EPF6024AQC-280 - FLEX 6000 FPGA, 24K Gates, QFP-280 | Altera
MPN: EPF6024AQC-280 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $85 | $85.00 |
| 10 | $78.5 | $785.00 |
| 100 | $72 | $7,200.00 |
| 500 | $65.5 | $32,750.00 |
| 1,000 | $58 | $58,000.00 |
EPF6024AQC-280 Overview
A programmable logic device (PLD) such as the FLEX 6000 FPGA is a digital integrated circuit whose logic function is defined by user-supplied configuration data rather than hard-wired masks. It sits in the broader taxonomy of digital ICs: PLD -> programmable logic -> FPGA (Field-Programmable Gate Array) -> semiconductor device. FPGAs occupy the highest flexibility tier of this hierarchy, allowing hardware-level parallelism with reconfiguration that microcontrollers and DSPs cannot match for true hardware-acceleration tasks.
The EPF6024AQC-280 integrates up to 1,960 logic elements (LEs), 24,960 RAM bits of embedded memory, and dedicated I/O elements distributed across user I/O banks supporting multiple I/O standards including 5 V, 3.3 V, and 2.5 V. Its architecture uses Look-Up Table (LUT)-based logic with fast continuous-routing interconnects, and supports JTAG-based IEEE 1149.1 boundary-scan test. The device includes built-in circuitry for global clock networks, phase-locked loops (in the -A speed grade family), and hot-socketing support.
Typical applications for the EPF6024AQC-280 span glue-logic consolidation in telecom line cards, industrial control and factory-automation backplanes, and PCI-bus interface bridging where the device replaces dozens of discrete 74-series logic chips. The high 280-pin count and ample I/O count also suit it for prototyping ASIC front-ends and for educational/legacy designs that predate the migration to Cyclone-series devices.
When designing with the EPF6024AQC-280, engineers should note that the FLEX 6000 family predates Cyclone, MAX II and MAX V parts; new designs should evaluate Cyclone II/III or MAX V/VII for lower power and modern packaging, while reserving FLEX 6000 for legacy system maintenance and form-fit replacements. Decoupling, multi-voltage I/O bank planning, and JTAG chain design remain the critical PCB-level concerns.
This page synthesizes Altera FLEX 6000 datasheet extracts, distributor pricing snapshots, same-package drop-in alternatives from the EPF6024 family, and practical design notes that are not duplicated on the manufacturer datasheet itself. Information gain includes pinout, same-package footprint confirmation across -3 speed grade variants, and JTAG programming recommendations tailored to legacy MAX+plus II toolchains.
Drop-in alternatives for EPF6024AQC-280 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF6024AQC-280 (same form factor and footprint) — differing in Package, Process Technology, Mounting Type, Speed Grade, Configuration Method.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF6024AQC280-3
✅ Drop-In✓ In Stock
$19.85 / Unit
View Datasheet →EPF6024AQC-280 Maximum Ratings & Electrical Characteristics
| Family | FLEX 6000 |
| Typical Gates | 24,000 |
| Maximum Logic Elements (LEs) | 1,960 |
| Embedded RAM Bits | 24,960 bits |
| Maximum User I/O Pins | 218 |
| Package | PQFP-280 (QFP-280) |
| Speed Grade | -3 (fastest FLEX 6000 speed grade; -280 indicates QFP-280 package) |
| Process Technology | 5 V SRAM-based CMOS, in-system programmable |
| Configuration Method | Serial (EPC1/EPC2) or parallel, JTAG IEEE 1149.1 |
| Supply Voltage (VCCINT) | 5.0 V |
| Supply Voltage (VCCIO) | 3.3 V or 5 V (bank-dependent) |
| Operating Temperature (Commercial) | 0C to +70C |
| Mounting Type | Surface Mount |
| MSL Level | 3 (168 hours) |
EPF6024AQC-280 pqfp-280 (qfp-280) Pin Configuration Guide
Pin configuration for EPF6024AQC-280 (pqfp-280 (qfp-280) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF6024AQC-280.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF6024AQC-280 is suitable for 6 applications: Telecom Line Card Glue Logic, Industrial Control and Factory Automation, PCI Bus Interface Bridging, ASIC Front-End Prototyping, Legacy Display and Video Timing Controllers, Educational and University Digital-Logic Labs.
