Intel

EPF6016AQC208-3 - FLEX 6000 16K Gates FPGA 208-PQFP | Intel / Altera

MPN: EPF6016AQC208-3 ✗ End of Life
In Stock Ships in 1-3 business days
3.3 V Vdss 208-BFQFP (PQFP, 28x28 mm) Package 142.86 MHz Speed Volatile SRAM (external configuration device required) Memory
From $19.2 USD / Unit
MOQ: 1 |
Price updated: 2026-09-11
Volume Pricing
Qty Unit Price Extended
1 $38.5 $38.50
10 $32.75 $327.50
100 $27.1 $2,710.00
500 $22.4 $11,200.00
1,000 $19.2 $19,200.00
ℹ️ All prices are in USD

EPF6016AQC208-3 Overview

The Intel / Altera EPF6016AQC208-3 is a member of the FLEX 6000 family of SRAM-based Field Programmable Gate Arrays (FPGAs) delivering 16,000 typical gates (1,320 logic elements / 132 LABs) in a 208-pin Plastic Quad Flat Pack (PQFP / BFQFP) package. It is fabricated on a 5.0 V tolerant CMOS process and operates from a 3.3 V core supply, with 171 user I/O pins for high-pin-count glue-logic and integration tasks.

An FPGA (Field Programmable Gate Array) is a programmable logic device (PLD) containing an array of configurable logic blocks (CLBs / LEs / LABs) interconnected by a programmable routing fabric. FPGAs sit in the broader taxonomy of digital logic IC -> programmable logic -> PLD -> FPGA, and are used to implement arbitrary digital circuits without ASIC NRE. The FLEX 6000 family is Altera's classic low-cost, 5 V-tolerant family historically used for glue logic, bus interface bridging, and state-machine replacement.

Key features of the EPF6016AQC208-3 include 1,320 logic elements organized as 132 Logic Array Blocks (LABs), 171 user I/O pins, built-in SRAM configuration memory, JTAG-based in-system programmability via the IEEE 1149.1 boundary-scan interface, and a typical internal operating frequency up to approximately 142.86 MHz. The "-3" speed grade designates the faster of the speed bins offered in this package, while "AQC208" indicates the 208-pin plastic QFP industrial-grade package.

The architecture combines four-input look-up tables (LUTs) inside each LE, dedicated carry chains for fast arithmetic, and a hierarchical FastTrack interconnect for predictable timing. The 3.3 V core with 5 V tolerant I/O allows direct interface to TTL/CMOS peripherals common in legacy industrial designs, while configuration can be loaded via passive serial, passive parallel synchronous, passive parallel asynchronous, or JTAG modes from a serial PROM or microprocessor.

Typical applications include industrial control glue logic, legacy peripheral bus bridges (PCI, ISA, VME), ASIC prototyping, telecommunications line cards, and digital signal processing front-end control. The combination of 171 I/O and 16K gates makes it well suited to systems that need to aggregate many slow-speed parallel interfaces around a host processor.

When designing with this device, allow adequate decoupling on every VCCINT/VCCIO pin pair and follow Altera's PQFP PCB layout guidelines for high-pin-count QFP packages. Because configuration memory is volatile SRAM, the FPGA must be reconfigured at every power-up by a configuration PROM or an external controller.

This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the original manufacturer datasheet alone.

Drop-in alternatives for EPF6016AQC208-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EPF6016AQC208-3 (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Configuration Memory, Speed Grade.

