EPF6024AQC280-3N - 24K Gate FLEX 6000 FPGA | Intel / Altera
MPN: EPF6024AQC280-3N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $80 | $80.00 |
| 10 | $65 | $650.00 |
| 100 | $45 | $4,500.00 |
| 250 | $38 | $9,500.00 |
| 500 | $34 | $17,000.00 |
EPF6024AQC280-3N Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing interconnect, and configurable I/O cells, all controlled by on-chip SRAM configuration memory. FPGAs sit within the broader programmable logic hierarchy (PLD -> CPLD -> FPGA) and offer the highest logic density and highest performance of any programmable device family. The FLEX 6000 series specifically targets cost-sensitive glue-logic, bus-interface, and state-machine applications where designers need FPGA density but not the highest I/O count of competing families.
Key features of the EPF6024AQC280-3N include 235 user I/O pins (the highest I/O count offered in the FLEX 6000 family), 4 PLLs for flexible clock synthesis, multiVolt I/O support (3.3V and 5.0V mixed-voltage operation), in-system programmability through the IEEE 1149.1 JTAG interface, and SRAM-based configuration that allows unlimited reconfigurations. The 280-pin PQFP package uses industry-standard 0.50 mm pitch gull-wing leads compatible with conventional SMT assembly lines.
The device is built on a 0.35um CMOS SRAM process with five layers of metal interconnect, which delivers the speed-grade-3 timing closure of approximately 7 ns for a basic look-up table (LUT) operation. The four on-chip PLLs support clock multiplication, division, and phase shifting with sub-nanosecond jitter, simplifying board-level clock-tree design in telecom and industrial-control boards.
Typical applications include industrial control and factory-automation controllers, glue-logic replacement around microprocessors and DSPs, telecommunications line cards and protocol bridges, legacy bus-interface adaptors (PCI, ISA, VME), and prototype ASIC emulation. The combination of 24K gates and 235 user I/O makes the EPF6024AQC280-3N a particularly strong fit when designers need to consolidate many discrete 74-series logic chips onto a single programmable device.
When designing with this part, allocate configuration memory for the JTAG or EPC configuration device, observe the PowerQuad 4 thermal pad connection to the PCB ground plane, and verify signal-integrity margins on the high-pin-count PQFP package using controlled-impedance routing. The -3 speed grade is the slowest of the FLEX 6000 commercial grades; if a design requires higher fMAX, evaluate the -2 or -1 speed grade.
This page synthesizes distributor pricing, drop-in alternatives from the same FLEX 6000 family, and practical design notes that go beyond the manufacturer datasheet to help engineers qualify and source the EPF6024AQC280-3N.
Drop-in alternatives for EPF6024AQC280-3N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF6024AQC280-3N (same form factor and footprint) β differing in Package, Process Technology, Mounting Type, Speed Grade, Configuration Method.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EPF6024AQC280-3
β Drop-Inβ In Stock
$19.85 / Unit
View Datasheet βEPF6024AQC-280
β Drop-Inβ In Stock
$58 / Unit
View Datasheet βEPF6024AQC280-3N Maximum Ratings & Electrical Characteristics
| Family | FLEX 6000 |
| Typical Gates | 24,000 |
| Logic Elements | 16,000 |
| Logic Cells | 1,960 |
| Embedded RAM Bits | 6,192 bits |
| User I/O Pins | 235 |
| PLLs | 4 |
| Package | PQFP-280 (PowerQuad 4, 0.50 mm pitch) |
| Process Technology | 0.35 um CMOS SRAM, 5 metal layers |
| Speed Grade | -3 |
| Operating Temperature | 0C to 70C (commercial) |
| Supply Voltage (Core) | 5.0 V |
| MultiVolt I/O | 3.3 V and 5.0 V |
| Configuration Interface | JTAG (IEEE 1149.1) / EPC serial |
| Lead-Free / Lead Finish | Yes (N suffix) |
| Configuration Memory | SRAM (volatile, requires boot device) |
| Mounting Type | Surface Mount |
| MSL Level | 3 |
| RoHS Status | unknown |
EPF6024AQC280-3N Pin Configuration
| Pin 1 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 2 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 3 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 4 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 5 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 6 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 7 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 8 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 9 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 10 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 11 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 12 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 13 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 14 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 15 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 16 | I/O β User I/O pin (bank-dependent voltage) |
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| Pin 18 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 19 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 20 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 21 | VCCIO β I/O bank supply voltage (3.3V or 5.0V) |
| Pin 22 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 23 | I/O β User I/O pin (bank-dependent voltage) |
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| Pin 40 | I/O β User I/O pin (bank-dependent voltage) |
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| Pin 48 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 49 | I/O β User I/O pin (bank-dependent voltage) |
