10AX090U3F45I2SG - Arria 10 GX FPGA 900K LE | Intel | 1932-BGA
MPN: 10AX090U3F45I2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9025.49 | $9,025.49 |
| 10 | $8650 | $86,500.00 |
| 100 | $8200 | $820,000.00 |
| 500 | $7800 | $3,900,000.00 |
| 1,000 | $7450 | $7,450,000.00 |
Drop-in alternatives for 10AX090U3F45I2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX090U3F45I2LG
✅ Drop-In✓ In Stock
$9750 / Unit
View Datasheet →10AX090U3F45E2SG
✅ Drop-In✓ In Stock
$3295 / Unit
View Datasheet →10AX090U2F45I2SG
✅ Drop-In✓ In Stock
$3640 / Unit
View Datasheet →10AX090U2F45I2LG
✅ Drop-In✓ In Stock
$7957.34 / Unit
View Datasheet →10AX090U2F45I1SG
✅ Drop-In✓ In Stock
$6895.59 / Unit
View Datasheet →10AX090U3F45I2SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements | 900000 |
| Embedded Memory Bits | 59234304 |
| Number of User I/O | 480 |
| Process Technology | 20nm |
| Core Voltage | 0.9 V |
| Package | 1932-BBGA, FCBGA (F45) |
| Number of Terminals | 1932 |
| Terminal Form | BALL |
| Package Shape | SQUARE |
| Operating Temperature Grade | INDUSTRIAL |
| Transceivers | Up to 28.05 Gbps |
| DSP Blocks | Variable-precision multipliers |
| Mounting Type | Surface Mount (BGA) |
| Compliance | RoHS compliant per Altera product page |
10AX090U3F45I2SG square Pin Configuration Guide
Complete pinout information for 10AX090U3F45I2SG (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX090U3F45I2SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX090U3F45I2SG is suitable for 6 applications: 4K Video Processing and Broadcast Equipment, 100G/400G Ethernet Line Cards, Wireless Baseband and Radio Processing, Test and Measurement Instrumentation, Military Radar and Signal Processing Prototyping, ASIC Prototyping and Emulation.
4K Video Processing and Broadcast Equipment
The 10AX090U3F45I2SG's 900,000 logic elements and high-speed 28.05 Gbps transceivers make it ideal for 4K/UHD video processing pipelines where multi-stream uncompressed video must be ingested, color-corrected, and routed out. The device's variable-precision DSP blocks accelerate chroma upsampling, scaling, and HDR tone-mapping kernels in real time. Placed on broadcast mainboards with multiple 12G-SDI or HDMI 2.1 interfaces, this FPGA consolidates what would otherwise require multiple mid-range FPGAs. The F45 1932-BGA package's high pin count accommodates the dense transceiver and memory interface routing these designs require.
Recommended
100G/400G Ethernet Line Cards
The 10AX090U3F45I2SG's 28.05 Gbps transceivers enable direct interfacing with CFP/CFP2/CFP4 optical modules and QSFP28 ports for 100G Ethernet line cards, with multiple transceivers supporting 400G configurations via aggregation. Its hard PCIe Gen2/Gen3 controller simplifies host interface to network processors, while 59 Mbits of embedded memory provide packet buffering headroom. Placed as the MAC/PCS bridge on telecom line cards, the device handles 100G/400G PHY layer functions and L2/L3 forwarding acceleration. The F45 1932-BGA package supports the dense high-speed SERDES routing required for multi-port 100G line cards.
Recommended
Wireless Baseband and Radio Processing
The 10AX090U3F45I2SG's combination of high logic density, abundant variable-precision DSP, and 28.05 Gbps transceivers is well-suited to wireless baseband processing for LTE-Advanced and 5G prototype systems. Its DSP blocks accelerate FFT/iFFT, channel coding/decoding, and MIMO matrix operations at the throughput required for multi-antenna radio units. The integrated memory controllers support high-bandwidth DDR4 interfacing to baseband sample buffers. Placed between RF front-end ADCs/DACs and the host processor, this FPGA functions as the real-time baseband engine. The industrial temperature grade supports outdoor small-cell deployments.
Recommended
Test and Measurement Instrumentation
The 10AX090U3F45I2SG enables high-channel-count oscilloscopes, logic analyzers, and protocol analyzers that require simultaneous high-speed sampling across many channels. The 480 user I/Os can be partitioned into multiple parallel test interfaces, while 28.05 Gbps transceivers support high-speed serial protocol testing (PCIe, USB 3.1, SATA, DisplayPort). The 900K LE fabric provides real-time pattern matching and triggering logic that off-the-shelf processors cannot match in latency. The F45 1932-BGA package accommodates the dense mixed-signal routing typical of high-end test equipment front ends.
