EPF6016ATC144-1N - FLEX 6000 FPGA, 16K Gates, 144-TQFP | Intel
MPN: EPF6016ATC144-1N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $32.75 | $327.50 |
| 100 | $26.4 | $2,640.00 |
| 500 | $21.95 | $10,975.00 |
| 1,000 | $18.2 | $18,200.00 |
EPF6016ATC144-1N Overview
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows designers to configure digital logic blocks and interconnect routing after manufacturing. FPGAs sit at the top of the programmable logic hierarchy: CPLD (Complex Programmable Logic Device) -> FPGA -> structured ASIC. The FLEX 6000 family was Altera's first SRAM-based FPGA family and represented a major step in low-cost, high-volume programmable logic, occupying the space between traditional CPLDs and high-density FLEX 10K FPGAs.
Key features of the EPF6016ATC144-1N include: 1,320 logic elements, an internal frequency rating of up to 172 MHz, 117 user I/O pins, and SRAM-based configuration that supports in-system reprogramming. The 144-TQFP package uses a 20 mm × 20 mm body with 0.5 mm pitch gull-wing leads, making it compatible with standard SMT assembly lines. The device is built on a 0.42 µm CMOS process with 5 nm SRAM configuration cells, providing fast reconfiguration and unlimited reprogram cycles.
The EPF6016ATC144-1N architecture combines Logic Array Blocks (LABs), Embedded Array Blocks (EABs) for memory functions, FastTrack interconnecting routing, and dedicated I/O cells with JTAG support. MultiVolt I/O allows interfacing with 3.3V and 5.0V logic. The device is programmed via the Altera ByteBlaster or BitBlaster download cable through a JTAG interface, and supports both serial and parallel configuration modes.
Typical applications include glue logic replacement, high-volume gate-array prototyping, industrial control logic, communications interface bridging, and consumer electronics where fast design changes are required during prototyping or design testing. The wide commercial temperature range and moderate logic capacity make it suitable for cost-sensitive production runs.
When designing with the EPF6016ATC144-1N, ensure adequate decoupling: place 0.1 µF and 10 µF capacitors close to each VCCINT and VCCIO pin. The 144-TQFP package requires careful PCB thermal management — at high toggle rates, junction temperature can rise significantly above ambient. Always configure unused I/O pins as inputs with bus-hold enabled or as outputs driving ground to minimize switching noise.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the original Altera datasheet — giving engineers a single source for parametric comparison and supply-chain decisions on this legacy but still-relevant FPGA.
Drop-in alternatives for EPF6016ATC144-1N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF6016ATC144-1N (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Speed Grade, Configuration Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF6016ATC144-1
✅ Drop-In✓ In Stock
$9.95 / Unit
View Datasheet →EPF6016ATC144-2N
✅ Drop-In✓ In Stock
$19.5 / Unit
View Datasheet →EPF6016ATC144-3N
✅ Drop-In✓ In Stock
$12.4 / Unit
View Datasheet →EPF6016AQC208-3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$31.2 / Unit
View Datasheet →EPF6016ATC144-1N Maximum Ratings & Electrical Characteristics
| Device Type | FLEX 6000 FPGA |
| Family | FLEX 6000 |
| Typical Gates | 16,000 |
