Intel

EPF6010ATC144-3 - 10K Gates FLEX 6000 FPGA, 144-TQFP | Intel

MPN: EPF6010ATC144-3 ✗ End of Life
In Stock Ships in 1-3 business days
3.0 V to 3.6 V Vdss LVTTL, LVCMOS, PCI compatible; multiVolt I/O Rds(on) 144-pin TQFP (Fine Line) Package 142.86 MHz Speed SRAM (volatile, re-programmable) Memory
From $9.75 USD / Unit
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Price updated: 2026-09-11
Volume Pricing
Qty Unit Price Extended
1 $18.5 $18.50
10 $16.2 $162.00
100 $13.85 $1,385.00
500 $11.4 $5,700.00
1,000 $9.75 $9,750.00
ℹ️ All prices are in USD

EPF6010ATC144-3 Overview

The Intel (formerly Altera) EPF6010ATC144-3 is a 10,000-gate FLEX 6000 family Field-Programmable Gate Array (FPGA) housed in a 144-pin Thin Quad Flat Pack (TQFP) package. Built on a 0.42 µm CMOS SRAM-based process, it integrates 880 logic elements and 102 user I/O pins, with a maximum internal operating frequency of approximately 142.86 MHz and a 3.3 V single supply requirement.

A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that combines the density of gate arrays with the design flexibility of user-customizable interconnect. The FLEX 6000 family sits at the lower-density end of the Altera/Intel CPLD/FPGA taxonomy: CPLD -> FLEX 6000 -> APEX/Stratix/Cyclone family hierarchy, used for glue logic, bus bridging, and moderate-complexity state-machine applications. FPGAs in this class are typically selected over CPLDs when the design requires more flip-flops, wider fan-in, or higher register density than a CPLD's macrocell structure can provide.

Key features include in-system programmability through a 4-pin JTAG/IEEE Std 1149.1 interface, built-in SRAM configuration memory, multiVolt I/O support for interfacing to 5.0 V, 3.3 V, and 2.5 V devices, and built-in boundary-scan test (BST) circuitry. The device also offers dedicated clock and global control signal networks, low-power standby modes, and tri-state buffer support on every I/O pin.

From an architectural standpoint, the EPF6010ATC144-3 uses logic elements (LEs) — each containing a 4-input look-up table, a programmable flip-flop, and dedicated carry/cascade chains — wired through a continuous, row-and-column FastTrack interconnect. The "-3" speed grade denotes a specific Fmax bin in the Altera naming convention; -3 parts are typically faster than -2 and -1 grade equivalents. Configuration data can be loaded from a serial EPROM or via JTAG, and the part retains its configuration indefinitely while VCC is held within specification.

Typical applications include legacy industrial control interfaces, telecommunications glue logic, bus-bridge and protocol-conversion bridges (e.g., PCI to local bus), and educational/development platforms for digital logic curricula. The wide 3.3 V supply tolerance makes it compatible with both 3.3 V and 5 V mixed-voltage systems when used with proper level-shifting.

When designing with this part, attention must be paid to I/O bank voltage selection, decoupling capacitor placement near each VCC/GND pair, and configuration mode selection (PS, AS, or JTAG). The 144-pin TQFP is a fine-pitch (0.5 mm pitch) package that requires careful PCB layout and assembly; production volumes should use a contract assembler familiar with fine-pitch QFP handling.

Drop-in alternatives for EPF6010ATC144-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EPF6010ATC144-3 (same form factor and footprint) — differing in Package, Configuration Method, Process Technology, Logic Array Blocks (LABs), Speed Grade.

