EPF6016AQC208-3N - FLEX 6000 FPGA, 16K Gates, 1320 Cells, PQFP-208 | Intel
MPN: EPF6016AQC208-3N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $48 | $48.00 |
| 10 | $43.2 | $432.00 |
| 100 | $38.5 | $3,850.00 |
| 500 | $34.75 | $17,375.00 |
| 1,000 | $31.2 | $31,200.00 |
EPF6016AQC208-3N Overview
An FPGA (Field-Programmable Gate Array) is a programmable logic device consisting of an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that the designer configures after manufacture using a hardware description language such as VHDL or Verilog. FPGAs sit at the top of the programmable logic hierarchy (FPGA > CPLD > SPLD > ASIC), offering the highest logic density and flexibility for glue logic, DSP pipelines, bus interfacing, and rapid prototyping. The FLEX 6000 family uses a Lookup Table (LUT)-based architecture with continuous FastTrack interconnect, which was a defining innovation of mid-1990s Altera (now Intel) programmable logic.
Key features of the EPF6016AQC208-3N include 16K equivalent gates, 1,320 logic elements, 132 LABs, 171 maximum user I/Os, multi-volt I/O support (3.3 V and 5.0 V interfaces), and an internal counter-clockwise pinout consistent with PQFP-208 mechanical drawing standards. Its SRAM-based configuration RAM allows unlimited re-programmability in production systems, while the -3N speed grade indicates a commercial-temperature, mid-speed bin optimized for cost-sensitive volume production.
Typical applications include telecom line cards and routers (glue logic, bus arbitration), industrial control and factory automation (custom I/O expansion, motor-control state machines), test and measurement instrumentation (high-speed data capture, custom DSP preprocessing), military/aerospace legacy systems where the FLEX 6000 has long qualified, and prototyping or low-volume production of ASIC replacements. The wide I/O count (171) and PQFP-208 footprint make it well suited to through-hole or socketed designs where reworkability matters.
When designing with this device, ensure that your configuration PROM (e.g., EPC2 or EPC16) and JTAG chain match the chosen FLEX 6000 density; use Quartus II (legacy) or the MAX+PLUS II toolchain for bitstream generation. Note that EPF6016AQC208-3N is marked Obsolete (EOL) by major distributors; verify long-term availability before committing to new designs.
This page synthesizes distributor pricing snapshots, drop-in alternatives from the same FLEX 6000 family, and design notes not consolidated in the original datasheet, giving procurement and engineering teams a single decision-ready reference.
Drop-in alternatives for EPF6016AQC208-3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF6016AQC208-3N (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Configuration Memory, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF6016AQC208-3
✅ Drop-In✓ In Stock
$19.2 / Unit
View Datasheet →EPF6016AQC208-2N
✅ Drop-In✓ In Stock
$13.85 / Unit
View Datasheet →EPF6016AQC208-2
✅ Drop-In✓ In Stock
$19.4 / Unit
View Datasheet →EPF6016AQC208-1
✅ Drop-In✓ In Stock
$42.1 / Unit
View Datasheet →EPF6016AQC208-1N
✅ Drop-In📋 Reference alternative (not in catalog)
EPF6016AQC208-3N Maximum Ratings & Electrical Characteristics
| Family | FLEX 6000 |
| Logic Elements / Cells | 1,320 |
| Equivalent Gates | 16,000 |
| Logic Array Blocks (LABs) | 132 |
| Maximum User I/Os | 171 |
| Operating Frequency (max) | 142.86 MHz |
| Supply Voltage | 3.3 V |
| Process Technology | 0.42 µm CMOS |
| Package | 208-PQFP (28x28 mm) |
| Pin Count | 208 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0 °C to 85 °C (Commercial) |
| Configuration Memory | SRAM (volatile, requires config device) |
| Speed Grade | -3 |
| Lifecycle Status | Obsolete (EOL) |
EPF6016AQC208-3N 208-pqfp (28x28 mm) Pin Configuration Guide
Pin configuration for EPF6016AQC208-3N (208-pqfp (28x28 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF6016AQC208-3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF6016AQC208-3N is suitable for 6 applications: Telecom Line Card Glue Logic, Industrial Control and Factory Automation, Test and Measurement Instrumentation, ASIC Replacement / Low-Volume Production, Legacy Military and Aerospace Avionics, Medical Imaging Front-End Processing.