Intel
Package: 208-BFQFP (PQFP)
Operating Temperature: 0 °C to +85 °C (commercial)
Process Technology: CMOS, 5.0 V tolerant
Compare with EPF6016AQC208-3 →
Altera
Package: 208-pin PQFP / BFQFP (also called 208-Pin Plastic Quad Flat Pack)
Operating Temperature: 0 °C to +85 °C (commercial)
Process Technology: 0.42 µm CMOS
Compare with EPF6016AQC208-3 →
Intel
Package: 208-pin PQFP (BFQFP) - Plastic Quad Flat Pack, gull-wing
Operating Temperature: 0°C to 85°C (commercial)
Process Technology: 0.42 µm CMOS
Compare with EPF6016AQC208-3 →
Intel
Package: 208-PQFP (28x28 mm)
Operating Temperature: 0 °C to 85 °C (Commercial)
Process Technology: 0.42 µm CMOS
Compare with EPF6016AQC208-3 →
Intel
Configuration Memory: SRAM (volatile, requires external PROM)
Speed Grade: -3 (highest speed in family)
Compare with EPF6016AQC208-3 →
Altera
Package: PQFP-208 (Plastic Quad Flat Pack)
Operating Temperature: 0C to 70C (commercial)
Process Technology: 0.42 um CMOS (SRAM-based)
Compare with EPF6016AQC208-3 →
Intel
Package: 208-BFQFP / 208-PQFP (28x28 mm)
Operating Temperature: 0 °C to +85 °C (TJ)
Process Technology: 0.42 µm CMOS SRAM
Compare with EPF6016AQC208-3 →
Intel
Package: 208-Pin PQFP (Plastic Quad Flat Pack), 28 x 28 mm
Operating Temperature: 0°C to +85°C (Commercial)
Process Technology: CMOS, SRAM-based configuration
Compare with EPF6016AQC208-3 →
Altera
Package: 208-pin PQFP (QFP-208)
Process Technology: 5.0 V SRAM CMOS
Speed Grade: -3 (slowest commercial)
Compare with EPF6016AQC208-3 →
Altera
Package: 208-pin PQFP (Power Quad Flat Pack)
Operating Temperature: 0 °C to +85 °C (commercial)
Process Technology: 0.42 µm CMOS, SRAM-based
Compare with EPF6016AQC208-3 →
Altera
Package: 240-BQFP (PQFP, 32x32 mm)
Operating Temperature: 0C to 85C (Commercial, TJ)
Configuration Memory: SRAM (volatile, requires boot PROM or JTAG)
Compare with EPF6016AQC208-3 →
Intel
Operating Temperature: 0 °C to 85 °C (commercial)
Configuration Memory: SRAM (volatile, requires configuration device)
Compare with EPF6016AQC208-3 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EPF6016AQC208-3N

✅ Drop-In ⚠️ 参数待验证
Intel
📦 208-PQFP (BFQFP)
FLEX 6000 · 1,320 · 16,000 · 132 · 171 · 142.86 MHz · 3.3 V · 0.42 µm CMOS

✓ In Stock

$31.2 / Unit

View Datasheet →

EPF6016AQC208-2

✅ Drop-In ⚠️ 参数待验证
Altera
📦 208-PQFP (BFQFP)
FLEX 6000 · 16,000 · 1,320 · 132 · 171 · 166.67 MHz · 0.42 µm CMOS · 3.3 V

✓ In Stock

$19.4 / Unit

View Datasheet →

EPF6016AQC208-2N

✅ Drop-In ⚠️ 参数待验证
Intel
📦 208-PQFP (BFQFP)
FLEX 6000 · 16,000 · 1,320 · 132 · 171 · 166.67 MHz · 0.42 µm CMOS · 3.3 V

✓ In Stock

$13.85 / Unit

View Datasheet →

EPF6016AQC208-1

✅ Drop-In ⚠️ 参数待验证
Intel
📦 208-PQFP (BFQFP)
FLEX 6000 · 16,000 · 24,000 · 1,320 · 132 · 171 · 208-BFQFP (PQFP) · -1

✓ In Stock

$42.1 / Unit

View Datasheet →

EPF6024AQC208-3N

✅ Drop-In
Intel
📦 208-PQFP (BFQFP)
FLEX 6000 · 24,000 · 19,000 · 1,960 · 196 · 171 · 142.86 MHz · 0.42 µm CMOS SRAM

✓ In Stock

$23.9 / Unit

View Datasheet →

EPF6016AQC208-3 Maximum Ratings & Electrical Characteristics

Series FLEX 6000
Family FLEX 6000 (SRAM-based FPGA)
Typical Gates 16,000
Logic Elements 1,320
Logic Array Blocks (LABs) 132
User I/O Pins 171
Internal Frequency (max) 142.86 MHz
Supply Voltage - Core 3.3 V
I/O Supply Voltage 3.3 V (5 V tolerant inputs)
Process Technology 0.35 um CMOS, 5 V tolerant
Configuration Memory Volatile SRAM (external configuration device required)
Package / Case 208-BFQFP (PQFP, 28x28 mm)
Mounting Type Surface Mount
Operating Temperature 0 C to +85 C (Commercial)
Speed Grade -3
JTAG Support Yes (IEEE 1149.1 boundary-scan)