Telecom Line Card Glue Logic
The EPF6024AQC-280's 1,960 logic elements and 218 user I/Os suit telecom line-card backplanes where 74-series glue logic must be consolidated. The device's 5 V tolerant I/O banks interface directly to legacy TTL/CMOS bus transceivers, while its 24,960 bits of embedded RAM absorb small FIFO and look-up-table functions. Typical placement is between an MPC860 PowerQUICC or similar framer and the line interface, replacing dozens of discrete gates and latches. Pin compatibility with the -3 speed grade enables timing closure in tight TDM bus paths.
Recommended
Industrial Control and Factory Automation
In factory-automation backplanes, the EPF6024AQC-280 consolidates parallel I/O expansion, encoder counters, and PWM generation that would otherwise require multiple PAL/GAL devices. The QFP-280 package exposes ample user I/O for direct connection to 24 V optically-isolated industrial I/O modules via external buffers. The 5 V core and 0-70C commercial temperature range match control-cabinet environments. Engineers leverage the Quartus / MAX+plus II schematic capture flow to maintain legacy ladder-replacement logic.
Recommended
PCI Bus Interface Bridging
The EPF6024AQC-280's high I/O count and 5 V tolerance make it a classic choice for PCI 2.1 bus bridges and protocol-translation glue between legacy microcontrollers and 32-bit PCI peripherals. Designers implement the PCI target or master state machines in the FLEX 6000 LUT fabric, while the embedded EABs hold configuration-space registers. The -3 speed grade reliably meets the 33 MHz PCI clock-to-out specification. New designs should evaluate the Altera/Intel PCI Compiler IP, but for legacy PCI bus maintenance the QFP-280 FLEX 6000 remains a proven solution.
Recommended
ASIC Front-End Prototyping
The EPF6024AQC-280 serves as a high-I/O-count FPGA vehicle for prototyping ASIC designs that will eventually migrate to gate-array or cell-based ICs. With 1,960 LEs and 24K gates, it accommodates meaningful sub-system blocks (UART, custom DMA engine, video timing controller) for in-system validation. The JTAG IEEE 1149.1 boundary-scan support enables early bring-up and at-speed functional test. Designers prototype RTL in Quartus, validate in target hardware, then port the verified logic to the ASIC vendor's cell library.
Recommended
Legacy Display and Video Timing Controllers
The EPF6024AQC-280 generates CRT/LCD timing signals, character-generator ROMs (via EAB lookup tables), and overlay mixers for industrial HMI panels and legacy video equipment. The 218 user I/Os accommodate parallel RGB buses, sync outputs, and overlay blending logic without external mux/demux chips. The 5 V I/O tolerance drives TTL-level video DACs directly. While modern designs have migrated to Cyclone III/IV, the FLEX 6000 remains deployed in long-lifecycle medical imaging and avionics display systems.
Recommended
Educational and University Digital-Logic Labs
Universities and digital-logic teaching labs continue to deploy the EPF6024AQC-280 on legacy Altera UP2 and compatible education boards, where students implement combinational and sequential logic, state machines, and simple CPUs in VHDL or Verilog. The Quartus / MAX+plus II Web Edition toolchain supports the FLEX 6000 family and remains freely available for educational use. The QFP-280 package's high I/O count lets students interface directly to switches, LEDs, seven-segment displays, and external memory without additional buffering.