| Logic Elements / Cells | 1,320 |
| Number of I/O | 117 |
| Supply Voltage | 3.0 V to 3.6 V |
| Internal Frequency | 172 MHz |
| Operating Temperature | 0°C to +85°C (Commercial) |
| Package | 144-pin TQFP (20x20 mm, 0.5 mm pitch) |
| Mounting Type | Surface Mount |
| Configuration Memory | SRAM (5 nm, in-system programmable) |
| Programming Interface | JTAG (ByteBlaster / BitBlaster) |
| Process Technology | 0.42 µm CMOS |
| I/O Standards | 3.3V / 5.0V MultiVolt |
EPF6016ATC144-1N Pin Configuration
| Pin 1 | I/O — User I/O pin (bank 1) |
| Pin 2 | I/O — User I/O pin (bank 1) |
| Pin 3 | I/O — User I/O pin (bank 1) |
| Pin 4 | I/O — User I/O pin (bank 1) |
| Pin 5 | VCCINT — Core supply voltage 3.3V |
| Pin 6 | I/O — User I/O pin (bank 1) |
| Pin 7 | I/O — User I/O pin (bank 1) |
| Pin 8 | I/O — User I/O pin (bank 1) |
| Pin 9 | GND — Ground |
| Pin 10 | I/O — User I/O pin (bank 1) |
| Pin 11 | I/O — User I/O pin (bank 1) |
| Pin 12 | I/O — User I/O pin (bank 1) |
| Pin 13 | I/O — User I/O pin (bank 1) |
| Pin 14 | I/O — User I/O pin (bank 1) |
| Pin 15 | I/O — User I/O pin (bank 1) |
| Pin 16 | I/O — User I/O pin (bank 1) |
| Pin 17 | I/O — User I/O pin (bank 1) |
| Pin 18 | I/O — User I/O pin (bank 1) |
| Pin 19 | I/O — User I/O pin (bank 1) |
| Pin 20 | I/O — User I/O pin (bank 1) |
| Pin 21 | GND — Ground |
| Pin 22 | I/O — User I/O pin (bank 1) |
| Pin 23 | I/O — User I/O pin (bank 1) |
| Pin 24 | I/O — User I/O pin (bank 1) |
| Pin 25 | I/O — User I/O pin (bank 1) |
| Pin 26 | I/O — User I/O pin (bank 1) |
| Pin 27 | I/O — User I/O pin (bank 1) |
| Pin 28 | I/O — User I/O pin (bank 1) |
| Pin 29 | I/O — User I/O pin (bank 1) |
| Pin 30 | VCCIO1 — I/O bank 1 supply voltage (3.3V or 5V) |
| Pin 31 | I/O — User I/O pin (bank 1) |
| Pin 32 | I/O — User I/O pin (bank 1) |
| Pin 33 | I/O — User I/O pin (bank 1) |
| Pin 34 | I/O — User I/O pin (bank 1) |
| Pin 35 | I/O — User I/O pin (bank 1) |
| Pin 36 | GND — Ground |
| Pin 37 | I/O — User I/O pin (bank 2) |
| Pin 38 | I/O — User I/O pin (bank 2) |
| Pin 39 | I/O — User I/O pin (bank 2) |
| Pin 40 | I/O — User I/O pin (bank 2) |
| Pin 41 | I/O — User I/O pin (bank 2) |
| Pin 42 | I/O — User I/O pin (bank 2) |
| Pin 43 | I/O — User I/O pin (bank 2) |
| Pin 44 | I/O — User I/O pin (bank 2) |
| Pin 45 | I/O — User I/O pin (bank 2) |
| Pin 46 | I/O — User I/O pin (bank 2) |
| Pin 47 | GND — Ground |
| Pin 48 | I/O — User I/O pin (bank 2) |
| Pin 49 | I/O — User I/O pin (bank 2) |
| Pin 50 | I/O — User I/O pin (bank 2) |
| Pin 51 | I/O — User I/O pin (bank 2) |
| Pin 52 | I/O — User I/O pin (bank 2) |
| Pin 53 | VCCINT — Core supply voltage 3.3V |
| Pin 54 | I/O — User I/O pin (bank 2) |
| Pin 55 | I/O — User I/O pin (bank 2) |
| Pin 56 | I/O — User I/O pin (bank 2) |
| Pin 57 | I/O — User I/O pin (bank 2) |
| Pin 58 | I/O — User I/O pin (bank 2) |
| Pin 59 | I/O — User I/O pin (bank 2) |
| Pin 60 | I/O — User I/O pin (bank 2) |
| Pin 61 | GND — Ground |
| Pin 62 | I/O — User I/O pin (bank 3) |
| Pin 63 | I/O — User I/O pin (bank 3) |
| Pin 64 | I/O — User I/O pin (bank 3) |
| Pin 65 | I/O — User I/O pin (bank 3) |
| Pin 66 | I/O — User I/O pin (bank 3) |
| Pin 67 | I/O — User I/O pin (bank 3) |
| Pin 68 | I/O — User I/O pin (bank 3) |
| Pin 69 | I/O — User I/O pin (bank 3) |
| Pin 70 | I/O — User I/O pin (bank 3) |