Intel
Package: 144-LQFP / TQFP-144 (20x20 mm)
Configuration Method: SRAM, in-system programmable via ByteBlaster/BitBlaster
Process Technology: 0.42 µm CMOS
Compare with EPF6010ATC144-3 →
Altera
Package: 144-LQFP (TQFP)
Configuration Method: Serial (EPC) or JTAG
Logic Array Blocks (LABs): 88
Compare with EPF6010ATC144-3 →
Intel
Package: 144-pin TQFP (20x20 mm, 1.0 mm pitch)
Process Technology: 0.42 µm CMOS, SRAM-based
Compare with EPF6010ATC144-3 →
Intel
Package: 256-ball FineLine BGA (FBGA)
Configuration Method: SRAM (volatile, requires external PROM)
Process Technology: 0.42 µm CMOS
Compare with EPF6010ATC144-3 →
Intel
Package: 144-pin LQFP (LFQFP)
Process Technology: 0.30 µm CMOS SRAM
Compare with EPF6010ATC144-3 →
Intel
Package: 144-pin TQFP (FineLine)
Configuration Method: SRAM, JTAG (IEEE 1149.1)
Process Technology: 0.42 µm CMOS
Compare with EPF6010ATC144-3 →
Intel
Package: TQFP-144 (20 x 20 mm)
Configuration Method: SRAM, ISP via JTAG or EPC2/EPC4 PROM
Logic Array Blocks (LABs): 132
Compare with EPF6010ATC144-3 →
Intel
Package: 144-LQFP (TQFP)
Logic Array Blocks (LABs): 196
Speed Grade: -3 (mid speed bin)
Compare with EPF6010ATC144-3 →
Altera
Package: TQFP-144 (TQ144)
Logic Array Blocks (LABs): 117
Speed Grade: -4
Compare with EPF6010ATC144-3 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EPF6010ATC144-2

✅ Drop-In
Altera
📦 TQFP-144
FLEX 6000 · 10,000 · 880 · 88 · 102 · 144-LQFP (TQFP) · -2 · 5 V

✓ In Stock

$14.95 / Unit

View Datasheet →

EPF6010ATC144-1

✅ Drop-In
Intel
📦 TQFP-144
FLEX 6000 · OptiFLEX, SRAM-based · 10K · 880 · 88 · 102 · 16 · 8192 bits

✓ In Stock

$10.95 / Unit

View Datasheet →

EPF6010ATC144-2N

✅ Drop-In ⚠️ 参数待验证
📦 TQFP-144
Same 144-TQFP pinout as EPF6010ATC144-3, speed grade -2 (~125 MHz, -12% Fmax), Pb-free suffix N

📋 Reference alternative (not in catalog)

EPF6010ATC144-3N

✅ Drop-In ⚠️ 参数待验证
Intel
📦 TQFP-144
FLEX 6000 · 880 · 10,000 · 88 · 102 · 880 · 3.3 V · 0.42 µm CMOS, SRAM-based

✓ In Stock

$24.6 / Unit

View Datasheet →

EPF6010ATC144-3 Maximum Ratings & Electrical Characteristics

Family FLEX 6000
Device Type FPGA (Field Programmable Gate Array)
System Gates 10,000
Logic Elements / Logic Cells 880
Maximum User I/O 102
Supply Voltage - Operating 3.0 V to 3.6 V
Process Technology 0.42 µm CMOS SRAM
Maximum Internal Frequency 142.86 MHz
Configuration Memory SRAM (volatile, re-programmable)
Programming Interface JTAG (IEEE Std 1149.1) / Serial
I/O Standards LVTTL, LVCMOS, PCI compatible; multiVolt I/O
Package Type 144-pin TQFP (Fine Line)
Pin Pitch 0.5 mm
Operating Temperature Grade Commercial / Industrial
Speed Grade -3
Mounting Type Surface Mount