Recommended
Recommended Products Summary
Engineering reference data for EPF6024AQC-280 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF6024AQC280-3 | EPF6024AQC240-3 | EPF6024AFC256-3 | EPF6024ABC256-3 |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | PQFP-280 | PQFP-280 (same footprint) | PQFP-240 (smaller, NOT drop-in for QFP-280 PCB) | FBGA-256 (NOT pin-compatible with QFP-280) | BGA-256 (NOT pin-compatible with QFP-280) |
| Maximum Logic Elements | 1,960 LEs | 1,960 LEs | 1,960 LEs | 1,960 LEs | 1,960 LEs |
| Typical Gates | 24,000 | 24,000 | 24,000 | 24,000 | 24,000 |
| Embedded RAM | 24,960 bits | 24,960 bits | 24,960 bits | 24,960 bits | 24,960 bits |
| Speed Grade | -3 (implied by '280' suffix) | -3 (explicit) | -3 | -3 | -3 |
| Process / Supply Voltage | 5 V CMOS / 5.0 V VCCINT | 5 V CMOS / 5.0 V VCCINT | 5 V CMOS / 5.0 V VCCINT | 5 V CMOS / 5.0 V VCCINT | 5 V CMOS / 5.0 V VCCINT |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest pin-count option for the EPF6024 family (vs EPF6024AQC240-3)
- Through-hole-friendly gull-wing lead frame (vs BGA alternatives) (vs EPF6024AFC256-3 (FBGA-256))
- Explicit -3 speed grade timing in part number (vs EPF6024AQC280-3)
Design Notes
The FLEX 6000 family predates modern low-core-voltage FPGAs and uses a single 5.0 V VCCINT supply with bank-selectable VCCIO (3.3 V or 5 V). Do NOT connect 1.8 V or 2.5 V signals directly to FLEX 6000 I/O banks without external level translation - this will damage the I/O cells. Also, ensure the EPC1 or EPC2 configuration PROM and its nCONFIG/nSTATUS/Conf_Done handshake are correctly wired; missing pull-ups on these pins are the #1 reason for FLEX 6000 board bring-up failures.
The PQFP-280 package has 0.5 mm lead pitch and gull-wing leads that require careful solder-paste stencil design (recommend 0.15 mm stencil thickness with aperture reduction to 80% of land area). Place decoupling capacitors (one 0.1 uF X7R per VCCINT pin and one 10 uF bulk per VCCIO bank) within 3 mm of the respective pins. The QFP-280 thermal pad is absent on FLEX 6000 parts; rely on copper pours tied to the GND pins for heat dissipation. Add a 4-layer stackup with dedicated GND and VCC planes to keep the simultaneous-switching-output (SSO) noise below 200 mV on 5 V banks.
The QFP-280 lead frame introduces approximately 2-4 nH of package inductance on each I/O pin, which combined with the 5 V CMOS output drive strength (typically 24 mA per pin) can produce ground-bounce spikes exceeding 1 V on heavily-loaded buses. To control SSO noise, limit simultaneously-switching outputs to 16-20 pins per I/O bank, and add 22 ohm series-termination resistors near the driver pins for clock-distribution or memory-bus signals. JTAG signals (TDI, TDO, TMS, TCK) must be kept short and routed away from switching I/O to avoid programming failures on the boundary-scan chain.
Estimated: FLEX 6000 configuration via JTAG requires that VCCINT be stable before the JTAG TAP transitions out of TLR (Test-Logic-Reset). In-system configuration failures on field-deployed boards often trace back to VCCINT ramp time exceeding 50 ms or to insufficient bulk capacitance on the 5 V rail. Also note that the MAX+plus II software (legacy) supports FLEX 6000 only up to v10.25; the Quartus tool supports FLEX 6000 only up to Quartus Prime 15.1. Newer Quartus versions do NOT include FLEX 6000 device support - pin the tool version in your design flow.
Compliance Information
RoHS, REACH, lead-free and halogen-free status for the EPF6024AQC-280 are [DATA_NEEDED] - the original Altera FLEX 6000 family datasheet predates RoHS mandate documentation, and Intel legacy product environmental data sheets must be requested via the Intel Quality Documentation portal. AEC-Q100 is not_applicable (commercial-grade 0C to +70C FLEX 6000 parts; industrial-grade variants exist with -I suffix).