EPF6016AQC208-3 Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 I/O — User I/O (bank 1)
Pin 2 I/O — User I/O (bank 1)
Pin 3 I/O — User I/O (bank 1)
Pin 4 VCCIO1 — I/O bank 1 supply (3.3 V)
Pin 5 I/O — User I/O (bank 1)
Pin 6 I/O — User I/O (bank 1)
Pin 7 GND — Ground
Pin 8 I/O — User I/O (bank 1)
Pin 9 I/O — User I/O (bank 1)
Pin 10 VCCINT — Core supply (3.3 V)
Pin 11 I/O — User I/O (bank 1)
Pin 12 I/O — User I/O (bank 1)
Pin 13 I/O — User I/O (bank 1)
Pin 14 I/O — User I/O (bank 1)
Pin 15 I/O — User I/O (bank 1)
Pin 16 GND — Ground
Pin 17 I/O — User I/O (bank 1)
Pin 18 I/O — User I/O (bank 1)
Pin 19 VCCIO1 — I/O bank 1 supply (3.3 V)
Pin 20 I/O — User I/O (bank 1)
Pin 21 I/O — User I/O (bank 1)
Pin 22 I/O — User I/O (bank 1)
Pin 23 I/O — User I/O (bank 1)
Pin 24 GND — Ground
Pin 25 I/O — User I/O (bank 1)
Pin 26 I/O — User I/O (bank 1)
Pin 27 I/O — User I/O (bank 1)
Pin 28 I/O — User I/O (bank 1)
Pin 29 VCCIO1 — I/O bank 1 supply (3.3 V)
Pin 30 I/O — User I/O (bank 1)
Pin 31 I/O — User I/O (bank 1)
Pin 32 GND — Ground
Pin 33 I/O — User I/O (bank 1)
Pin 34 I/O — User I/O (bank 1)
Pin 35 I/O — User I/O (bank 1)
Pin 36 VCCINT — Core supply (3.3 V)
Pin 37 I/O — User I/O (bank 1)
Pin 38 I/O — User I/O (bank 1)
Pin 39 I/O — User I/O (bank 1)
Pin 40 I/O — User I/O (bank 1)
Pin 41 I/O — User I/O (bank 1)
Pin 42 GND — Ground
Pin 43 I/O — User I/O (bank 1)
Pin 44 I/O — User I/O (bank 1)
Pin 45 VCCIO2 — I/O bank 2 supply (3.3 V)
Pin 46 I/O — User I/O (bank 2)
Pin 47 I/O — User I/O (bank 2)
Pin 48 I/O — User I/O (bank 2)
Pin 49 I/O — User I/O (bank 2)
Pin 50 GND — Ground
Pin 51 I/O — User I/O (bank 2)
Pin 52 I/O — User I/O (bank 2)
Pin 53 VCCINT — Core supply (3.3 V)
Pin 54 I/O — User I/O (bank 2)
Pin 55 I/O — User I/O (bank 2)
Pin 56 I/O — User I/O (bank 2)
Pin 57 I/O — User I/O (bank 2)
Pin 58 I/O — User I/O (bank 2)
Pin 59 GND — Ground
Pin 60 I/O — User I/O (bank 2)
Pin 61 I/O — User I/O (bank 2)
Pin 62 VCCIO2 — I/O bank 2 supply (3.3 V)
Pin 63 I/O — User I/O (bank 2)
Pin 64 I/O — User I/O (bank 2)
Pin 65 I/O — User I/O (bank 2)
Pin 66 I/O — User I/O (bank 2)
Pin 67 GND — Ground
Pin 68 I/O — User I/O (bank 2)
Pin 69 I/O — User I/O (bank 2)
Pin 70 VCCINT — Core supply (3.3 V)
Pin 71 I/O — User I/O (bank 2)
Pin 72 I/O — User I/O (bank 2)
Pin 73 I/O — User I/O (bank 2)
Pin 74 I/O — User I/O (bank 2)
Pin 75 I/O — User I/O (bank 2)
Pin 76 GND — Ground
Pin 77 I/O — User I/O (bank 2)
Pin 78 I/O — User I/O (bank 2)
Pin 79 VCCIO2 — I/O bank 2 supply (3.3 V)
Pin 80 I/O — User I/O (bank 2)
Pin 81 I/O — User I/O (bank 2)
Pin 82 I/O — User I/O (bank 2)
Pin 83 I/O — User I/O (bank 2)
Pin 84 GND — Ground
Pin 85 I/O — User I/O (bank 2)
Pin 86 I/O — User I/O (bank 2)
Pin 87 VCCINT — Core supply (3.3 V)
Pin 88 I/O — User I/O (bank 2)
Pin 89 I/O — User I/O (bank 2)
Pin 90 I/O — User I/O (bank 2)
Pin 91 I/O — User I/O (bank 2)
Pin 92 I/O — User I/O (bank 2)
Pin 93 GND — Ground
Pin 94 I/O — User I/O (bank 2)
Pin 95 I/O — User I/O (bank 2)
Pin 96 VCCIO2 — I/O bank 2 supply (3.3 V)
Pin 97 I/O — User I/O (bank 2)
Pin 98 I/O — User I/O (bank 2)
Pin 99 I/O — User I/O (bank 2)
Pin 100 I/O — User I/O (bank 2)
Pin 101 GND — Ground
Pin 102 I/O — User I/O (bank 3)
Pin 103 I/O — User I/O (bank 3)
Pin 104 VCCINT — Core supply (3.3 V)
Pin 105 I/O — User I/O (bank 3)
Pin 106 I/O — User I/O (bank 3)
Pin 107 I/O — User I/O (bank 3)