EPF6010ATC144-3 Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 I/O — User I/O pin (bank 1)
Pin 2 I/O — User I/O pin (bank 1)
Pin 3 I/O — User I/O pin (bank 1)
Pin 4 I/O — User I/O pin (bank 1)
Pin 5 VCCIO1 — I/O bank 1 supply voltage
Pin 6 I/O — User I/O pin (bank 1)
Pin 7 I/O — User I/O pin (bank 1)
Pin 8 I/O — User I/O pin (bank 1)
Pin 9 GND — Ground
Pin 10 I/O — User I/O pin (bank 1)
Pin 11 I/O — User I/O pin (bank 1)
Pin 12 I/O — User I/O pin (bank 1)
Pin 13 I/O — User I/O pin (bank 1)
Pin 14 TDI — JTAG test data input
Pin 15 TMS — JTAG test mode select
Pin 16 TCK — JTAG test clock
Pin 17 I/O — User I/O pin (bank 1)
Pin 18 I/O — User I/O pin (bank 1)
Pin 19 I/O — User I/O pin (bank 1)
Pin 20 I/O — User I/O pin (bank 1)
Pin 21 GND — Ground
Pin 22 I/O — User I/O pin (bank 1)
Pin 23 I/O — User I/O pin (bank 1)
Pin 24 I/O — User I/O pin (bank 1)
Pin 25 I/O — User I/O pin (bank 1)
Pin 26 VCCIO1 — I/O bank 1 supply voltage
Pin 27 I/O — User I/O pin (bank 1)
Pin 28 I/O — User I/O pin (bank 1)
Pin 29 I/O — User I/O pin (bank 1)
Pin 30 I/O — User I/O pin (bank 1)
Pin 31 GND — Ground
Pin 32 I/O — User I/O pin (bank 2)
Pin 33 I/O — User I/O pin (bank 2)
Pin 34 I/O — User I/O pin (bank 2)
Pin 35 I/O — User I/O pin (bank 2)
Pin 36 I/O — User I/O pin (bank 2)
Pin 37 VCCIO2 — I/O bank 2 supply voltage
Pin 38 I/O — User I/O pin (bank 2)
Pin 39 I/O — User I/O pin (bank 2)
Pin 40 I/O — User I/O pin (bank 2)
Pin 41 GND — Ground
Pin 42 I/O — User I/O pin (bank 2)
Pin 43 I/O — User I/O pin (bank 2)
Pin 44 I/O — User I/O pin (bank 2)
Pin 45 I/O — User I/O pin (bank 2)
Pin 46 I/O — User I/O pin (bank 2)
Pin 47 I/O — User I/O pin (bank 2)
Pin 48 VCCIO2 — I/O bank 2 supply voltage
Pin 49 I/O — User I/O pin (bank 2)
Pin 50 I/O — User I/O pin (bank 2)
Pin 51 I/O — User I/O pin (bank 2)
Pin 52 I/O — User I/O pin (bank 2)
Pin 53 GND — Ground
Pin 54 I/O — User I/O pin (bank 2)
Pin 55 I/O — User I/O pin (bank 2)
Pin 56 I/O — User I/O pin (bank 2)
Pin 57 I/O — User I/O pin (bank 2)
Pin 58 I/O — User I/O pin (bank 2)
Pin 59 VCCINT — Core supply voltage (3.3 V)
Pin 60 I/O — User I/O pin (bank 3)
Pin 61 I/O — User I/O pin (bank 3)
Pin 62 I/O — User I/O pin (bank 3)
Pin 63 GND — Ground
Pin 64 I/O — User I/O pin (bank 3)
Pin 65 I/O — User I/O pin (bank 3)
Pin 66 I/O — User I/O pin (bank 3)
Pin 67 I/O — User I/O pin (bank 3)
Pin 68 VCCIO3 — I/O bank 3 supply voltage
Pin 69 I/O — User I/O pin (bank 3)
Pin 70 I/O — User I/O pin (bank 3)
Pin 71 I/O — User I/O pin (bank 3)
Pin 72 I/O — User I/O pin (bank 3)
Pin 73 GND — Ground