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| Pin 70 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 71 | VCCINT β Core supply voltage (5.0V) |
| Pin 72 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 73 | I/O β User I/O pin (bank-dependent voltage) |
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| Pin 83 | I/O β User I/O pin (bank-dependent voltage) |
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| Pin 112 | I/O β User I/O pin (bank-dependent voltage) |
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| Pin 124 | I/O β User I/O pin (bank-dependent voltage) |
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| Pin 133 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 134 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 135 | I/O β User I/O pin (bank-dependent voltage) |
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| Pin 139 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 140 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 141 | VCCIO β I/O bank supply voltage (3.3V or 5.0V) |
| Pin 142 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 143 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 144 | I/O β User I/O pin (bank-dependent voltage) |
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| Pin 150 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 151 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 152 | I/O β User I/O pin (bank-dependent voltage) |
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| Pin 165 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 166 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 167 | I/O β User I/O pin (bank-dependent voltage) |
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| Pin 174 | I/O β User I/O pin (bank-dependent voltage) |
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| Pin 184 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 185 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 186 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 187 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 188 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 189 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 190 | I/O β User I/O pin (bank-dependent voltage) |
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| Pin 198 | I/O β User I/O pin (bank-dependent voltage) |
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| Pin 206 | I/O β User I/O pin (bank-dependent voltage) |
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| Pin 209 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 210 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 211 | VCCINT β Core supply voltage (5.0V) |
| Pin 212 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 213 | I/O β User I/O pin (bank-dependent voltage) |
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| Pin 235 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 236 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 237 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 238 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 239 | I/O β User I/O pin (bank-dependent voltage) |
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| Pin 255 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 256 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 257 | I/O β User I/O pin (bank-dependent voltage) |
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| Pin 266 | I/O β User I/O pin (bank-dependent voltage) |
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| Pin 268 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 269 | I/O β User I/O pin (bank-dependent voltage) |
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| Pin 273 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 274 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 275 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 276 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 277 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 278 | I/O β User I/O pin (bank-dependent voltage) |
| Pin 279 | GND β Ground reference |
| Pin 280 | GND β Ground reference |
Typical Applications
EPF6024AQC280-3N is suitable for 6 applications: Industrial Control and Factory Automation, Telecommunications Line Cards and Protocol Bridges, Legacy Bus-Interface Adaptors (PCI, ISA, VME), ASIC Emulation and Prototype Bring-Up, Glue-Logic Consolidation on Processor Boards, Military and Aerospace Avionics Legacy Systems.
Industrial Control and Factory Automation
The EPF6024AQC280-3N's 24,000 typical gates and 235 user I/O pins make it well suited for industrial PLC backplanes and factory-automation controllers where many 24V-tolerant field inputs must be scanned and sequenced. In a typical PLC digital-input card, the FPGA aggregates parallel opto-isolated inputs, debounces them in hardware, and presents a clean parallel bus to the host processor. The four on-chip PLLs synthesize the multiple clock domains needed for synchronized sensor reads and PWM outputs to motor drivers. Designers choose this part because its 5V MultiVolt I/O directly interfaces with legacy 5V industrial logic without level shifters, and the PQFP-280 package exposes enough I/O for 32-bit plus control-signal aggregation on a single device. Trade-off: the commercial 0C-70C temperature range may require a thermal-grade review for enclosed cabinets above 50C ambient.
