EPF6024AQI240-3 - FLEX 6000 FPGA, 24K Gates, 240-PQFP | Intel
MPN: EPF6024AQI240-3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $38.25 | $382.50 |
| 100 | $33.1 | $3,310.00 |
| 500 | $28.75 | $14,375.00 |
| 1,000 | $25.4 | $25,400.00 |
EPF6024AQI240-3 Overview
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor device based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit between simple PLDs/CPLDs (lower density, deterministic timing) and ASICs (high NRE, fixed function). The FLEX 6000 family is Altera's classic SRAM-based, low-density FPGA line (now owned and supported by Intel) positioned for cost-sensitive glue logic, bridging, and I/O expansion roles rather than high-performance signal processing.
Key features of the EPF6024AQI240-3 include 1,960 logic elements, 199 user I/O lines plus 4 dedicated inputs, 0.5 mm pitch PQFP-240 for socketed or hand-prototype assembly, SRAM-based configuration (volatile - requires a configuration PROM such as EPC2 or EPC4 on power-up), and in-system programmability via JTAG (IEEE 1149.1). The 240-pin PQFP footprint enables simpler rework and breadboarding compared with fine-pitch BGA alternatives, an important consideration for legacy industrial designs.
Architecturally, the FLEX 6000 device uses Altera's patented continuous interconnect scheme with embedded array blocks (EABs) used as RAM/ROM. The part is fabricated on a CMOS process and operates from a 5.0 V core supply with multi-voltage I/O support. Configuration is loaded from a serial or parallel PROM over a dedicated data path, making board-level bring-up straightforward.
Typical applications include industrial control glue logic, parallel I/O expansion and bus interfacing, prototype-to-production ASIC replacement, motor-control sequencing, legacy telecom backplane glue logic, and test instrumentation I/O conditioning. The 240-pin PQFP package is also favored where socket-based field replacement is required.
Design consideration: The EPF6024AQI240-3 is an older FLEX 6000 device, and Intel/Altera long-term support is limited. Designers building new products should consider Cyclone or Cyclone II as modern equivalents, while keeping the FLEX 6000 family for legacy repair and second-source maintenance.
Drop-in alternatives for EPF6024AQI240-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF6024AQI240-3 (same form factor and footprint) — differing in Package, Process Technology, Configuration Method, Speed Grade, Maximum Clock Frequency.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF6024AQI240-2
✅ Drop-In✓ In Stock
$9.75 / Unit
View Datasheet →EPF6024AQI240-2N
✅ Drop-In✓ In Stock
$16.4 / Unit
View Datasheet →EPF6024AQI240-1
✅ Drop-In✓ In Stock
$15.2 / Unit
View Datasheet →EPF6024AQI240-1N
✅ Drop-In✓ In Stock
$16.2 / Unit
View Datasheet →EPF6024AQC240-3
✅ Drop-In✓ In Stock
$19.8 / Unit
View Datasheet →EPF6024AQC240-3N
✅ Drop-In✓ In Stock
$69.3 / Unit
View Datasheet →EPF6024AQI240-3 Maximum Ratings & Electrical Characteristics
| Family | FLEX 6000 |
| Logic Elements | 1,960 |
| Usable Gates | 24,000 (typical) |
| User I/O | 199 |
| Dedicated Inputs | 4 |
| Maximum Clock Frequency | 133 MHz |
| Speed Grade | -3 |
| Process Technology | CMOS (SRAM-based) |
| Package | 240-pin PQFP (PQFP240), 0.50 mm pitch |
| Mounting Type | Surface Mount |
| Configuration Method | SRAM (serial/parallel PROM, JTAG) |
| Operating Temperature Range | Industrial (I suffix) |
| Embedded Array Blocks (EAB) | Yes (used as RAM/ROM) |
| Supply Voltage | 5.0 V core (multi-voltage I/O support) |
EPF6024AQI240-3 240-pin pqfp (pqfp240), 0.50 mm pitch Pin Configuration Guide
Pin configuration for EPF6024AQI240-3 (240-pin pqfp (pqfp240), 0.50 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF6024AQI240-3.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF6024AQI240-3 is suitable for 6 applications: Industrial Glue Logic and Bus Bridging, Legacy ASIC Replacement and Prototype Bring-Up, Motor Control Sequencing and PWM Generation, Telecom Backplane Glue Logic, Test and Measurement I/O Conditioning, Military and Aerospace Avionics (Legacy).
Industrial Glue Logic and Bus Bridging
The EPF6024AQI240-3's 1,960 logic elements and 199 user I/O pins make it well suited to industrial glue-logic boards that must bridge parallel buses (e.g., ISA, PC/104, custom 16/32-bit parallel interfaces) to peripherals or controllers. Designers typically instantiate multiple bus-state-machine cores, FIFOs, and address-decode logic while keeping timing predictable thanks to the FLEX 6000 deterministic interconnect. The PQFP-240 footprint supports socket-based field replacement, an advantage in long-life industrial installations.
Recommended
Legacy ASIC Replacement and Prototype Bring-Up
Engineers use the EPF6024AQI240-3 as a quick-turn ASIC substitute during the gap between FPGA prototype and ASIC silicon return. The 24,000 usable gates and 199 I/O cover typical control-plane ASICs (register-rich, low arithmetic), while SRAM-based in-system programmability via JTAG accelerates board bring-up. Designers download bitstreams via ByteBlaster or USB-Blaster, iterate in MAX+PLUS II or Quartus II Web Edition, and validate the design before committing to ASIC NRE.
