0°C to 85°C (commercial) per the distributor datasheet, and FineLine BGA-compatible pin assignments in the 100-TQFP variant. The "I" suffix indicates the industrial temperature grade, while the "-2" speed grade designates a mid-range performance bin. The device is configured via a serial EPROM or microcontroller and supports in-system programmability through the JTAG IEEE 1149.1 boundary-scan interface.
Typical applications include peripheral interface bridging, custom bus controllers, glue logic in telecom and networking equipment, low-volume ASIC replacement, and rapid prototyping of digital systems. The EPF6016ATI100-2 provides an ideal low-cost, programmable alternative to high-volume gate array designs, allowing fast design changes during prototyping or production testing.
When designing with this FPGA, plan for external configuration memory (typically an EPC2 or EPC16 serial configuration device) and ensure all I/O banks are powered within the 3.0 V to 3.6 V range. This page synthesizes distributor inventory data, cross-references, and engineering trade-offs that the manufacturer datasheet alone does not provide.
Drop-in alternatives for EPF6016ATI100-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF6016ATI100-2 (same form factor and footprint) — differing in Operating Temperature, Package, Process Technology, Speed Grade, Logic Array Blocks (LABs).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF6016ATC100-2
✅ Drop-In✓ In Stock
$22.49 / Unit
View Datasheet →EPF6016ATC100-3N
✅ Drop-In✓ In Stock
$10.4 / Unit
View Datasheet →EPF6016ATC100-3
✅ Drop-In✓ In Stock
$11.4 / Unit
View Datasheet →EPF6016ATC100-1
✅ Drop-In✓ In Stock
$28.83 / Unit
View Datasheet →EPF6010ATI100-2
✅ Drop-In✓ In Stock
$16.2 / Unit
View Datasheet →EPF6010ATI100-2N
✅ Drop-In✓ In Stock
$11.5 / Unit
View Datasheet →EPF6016ATI100-2 Maximum Ratings & Electrical Characteristics
| Device Type | FPGA (FLEX 6000 family) |
| Family | FLEX 6000 |
| Logic Elements / Cells | 1320 |
| Equivalent Gates | 16,000 |
| Logic Array Blocks (LABs) | 132 |
| User I/Os | 81 |
| Internal Frequency (max) | 166.67 MHz |
| Supply Voltage | 3.3 V (3.0 V to 3.6 V) |
| Process Technology | 0.42 µm CMOS |
| Package | 100-pin TQFP (14x14 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C to 85°C |
| Speed Grade | -2 |
| Programming Interface | JTAG (IEEE 1149.1), serial configuration |
| Configuration Memory | External (EPC2/EPC16 series recommended) |
EPF6016ATI100-2 100-pin tqfp (14x14 mm) Pin Configuration Guide
Pin configuration for EPF6016ATI100-2 (100-pin tqfp (14x14 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF6016ATI100-2.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF6016ATI100-2 is suitable for 6 applications: ASIC Replacement / Gate Array Emulation, Peripheral Interface Bridging, Telecom / Networking Glue Logic, Rapid Prototyping & Emulation Platforms, Industrial Control & Factory Automation, Legacy Maintenance & Field Repair.
ASIC Replacement / Gate Array Emulation
The EPF6016ATI100-2 was designed as a low-cost, programmable substitute for fixed gate arrays in high-volume applications. With 16,000 equivalent gates and 1,320 logic elements, the device emulates small-to-medium ASICs in glue-logic functions, allowing late-stage design changes without respinning silicon. Its 100-TQFP package and JTAG re-programmability make it ideal for production lines where fast turnaround on logic corrections is required. Compared to a fixed gate array, the FLEX 6000 architecture reduces NRE costs to zero and shrinks prototyping cycles from months to days.
Recommended
Peripheral Interface Bridging
The 81 user I/Os and 3.3 V operation of the EPF6016ATI100-2 make it well suited for bridging legacy and modern peripheral buses - for example, ISA-to-PCI bus bridges, parallel-port expansion, or custom UART/SPI multiplexing in industrial PC designs. The device's 166.67 MHz internal frequency comfortably handles 33 MHz PCI and 100 MHz synchronous buses, while the TQFP-100 footprint exposes enough I/O for wide data-path translation. Compared with discrete 74-series glue logic, an FPGA-based bridge consolidates dozens of chips into one re-programmable device.
Recommended
Telecom / Networking Glue Logic
Inside routers, switches, and access multiplexers the EPF6016ATI100-2 performs front-panel LED control, watchdog timers, bus arbiters, and clock-domain crossings between line-card ASICs. The industrial 0-85°C temperature grade suits thermally constrained telecom enclosures, and the SRAM-based architecture allows field firmware updates via JTAG when protocol revisions ship. The 16K-gate capacity is sufficient for multi-channel HDLC controllers, simple framer interfaces, and TDM switch matrices without resorting to a larger FLEX 10K device.