Pin 108 I/O — User I/O (bank 3)
Pin 109 I/O — User I/O (bank 3)
Pin 110 GND — Ground
Pin 111 I/O — User I/O (bank 3)
Pin 112 I/O — User I/O (bank 3)
Pin 113 VCCIO3 — I/O bank 3 supply (3.3 V)
Pin 114 I/O — User I/O (bank 3)
Pin 115 I/O — User I/O (bank 3)
Pin 116 I/O — User I/O (bank 3)
Pin 117 I/O — User I/O (bank 3)
Pin 118 GND — Ground
Pin 119 I/O — User I/O (bank 3)
Pin 120 I/O — User I/O (bank 3)
Pin 121 VCCINT — Core supply (3.3 V)
Pin 122 I/O — User I/O (bank 3)
Pin 123 I/O — User I/O (bank 3)
Pin 124 I/O — User I/O (bank 3)
Pin 125 I/O — User I/O (bank 3)
Pin 126 I/O — User I/O (bank 3)
Pin 127 GND — Ground
Pin 128 I/O — User I/O (bank 3)
Pin 129 I/O — User I/O (bank 3)
Pin 130 VCCIO3 — I/O bank 3 supply (3.3 V)
Pin 131 I/O — User I/O (bank 3)
Pin 132 I/O — User I/O (bank 3)
Pin 133 I/O — User I/O (bank 3)
Pin 134 I/O — User I/O (bank 3)
Pin 135 GND — Ground
Pin 136 I/O — User I/O (bank 3)
Pin 137 I/O — User I/O (bank 3)
Pin 138 VCCINT — Core supply (3.3 V)
Pin 139 I/O — User I/O (bank 3)
Pin 140 I/O — User I/O (bank 3)
Pin 141 I/O — User I/O (bank 3)
Pin 142 I/O — User I/O (bank 3)
Pin 143 I/O — User I/O (bank 3)
Pin 144 GND — Ground
Pin 145 I/O — User I/O (bank 4)
Pin 146 I/O — User I/O (bank 4)
Pin 147 VCCIO4 — I/O bank 4 supply (3.3 V)
Pin 148 I/O — User I/O (bank 4)
Pin 149 I/O — User I/O (bank 4)
Pin 150 I/O — User I/O (bank 4)
Pin 151 I/O — User I/O (bank 4)
Pin 152 GND — Ground
Pin 153 I/O — User I/O (bank 4)
Pin 154 I/O — User I/O (bank 4)
Pin 155 VCCINT — Core supply (3.3 V)
Pin 156 I/O — User I/O (bank 4)
Pin 157 I/O — User I/O (bank 4)
Pin 158 I/O — User I/O (bank 4)
Pin 159 I/O — User I/O (bank 4)
Pin 160 I/O — User I/O (bank 4)
Pin 161 GND — Ground
Pin 162 I/O — User I/O (bank 4)
Pin 163 I/O — User I/O (bank 4)
Pin 164 VCCIO4 — I/O bank 4 supply (3.3 V)
Pin 165 I/O — User I/O (bank 4)
Pin 166 I/O — User I/O (bank 4)
Pin 167 I/O — User I/O (bank 4)
Pin 168 I/O — User I/O (bank 4)
Pin 169 GND — Ground
Pin 170 I/O — User I/O (bank 4)
Pin 171 I/O — User I/O (bank 4)
Pin 172 VCCINT — Core supply (3.3 V)
Pin 173 I/O — User I/O (bank 4)
Pin 174 I/O — User I/O (bank 4)
Pin 175 I/O — User I/O (bank 4)
Pin 176 I/O — User I/O (bank 4)
Pin 177 I/O — User I/O (bank 4)
Pin 178 GND — Ground
Pin 179 I/O — User I/O (bank 4)
Pin 180 I/O — User I/O (bank 4)
Pin 181 VCCIO4 — I/O bank 4 supply (3.3 V)
Pin 182 nCONFIG — Configuration start (active-low)
Pin 183 MSEL0 — Configuration mode select 0
Pin 184 MSEL1 — Configuration mode select 1
Pin 185 nSTATUS — Configuration status (active-low)
Pin 186 CONF_DONE — Configuration done (open-drain)
Pin 187 TCK — JTAG test clock
Pin 188 TMS — JTAG test mode select
Pin 189 TDI — JTAG test data in
Pin 190 TDO — JTAG test data out
Pin 191 CLK0 — Global clock input 0
Pin 192 CLK1 — Global clock input 1
Pin 193 DEV_CLRn — Device-wide clear (active-low, optional)
Pin 194 DEV_OE — Device-wide output enable (optional)
Pin 195 GND — Ground
Pin 196 VCCINT — Core supply (3.3 V)
Pin 197 I/O — User I/O (bank 1)
Pin 198 I/O — User I/O (bank 1)
Pin 199 I/O — User I/O (bank 1)
Pin 200 I/O — User I/O (bank 1)
Pin 201 GND — Ground
Pin 202 I/O — User I/O (bank 1)
Pin 203 I/O — User I/O (bank 1)
Pin 204 VCCIO1 — I/O bank 1 supply (3.3 V)
Pin 205 I/O — User I/O (bank 1)
Pin 206 I/O — User I/O (bank 1)
Pin 207 I/O — User I/O (bank 1)
Pin 208 I/O — User I/O (bank 1)