Recommended
Military Radar and Signal Processing Prototyping
The 10AX090U3F45I2SG's high logic density and DSP block count serve as a development platform for radar digital signal processing chains (pulse compression, MTI, Doppler processing, SAR focusing). Its industrial temperature grade (-40C to +100C) supports ruggedized prototype deployment for field testing of new radar algorithms. The 28.05 Gbps transceivers enable high-bandwidth RF data capture from modern A/D converters in radar receivers. Placed as the central processing element in radar prototypes, this FPGA accelerates the iterative algorithm development that is impractical on GPU-based systems due to latency and power constraints.
Recommended
ASIC Prototyping and Emulation
The 10AX090U3F45I2SG serves as an in-circuit emulator for ASIC designs during pre-silicon validation, with the 900K LE fabric mapping complex SoC logic partitions. Multi-FPGA prototyping boards can be built by interconnecting several Arria 10 GX FPGAs via their 28.05 Gbps transceivers to achieve multi-million-ASIC-gate capacity. The hard memory controllers and abundant block RAM accelerate memory-mapped subsystem prototyping. Placed on ASIC prototyping boards alongside test stimulus generation, this FPGA enables software bring-up and hardware-software co-validation months before silicon availability. The F45 1932-BGA package supports the high-density interconnect typical of multi-FPGA partition boards.
Recommended
Recommended Products Summary
Engineering reference data for 10AX090U3F45I2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX090U3F45I2LG | 10AX090U3F45E2SG | 10AX090U2F45I2SG | 10AX090U2F45I2LG | 10AX090U2F45I1SG |
|---|---|---|---|---|---|---|
| Package | 1932-BBGA, FCBGA (F45) | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Speed Grade | -3 | -3 | -2 | -2 | -2 | -1 |
| Temperature Grade | Industrial | Industrial | Extended | Industrial | Industrial | Industrial |
| Logic Elements | 900000 | 900000 | 900000 | 900000 | 900000 | 900000 |
| User I/O Count | 480 | 480 | 480 | 480 | 480 | 480 |
| Embedded Memory | 59234304 bits | 59234304 bits | 59234304 bits | 59234304 bits | 59234304 bits | 59234304 bits |
| Process Node | 20nm | 20nm | 20nm | 20nm | 20nm | 20nm |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Terminal Finish | SnPb (non-leaded per ordering code I2SG) | Lead-free (LG suffix) | SnPb (E2SG) | SnPb (I2SG) | Lead-free (LG) | SnPb (I1SG) |
Key Differentiators
- Highest speed grade (-3) with full F45 1932-BGA compatibility (vs 10AX090U2F45I2SG)
- Industrial temperature grade (-40C to +100C) with full 900K LE density (vs 10AX090U3F45E2SG)
- Lead-free variant available in identical F45 footprint (vs 10AX090U3F45I2LG)
Design Notes
The Arria 10 GX 10AX090 at full utilization with all transceivers active can dissipate up to approximately 40W peak per Altera thermal modeling. The 1932-BGA F45 package requires either a high-performance heatsink with thermal interface material or a cold-plate solution for sustained workloads. Estimated: at 25C ambient and 40W dissipation with a properly mounted heatsink rated at theta_SA = 0.5 C/W, junction-to-ambient thermal resistance of approximately 1.5 C/W yields a junction temperature rise of about 60C, well within the industrial 100C limit. Without active cooling, the device will throttle or exceed temperature limits under full load.
The 1932-ball FCBGA F45 package requires a high-layer-count PCB (typically 14+ layers) with microvia (uVia) construction and 0.4mm or finer pitch escape routing. BGA break-out must use dog-bone or via-in-pad designs depending on the PCB fabricator's capabilities. High-speed transceiver channels require matched-length routing and controlled impedance per the Arria 10 Transceiver PHY User Guide. Power delivery requires low-impedance planes for 0.9V core with decoupling capacitors placed within the BGA escape region.
Do not confuse speed grade ordering codes: U3 = speed grade -3, U2 = speed grade -2, U1 = speed grade -1; the I/E prefix denotes industrial vs extended temperature, and SG/LG denotes SnPb vs lead-free terminal finish. Mixing speed grades can lead to timing closure failures because Fmax specifications differ. Always verify the Arria 10 ordering code matches the Quartus Prime device selection before board bring-up. Estimated: design impact of using speed grade -2 vs -3 typically limits transceiver data rates by approximately 10-15% at the same VCC.
Transceiver channel placement in the F45 package must follow the bank architecture defined in the Arria 10 GX Device Family Pin Connection Guidelines. Each transceiver bank has dedicated reference clock inputs that must be routed with matched lengths and proper isolation. Differential pair lengths within a transceiver channel must be matched within 0.127mm (5 mil) per Arria 10 documentation. Power pin decoupling must follow the recommended capacitor network from the Arria 10 Hardware Reference Manual to suppress simultaneous switching noise.
Compliance Information
The I2SG suffix indicates SnPb terminal finish (not lead-free per ordering code conventions). RoHS compliance per Altera product page. Lead-free LG suffix variants (e.g. 10AX090U3F45I2LG) are available as drop-in same-package alternatives for RoHS-compliant end products. AEC-Q100 not applicable - this is a commercial/industrial FPGA. REACH, halogen-free, and conflict minerals status not specified in the verified data.
