Intel

EPF6016ATC144-2N - FLEX 6000 FPGA, 16K Gates, 1320 Cells | Intel

MPN: EPF6016ATC144-2N ⚠ Last Time Buy

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3.3 V Vdss 144-pin TQFP (FineLine) Package 166.67 MHz Speed

From $19.5 USD / Unit

MOQ: 1 |

Price updated: 2026-09-11

Volume Pricing

Qty	Unit Price	Extended
1	$38.5	$38.50
10	$33.2	$332.00
100	$27.8	$2,780.00
500	$23.1	$11,550.00
1,000	$19.5	$19,500.00

ℹ️ All prices are in USD

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EPF6016ATC144-2N Overview

The Intel (formerly Altera) EPF6016ATC144-2N is a member of the FLEX 6000 family of SRAM-based, reprogrammable CMOS Field Programmable Gate Arrays, offering 16,000 typical gates (24,000 maximum logic elements) and 1,320 logic cells in a 144-pin TQFP package. The device integrates 132 Logic Array Blocks (LABs), 117 user I/O pins, and operates from a 3.3 V core supply with MultiVolt I/O supporting 3.3 V and 5.0 V interfaces. Internal performance supports system speeds up to 166.67 MHz, and the part is fabricated on a 0.42 µm CMOS process.

A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs / LEs), programmable routing interconnect, and I/O cells, that can be re-programmed in-system to implement arbitrary digital logic functions. FPGAs sit hierarchically between fixed-function ASICs and CPLDs, offering higher logic density than CPLDs while remaining more flexible than ASICs. The FLEX 6000 family is positioned for mid-density, cost-sensitive glue logic, bus interfacing, and state-machine applications that exceed CPLD capacity but do not require high-end FPGA features.

Key features include 16K typical gates (24K maximum logic elements), 1,320 logic cells, 132 LABs, and 117 user I/Os. The device supports in-system programmability via the IEEE 1149.1 JTAG interface and configuration via Altera serial configuration devices. Each LE contains a 4-input look-up table, a programmable register, and dedicated carry/cascade chains for high-speed arithmetic and wide-input functions. The FineLine BGA and TQFP packages both offer high I/O density in a small footprint.

Architecturally, FLEX 6000 devices use a continuous, hierarchical interconnect structure with FastTrack routing that drives signals across the device with predictable delay. The 0.42 µm process and SRAM configuration memory enable unlimited re-programmability, while embedded JTAG and built-in self-test support manufacturing boundary-scan. Each LAB contains 10 LEs with shared local interconnect for fast intra-LAB communication.

Typical applications include telecommunications line cards, industrial control and instrumentation, glue logic for processor-based designs, DSP co-processing front-ends, bus-bridging (PCI, ISA, VME), and legacy ASIC replacement during prototyping. The wide supply tolerance and MultiVolt I/O make the EPF6016ATC144-2N especially suitable for mixed-voltage boards where 5 V peripherals must coexist with 3.3 V logic.

When designing with this part, allocate sufficient time for place-and-route in the Quartus II or MAX+PLUS II toolchain - timing closure in 16K-gate designs is straightforward but routing congestion can occur if many wide buses are routed across the device. Confirm configuration mode (PS, PPS, JTAG) before PCB layout to ensure proper MSEL[1:0] strapping.

This page synthesizes distributor availability, drop-in same-package alternatives, and practical design considerations not consolidated on any single manufacturer or distributor page.

Drop-in alternatives for EPF6016ATC144-2N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EPF6016ATC144-2N (same form factor and footprint) — differing in Package, Operating Temperature, Configuration Method, Process Technology, Speed Grade.

EPF6010ATC144-3

Intel

Process Technology: 0.42 µm CMOS SRAM

Speed Grade: -3