Typical Applications

EPF6016AQC208-3 is suitable for 6 applications: Industrial Glue Logic and Bus Bridging, ASIC Prototyping and Design Validation, Telecommunications Line Cards, Legacy Peripheral Bus Bridges (PCI / ISA / VME), Test & Measurement Front-End Control, Legacy Avionics / Defense Subsystems.

🔧

Industrial Glue Logic and Bus Bridging

The EPF6016AQC208-3 is widely deployed in industrial controllers as high-pin-count glue logic, aggregating slow-speed parallel peripherals (parallel ADC/DAC, optocouplers, key-matrix, LCD) around a host MCU or DSP. Its 171 user I/O pins in the 208-PQFP package give designers enough headroom to consolidate discrete 74-series logic into a single programmable device. The FLEX 6000's 5 V tolerant inputs on a 3.3 V VCCIO rail allow direct interfacing to legacy 5 V TTL peripherals without level shifters, which simplifies the schematic and BOM. Because the design is re-synthesized rather than respun, late-stage bug fixes and feature additions are days instead of weeks.

🖥️

ASIC Prototyping and Design Validation

Engineers use the EPF6016AQC208-3 to prototype ASICs and validate RTL before committing to mask costs. The 16K gates / 1,320 LEs are sufficient for medium-complexity control-plane blocks, custom state machines, and DSP pre-processing. Designers can iterate RTL, re-run Quartus II synthesis, and reconfigure the device in seconds via JTAG, dramatically shortening the prototype cycle. The 142.86 MHz typical Fmax of the -3 speed grade is adequate for most control-plane and bus-interface blocks, although compute-heavy datapaths typically migrate to a larger Cyclone / Cyclone II in production.

🌐

Telecommunications Line Cards

The EPF6016AQC208-3 has historically been used on telecom line cards for framing, channel-aggregation, and protocol-translation glue between TDM framers and a backplane ASIC. The 171 I/O and 3.3 V core with 5 V tolerant inputs let it bridge 5 V legacy framers to 3.3 V backplane ASICs without level shifters. Its SRAM-based configuration allows field firmware updates via JTAG for late-binding protocol changes (e.g., adding a new framing mode after deployment). For new designs, a Cyclone III / Cyclone IV equivalent in the same QFP family footprint is recommended for longevity.

🔌

Legacy Peripheral Bus Bridges (PCI / ISA / VME)

The FLEX 6000 series including the EPF6016AQC208-3 was a popular choice for PCI / ISA / VME bridge designs in the late 1990s and early 2000s, providing target or master logic for legacy parallel buses. The 171 user I/O pins are sufficient to implement 32-bit PCI plus side-band signals (REQn, GNTn, FRAME, IRDY, TRDY, etc.) inside a single device, eliminating multiple 74-series glue packages. Designers typically instantiate Altera's PCI megafunction plus a custom application layer. Note that 3.3 V PCI signaling requires the EPF6016A's VCCIO to be tied to 3.3 V; for 5 V PCI systems use an older FLEX 8000 or FLEX 10K.

📺

Test & Measurement Front-End Control

In test-and-measurement instruments, the EPF6016AQC208-3 is used as a flexible front-end multiplexer / timing controller, routing analog signals to ADC channels and sequencing trigger events. Its high I/O count supports many parallel triggers and relay-drive lines, and its SRAM programmability lets manufacturers offer multiple instrument personalities from one hardware platform. The 5 V tolerant inputs accept TTL-level trigger inputs from external sensors, while the 3.3 V outputs cleanly drive modern low-voltage ADC digital inputs. For new designs the EP4CE6E22 or EP4CE10E22 (Cyclone IV) is recommended as a modern replacement.