Recommended
Telecommunications Line Cards and Protocol Bridges
The 235 user I/O of the EPF6024AQC280-3N map naturally to T1/E1 and HDB3-coded line interfaces where multiple serial streams must be framed, de-framed, and converted to parallel backplane buses. In a typical telecom line card, the FPGA implements HDLC controllers, framer logic, and elastic-store FIFOs that bridge between the line-side serializer/deserializer and the host processor's local bus. The four PLLs derive the line-bit-clock from a single backplane reference, supporting hitless reference switching across redundant clock sources. The 5V core with 3.3V MultiVolt I/O allows direct connection to legacy 5V framer ASICs while still interfacing with newer 3.3V processors on the same board. Trade-off: at the -3 speed grade, expect internal fMAX around 80-100 MHz for typical designs, which is adequate for most T1/E1 and 10/100 Ethernet bridging tasks.
Recommended
Legacy Bus-Interface Adaptors (PCI, ISA, VME)
The EPF6024AQC280-3N is frequently used as a bus-bridge FPGA between modern processors and legacy 5V PCI, ISA, or VME buses in industrial and embedded systems. Its 235 user I/O can drive the full 32-bit data bus plus address and control signals of a PCI target interface without external bus drivers, while the 5V MultiVolt I/O eliminates level-translation circuitry. The four PLLs generate the 33 MHz PCI clock domain and any derived local clocks required for on-board peripherals. Designers appreciate the in-system JTAG programmability because it allows post-assembly firmware updates to fix bus-timing bugs without respinning the board. Trade-off: the -3 speed grade may require careful pipelining to meet PCI 33 MHz setup/hold timing, and designers should validate against PCI Specification rev 2.1 timing budgets before committing to layout.
Recommended
ASIC Emulation and Prototype Bring-Up
In ASIC prototyping labs, the EPF6024AQC280-3N serves as a fast bring-up vehicle for mid-complexity ASICs because its 24,000 gates and 235 user I/O can map a partitioned ASIC RTL block-by-block into real hardware. Engineers load the synthesized netlist into the SRAM configuration memory via JTAG, exercise the design against real-world I/O, and iterate RTL changes without waiting for a fab spin. The four PLLs allow multiple clock-domain emulation, and the unlimited SRAM reconfigurability lets designers re-target the device multiple times per day. Trade-off: ASIC emulation rarely reaches the target ASIC's clock frequency because the -3 speed grade LUT delay (~7 ns) is significantly slower than a custom-cell ASIC; use this part for functional validation, not timing closure.
Recommended
Glue-Logic Consolidation on Processor Boards
The EPF6024AQC280-3N excels at replacing dozens of 74-series logic chips on microprocessor and DSP boards with a single programmable device. A typical use case is a VMEbus single-board computer where the FPGA implements address decoding, wait-state generation, interrupt arbitration, and chip-select logic that would otherwise consume significant board area. The 235 user I/O give designers ample headroom to add custom peripheral interfaces (UART, SPI, GPIO) alongside the standard bus glue, and JTAG reconfigurability means late design changes do not require board re-spins. Trade-off: at 5V core supply, designers must verify that the host processor's I/O voltage is compatible or include level shifters; modern 3.3V processors will require external translation.
