TPS53355DQPR - 30A Sync Buck Converter 1.5-15V | TI
MPN: TPS53355DQPR β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7.85 | $7.85 |
| 10 | $7.07 | $70.70 |
| 100 | $6.28 | $628.00 |
| 500 | $5.5 | $2,750.00 |
| 1,000 | $4.71 | $4,710.00 |
TPS53355DQPR Overview
A synchronous buck converter is a DC-DC switching regulator that uses two internally integrated MOSFETs and an external inductor to step a higher input voltage down to a lower, tightly regulated output voltage. Buck regulators form the core of modern point-of-load power management hierarchies, converting intermediate distribution rails (such as 12 V) into the low voltages required by processors, FPGAs, and memory, with far higher efficiency than linear regulators.
Key features include the D-CAP control topology, which requires no external compensation network and delivers excellent load transient response, plus TI eco-mode technology that reduces switching frequency at light load to maintain high efficiency across the full load range. The internal 5-mOhm/2-mOhm MOSFET pair minimizes conduction losses at full 30-A output, while the accurate 1% 0.6-V internal reference supports low-voltage core rails. An integrated boost switch eliminates an external bootstrap diode.
Technically, the device supports adjustable switching frequency (250 kHz to 1 MHz), adjustable current limit with thermal shutdown protection, and flexible soft-start control. The wide 1.5-V to 15-V conversion input allows direct operation from 12-V intermediate bus rails as well as 5-V and lower rails.
Typical applications include server and network processor core power, point-of-load supplies for FPGAs, ASICs, and DDR memory, telecom and datacenter power stages, and distributed power systems where a compact 30-A stage with minimal external components is required.
Design consideration: at 30-A output the power stage dissipation is dominated by conduction losses, so a solid PCB thermal layout with generous copper pour on the exposed thermal pad is essential for reliable continuous operation.
This page synthesizes distributor availability data, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for TPS53355DQPR β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
TPS53355DQPT
β Drop-Inπ Reference alternative (not in catalog)
TPS53319DQPR
β Drop-Inπ Reference alternative (not in catalog)
TPS53353DQPR
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
TPS53355DQPR Maximum Ratings & Electrical Characteristics
| Topology | Synchronous Buck (Step-Down) |
| Control Topology | D-CAP mode with eco-mode |
| Input Voltage Range | 1.5 V to 15 V |
| Output Voltage Range | 0.6 V to 5.5 V (adjustable) |
| Maximum Output Current | 30 A |
| Output Voltage Reference | 0.6 V, 1% accuracy |
| Integrated High-Side MOSFET Rds(on) | 5 mOhm |
| Integrated Low-Side MOSFET Rds(on) | 2 mOhm |
| Switching Frequency | Adjustable, 250 kHz to 1 MHz |
| Number of Outputs | 1 |
| Quiescent Current | 0.32 mA (typ) |
| Integrated Boost Switch | Yes |
| Current Limit | Adjustable |
| Package | 22-PowerLFDFN (DQP), 6 mm x 5 mm |
| Mounting Type | Surface Mount |
| Features | Eco-mode, adjustable current limit, thermal shutdown |
TPS53355DQPR 22-powerlfdfn (dqp), 6 mm x 5 mm Pin Configuration Guide
Pin configuration for TPS53355DQPR (22-powerlfdfn (dqp), 6 mm x 5 mm package). This power device features gate, drain, and source terminals. For non-polarized packages, refer to the manufacturer datasheet for exact pin 1 orientation and footprint details. Common applications include power supply design, motor driving, and load switching.
No detailed pinout data available for TPS53355DQPR.
Refer to the datasheet for full pin configuration.
Typical Applications
TPS53355DQPR is suitable for 6 applications: Server and Processor Core Power, FPGA and ASIC Point-of-Load Power, Telecom and Datacenter Power Distribution, Industrial Automation and Motor Controller Logic Power, DDR Memory Power Supply, Distributed Power in Storage and Network Appliances.
Server and Processor Core Power
The TPS53355DQPR fits server CPU and network processor core power stages because modern processors demand 20-30 A rails with millivolt-level accuracy and nanosecond load-step response. Its D-CAP topology responds to transient load changes without external compensation, and the 1% 0.6-V reference supports low core voltages directly. In a typical 12-V intermediate bus design, the converter steps 12 V down to sub-1-V core rails with integrated 5-mOhm/2-mOhm MOSFETs minimizing conduction loss. Eco-mode keeps standby efficiency high when the processor enters sleep states, and the compact 6-mm x 5-mm QFN conserves the dense board space typical of server motherboards.
Recommended
FPGA and ASIC Point-of-Load Power
For FPGA and ASIC point-of-load conversion, the TPS53355DQPR provides the high transient current these devices draw during simultaneous switching. The 30-A rating covers mid-range FPGA cores, and the adjustable 250-kHz to 1-MHz frequency lets designers optimize inductor size versus efficiency on space-limited boards. Because the MOSFETs and boost switch are integrated, the external solution requires only an inductor, a few capacitors, and resistors, which reduces BOM complexity compared with a controller-plus-external-FET approach. Adjustable current limit also protects expensive ASICs during fault conditions, and the power-good monitoring simplifies power-sequencing implementation with upstream controllers in multi-rail systems.