Pin 74 I/O — User I/O pin (bank 3)
Pin 75 I/O — User I/O pin (bank 3)
Pin 76 I/O — User I/O pin (bank 3)
Pin 77 I/O — User I/O pin (bank 3)
Pin 78 I/O — User I/O pin (bank 3)
Pin 79 I/O — User I/O pin (bank 3)
Pin 80 VCCIO3 — I/O bank 3 supply voltage
Pin 81 I/O — User I/O pin (bank 3)
Pin 82 I/O — User I/O pin (bank 3)
Pin 83 I/O — User I/O pin (bank 3)
Pin 84 I/O — User I/O pin (bank 3)
Pin 85 GND — Ground
Pin 86 I/O — User I/O pin (bank 4)
Pin 87 I/O — User I/O pin (bank 4)
Pin 88 I/O — User I/O pin (bank 4)
Pin 89 I/O — User I/O pin (bank 4)
Pin 90 I/O — User I/O pin (bank 4)
Pin 91 VCCIO4 — I/O bank 4 supply voltage
Pin 92 I/O — User I/O pin (bank 4)
Pin 93 I/O — User I/O pin (bank 4)
Pin 94 I/O — User I/O pin (bank 4)
Pin 95 GND — Ground
Pin 96 I/O — User I/O pin (bank 4)
Pin 97 I/O — User I/O pin (bank 4)
Pin 98 I/O — User I/O pin (bank 4)
Pin 99 I/O — User I/O pin (bank 4)
Pin 100 I/O — User I/O pin (bank 4)
Pin 101 I/O — User I/O pin (bank 4)
Pin 102 VCCIO4 — I/O bank 4 supply voltage
Pin 103 I/O — User I/O pin (bank 4)
Pin 104 I/O — User I/O pin (bank 4)
Pin 105 I/O — User I/O pin (bank 4)
Pin 106 I/O — User I/O pin (bank 4)
Pin 107 GND — Ground
Pin 108 I/O — User I/O pin (bank 4)
Pin 109 I/O — User I/O pin (bank 4)
Pin 110 I/O — User I/O pin (bank 4)
Pin 111 I/O — User I/O pin (bank 4)
Pin 112 I/O — User I/O pin (bank 4)
Pin 113 CLK0 — Dedicated clock input 0
Pin 114 CLK1 — Dedicated clock input 1
Pin 115 I/O — User I/O pin (bank 4)
Pin 116 I/O — User I/O pin (bank 4)
Pin 117 VCCINT — Core supply voltage (3.3 V)
Pin 118 I/O — User I/O pin (bank 4)
Pin 119 I/O — User I/O pin (bank 4)
Pin 120 I/O — User I/O pin (bank 4)
Pin 121 GND — Ground
Pin 122 I/O — User I/O pin (bank 1)
Pin 123 I/O — User I/O pin (bank 1)
Pin 124 I/O — User I/O pin (bank 1)
Pin 125 I/O — User I/O pin (bank 1)
Pin 126 MSEL0 — Configuration mode select 0
Pin 127 MSEL1 — Configuration mode select 1
Pin 128 nCONFIG — Configuration start (active low)
Pin 129 nSTATUS — Configuration status (active low)
Pin 130 CONF_DONE — Configuration complete
Pin 131 I/O — User I/O pin (bank 1)
Pin 132 I/O — User I/O pin (bank 1)
Pin 133 I/O — User I/O pin (bank 1)
Pin 134 VCCIO1 — I/O bank 1 supply voltage
Pin 135 I/O — User I/O pin (bank 1)
Pin 136 I/O — User I/O pin (bank 1)
Pin 137 I/O — User I/O pin (bank 1)
Pin 138 I/O — User I/O pin (bank 1)
Pin 139 GND — Ground
Pin 140 I/O — User I/O pin (bank 1)
Pin 141 I/O — User I/O pin (bank 1)
Pin 142 I/O — User I/O pin (bank 1)
Pin 143 I/O — User I/O pin (bank 1)
Pin 144 TDO — JTAG test data output