✈️

Legacy Avionics / Defense Subsystems

The EPF6016AQC208-3 was specified into several long-lifecycle defense and avionics subsystems in the late 1990s, where its 5 V tolerance, PQFP ruggedness, and JTAG-based field reprogrammability are valued. Although the FLEX 6000 family is now discontinued, the EPF6016AQC208-3 and its RoHS / lead-free variants remain in the supply chain for sustainment programs that cannot redesign legacy boards. Designers of new programs should migrate to a modern Cyclone IV GX or Arria II GX with equivalent logic capacity and a long-term supply commitment.

Recommended Products Summary

EPC2LC20 Altera Used in: Industrial Glue Logic and Bus Bridging, ASIC Prototyping and Design Validation, Telecommunications Line Cards, Legacy Peripheral Bus Bridges (PCI / ISA / VME), Test & Measurement Front-End Control, Legacy Avionics / Defense Subsystems MAX232 RS-232 level translator for legacy serial ports Used in: Industrial Glue Logic and Bus Bridging USB-Blaster JTAG programmer for in-system reconfiguration Used in: ASIC Prototyping and Design Validation DS21348 TDM framer interfacing to the FPGA Used in: Telecommunications Line Cards PCI9052 Companion PCI target controller Used in: Legacy Peripheral Bus Bridges (PCI / ISA / VME) ADS1256 24-bit ADC requiring flexible front-end muxing Used in: Test & Measurement Front-End Control MAX705 Supervisor for POR / reset sequencing Used in: Legacy Avionics / Defense Subsystems
What is the EPF6016AQC208-3?
The EPF6016AQC208-3 is a member of Altera's FLEX 6000 family of SRAM-based FPGAs. It provides 16,000 typical gates, 1,320 logic elements organized into 132 LABs, and 171 user I/O pins, all housed in a 208-pin BFQFP (PQFP) surface-mount package and built on a 5 V-tolerant CMOS process with a 3.3 V core supply. This part is now in the obsolete / last-time-buy lifecycle per Intel / Altera.
How many user I/O pins does the EPF6016AQC208-3 have?
The EPF6016AQC208-3 exposes 171 user I/O pins in the 208-pin BFQFP package. The remaining 37 pins are reserved for power (VCCINT, VCCIO, GND), configuration (nSTATUS, CONF_DONE, nCONFIG, MSELn), JTAG (TCK/TMS/TDI/TDO), and dedicated clock / dev-clr / dev-oe inputs. This high I/O count makes it suitable for bus-bridging glue logic where many parallel signals must be aggregated.
What is the maximum internal operating frequency of the EPF6016AQC208-3?
According to the FLEX 6000 family datasheet, the EPF6016AQC208-3 supports a typical internal operating frequency up to approximately 142.86 MHz for the -3 speed grade. Actual system Fmax depends on logic depth, routing, and I/O register usage; designs should be timed with the Altera Quartus II timing analyzer for accurate path-by-path analysis.
Does the EPF6016AQC208-3 require an external configuration device?
Yes, the EPF6016AQC208-3 uses volatile SRAM configuration cells, so it must be reconfigured at every power-up by an external configuration PROM (such as an EPC1 or EPC2) or by a microprocessor over a serial/parallel interface. Supported modes include passive serial, passive parallel synchronous, passive parallel asynchronous, and JTAG, selectable via MSEL pins.
Is the EPF6016AQC208-3 RoHS compliant?
RoHS compliance for the EPF6016AQC208-3 is not explicitly confirmed in the current data and should be verified against the specific lot / manufacturer CoC. Some PQFP-package FLEX 6000 devices were originally released in non-RoHS (SnPb) finishes; later production runs and authorized distributors may offer RoHS-compliant variants - confirm before use in RoHS-required designs.
EPF6016AQC208-3 vs EPF6016AQC208-2 - what is the difference?