Recommended
Telecom and Datacenter Power Distribution
Telecom base stations and datacenter racks commonly distribute 12 V on an intermediate bus, exactly matching the 15-V maximum input of the TPS53355DQPR. The device steps this bus down to 3.3-V, 2.5-V, or 1.x-V logic rails for line cards, switch ASICs, and memory subsystems. Its eco-mode maintains efficiency at the low utilization factors typical of telecom equipment that spends much of its life at partial load, reducing thermal design burden in sealed enclosures. The 6-mm x 5-mm QFN with exposed pad supports the high board density of ATCA and similar carrier cards, while adjustable current limit enables safe hot-swap behavior under upstream ORing controllers.
Recommended
Industrial Automation and Motor Controller Logic Power
Industrial drives, PLCs, and motion controllers need robust 12-V-derived logic rails that tolerate wide input excursions; the 1.5-V to 15-V input range of the TPS53355DQPR covers unregulated industrial bus variations. Its 30-A capacity also directly powers the gate-driver supply stages of larger drives, and the adjustable current limit allows coordination with upstream protection. The D-CAP loop remains stable with low-ESR ceramic output capacitors, and thermal shutdown provides a last-line safeguard in high-ambient cabinets. The integrated-MOSFET design removes the gate-drive layout sensitivity that external-FET solutions require, improving manufacturability in high-volume industrial boards.
Recommended
DDR Memory Power Supply
High-density DDR3/DDR4 memory arrays draw tens of amps of low-voltage rail current with sharp burst transients during read/write bursts, a profile matched to the 30-A capability and fast D-CAP transient response of the TPS53355DQPR. The 1% reference accuracy keeps VDD within JEDEC memory tolerance windows even with resistor-divider tolerance included, improving margin. At 1.5-V input the converter operates with low duty cycle and excellent efficiency using the 2-mOhm low-side FET. Designers typically set the switching frequency near 500 kHz to balance ripple and transient response, and eco-mode reduces quiescent losses when the memory controller enters self-refresh.
Recommended
Distributed Power in Storage and Network Appliances
SSD arrays, storage controllers, and network appliances populate boards with many point-of-load converters; the TPS53355DQPR serves the heavy central rails while smaller SWIFT parts feed peripheral loads. Its high integration reduces total solution footprint - TI notes the part is designed for ease of use, low external component count, and space-conscious power systems. Adjustable switching frequency avoids beat-frequency interference among multiple converters on the same board by letting designers stagger frequencies. The same 6-mm x 5-mm QFN footprint is shared across the TPS533xx family, allowing one PCB land pattern to serve several current ratings and simplifying logistics in appliance mass production.
Recommended
Recommended Products Summary
Engineering reference data for TPS53355DQPR β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | TPS53355DQPT | TPS53319DQPR | TPS53353DQPR |
|---|---|---|---|---|
| Package | 22-PowerLFDFN (DQP), 6 mm x 5 mm | 22-PowerLFDFN (DQP), 6 mm x 5 mm - same | 22-PowerLFDFN (DQP), 6 mm x 5 mm - same | 22-PowerLFDFN (DQP), 6 mm x 5 mm - same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Maximum Output Current | 30 A | 30 A | Lower rating (verify datasheet) | Lower rating (verify datasheet) |
| Control Topology | D-CAP mode with eco-mode | D-CAP mode with eco-mode | D-CAP mode | D-CAP mode |
Key Differentiators
- Highest output current in footprint family (vs TPS53319DQPR)
- Fully integrated power stage (vs TPS53353DQPR)
- Eco-mode light-load efficiency (vs TPS53319DQPR)
Design Notes
At 30-A continuous output, conduction loss in the integrated 5-mOhm high-side and 2-mOhm low-side MOSFETs dominates total dissipation. Estimated: at Iout = 30 A, I-squared-R loss reaches approximately 1.35 W on the high-side and 0.54 W on the low-side FET (using R-squared-I arithmetic with those Rds(on) values), plus switching losses that scale with frequency and input voltage. The exposed thermal pad must connect to a minimum 1-square-inch copper pour with an array of thermal vias; without it, the junction will exceed safe limits at full load.
Follow the layout guidelines in the TI TPS53355 datasheet: keep the input capacitor loop as small as possible because it carries pulsed switching current; place the inductor close to the SW pin; route the VOSNS feedback sense lines as a Kelvin pair directly to the output capacitor, not to a high-current trace. The DQP package's thermal pad should have a 5x5 via array filling the pad area. Poor Kelvin sensing is the most common cause of output-voltage droop under load in 30-A designs.
Do not exceed the 15-V maximum input, and account for input transient spikes when the converter is fed from long inductive wiring. Choose output capacitors whose ESR region keeps the D-CAP loop stable - excessively low-ESR pure ceramic banks may need a small series resistor per TI application guidance. The frequency-set resistor also affects current-limit behavior, so re-verify current limit after any frequency change rather than assuming the default remains valid.
Compliance Information
Compliance status was not explicitly stated in the retrieved web data. Obtain the official material declaration from the TI quality/environmental portal for regulatory documentation.