Typical Applications

EPF6010ATC144-3 is suitable for 6 applications: Industrial Glue Logic and Bus Bridge, Legacy Telecommunications Interface, Educational FPGA Development Platform, Test and Measurement Instrumentation, Legacy Industrial Control Backplane, Automotive Infotainment Prototype (Legacy).

🏭

Industrial Glue Logic and Bus Bridge

The EPF6010ATC144-3 is well-suited to industrial glue-logic and bus-bridge applications where mid-range gate counts (10,000 gates / 880 LEs) and a high I/O count (102 user I/O) are required. In a typical PCI-to-local-bus bridge or ISA-to-PCI translation design, the FPGA implements address decoding, wait-state insertion, and interrupt steering, replacing multiple discrete 74-series TTL packages. The 142.86 MHz internal Fmax comfortably handles 33 MHz PCI bus timing. Its 3.3 V core with multiVolt I/O banks allows direct interface to both 5 V legacy peripherals and 3.3 V modern ASICs, eliminating external level shifters. Designers should allocate JTAG pins for boundary-scan test access, which the 102 I/O pins easily accommodate.

🌐

Legacy Telecommunications Interface

Telecommunications infrastructure upgrades of legacy equipment (TDM, E1/T1 framer glue, HDLC controllers) commonly use the EPF6010ATC144-3 for protocol adaptation and line-interface glue logic. Its 880 LEs and 102 I/O are sufficient to implement framer-to-DSP data paths, clock-recovery assist logic, and status-register aggregation. The part's 3.0 V to 3.6 V supply range and LVCMOS/LVTTL I/O standards interface cleanly with 3.3 V PHY and DSP devices, while the multiVolt I/O banks allow legacy 5 V bus interfaces. The JTAG port enables in-system firmware updates and board-level boundary-scan diagnostics — critical for field maintenance of installed telecom equipment.

🎓

Educational FPGA Development Platform

Universities and training institutes continue to use the EPF6010ATC144-3 in introductory digital-design curricula because its 880-LE capacity is large enough for meaningful projects (UART, VGA controllers, simple RISC cores) yet small enough that students can map every logic element by hand. The 144-pin TQFP's 102 user I/O expose ample pins for breadboard-friendly breakout boards with switches, LEDs, and 7-segment displays. The Quartus II Web Edition toolchain (free, Windows/Linux) supports the device fully, including SignalTap logic analyzer and TimeQuest timing analysis. With a 142.86 MHz Fmax, students can implement 50 MHz CPU cores with comfortable timing margin, and the JTAG port enables instant bitstream reload during lab sessions.

🔬

Test and Measurement Instrumentation

Test-and-measurement equipment manufacturers historically used the EPF6010ATC144-3 for custom trigger logic, pattern generation, and protocol decoding firmware. The 880-LE budget accommodates 32-bit state machines for protocol analysis, and the 102 I/O allow direct parallel sampling of digital buses under test. The 142.86 MHz internal Fmax supports real-time decoding of low-speed serial protocols (UART, SPI, I2C) and slow parallel interfaces. The JTAG interface simplifies factory calibration and field firmware upgrades. Test equipment built around this part typically pairs it with a microcontroller for user-interface control and external SRAM for capture buffers.

🏭

Legacy Industrial Control Backplane

Industrial PLC backplanes and VME/cPCI cards from the late 1990s and 2000s use the EPF6010ATC144-3 as the local bus arbitrator and I/O expander. The part's 102 user I/O allow direct connection to 32-bit parallel backplane data buses plus discrete control signals, eliminating the need for multiple smaller PLDs. Its 3.3 V core with 5 V-tolerant I/O banks is compatible with classic 5 V backplane signalling via proper current limiting, while newer 3.3 V cPCI systems interface directly. The SRAM-based programmability supports field firmware upgrades without removing the card, important for installed industrial systems with 15-20 year service life requirements.

🚗

Automotive Infotainment Prototype (Legacy)

First-generation automotive infotainment and telematics prototypes from the early 2000s used the EPF6010ATC144-3 for display-controller glue logic, audio routing, and CAN/LIN bus bridging. Its 880-LE budget supports CAN protocol controllers and audio multiplexer matrices, and the 102 I/O pins accommodate multiple display interfaces, button matrices, and audio codec connections. Designers valued the JTAG interface for rapid prototype bring-up. Note: this part is not AEC-Q100 qualified and is therefore not recommended for current production automotive designs — modern automotive applications should use Cyclone IV GX or similar AEC-Q100 qualified parts. This entry covers legacy prototype support only.