| Pin 71 | I/O — User I/O pin (bank 3) |
| Pin 72 | GND — Ground |
| Pin 73 | I/O — User I/O pin (bank 3) |
| Pin 74 | I/O — User I/O pin (bank 3) |
| Pin 75 | I/O — User I/O pin (bank 3) |
| Pin 76 | I/O — User I/O pin (bank 3) |
| Pin 77 | I/O — User I/O pin (bank 3) |
| Pin 78 | VCCINT — Core supply voltage 3.3V |
| Pin 79 | I/O — User I/O pin (bank 3) |
| Pin 80 | I/O — User I/O pin (bank 3) |
| Pin 81 | I/O — User I/O pin (bank 3) |
| Pin 82 | I/O — User I/O pin (bank 3) |
| Pin 83 | I/O — User I/O pin (bank 3) |
| Pin 84 | I/O — User I/O pin (bank 3) |
| Pin 85 | GND — Ground |
| Pin 86 | I/O — User I/O pin (bank 4) |
| Pin 87 | I/O — User I/O pin (bank 4) |
| Pin 88 | I/O — User I/O pin (bank 4) |
| Pin 89 | I/O — User I/O pin (bank 4) |
| Pin 90 | I/O — User I/O pin (bank 4) |
| Pin 91 | I/O — User I/O pin (bank 4) |
| Pin 92 | I/O — User I/O pin (bank 4) |
| Pin 93 | I/O — User I/O pin (bank 4) |
| Pin 94 | I/O — User I/O pin (bank 4) |
| Pin 95 | I/O — User I/O pin (bank 4) |
| Pin 96 | GND — Ground |
| Pin 97 | I/O — User I/O pin (bank 4) |
| Pin 98 | I/O — User I/O pin (bank 4) |
| Pin 99 | I/O — User I/O pin (bank 4) |
| Pin 100 | I/O — User I/O pin (bank 4) |
| Pin 101 | I/O — User I/O pin (bank 4) |
| Pin 102 | VCCIO4 — I/O bank 4 supply voltage (3.3V or 5V) |
| Pin 103 | I/O — User I/O pin (bank 4) |
| Pin 104 | I/O — User I/O pin (bank 4) |
| Pin 105 | I/O — User I/O pin (bank 4) |
| Pin 106 | I/O — User I/O pin (bank 4) |
| Pin 107 | I/O — User I/O pin (bank 4) |
| Pin 108 | I/O — User I/O pin (bank 4) |
| Pin 109 | GND — Ground |
| Pin 110 | I/O — User I/O pin (bank 1) |
| Pin 111 | I/O — User I/O pin (bank 1) |
| Pin 112 | I/O — User I/O pin (bank 1) |
| Pin 113 | I/O — User I/O pin (bank 1) |
| Pin 114 | I/O — User I/O pin (bank 1) |
| Pin 115 | I/O — User I/O pin (bank 1) |
| Pin 116 | I/O — User I/O pin (bank 1) |
| Pin 117 | I/O — User I/O pin (bank 1) |
| Pin 118 | I/O — User I/O pin (bank 1) |
| Pin 119 | I/O — User I/O pin (bank 1) |
| Pin 120 | GND — Ground |
| Pin 121 | I/O — User I/O pin (bank 1) |
| Pin 122 | I/O — User I/O pin (bank 1) |
| Pin 123 | I/O — User I/O pin (bank 1) |
| Pin 124 | I/O — User I/O pin (bank 1) |
| Pin 125 | I/O — User I/O pin (bank 1) |
| Pin 126 | VCCINT — Core supply voltage 3.3V |
| Pin 127 | I/O — User I/O pin (bank 1) |
| Pin 128 | I/O — User I/O pin (bank 1) |
| Pin 129 | I/O — User I/O pin (bank 1) |
| Pin 130 | I/O — User I/O pin (bank 1) |
| Pin 131 | I/O — User I/O pin (bank 1) |
| Pin 132 | I/O — User I/O pin (bank 1) |
| Pin 133 | GND — Ground |
| Pin 134 | nCONFIG — Configuration control (active-low) |
| Pin 135 | nSTATUS — Configuration status (active-low) |
| Pin 136 | CONF_DONE — Configuration complete (active-high) |
| Pin 137 | TCK — JTAG test clock |
| Pin 138 | TMS — JTAG test mode select |
| Pin 139 | TDO — JTAG test data out |
| Pin 140 | TDI — JTAG test data in |
| Pin 141 | CLK0 — Clock input 0 |
| Pin 142 | CLK1 — Clock input 1 |
| Pin 143 | VCCINT — Core supply voltage 3.3V |
| Pin 144 | GND — Ground |
Typical Applications
EPF6016ATC144-1N is suitable for 6 applications: Glue Logic Replacement, High-Volume Gate Array Prototyping, Industrial Control Logic, Communications Interface Bridging, Consumer Electronics Logic Consolidation, Legacy Test Equipment & Maintenance.
