EPF6024AQC240-3 - FLEX 6000 FPGA, 24K Gates, 240-PQFP | Intel
MPN: EPF6024AQC240-3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $33.2 | $332.00 |
| 100 | $27.9 | $2,790.00 |
| 500 | $23.45 | $11,725.00 |
| 1,000 | $19.8 | $19,800.00 |
EPF6024AQC240-3 Overview
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs belong to the broader class of programmable logic devices (PLDs), which sit within digital logic ICs and integrated circuits. Unlike fixed-function ASICs, FPGAs allow designers to implement custom digital logic, glue logic, state machines, bus bridges, and parallel processing pipelines that can be reconfigured in-system via SRAM configuration memory.
The FLEX 6000 family uses Altera's OptiFLEX architecture, which minimizes die size while preserving routability and performance. Key features of the EPF6024AQC240-3 include 1,960 logic cells, 196 logic array blocks (LABs), a 3.0 V to 3.6 V single-supply operating range, and reconfigurable SRAM elements that allow rapid design iteration during prototyping. The device is intended as a low-cost, high-volume alternative to mask-programmed gate arrays for production volumes that do not justify ASIC NRE.
Architecturally, the EPF6024AQC240-3 integrates distributed SRAM configuration memory with a hierarchical routing fabric, I/O elements (IOEs) supporting common single-ended standards, and dedicated clock networks. The 240-pin PQFP (also referred to as 240-BFQFP) package offers 199 usable user I/Os after accounting for power, ground, JTAG, and configuration pins, making it suitable for medium-density glue-logic and bus-interface designs.
Typical applications include telecommunications glue logic, industrial control interfaces, PCI bus bridging, peripheral expansion in embedded systems, and prototyping of ASIC-equivalent designs where fast design turnaround is more valuable than absolute lowest unit cost. The 3.3 V supply also simplifies integration into 3.3 V-only embedded platforms without level shifting.
When designing with this device, allocate sufficient decoupling (0.1 µF + bulk) near every supply pin and follow Altera's Quartus / MAX+PLUS II configuration guidelines for the JTAG and configuration pins. Note that FLEX 6000 SRAM-based devices require configuration at every power-up, so the EPF6024AQC240-3 is paired with a configuration PROM or microcontroller in production designs.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives from the same FLEX 6000 family, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for EPF6024AQC240-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF6024AQC240-3 (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Speed Grade, Configuration Method.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF6024AQC240-2
✅ Drop-In✓ In Stock
$23.1 / Unit
View Datasheet →EPF6024AQC240-1
✅ Drop-In✓ In Stock
$18.95 / Unit
View Datasheet →EPF6024AQC240-2N
✅ Drop-In✓ In Stock
$26.1 / Unit
View Datasheet →EPF6024AQC240-1N
✅ Drop-In✓ In Stock
$54 / Unit
View Datasheet →EPF6024AQC240-2S
✅ Drop-In✓ In Stock
$22.95 / Unit
View Datasheet →EPF6024AQC240-3 Maximum Ratings & Electrical Characteristics
| Family | FLEX 6000 |
| Device Type | Loadable PLD / SRAM-based FPGA |
| Logic Cells | 1960 |
| Logic Array Blocks (LABs) | 196 |
| Typical Gate Count | 24,000 gates |
| User I/Os | 199 |
| Internal Frequency | 142.86 MHz |
| Process Technology | 0.42 µm CMOS |
| Supply Voltage (Operating) | 3.0 V to 3.6 V |
| Nominal Core Voltage | 3.3 V |
| Configuration Memory | SRAM (volatile, requires external PROM) |
| Architecture | OptiFLEX |
| Package | 240-pin PQFP (BFQFP, 32x32 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0 °C to +85 °C (commercial) |
| RoHS Status | unknown |
EPF6024AQC240-3 240-pin pqfp (bfqfp, 32x32 mm) Pin Configuration Guide
Pin configuration for EPF6024AQC240-3 (240-pin pqfp (bfqfp, 32x32 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF6024AQC240-3.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF6024AQC240-3 is suitable for 6 applications: Telecommunications Glue Logic, Industrial Control Interfaces, PCI Bus Bridge and Expansion, ASIC Prototyping and Design Verification, Embedded System Glue Logic, Legacy Design Maintenance and Field Upgrades.
Telecommunications Glue Logic
The EPF6024AQC240-3 fits telecommunications glue-logic roles because its 1,960 logic cells and 199 user I/Os provide ample capacity for protocol adaptation between backplane buses, TDM framers, and serializer/deserializer (SerDes) companion chips. The 142.86 MHz internal frequency comfortably handles standard telecom data rates such as E1/T1 framing and low-speed STS tributaries, while the 240-pin PQFP exposes enough I/O for parallel backplane interfaces without requiring a BGA. Compared with discrete TTL/CMOS glue logic, the EPF6024AQC240-3 consolidates dozens of 74-series packages into one reconfigurable device, reducing board area, BOM count, and design risk during protocol revisions. Designers should pair the device with a 3.3 V LDO and follow Altera JTAG configuration guidelines for field-upgradeable designs.
Recommended
Industrial Control Interfaces
The EPF6024AQC240-3 suits industrial control interface designs because its 3.3 V single supply simplifies integration with 3.3 V-only MCUs and DSPs, while its 199 user I/Os accept the abundant parallel signaling typical of PLC backplanes, motor-control feedback, and encoder interfaces. The commercial 0 to 85 °C operating range is acceptable for cabinet-mounted equipment. With 24K gates of logic capacity, the device can host custom state machines, watchdog timers, and protocol bridges (for example, SPI-to-parallel or UART-to-Profibus) that would otherwise require multiple discrete ICs. Industrial designers should still add TVS protection on field-side I/Os and confirm conformal coating compatibility of the PQFP package in dusty or humid environments.