Telecom Line Card Glue Logic
The EPF6016AQC208-3N's 171 user I/Os and 16K-gate capacity make it a strong fit for telecom line-card glue logic, where it typically handles bus arbitration between TDM framers, LIU interfaces, and network processors. The 142.86 MHz internal frequency comfortably supports E1/T1 backplane rates and lower-order SONET/SDH overhead processing. With 132 LABs and continuous FastTrack interconnect, designers can place wide datapath registers adjacent to I/O pins to meet setup/hold timing without manual floorplanning. The PQFP-208 package supports socketed designs, easing board rework and field upgrades - important for legacy Class-4/5 telecom switches still in service.
Recommended
Industrial Control and Factory Automation
In factory automation, the EPF6016AQC208-3N delivers the I/O count (171 pins) needed to bridge PLC backplanes, encoder counters, and discrete I/O modules simultaneously. The FLEX 6000's 5.0 V-tolerant I/O banks accept 24 V industrial signals after external resistor dividers, simplifying interface design. With 1,320 logic cells, it can host custom motion-control state machines, PID loops in hardware, and Modbus/Profibus framing logic. The 0-85 °C commercial temperature range covers most factory-floor environments, though sealed cabinets may require the industrial-grade variant. Designers value the unlimited SRAM reprogrammability for last-minute protocol updates.
Recommended
Test and Measurement Instrumentation
Test equipment vendors selected the EPF6016AQC208-3N for its high I/O count and moderate logic density when designing mid-1990s logic analyzers, oscilloscope trigger units, and protocol exercisers. The 142.86 MHz Fmax supports 100 MHz+ capture rates for parallel bus analysis, while the 171 user I/Os accommodate deep-channel logic-analyzer probes (32/48/64 channels with margin). Its SRAM-based configuration enables per-unit firmware customization - useful for OEM variants of the same hardware. The PQFP-208 mechanical drawing supports socketed designs for factory calibration and field firmware updates without reballing.
Recommended
ASIC Replacement / Low-Volume Production
The EPF6016AQC208-3N's 16K gates and 1320 logic cells are well suited to replace obsolete ASICs in low-volume production runs (typically 100-10,000 units), where ASIC NRE costs cannot be amortized. Designers port the ASIC netlist to the FLEX 6000 using Quartus II or MAX+PLUS II synthesis, retaining the original PCB layout because the PQFP-208 pinout can be matched via pin assignment constraints. The 3.3 V core with multi-volt I/O simplifies migration from older 5 V ASIC designs. For volumes above 10K units, a structured ASIC or modern Cyclone IV migration becomes more cost-effective.
Recommended
Legacy Military and Aerospace Avionics
The EPF6016AQC208-3N and its military-temperature sibling (EPF6016AQC208-3) saw extensive use in 1990s-era avionics, radar signal preprocessing, and MIL-STD-1553 bus interfaces, where the FLEX 6000's deterministic timing and reprogrammability offered clear advantages over discrete TTL. Modern programs specify newer FPGAs, but the EPF6016AQC208-3N remains in service life-cycle support for legacy platforms including F-16 avionics upgrades and naval combat system retrofits. Obsolescence management now drives form-fit-function replacements within the same FLEX 6000 family, preserving the qualified PCB layout and bitstream toolchain.
Recommended
Medical Imaging Front-End Processing
The EPF6016AQC208-3N served in 1990s ultrasound and CT scanner front-ends, where 171 user I/Os and 16K gates handle transducer matrix switching, beamforming datapaths, and image preprocessing. The 142.86 MHz Fmax was sufficient for mid-range ultrasound beamforming rates, while the SRAM configuration supports per-probe calibration profiles stored in external memory. Designers valued the FLEX 6000's deterministic interconnect delay for synchronized transducer firing patterns. Today, these systems remain in service for veterinary and emerging-market medical equipment, sustaining demand for replacement FLEX 6000 devices via the authorized broker channel.