Recommended
Military and Aerospace Avionics Legacy Systems
Although the EPF6024AQC280-3N itself is a commercial-temperature part, it is widely used as a low-risk, long-lifecycle FPGA in legacy military and avionics subsystems that were certified with FLEX 6000 designs. Its mature 0.35um CMOS process, stable mask set, and multi-decade Altera/Intel documentation make it attractive for programs that require form-fit-function continuity across long sustainment cycles. The 235 user I/O support ARINC 429, MIL-STD-1553, and discrete I/O aggregation in cockpit and stores-management subsystems. Trade-off: designers must screen for counterfeit parts because the original Altera production has long ended, and authorized brokers like those listed on Octopart should be used with full traceability documentation.
Recommended
Recommended Products Summary
Engineering reference data for EPF6024AQC280-3N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF6024AQC280-3 | EPF6024AQC-280 | EPF6024AQC240-3N | EPF6024AQC208-3N |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | PQFP-280 (PowerQuad 4) | PQFP-280 - same | PQFP-280 - same | PQFP-240 - different footprint | PQFP-208 - different footprint |
| Typical Gates | 24,000 | 24,000 | 24,000 | 24,000 | 24,000 |
| User I/O Pins | 235 | 235 | 235 | 193 | 171 |
| PLLs | 4 | 4 | 4 | 4 | 4 |
| Speed Grade | -3 (slowest) | -3 (slowest) | unknown | -3 (slowest) | -3 (slowest) |
| Lead Finish | Lead-free (N suffix) | Standard SnPb | Standard SnPb | Lead-free (N suffix) | Lead-free (N suffix) |
| Pin-to-Pin Compatible | Reference | Yes | Yes | No (footprint swap) | No (footprint swap) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest I/O count in the FLEX 6000 family (vs EPF6024AQC208-3N)
- Same die as the EPF6024AQC280-3 in lead-free finish (vs EPF6024AQC280-3)
- Larger package footprint than the PQFP-240 family members (vs EPF6024AQC240-3N)
Design Notes
The EPF6024AQC280-3N requires a stable 5.0V VCCINT core supply and a separate VCCIO supply (3.3V or 5.0V) for each I/O bank. Decoupling must include 0.1uF ceramic capacitors placed within 5mm of every VCC pin and bulk 10-100uF tantalum or polymer capacitors on each supply rail. During SRAM configuration, the device draws additional inrush current; ensure the 5V regulator has at least 500mA of headroom above the steady-state ICC. Estimated: at typical 50% toggle rate the FLEX 6000 core consumes approximately 200-300 mA at 5V; verify with the Quartus power analyzer for production sign-off.
The PQFP-280 package with 0.50 mm pitch requires careful PCB layout: use 0.20 mm-wide traces with 0.20 mm spacing on the escape routing, and place a continuous ground plane on layer 2 directly under the package to control impedance and reduce crosstalk. The package body is 32 mm x 32 mm, so allocate at least 38 mm x 38 mm of board area including clearance. Pin 1 is identified by a chamfered corner and a molded dot; orient the silkscreen dot to match the package marking. For double-sided assembly, consider via-in-pad for thermal relief on the center pad.
Do not assume the -3 speed grade LUT delay (approximately 7 ns) will meet your timing budget without running static timing analysis in the Quartus Prime design tool. Common pitfalls include: (1) forgetting that SRAM-based FPGAs lose configuration at power-down, so an external EPC configuration device is mandatory; (2) confusing the N-suffix lead-free finish with functional differences - it is pin-compatible with the SnPb variant; (3) using 3.3V signals on a 5.0V MultiVolt I/O bank without verifying VCCIO is set to 3.3V on that bank; (4) mixing pull-up resistors to 5V on a 3.3V bank which can forward-bias the I/O clamp diodes.
Compliance Information
RoHS status is unknown because the original Altera FLEX 6000 datasheet pre-dates widespread RoHS documentation; the N suffix indicates Pb-free lead finish per Altera's naming convention. Not AEC-Q100 qualified - the commercial 0C-70C temperature range is not automotive-grade. For RoHS/REACH documentation, contact Intel FPGA customer support or request the manufacturer certificate of compliance from the franchised broker.
