EP20K400CF672C7 - APEX 20KC FPGA, 400K Gates, 672-BGA | Intel
MPN: EP20K400CF672C7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $242 | $24,200.00 |
| 500 | $218.75 | $109,375.00 |
| 1,000 | $195 | $195,000.00 |
EP20K400CF672C7 Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, programmable interconnect, and I/O cells, all controlled by a user-defined bitstream. In the system hierarchy, FPGAs sit between general-purpose processors and fixed-function ASICs - offering hardware-level parallelism and design flexibility while consuming more power than purpose-built ASICs. The APEX 20KC family further extends this concept with MultiCore™ architecture combining look-up-table (LUT) logic with embedded system blocks (ESBs) that double as RAM, ROM, or content-addressable memory.
Key features of the EP20K400CF672C7 include 488 maximum user I/Os, 212,992 RAM bits, 2.5 ns pin-to-pin propagation delay, and up to 375.94 MHz internal operation. The 672-ball FineLine BGA package supports high-speed signal integrity for parallel buses, LVDS, and DDR memory interfaces, while the speed grade "-7" represents the mid-tier (commercial 0 °C to 85 °C) timing bin. The device also integrates 4 phase-locked loops (PLLs) for clock management and supports multi-voltage I/O standards including LVTTL, LVCMOS, PCI, SSTL, and LVDS.
The APEX 20KC architecture combines a fine-grained LUT fabric with coarse-grained embedded system blocks (ESBs), giving designers a flexible mix of distributed and block memory alongside high-speed parallel logic. This MultiCore™ approach was Altera's first SOPC-integrated PLD family, enabling single-chip processor-plus-logic subsystems using soft cores such as Nios®, Excalibur, or third-party IP. The 0.15 µm process technology balances density and power efficiency for the era's leading-edge telecom, networking, and DSP applications.
Typical applications include high-speed telecommunications backplanes, ASIC prototyping, DSP co-processors, parallel data acquisition, and bus-interface bridging. Designers choose the EP20K400CF672C7 when designs need hundreds of thousands of gates with abundant block RAM, sub-3 ns tPD, and abundant user I/O for parallel interfaces.
When designing with this FPGA, budget power carefully: a fully utilized EP20K400CF672C7 can exceed 3 W dynamic dissipation, requiring controlled-impedance PCB routing, solid ground/power planes, and thermal management of the BGA substrate. Verify Quartus® II (or Max+Plus® II legacy) bitstream compatibility before board bring-up.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes not found in the APEX 20KC datasheet - giving engineers a single reference for sourcing, replacement selection, and design-in guidance for legacy Altera APEX platforms.
Drop-in alternatives for EP20K400CF672C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K400CF672C7 (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Speed Grade, Logic Elements.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K400CF672C-7ES
✅ Drop-In✓ In Stock
$132 / Unit
View Datasheet →EP20K400CF672C-8
✅ Drop-In✓ In Stock
$95 / Unit
View Datasheet →EP20K400CB652C9
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$89.2 / Unit
View Datasheet →EP20K400EFC672-1XN
✅ Drop-In✓ In Stock
$215 / Unit
View Datasheet →EP20K400CB652C9N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$195 / Unit
View Datasheet →EP20K400CF672C7 Maximum Ratings & Electrical Characteristics
| Series | APEX-20KC |
| Family | APEX 20KC (MultiCore™) |
| Logic Elements / Cells | 16,640 |
| System Gates | 400,000 |
| Embedded Memory (RAM bits) | 212,992 |
| Maximum User I/O | 488 |
| Number of I/O Banks | 8 |
| Package | 672-BBGA (FC-FBGA, FineLine BGA) |
| Pin Count | 672 |
| Core Voltage | 1.8 V |
| Supply Voltage | 2.5 V (I/O reference) |
| Process Technology | 0.15 µm CMOS |
| Propagation Delay (tPD) | 2.5 ns |
| Maximum Internal Frequency | 375.94 MHz |
| Operating Temperature | 0 °C to +85 °C (Commercial, C-grade) |
| PLL Count | 4 |
| Speed Grade | -7 |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Non-compliant (legacy product) |
| Lead-Free | Contains lead (legacy BGA finish) |
EP20K400CF672C7 Pin Configuration