Recommended
PCI Bus Bridge and Expansion
The EPF6024AQC240-3 is well matched to PCI bus bridge and expansion designs because its 199 user I/Os comfortably accommodate the 32-bit PCI bus (49 signals) plus local-bus side channels, FIFOs, and configuration registers. The 142.86 MHz internal frequency supports 33 MHz PCI with timing margin to spare for address decoding, bus arbitration, and interrupt steering logic. The 24K-gate capacity also allows integration of two independent PCI functions or a PCI-to-ISA bridge within a single device. Compared with dedicated PCI bridge ASICs, the FLEX 6000 approach offers flexibility for proprietary register maps and rapid revision during PCI compliance testing, though designers must verify signal-integrity constraints for 33 MHz parallel operation on PQFP packages.
Recommended
ASIC Prototyping and Design Verification
The EPF6024AQC240-3 is commonly used as an ASIC prototyping vehicle because its SRAM-based configuration allows rapid HDL iteration in the lab, while its 24K-gate capacity accommodates moderate ASIC-equivalent designs (such as custom peripherals or DSP accelerators) before committing to mask NRE. The 240-pin PQFP exposes enough I/O for full-speed real-world stimulus, and Quartus / MAX+PLUS II synthesis support makes design entry straightforward. Compared with ASIC prototypes, the FLEX 6000 provides design-for-test hooks, in-system reconfiguration, and the ability to ship limited production volumes without wafer tooling - useful for early customer sampling. Designers should still account for FPGA-to-ASIC migration in RTL coding style (avoiding FPGA-specific primitives) to ease the eventual ASIC port.
Recommended
Embedded System Glue Logic
The EPF6024AQC240-3 fits embedded-system glue-logic designs because it can replace many discrete 74-series logic ICs with a single reconfigurable device, simplifying PCB layout and BOM while preserving design flexibility. With 199 user I/Os, the device can interface directly between a host CPU, memory bus, and multiple peripheral chips such as UARTs, timers, and display controllers. The 3.3 V supply matches common embedded CPUs of its era, eliminating level shifters. Compared with CPLDs of similar gate count, the FLEX 6000 architecture offers richer register-rich logic and predictable timing for synchronous designs, at the cost of requiring a configuration PROM at every power-up.
Recommended
Legacy Design Maintenance and Field Upgrades
The EPF6024AQC240-3 is best understood as a maintenance and field-upgrade part for existing FLEX 6000 designs rather than a candidate for new development. Because the device is obsolete, it is most relevant to engineers supporting installed systems in industrial, telecom, or military applications where board redesign is not feasible. The SRAM configuration allows in-system firmware updates via JTAG, extending product life without respinning the PCB. Designers sourcing this part should validate lot traceability rigorously - the open-market counterfeit rate for this device is reported at 59 percent - and stock sufficient quantity for the product's anticipated support window to avoid future scarcity.
Recommended
Recommended Products Summary
Engineering reference data for EPF6024AQC240-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF6024AQC240-2 | EPF6024AQC240-1 | EPF6024AQC240-2N |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 240-pin PQFP | 240-pin PQFP - same | 240-pin PQFP - same | 240-pin PQFP - same |
| Family | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 |
| Speed Grade | -3 (fastest) | -2 | -1 (slowest) | -2 |
| Logic Cells | 1960 | 1960 | 1960 | 1960 |
| User I/Os | 199 | 199 | 199 | 199 |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest speed grade in the FLEX 6000 240-pin PQFP family (vs EPF6024AQC240-2)
- Largest user I/O count in the FLEX 6000 family for PQFP packages (vs EPF6024AQC208-3)
- OptiFLEX architecture minimizes die size while preserving routability (vs EPF10K30EQC208-3)
Design Notes
The EPF6024AQC240-3 operates from a single 3.3 V rail spanning 3.0 V to 3.6 V. Estimated: at 142.86 MHz with 199 I/Os switching simultaneously at moderate toggle rates, core current can reach several hundred milliamperes. Place one 0.1 µF ceramic decoupling capacitor adjacent to every supply pin, plus bulk capacitance (10-47 µF tantalum or polymer) near the package. Because FLEX 6000 SRAM configuration is volatile, design the power-up ramp to be monotonic and within the datasheet's VCC rise-time spec to avoid configuration failures.
Because the EPF6024AQC240-3 is obsolete, the open-market counterfeit rate is reported at 59 percent. Avoid sourcing from unauthorized brokers; insist on franchised-distributor supply with full traceability paperwork. Verify lot and date codes against Altera / Intel historical records, perform decapsulation or X-ray inspection on suspect lots, and electrically test each unit in a known-good socket before PCB assembly. For new designs, plan a migration path to FLEX 10K or MAX II families to avoid future re-sourcing risk.
The 240-pin PQFP package has 0.5 mm typical lead pitch and 32x32 mm body size. Allow generous trace escape routing and use vias-in-pad or dog-bone fan-out under the package. Maintain continuous ground plane on an adjacent layer for return-path integrity, especially for the JTAG and clock pins. Place the external configuration PROM (such as EPC1 or EPC4) within 5 cm of the FPGA's DATA / DCLK pins to avoid configuration timing violations, and follow Altera AN-83 application-note layout guidance for passive-series termination on heavily-loaded outputs.
Compliance Information
Compliance documentation for legacy FLEX 6000 devices is inconsistent across distributor records. RoHS and lead-free status marked 'unknown' pending verification with specific lot and date code. Not AEC-Q100 qualified - this part targets commercial / industrial embedded designs, not automotive.