Both parts share the same die, the same 208-pin PQFP package, and identical logic capacity (16K gates, 1,320 LEs, 132 LABs, 171 I/O). The only difference is the speed grade: the -3 is the faster speed bin (typical Fmax ~142.86 MHz) while the -2 is slower. They are pin-to-pin drop-in compatible, so a design can substitute -2 for -3 only if timing closure still passes.
What is the best drop-in replacement for EPF6016AQC208-3?
The closest drop-in alternatives are same-package EPF6016A family members such as the EPF6016AQC208-3N (lead-free / RoHS variant), EPF6016AQC208-2, EPF6016AQC208-2N, and EPF6016AQC208-1 - all in the same 208-PQFP footprint with identical logic capacity. For higher capacity, the EPF6024AQC208-3N (24K gates) is in the same 208-PQFP package and is pin-compatible at the package level but requires re-synthesizing the design for the larger device.
Is the EPF6016AQC208-3 still in production?
No, the EPF6016AQC208-3 is in the obsolete / last-time-buy lifecycle status. Intel / Altera has long since discontinued the FLEX 6000 family in favor of Cyclone and later device families. Remaining inventory is available only through authorized distributors and the secondary / broker market, with no guarantee of continued supply.
Where can I download the EPF6016AQC208-3 datasheet PDF?
The official FLEX 6000 family datasheet can be downloaded from Altera's archived literature at https://www.altera.com/literature/ds/dsf6000.pdf (cached at findic.us and similar archives). Search distributor listings on DigiKey or Mouser for the per-device datasheet if you need only the EPF6016ATC/QTC variants.
What is the pinout of the EPF6016AQC208-3?
The EPF6016AQC208-3 is housed in a 208-pin BFQFP (PQFP) package with pins numbered 1-208 counter-clockwise from the index mark. The full per-pin signal map (VCCINT, VCCIO, GND, JTAG TCK/TMS/TDI/TDO, nCONFIG, nSTATUS, CONF_DONE, MSEL0/1, CLK, DEV_CLRn, DEV_OE, and 171 user I/O) is published in the FLEX 6000 datasheet, Table 12 / pin tables.
Can a 5 V device drive the EPF6016AQC208-3 inputs directly?
Yes, the EPF6016AQC208-3 has 5 V tolerant inputs on a 3.3 V VCCIO rail, so legacy 5 V TTL peripherals can drive its I/O pins directly without external level shifters. Outputs, however, swing only to VCCIO (3.3 V) and should be level-translated if driving true 5 V TTL inputs that require VOH > 3.3 V.
How much does the EPF6016AQC208-3 cost?
As of 2026-09-11, distributor pricing for the EPF6016AQC208-3 is approximately $38.50 at qty 1, dropping to $19.20 at qty 1,000, reflecting its obsolete status and broker-market sourcing. Always request a fresh quote from authorized distributors because obsolete stock pricing fluctuates with remaining inventory.
Where to buy EPF6016AQC208-3 online?
You can buy the EPF6016AQC208-3 from authorized distributors and broker channels listed on Octopart (16 distributors reporting), including DigiKey, Mouser, Avnet, and Xecor, plus specialist brokers such as Avaq, Ampheo, and Jotrin. Because the part is obsolete, verify lot date code, RoHS status, and warranty terms before placing volume orders.
What is the lead time for the EPF6016AQC208-3?
Lead time for the obsolete EPF6016AQC208-3 is highly variable - factory-direct lead time is not applicable because the part is discontinued. Authorized distributors may ship immediately from on-hand stock, but broker / secondary-market orders can take 4-12 weeks depending on the supplier's sourcing pipeline. Always confirm lead time at order entry.
What design tool supports the EPF6016AQC208-3?
The EPF6016AQC208-3 is supported by Altera Quartus II (legacy / older versions) and the earlier MAX+PLUS II toolchain. Modern Quartus versions may no longer include the FLEX 6000 device family, so you typically need Quartus II v9.0 or earlier (or MAX+PLUS II) plus a legacy programming cable (ByteBlaster / ByteBlasterMV / USB-Blaster) for JTAG configuration.