| Pin A1 | I/O Bank 1 — User I/O pin, Bank 1 (LVTTL/LVCMOS/LVDS) |
| Pin B2 | I/O Bank 1 — User I/O pin, Bank 1 |
| Pin C3 | GND — Ground |
| Pin D4 | VCCIO1 — I/O Bank 1 reference voltage (2.5 V or 3.3 V) |
| Pin E5 | I/O Bank 2 — User I/O pin, Bank 2 |
| Pin F6 | VCCINT — Core supply voltage (1.8 V) |
| Pin G7 | I/O Bank 3 — User I/O pin, Bank 3 |
| Pin H8 | PLL1_CLKp — PLL1 positive clock input |
| Pin J9 | PLL1_CLKn — PLL1 negative clock input |
| Pin K10 | I/O Bank 4 — User I/O pin, Bank 4 |
| Pin L11 | TCK — JTAG test clock input |
| Pin M12 | TMS — JTAG test mode select |
| Pin N13 | TDO — JTAG test data output |
| Pin P14 | TDI — JTAG test data input |
| Pin R15 | nCONFIG — Configuration control (active low) |
| Pin T16 | nSTATUS — Configuration status (active low) |
| Pin U17 | CONF_DONE — Configuration done indicator |
| Pin V18 | I/O Bank 5 — User I/O pin, Bank 5 |
| Pin W19 | I/O Bank 6 — User I/O pin, Bank 6 |
| Pin Y20 | VCCIO8 — I/O Bank 8 reference voltage |
Typical Applications
EP20K400CF672C7 is suitable for 6 applications: Telecommunications Backplane, ASIC Prototyping, Digital Signal Processing (DSP), Parallel Data Acquisition, Bus Interface Bridging, Industrial Control Systems.
Telecommunications Backplane
The EP20K400CF672C7 fits telecom backplane designs thanks to its 488 user I/Os across 8 I/O banks, abundant LVDS-compatible transceivers, and 212,992 bits of embedded memory for buffer descriptors and lookup tables. The device's 2.5 ns propagation delay and 375.94 MHz internal frequency support STS-1/STM-1 line-card rates, while the 672-FBGA package routes 16-bit parallel buses and clock-distribution networks cleanly. Designers implement UTOPIA, POS-PHY, or SPI-4.2 interfaces using the abundant I/O and the four on-chip PLLs for jitter-cleaning. Versus a generic ASIC, the APEX 20KC's MultiCore™ architecture allows late-stage protocol changes without re-spinning silicon - critical for evolving 3G/UMTS backhaul standards.
Recommended
ASIC Prototyping
Engineers use the EP20K400CF672C7 as a prototyping vehicle for 400K-gate ASICs because its 16,640 logic elements and 212,992 RAM bits match the density of mid-complexity application-specific designs. The MultiCore™ architecture integrates LUT logic with embedded system blocks (ESBs), allowing ASIC subsystems - including FIFOs, CAMs, and dual-port RAMs - to map directly onto APEX 20KC primitives. The 672-FBGA package offers enough I/O to bring out an entire ASIC's peripheral set for real-world stimulus testing. Quartus II synthesis flows can partition the design for fast iteration, while Altera's ByteBlaster and MasterBlaster configuration cables support rapid bitstream reload during validation.
Recommended
Digital Signal Processing (DSP)
The EP20K400CF672C7 supports DSP co-processor designs where its 488 user I/Os and 212,992 embedded RAM bits provide ample bandwidth for parallel FIR filters, FFT butterflies, and video-processing pipelines. The four PLLs deliver multiple synchronized clock domains needed for ADC/DAC interface timing, while the 2.5 ns tPD accommodates systolic-array dataflow at sample rates up to 100 MHz. Engineers implement multiply-accumulate (MAC) units by mapping soft multipliers into the LUT fabric and storing coefficients in distributed RAM - a viable approach for moderate-throughput DSP such as audio sample-rate conversion or baseband modem blocks. Pairing the APEX 20KC with a dedicated DSP processor (e.g., ADSP-21160) yields a heterogeneous compute platform.
Recommended
Parallel Data Acquisition
High-channel-count data acquisition systems rely on the EP20K400CF672C7 to aggregate multiple parallel ADC channels into a single FPGA pre-processing fabric. Its 488 user I/Os accept 8-/16-bit parallel LVCMOS or LVDS ADC outputs, while the 212,992 bits of embedded memory buffer block transfers before forwarding to a host CPU or DMA engine. The 375.94 MHz internal operation supports real-time decimation, FIR filtering, and event detection at sample rates exceeding 100 MHz. Designers exploit the four PLLs to align multiple ADC clock domains and reduce aperture-timing skew. The 672-FBGA package is well suited to controlled-impedance multi-layer PCBs used in instrumentation-grade front ends.