Recommended
Motor Control Sequencing and PWM Generation
Stepper and BLDC motor control boards benefit from the EPF6024AQI240-3's 133 MHz clock and 1,960 logic elements for multi-axis PWM generation, encoder decoding, and commutation sequencing. Hardware state machines deliver deterministic timing free from RTOS jitter, and the 199 I/O support multiple encoder/HALL-sensor inputs plus parallel DAC interfaces. The industrial temperature grade (I suffix) suits factory-floor environments with extended thermal range.
Recommended
Telecom Backplane Glue Logic
Legacy telecom and networking backplanes use the EPF6024AQI240-3 for protocol conversion, framing/deframing, and bus arbitration between line cards. The 199 I/O accommodate multiple low-speed serial links and parallel control buses, while SRAM-based configuration enables fast field firmware updates via JTAG. Socketed PQFP-240 assembly simplifies line-card rework when a single FPGA must be replaced on a fully populated backplane.
Recommended
Test and Measurement I/O Conditioning
Test instruments and ATE fixtures use the EPF6024AQI240-3 as a reconfigurable I/O-conditioning layer between measurement ASICs and the unit-under-test. The 199 I/O support parallel pattern generation, handshake sequencing, and adaptive threshold conditioning, while the 133 MHz clock enables deterministic timing for compliance tests. Engineers prototype new test routines in days rather than weeks because configuration changes load in seconds via JTAG.
Recommended
Military and Aerospace Avionics (Legacy)
Long-lifecycle avionics and military systems rely on the EPF6024AQI240-3 for stable, established-source logic functions where requalification cost outweighs the benefit of modern FPGAs. The industrial temperature grade and PQFP-240 footprint are qualified in many legacy DO-254 and MIL-STD-454 platforms. Modernization programs are encouraged to migrate to rad-tolerant FPGAs, but the EPF6024AQI240-3 continues to support sustainment-phase production through licensed distribution.
Recommended
Recommended Products Summary
Engineering reference data for EPF6024AQI240-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF6024AQI240-2 | EPF6024AQI240-2N | EPF6024AQI240-1 | EPF6024AQI240-1N | EPF6024AQC240-3 | EPF6024AQC240-3N |
|---|---|---|---|---|---|---|---|
| Package | PQFP-240 (0.50 mm pitch) | PQFP-240 (same) | PQFP-240 (same) | PQFP-240 (same) | PQFP-240 (same) | PQFP-240 (same) | PQFP-240 (same) |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Speed Grade | -3 (fastest, 133 MHz fmax) | -2 | -2 | -1 | -1 | -3 | -3 |
| Logic Elements | 1,960 | 1,960 (same die) | 1,960 (same die) | 1,960 (same die) | 1,960 (same die) | 1,960 (same die) | 1,960 (same die) |
| User I/O | 199 | 199 (same) | 199 (same) | 199 (same) | 199 (same) | 199 (same) | 199 (same) |
| Temperature Grade | Industrial (I suffix) | Industrial | Industrial | Industrial | Industrial | Commercial | Commercial |
| Lead-Free (N suffix) | No | No | Yes | No | Yes | No | Yes |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Configuration PROM | External (EPC2/EPC4/EPC8) | External (same) | External (same) | External (same) | External (same) | External (same) | External (same) |
Key Differentiators
- Fastest -3 speed grade in the FLEX 6000 PQFP-240 industrial family (vs EPF6024AQI240-2)
- Industrial temperature range for harsh-environment deployments (vs EPF6024AQC240-3)
- High I/O density for bus-bridging designs (vs EPF6016QC208-3)
Design Notes
The EPF6024AQI240-3 in PQFP-240 has a junction-to-ambient thermal resistance (theta_JA) of approximately 30-35 C/W on a standard 4-layer JEDEC test board with no airflow. At a 5 V core supply drawing ~250 mA, internal dissipation is ~1.25 W and the die temperature rises 40-45 C above ambient. For enclosed industrial enclosures above 60 C ambient, derate by ~2-3 C/W per missing layer and confirm with a thermal probe during bring-up.
Always include an external configuration PROM (EPC2, EPC4, EPC8, or EPC16) selected by bitstream size - the SRAM configuration is volatile and the FPGA will not power up functional without it. Connect nCONFIG to a supervisor reset or RC delay so VCC is stable before configuration begins. JTAG (TCK, TMS, TDI, TDO, VCCIO, GND) must be routed to a header for factory programming; forgetting JTAG access forces board rework later.
PQFP-240 has 0.50 mm pitch leads that require careful land-pattern and solder-mask definition. Use a length-to-width pad ratio of approximately 1.5:1 with toe and heel fillets to prevent solder bridges during reflow. Place a 0.1 uF decoupling cap on every four VCCIO/VCCINT pins, plus a bulk 47-100 uF tantalum near the FPGA. Route all VCC and GND pairs as wide power pours with multiple vias to drop impedance.
Compliance Information
RoHS status not documented in public sources. The original PQFP-240 device was likely SnPb lead finish. The N-suffix variants (e.g., EPF6024AQI240-2N, EPF6024AQC240-3N) indicate lead-free finishes per Altera ordering nomenclature.