Recommended
Rapid Prototyping & Emulation Platforms
Designers use the EPF6016ATI100-2 on prototype boards to validate new digital architectures before committing to an ASIC or gate-array spin. The JTAG IEEE 1149.1 boundary-scan interface allows instant in-system logic changes, while the 100-TQFP package is hand-solderable on breadboard adapters for low-volume labs. The device's 166.67 MHz fmax enables realistic timing validation of CPU glue logic, DMA controllers, and memory interfaces. Combined with Quartus II Web Edition software, engineers can complete full design entry, synthesis, place-and-route, and verification in hours.
Recommended
Industrial Control & Factory Automation
Industrial PLCs and motor controllers leverage the EPF6016ATI100-2 for PWM generation, encoder quadrature decoding, and safety-interlock logic where fixed logic would be too rigid. The 81 I/Os handle multiple 24 V-tolerant opto-isolated signal paths after external level shifting, and the 0.42 µm CMOS process provides proven long-term reliability in continuous-duty factory environments. The device's re-programmability simplifies IEC 61131-3 safety-logic certification updates without hardware rework.
Recommended
Legacy Maintenance & Field Repair
Because the EPF6016ATI100-2 is now obsolete, its most common application is maintaining installed telecom, military, and industrial systems originally designed around the FLEX 6000 family. Distributors including Rochester Electronics, Heisener, and Infinity-Semiconductor hold remaining inventory for board-level repair and last-time-buy orders. Engineers verifying a faulty board can use JTAG boundary-scan to confirm FPGA logic integrity before replacement, then re-program the EPC2 EPROM if the original bitstream is preserved in version control.
Recommended
Recommended Products Summary
Engineering reference data for EPF6016ATI100-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF6016ATC100-2 | EPF6016ATC100-3N | EPF6016ATC100-3 | EPF6016ATC100-1 | EPF6010ATI100-2 | EPF6010ATI100-2N |
|---|---|---|---|---|---|---|---|
| Package | 100-TQFP (14x14 mm) | 100-TQFP (14x14 mm) | 100-TQFP (14x14 mm) | 100-TQFP (14x14 mm) | 100-TQFP (14x14 mm) | 100-TQFP (14x14 mm) | 100-TQFP (14x14 mm) |
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Logic Capacity (gates) | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 | 10,000 | 10,000 |
| Logic Elements | 1320 | 1320 | 1320 | 1320 | 1320 | ~880 | ~880 |
| Speed Grade | -2 | -2 | -3 | -3 | -1 | -2 | -2 |
| Temperature Grade | Industrial (0-85°C) | Commercial (0-85°C) | Commercial (0-85°C) | Commercial (0-85°C) | Commercial (0-85°C) | Industrial (0-85°C) | Industrial (0-85°C) |
| User I/Os | 81 | 81 | 81 | 81 | 81 | 71 | 71 |
| Supply Voltage | 3.3 V (3.0-3.6 V) | 3.3 V (3.0-3.6 V) | 3.3 V (3.0-3.6 V) | 3.3 V (3.0-3.6 V) | 3.3 V (3.0-3.6 V) | 3.3 V (3.0-3.6 V) | 3.3 V (3.0-3.6 V) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest logic density in FLEX 6000 100-TQFP family (vs EPF6010ATI100-2)
- Industrial temperature grade for harsh environments (vs EPF6016ATC100-2)
- Mid-range speed grade balances cost and performance (vs EPF6016ATC100-3)
Design Notes
The EPF6016ATI100-2 requires a tightly regulated 3.3 V supply between 3.0 V and 3.6 V; ripple above 50 mVpk-pk can cause configuration failures or logic errors during SRAM bitstream load. Decouple VCCINT and VCCIO pins with one 0.1 µF ceramic per pin group and a single 33 µF tantalum bulk capacitor within 1 inch of the device. Power-on ramp should be monotonic between 0 V and 3.6 V in less than 100 ms to satisfy the configuration logic reset requirement; an RC reset supervisor (e.g., MAX811) is recommended for production boards.
The 100-TQFP package has a 0.5 mm lead pitch, requiring fine-line PCB fabrication (≥6 mil trace/space recommended). Provide at least four via-stitched ground-keepout regions under the device for thermal dissipation and signal-return integrity, and route all 81 user I/Os on the outer two layers for shortest stub lengths. JTAG TDI/TDO/TMS/TCK traces must be length-matched within 25 mm to maintain boundary-scan timing; keep configuration and clock traces away from switching power or high-current signals.
Do not omit the external configuration EPROM (EPC2LC20N or equivalent) - the FLEX 6000 is SRAM-based and loses its logic on every power cycle. Ensure the JTAG chain does not include other devices with mismatched VCCIO levels, or use a level shifter on TDI/TDO. Verify the Quartus II project setting matches the actual silicon revision (-2 speed grade); using the wrong speed grade file will produce a working but out-of-spec design. Finally, keep original .pof/.sof files in version control - obsolete parts cannot be re-generated.
Compliance Information
Compliance information not present in the verified distributor data; RoHS/REACH status should be verified against the manufacturer datasheet or specific reel/label. AEC-Q100 not applicable - this is a commercial/industrial FPGA, not an automotive-qualified part.