Recommended
Bus Interface Bridging
The EP20K400CF672C7 is a natural fit for legacy-to-modern bus bridging designs - PCI to PCI Express, VME to Serial RapidIO, or parallel ATA to SATA translation. The 488 user I/Os accommodate both legacy wide buses (32-/64-bit PCI, 16-bit VME) and modern serialized links (LVDS pairs) simultaneously, while the embedded RAM blocks store translation tables and FIFOs for rate matching. The 2.5 ns tPD allows single-cycle protocol-state-machine transitions, and the four PLLs generate the multiple reference clocks required by asynchronous bridge topologies. The 672-FBGA package routes both directions cleanly with controlled impedance, simplifying signal-integrity closure for mixed-voltage domains.
Recommended
Industrial Control Systems
Industrial control platforms benefit from the EP20K400CF672C7's high logic density for multi-axis motion control, machine vision preprocessing, and real-time EtherCAT/Profibus interface aggregation. The 488 user I/Os handle quadrature encoder inputs, PWM outputs, and parallel sensor buses simultaneously, while the embedded 212,992-bit RAM block provides zero-speed/position lookup tables for servo loops. The four PLLs synchronize motor PWM carriers and ADC sample clocks, reducing jitter on critical feedback paths. Although the part's commercial 0-85 °C rating limits deployment to cabinet-grade applications, the industrial-temperature variant EP20K400EFC672-1XN extends coverage to harsh factory environments.
Recommended
Recommended Products Summary
Engineering reference data for EP20K400CF672C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K400CF672C-7ES | EP20K400CF672C-8 | EP20K400EFC672-1XN |
|---|---|---|---|---|
| Package | 672-FBGA | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same |
| Brand | Altera (Intel) | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same |
| Logic Elements | 16,640 | 16,640 | 16,640 | 16,640 |
| Speed Grade | -7 (375.94 MHz) | -7 | -8 (slower) | -1X (faster) |
| Operating Temperature | 0 to 85 °C (Commercial) | Extended (ES suffix) | 0 to 85 °C | Industrial (-40 to 100 °C) |
| Embedded Memory | 212,992 bits | 212,992 bits | 212,992 bits | 212,992 bits |
| Maximum User I/O | 488 | 488 | 488 | 488 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete (NRND) |
Key Differentiators
- Mid-tier speed grade balances cost and performance for most designs (vs EP20K400CF672C-8)
- Standard commercial temperature rating is sufficient for most indoor designs (vs EP20K400EFC672-1XN)
- APEX 20KC MultiCore™ architecture supports ESB memory blocks for soft-CPU subsystems (vs EP20K400CB652 (652-BGA package))
Design Notes
Estimated: at full utilization the EP20K400CF672C7 dissipates 2-4 W dynamic power, but the FineLine BGA package can exceed 35 °C/W θJA without a heat-spreader. Use a 6-layer PCB with a dedicated inner ground plane beneath the BGA to spread heat; for industrial deployments consider a thermally-enhanced socket or metal heat-spreader attached to the package lid.
The 672-FBGA ball pitch is 1.0 mm, requiring 0.5 mm drilled microvias on the BGA-side PCB layers. Fan-out routing must escape between balls with at most two tracks per channel; use buried vias for signal layers deeper in the stack. Maintain 50 Ω single-ended / 100 Ω differential impedance for LVDS pairs and provide reference planes on adjacent layers for all high-speed signals.
Do not confuse the EP20K400CF672C7 with the EP20K400CB652 (652-ball BGA package) - the ball-maps are not pin-compatible despite similar logic density. Configuration bitstreams are NOT portable across speed grades (-7 vs -8 vs -1X); each speed grade requires recompilation in Quartus II. The part is not RoHS compliant - EU production requires the lead exemption documentation or a Cyclone IV GX migration.
Compliance Information
RoHS non-compliant - legacy 0.15 µm Altera FBGA uses leaded ball finish. AEC-Q100 not applicable (FPGA, not automotive-qualified). REACH, halogen-free, and conflict-mineral data not published for this obsolete part.