What is the EPF6010ATC144-3?
The EPF6010ATC144-3 is a 10,000-gate FLEX 6000 family Field-Programmable Gate Array from Intel (formerly Altera) housed in a 144-pin TQFP package. According to the manufacturer datasheet, it contains 880 logic elements, supports 102 user I/O pins, operates from 3.0 V to 3.6 V, and runs at up to 142.86 MHz internal frequency. It belongs to the broader FLEX 6000 taxonomy: FPGAs that target low-density glue-logic and bus-bridge applications in industrial and embedded systems.
What package does the EPF6010ATC144-3 use?
The EPF6010ATC144-3 ships in a 144-pin Thin Quad Flat Pack (TQFP) with a 0.5 mm lead pitch and "Fine Line" lead-frame construction, also designated TQFP-144 or 144-LQFP by some distributors. The package is RoHS-availability dependent on date code; earlier samples may be Pb-bearing while later date codes are Pb-free. The exposed-pad variant does not exist on this part — all 144 pins are user-defined or supply.
How many logic elements and I/O pins does the EPF6010ATC144-3 have?
The EPF6010ATC144-3 integrates 880 logic elements (LEs), each composed of a 4-input look-up table, a programmable flip-flop, and dedicated carry/cascade logic. It supports up to 102 user I/O pins out of the 144 package pins, with the remaining pins allocated to VCCINT, VCCIO, GND, JTAG, configuration mode, and no-connect reservations. The 880-LE count equates roughly to 10,000 system gates per the manufacturer's gating metric.
What is the operating voltage of EPF6010ATC144-3?
The EPF6010ATC144-3 operates from 3.0 V to 3.6 V on its core VCCINT supply, with VCCIO banks configurable to 3.3 V, 2.5 V, or 1.8 V (via multiVolt I/O) to interface with mixed-voltage peripherals. GlobalSpec's datasheet directory confirms the 3.0 V to 3.6 V operating range. Power sequencing requires VCCINT stable before VCCIO ramps to prevent I/O latch-up, and 100 nF decoupling is recommended adjacent to every VCC pin.
Is the EPF6010ATC144-3 obsolete or still active?
The EPF6010ATC144-3 is classified as Not Recommended for New Designs (NRND) by Intel, having been superseded by Cyclone-series FPGAs in most new applications. It remains available in production quantities via authorized distributors and the secondary market, but Intel no longer recommends it for new designs. Long-term availability is limited; expect eventual last-time-buy and end-of-life transitions. As of 2026-09-11, distributor inventory (Heisener ~16,476 pcs) suggests near-term supply.
Where can I buy the EPF6010ATC144-3?
The EPF6010ATC144-3 can be purchased from authorized distributors including DigiKey, Mouser, and Octopart-listed resellers, plus Heisener (which reported 16,476 in stock on 2026-09-11), Jotrin, YIC Electronics, and Avaq. Pricing as of 2026-09-11 ranges from approximately USD 9.75/qty at 1000-unit breaks to USD 18.50/qty at single-unit. Lead times vary from same-day shipment at DigiKey to 1-2 weeks at smaller brokers.
What is the price of EPF6010ATC144-3?
As of 2026-09-11, the EPF6010ATC144-3 unit price ranges approximately USD 9.75 at 1000-unit quantity up to USD 18.50 at single-unit quantity. Octopart indexes 21 distributors for this part, and broker pricing varies by date code, lead-time, and packaging. For small prototype quantities under 100 units, expect USD 13-19 per piece. Bulk OEM pricing at 5,000-unit breaks typically drops to USD 7-9 per piece from brokers like Heisener and Veswin.
What is the lead time for EPF6010ATC144-3?
Lead time for the EPF6010ATC144-3 depends on the supplier. Authorized distributors such as DigiKey and Mouser typically ship same-day when stock is available, with standard delivery of 1-3 business days. Smaller brokers report 3-7 day shipping windows. For bulk orders exceeding 1,000 units, expect 2-4 weeks if the stock is not on-shelf. Heisener reported on 2026-09-11 a Can Ship Immediately status for 16,476 units, suggesting same-day dispatch.
EPF6010ATC144-3 vs EPF6010ATC144-2 — what is the difference?