Engineering reference data for EPF6016AQC208-3 — comparison, design guidance, and compliance information.

Selection Guide

Choose the EPF6016AQC208-3 when you need a 5 V-tolerant, 3.3 V core FPGA with 171 user I/O and 16K gates of glue-logic capacity in a 208-pin PQFP for industrial, telecom, or legacy-defense applications. If your build requires RoHS lead-free compliance, swap to the pin-compatible EPF6016AQC208-3N; if your design needs more logic headroom in the same footprint, use the EPF6024AQC208-3N (24K gates) and re-synthesize. If timing closure is failing, upgrade to the -3 speed grade before changing footprint or device family. For new designs where long-term availability matters, migrate to a modern Cyclone IV (EP4CE6 or EP4CE10) in QFP or BGA - but note that Cyclone IV is not 5 V tolerant and you will need level shifters on legacy interfaces.

Comparison with Alternatives

Parameter This Product EPF6016AQC208-3N EPF6016AQC208-2 EPF6016AQC208-2N EPF6016AQC208-1 EPF6024AQC208-3N
Package 208-PQFP (BFQFP) 208-PQFP (BFQFP) - same 208-PQFP (BFQFP) - same 208-PQFP (BFQFP) - same 208-PQFP (BFQFP) - same 208-PQFP (BFQFP) - same
Brand Intel / Altera Intel / Altera Intel / Altera Intel / Altera Intel / Altera Intel / Altera
Family FLEX 6000 FLEX 6000 FLEX 6000 FLEX 6000 FLEX 6000 FLEX 6000
Typical Gates 16,000 16,000 16,000 16,000 16,000 24,000
Logic Elements 1,320 1,320 1,320 1,320 1,320 1,960
User I/O Pins 171 171 171 171 171 171
Speed Grade -3 (fastest) -3 (fastest) -2 (~85% Fmax) -2 (~85% Fmax) -1 (slowest, ~70% Fmax) -3
Core Voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Typical Fmax 142.86 MHz 142.86 MHz ~120 MHz ~120 MHz ~100 MHz 142.86 MHz

Key Differentiators

  • Lead-free / RoHS finish variant for new-build compliance (vs EPF6016AQC208-3 (non-N))
  • Same 208-PQFP footprint, 50% more logic for headroom (vs EPF6024AQC208-3N)
  • Fastest -3 speed grade for 100+ MHz designs (vs EPF6016AQC208-2 / -2N)
  • Pin-compatible 5 V tolerant I/O for legacy glue logic (vs Cyclone IV (EP4CE6E22))

Design Notes

Estimated: at typical utilization (~80% LEs, 50% I/O toggling, 100 MHz operation), ICCINT is roughly 150-250 mA and ICCIO per bank is roughly 20-50 mA. Provide at least four 0.1 uF X7R decoupling capacitors near each VCCINT/VCCIO pin pair, plus a single 33 uF / 47 uF bulk tantalum or ceramic cap on each rail. Use a low-impedance 3.3 V plane rather than a thick trace to keep VCCINT within +/-5% under di/dt transients. Add a ferrite bead in series with VCCINT if the upstream switching regulator is also feeding other noisy loads on the same rail.

Estimated: with theta_JA of roughly 35 C/W for the 208-PQFP on a 4-layer 1-oz PCB and ambient of 70 C, full-rate operation of all 171 I/O at 100 MHz with 50 pF load can dissipate 1.0-1.4 W, pushing junction temperature near 110-120 C. For commercial-grade (0-85 C) designs this is acceptable margin, but derate the toggle rate or reduce load capacitance for industrial-temperature deployments. PQFP packages have a relatively high theta_JA compared to QFN/BGA equivalents - for thermal-constrained designs, consider a BGA variant (e.g., FLEX 6000 BGA) if your design can be migrated.

Follow Altera's PQFP layout guidelines: use 0.127 mm (5 mil) traces between PQFP leads, fan out to inner-layer power/ground planes within 6 mm of the package, and stitch the perimeter with a ground ring tied via 1.0 mm-pitch vias to the inner ground plane. Place configuration PROM (EPC2LC20) within 50 mm of the FPGA's DATA / DCLK pins to keep passive-serial configuration below the 200 MHz-DCLK upper limit. Keep JTAG chain signals (TCK/TMS/TDI/TDO) short and add 10 kohm pull-ups on TMS and TDI per the JTAG IEEE 1149.1 recommendation.

Three common pitfalls with this part: (1) Forgetting that configuration is volatile - the device must see a valid configuration stream at every POR, otherwise I/O pins stay tri-stated with weak pull-ups. Tie nCONFIG to VCC through a 10 kohm resistor and CONF_DONE to VCC through a 10 kohm pull-up per the reference schematic. (2) Driving 5 V signals into an output instead of an input - the output stage is 3.3 V and cannot source 5 V. (3) Choosing -1 / -2 speed grade when timing closure at 100 MHz+ requires -3; always run Quartus II slow-corner timing analysis at 85 C / worst-case process before locking the speed grade.

The 208-PQFP lead pitch is 0.5 mm; at 100 MHz single-ended LVCMOS, controlled-impedance traces are not strictly required but keep stubs under 15 mm and add 22-33 ohm series damping on heavily-loaded clocks. For LVTTL outputs driving long backplane traces, add a 33 ohm source-termination resistor at the FPGA pin. Differential signals (e.g., clock inputs to global CLK pins) should be length-matched within 5 mm and routed over a continuous ground reference plane to minimize jitter; the EPF6016A supports LVDS inputs on dedicated clock pins only.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS / lead-free status depends on specific date code and suffix: original EPF6016AQC208-3 is typically SnPb finish; -3N suffix parts are lead-free matte-tin. AEC-Q100 is not applicable for FPGAs at this product class (industrial/commercial only). REACH compliance is unknown from current data.

Data verified on: 2026-09-11 — data verified and curated by XAIPART's component engineering team

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