Glue Logic Replacement
The EPF6016ATC144-1N with 1,320 logic elements and 117 user I/Os is well suited to replace discrete 74-series and PAL/GAL glue-logic in complex digital systems. By consolidating multiple TTL chips into a single programmable device, designers reduce PCB area, BOM count, and signal-trace length — improving signal integrity at high bus speeds. The 172 MHz internal frequency supports fast register-to-register paths typical of address decoding, bus arbitration, and timing-constraint glue. Engineers port their discrete logic via the Quartus / MAX+PLUS II toolchain and verify timing with the included timing analyzer, with typical designs consuming 60–80% of the 1,320 logic cells while leaving headroom for iterative ECO changes.
Recommended
High-Volume Gate Array Prototyping
The EPF6016ATC144-1N provides an ideal low-cost, programmable alternative to high-volume gate-array ASICs and allows fast design changes during prototyping or design testing. With 16,000 typical gates, it sits in the sweet spot for gate-array prototyping where engineers validate logic and routing before committing to NRE-heavy mask-set production. JTAG-based in-system reprogramming supports rapid iterations, and SRAM configuration supports unlimited design changes without replacing the device. Once design is frozen, the validated netlist can be ported to a hard-array ASIC for high-volume production, dramatically reducing time-to-market and design risk compared to traditional ASIC development.
Recommended
Industrial Control Logic
The EPF6016ATC144-1N's 117 I/O pins support direct connection to industrial sensors, actuators, and bus peripherals typically found in factory automation controllers. Its 3.0–3.6V core supply with MultiVolt I/O accepts 5V inputs from legacy industrial circuitry, allowing the FPGA to coexist with 5V PLC I/O modules while running internally from a regulated 3.3V rail. The 0–85°C commercial temperature range suits most factory-floor enclosures, and the SRAM configuration allows firmware updates over JTAG during commissioning and field service. Engineers implement state-machine logic for sequencing, pulse-width modulation for motor control, and parallel bus bridging between legacy and modern subsystems.
Recommended
Communications Interface Bridging
The EPF6016ATC144-1N serves as a flexible protocol-bridging device in communications equipment, supporting conversion between UART, SPI, I²C, parallel buses, and custom proprietary interfaces. With 1,320 logic cells, designers implement multi-channel protocol converters with on-the-fly data-rate matching, byte-order swapping, and FIFO buffering. The 172 MHz internal frequency handles aggregate throughput of 50–100 Mbps across multiple parallel channels, while 117 I/Os accommodate 8- or 16-bit parallel data paths plus control signals. SRAM-based reconfiguration also enables field upgrades to support new protocol revisions without hardware replacement.
Recommended
Consumer Electronics Logic Consolidation
In cost-sensitive consumer electronics, the EPF6016ATC144-1N consolidates multiple discrete logic functions — display controllers, key-scanning matrices, LED multiplexing, and audio-routing logic — into a single reprogrammable device. The 144-TQFP package is widely supported by high-volume SMT lines, and the SRAM configuration enables last-minute feature changes during pilot production. With 117 I/Os the part drives multiple character LCDs, LED arrays, and key-scan matrices simultaneously while leaving logic headroom for additional product-differentiating features. As of 2026-09-11, however, new consumer designs typically migrate to MAX II CPLDs or smaller Cyclone FPGAs for better availability and lower unit cost.