The EPF6010ATC144-3 and EPF6010ATC144-2 differ only in speed grade within the same die, package, and footprint. The "-3" speed grade is the fastest bin in the FLEX 6000 family, with the manufacturer datasheet indicating approximately 142.86 MHz typical internal frequency, while the "-2" grade runs at approximately 125 MHz. Both share the same 144-TQFP pinout, voltage range, and configuration interface, making them drop-in compatible if timing closure can tolerate the slower part.
What is the best drop-in replacement for EPF6010ATC144-3?
The best drop-in replacement for the EPF6010ATC144-3 is the EPF6010ATC144-2 (same 144-TQFP package, same die, only slower speed grade) or EPF6010ATC144-1 (slowest speed grade, same package) — all three share the identical TQFP-144 footprint and pinout. Cross-brand drop-in replacements from Lattice or Xilinx in the same footprint do not exist; designers requiring an alternative should plan a PCB redesign to a Cyclone, MachXO, or similar modern low-density FPGA.
Can EPF6010ATC144-1 replace EPF6010ATC144-3?
Yes, the EPF6010ATC144-1 can replace the EPF6010ATC144-3 on the same PCB footprint because both share the identical 144-pin TQFP package and pinout. The only difference is speed grade: EPF6010ATC144-1 is the slowest bin, EPF6010ATC144-3 is the fastest. Replacement is feasible if your design's critical paths run below approximately 100 MHz (the -1 grade typical Fmax). Always re-run static timing analysis after downgrading speed grade.
Where to download EPF6010ATC144-3 datasheet PDF?
The EPF6010ATC144-3 datasheet PDF can be downloaded from Intel's official Altera literature archive at intel.com (search "FLEX 6000 datasheet" or document dsf6000). Third-party mirrors are available at datasheets.com, digchip.com, and aipcba.com. The datasheet covers device architecture, AC/DC characteristics, pinout, package drawings, and configuration timing. Quoted page count from mirrors varies; treat the manufacturer PDF as the authoritative source.
What is the pinout of the EPF6010ATC144-3?
The EPF6010ATC144-3 pinout is detailed in the manufacturer datasheet. Pin 1 is the index mark on the 144-TQFP package, with pins numbered counter-clockwise around the package periphery. The 144 pins are allocated among 102 user I/O, multiple VCCINT and VCCIO pins, GND pins, JTAG signals (TDI, TDO, TMS, TCK), configuration mode pins (MSEL0/MSEL1), dedicated inputs (DEV_CLRn, DEV_OE, CLK0-CLK3), and no-connect reservations. Refer to the manufacturer datasheet pin table for the exact mapping.
What is the difference between EPF6010ATC144-3 and EPF6010ATC100-3?
The EPF6010ATC144-3 (144-pin TQFP, 102 user I/O) and the EPF6010ATC100-3 (100-pin TQFP, ~80 user I/O) belong to the same FLEX 6000 family and share the same 880 logic elements and silicon die, but they differ in package and pin count. The 144-TQFP exposes more I/O and is used for I/O-rich designs; the 100-TQFP sacrifices 22 user I/O for a smaller PCB footprint. They are NOT pin-compatible — the 100-TQFP variant cannot replace the 144-TQFP without redesign.
Is the EPF6010ATC144-3 suitable for new designs in 2026?
The EPF6010ATC144-3 is Not Recommended for New Designs (NRND) by Intel as of 2026-09-11. For new designs, Intel recommends the Cyclone IV or Cyclone 10 LP family, which offer lower cost, higher density, and lower power at the same process node. The EPF6010ATC144-3 remains appropriate for legacy maintenance, repair, and existing-platform refresh where a Cyclone migration would require a board redesign. Long-term availability is limited and uncertain.
What is the configuration interface of EPF6010ATC144-3?
The EPF6010ATC144-3 supports four configuration modes: Passive Serial (PS), Passive Parallel Synchronous (PPS), Passive Parallel Asynchronous (PPA), and JTAG. The MSEL0/MSEL1 pins select between these at power-on. In PS mode, an external EPC configuration EPROM serially loads the SRAM configuration memory on power-up. JTAG mode (IEEE 1149.1) supports in-system programming and boundary-scan test. Configuration time depends on bitstream size and clock frequency.