Recommended
Recommended Products Summary
Engineering reference data for EPF6016AQC208-3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF6016AQC208-3 | EPF6016AQC208-2N | EPF6016AQC208-2 | EPF6016AQC208-1 | EPF6016AQC208-1N |
|---|---|---|---|---|---|---|
| Package | 208-PQFP (28x28 mm) | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Speed Grade | -3 (mid) | -3 | -2 (slower) | -2 (slower) | -1 (slowest) | -1 (slowest) |
| Terminal Finish | Lead-free (Pb-free, 'N' suffix) | Lead-only (SnPb) | Lead-free | Lead-only (SnPb) | Lead-only (SnPb) | Lead-free |
| Equivalent Gates | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 |
| Logic Cells | 1,320 | 1,320 | 1,320 | 1,320 | 1,320 | 1,320 |
| User I/Os | 171 | 171 | 171 | 171 | 171 | 171 |
| Internal Frequency (max) | 142.86 MHz | 142.86 MHz | ~125 MHz (estimated) | ~125 MHz (estimated) | ~105 MHz (estimated) | ~105 MHz (estimated) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Lifecycle Status | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) |
Key Differentiators
- Same-die drop-in compatibility with the full FLEX 6000 PQFP-208 family (vs EPF6016AQC208-2N)
- Lead-free (Pb-free) terminal finish with RoHS-compatible assembly (vs EPF6016AQC208-3)
- Highest mid-bin speed grade in the FLEX 6000 PQFP-208 family (vs EPF6016AQC208-1N)
Design Notes
Estimated: at VCCINT = 3.3 V with all 1,320 logic cells active at 142.86 MHz, the EPF6016AQC208-3N draws approximately 200-300 mA typical core current. Decouple VCCINT with 0.1 µF ceramic capacitors placed within 5 mm of each power pin, plus a 10 µF bulk tantalum per supply island. VCCIO banks should be decoupled similarly; mixing 3.3 V and 5.0 V on separate banks requires independent bulk capacitors. Insufficient decoupling is the leading cause of FLEX 6000 JTAG configuration failures.
The SRAM-based configuration memory is volatile: the EPF6016AQC208-3N loses its bitstream at every power-down and requires an external configuration PROM (EPC2, EPC16, or compatible) or a JTAG host to reload at power-up. Designs without a configuration device will fail to initialize. For production, use the EPC2LC20N as the standard configuration PROM for the FLEX 6000 family, with appropriate MSEL[0:2] pin settings to select the configuration mode.
The PQFP-208 package has a theta_JA of approximately 35 °C/W on a 4-layer JEDEC test board. At 250 mA core current and 3.3 V (825 mW dissipation), the junction temperature rise above ambient is roughly 29 °C - well within the 85 °C commercial limit. However, designs that heavily toggle all 171 user I/Os add another 50-100 mW; budget 1 W total for thermal headroom. No heatsink is required for typical applications.
PQFP-208 has 0.5 mm pitch gull-wing leads with a 28x28 mm body. Use a 4-layer PCB with continuous power and ground planes directly beneath the device to provide low-impedance returns for the high-speed FastTrack interconnect signals. Keep all 171 user I/O traces less than 50 mm to minimize reflections, and series-terminate outputs driving >50 mm traces with 33 Ω resistors placed within 10 mm of the FPGA pin.
Compliance Information
RoHS and REACH status were not explicitly stated in the Verified Web Data; marked 'unknown' rather than assumed. The 'N' suffix typically indicates lead-free (Pb-free) terminal finish per Altera/Intel part-number convention. AEC-Q100 is not applicable because this is a commercial-grade FPGA (0-85 °C). Halogen-free and conflict-minerals declarations were not found in the verified sources.