Recommended
Legacy Test Equipment & Maintenance
The EPF6016ATC144-1N continues to see service in legacy test-and-measurement equipment where its original design was based on the FLEX 6000 family and where OEM support has ended. With obsolete-stock availability through brokers like Heisener, Xecor, and Avaq as of 2026-09-11, the part remains a viable maintenance solution for legacy test racks, ATE fixtures, and industrial controllers. Engineers tasked with extending the life of installed equipment use SRAM reconfiguration to apply bug fixes and feature enhancements without replacing expensive instruments. For new test equipment, however, modern Cyclone IV/V or MAX V CPLDs offer active manufacturer support and significantly lower cost.
Recommended
Recommended Products Summary
Engineering reference data for EPF6016ATC144-1N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF6016ATC144-1 | EPF6016ATC144-2N | EPF6016ATC144-3N | EPF6016AQC208-3N |
|---|---|---|---|---|---|
| Package | 144-TQFP (20x20 mm) | 144-TQFP - same | 144-TQFP - same | 144-TQFP - same | 208-PQFP - DIFFERENT |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) - same | Intel (formerly Altera) - same | Intel (formerly Altera) - same | Intel (formerly Altera) - same |
| Logic Elements / Cells | 1,320 cells | 1,320 cells | 1,320 cells | 1,320 cells | 1,320 cells |
| Speed Grade | -1 (fastest) | -1 | -2 (slower) | -3 (slowest) | -3 (slowest) |
| User I/O Count | 117 | 117 | 117 | 117 | 171 (in 208-PQFP) |
| RoHS Compliant | Yes (Pb-free, 'N' suffix) | No (non-RoHS) | Yes | Yes | Yes |
| Operating Temperature | 0°C to +85°C (Commercial) | 0°C to +85°C | 0°C to +85°C | 0°C to +85°C | 0°C to +85°C |
| Lifecycle Status (2026) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- RoHS-compliant (Pb-free) termination (vs EPF6016ATC144-1)
- Fastest speed grade (-1) of the FLEX 6000 family (vs EPF6016ATC144-2N / EPF6016ATC144-3N)
- Higher I/O density in same 144-TQFP footprint vs older FLEX 6000 variants (vs EPF6010ATC144-1 (FLEX 6010 family))
Design Notes
The EPF6016ATC144-1N requires separate VCCINT (3.0–3.6V core) and VCCIO (3.3V or 5V I/O bank) supplies. Place a 0.1 µF ceramic decoupling capacitor adjacent to every VCCINT and VCCIO pin, plus a single 10–47 µF bulk tantalum or aluminum polymer capacitor per supply rail. Estimated: with 117 I/Os toggling at 50 MHz, the core current draw is approximately 30–60 mA — add at least 30% margin when sizing the 3.3V regulator. Power-on sequencing is not required, but VCCINT must be stable before nCONFIG is released.
The 144-TQFP package (20x20 mm, 0.5 mm pitch) requires careful PCB layout: use a 4-layer board with continuous ground plane beneath the device, escape traces from inner pads on the package perimeter, and 0.1 µF / 10 µF decoupling within 5 mm of every VCC pin. Estimated: trace impedance should target 50 Ω single-ended for clock and JTAG signals; failure to control impedance may cause signal integrity issues at 100+ MHz I/O toggling. Route JTAG signals (TCK, TMS, TDI, TDO) as a bus with ground guard traces to minimize crosstalk.
Common pitfalls when working with the EPF6016ATC144-1N: (1) forgetting to enable MultiVolt I/O via the configuration bitstream — without it, 5V input signals will damage the 3.3V I/O cells; (2) leaving unused I/O pins floating — always configure as inputs with bus-hold or outputs driving ground to minimize power consumption; (3) failing to recompile the design after a speed-grade change — swapping -1 for -2 or -3 requires timing re-analysis because internal delays change; (4) assuming all FLEX 6000 variants are pin-compatible — different package options (100-TQFP, 144-TQFP, 208-PQFP, 256-BGA) have different I/O counts and pin assignments even within the same family.
Compliance Information
RoHS compliance indicated by 'N' suffix in MPN. REACH, halogen-free, and conflict-minerals status not stated in available datasheet excerpts — set to 'unknown'. Not AEC-Q100 qualified (commercial 0–85°C grade only).