Engineering reference data for EPF6010ATC144-3 — comparison, design guidance, and compliance information.

Selection Guide

Choose the EPF6010ATC144-3 when you need the fastest (-3) speed grade of the FLEX 6000 family in a 144-TQFP footprint, typically for designs targeting 33 MHz PCI or 50 MHz logic buses that need full 142.86 MHz timing margin. Choose EPF6010ATC144-2 instead if your design runs below ~100 MHz internal Fmax — it is functionally identical except for a slower speed bin and typically slightly cheaper. Choose EPF6010ATC144-1 for non-timing-critical designs to maximize cost savings. If you need only 80 user I/O, the EPF6010ATC100-3 in 100-TQFP saves PCB area but is NOT pin-compatible with the 144-TQFP variant. For new designs in 2026, prefer the Cyclone IV or Cyclone 10 LP family instead, as the FLEX 6000 family is NRND.

Comparison with Alternatives

Parameter This Product EPF6010ATC144-2 EPF6010ATC144-1 EPF6010ATC144-2N EPF6010ATC144-3N
Brand Intel (formerly Altera) Intel Intel Intel Intel
Package TQFP-144 TQFP-144 - same TQFP-144 - same TQFP-144 - same TQFP-144 - same
Family FLEX 6000 FLEX 6000 - same FLEX 6000 - same FLEX 6000 - same FLEX 6000 - same
Logic Elements 880 880 - same 880 - same 880 - same 880 - same
Speed Grade -3 (~142.86 MHz) -2 (~125 MHz) -1 (~100 MHz) -2 (~125 MHz) -3 (~142.86 MHz)
User I/O 102 102 - same 102 - same 102 - same 102 - same
Supply Voltage 3.0 V to 3.6 V 3.0 V to 3.6 V - same 3.0 V to 3.6 V - same 3.0 V to 3.6 V - same 3.0 V to 3.6 V - same
Lifecycle Status NRND NRND NRND NRND NRND

Key Differentiators

  • Highest speed grade (-3) of the FLEX 6000 ATC144 family (vs EPF6010ATC144-2)
  • 144-TQFP package exposes maximum user I/O (102 pins) of the FLEX 6000 family (vs EPF6010ATC100-3)
  • Production-grade (-3) speed bin, fully characterized by Intel (vs Engineering sample / unbin'ed parts)

Design Notes

The EPF6010ATC144-3 requires a clean 3.3 V core supply on VCCINT and separately-isolated VCCIO bank supplies (one per I/O bank). Place 100 nF X7R ceramic decoupling capacitors adjacent to every VCCINT and VCCIO pin, and add bulk 10 µF tantalum or polymer capacitors near the package. Power-on sequencing should ensure VCCINT ramps before VCCIO to avoid I/O latch-up; if sequencing is impossible, add a small Schottky diode from VCCINT to VCCIO. The 0.42 µm CMOS process draws significant inrush current during SRAM configuration — budget for at least 200 mA peak on VCCINT during config.

The 144-pin TQFP has a 0.5 mm lead pitch requiring careful PCB layout: keep solder mask slivers at least 0.2 mm wide, use ENIG or immersion tin surface finish for fine-pitch assembly, and route all signals on inner layers beneath the package to escape the fine-pitch perimeter pins. Thermal pad design is not required for this part (no exposed pad), but adequate copper pour around the package reduces thermal resistance and improves power dissipation. Reflow profile should follow J-STD-020 MSL classification printed on the reel label.

Three common pitfalls when designing with the EPF6010ATC144-3: (1) Forgetting to strap MSEL0/MSEL1 for the desired configuration mode — leaving them floating yields unpredictable behavior; (2) Not providing a valid configuration source at power-up — without an EPC EPROM or JTAG programmer, the device never completes configuration and CONF_DONE stays low; (3) Driving JTAG signals (TDI, TMS, TCK) with non-3.3 V logic — the JTAG port shares the same 3.3 V supply rail as the core, and 5 V signals will damage the inputs. Always include a JTAG header for boundary-scan test and in-system programming access.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Qualified
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

RoHS, REACH, and AEC-Q100 compliance for the EPF6010ATC144-3 were not present in the verified web data and are marked unknown. The 'N' suffix variants (EPF6010ATC144-3N) are Pb-free per Altera/Intel naming convention, but full material declaration must be obtained from the manufacturer. This part is NOT AEC-Q100 qualified and is not recommended for new automotive designs.

Data verified on: 2026-09-11 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera EPF6010ATC144-3 EPF6010ATC144-2 EPF6010ATC144-1 EPF6010ATC144-2N EPF6010ATC144-3N FLEX 6000 FPGA Field Programmable Gate Array CPLD SRAM configuration memory JTAG IEEE 1149.1 TQFP-144 multiVolt I/O LVTTL LVCMOS 0.42 µm CMOS logic element look-up table boundary-scan test configuration EPROM EPC2 Quartus II RoHS
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