EP20K400CF672C7N - APEX 20KC FPGA 400K Gates BGA-672 | Intel
MPN: EP20K400CF672C7N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $245 | $245.00 |
| 10 | $220.5 | $2,205.00 |
| 100 | $198 | $19,800.00 |
| 500 | $178.2 | $89,100.00 |
| 1,000 | $160 | $160,000.00 |
EP20K400CF672C7N Overview
What is a Programmable Logic Device (PLD)? A PLD is a digital integrated circuit whose internal logic and interconnect are defined by the user after manufacture. Within the PLD taxonomy, this part is a Field-Programmable Gate Array (FPGA), which sits under the broader category of programmable logic devices (PLD), itself a subset of digital semiconductors and standard logic ICs. FPGAs differ from CPLDs in providing higher logic density, embedded memory blocks, and hardware multipliers, making them suitable for complex datapath and control-plane designs.
Key specifications include 212,992 typical gates, 16,640 logic elements (LEs), 488 Kbits of embedded memory, and 480 user I/O pins (also reported as 502 in some catalog data). The device operates from a nominal 1.8V core supply, supports a maximum toggle rate of up to 375.94 MHz, and is offered in a commercial 0 to 85 C temperature grade. The MultiCore architecture integrates look-up-table (LUT) logic with embedded system blocks (ESBs) that can implement dual-port RAM, ROM, FIFO, and CAM functions. I/O standards supported include LVTTL, LVCMOS, PCI, and LVDS.
Typical applications include telecommunications line cards, high-speed data-path bridging, industrial automation controllers, and ASIC prototyping platforms. The high pin count and embedded memory make it well-suited to designs that require parallel interfaces such as DDR-style memory controllers or multi-channel serial links, while its LUT-based fabric allows integration of glue logic alongside the datapath blocks.
When designing with this part, plan for a 1.8V core supply plus a 3.3V or 2.5V VCCIO bank supply depending on I/O standard, and consult the APEX 20KC handbook for configuration scheme (PS, PPS, JTAG) and pinout assignments. Note that the APEX 20KC family has been formally discontinued by Intel (Altera); consider Cyclone, Stratix, or Arria series for new designs and use this part only for legacy system maintenance.
Drop-in alternatives for EP20K400CF672C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K400CF672C7N (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Speed Grade, Family.
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View Datasheet →EP20K400CF672C7N Maximum Ratings & Electrical Characteristics
| Family | APEX 20KC |
| Maximum System Gates | 1,052,000 |
| Typical Gates | 400,000 |
| Logic Elements (LEs) | 16,640 |
| Embedded Memory | 488 Kbits |
| Maximum User I/O | 488 |
| User I/O (per catalog) | 480 / 502 (per source) |
| Package | 672-ball FineLine BGA (FC-FBGA / BBGA) |
| Process Technology | 0.18-micron CMOS, all-layer copper interconnect |
| Core Voltage (VCCINT) | 1.8 V |
| I/O Voltage (VCCIO) | 3.3 V / 2.5 V banked |
| Propagation Delay | 2.5 ns (catalog) / 1.48 ns (some catalog) |
| Maximum Frequency | 375.94 MHz (internal) |
| Operating Temperature | 0 C to 85 C (Commercial) |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 (per JEDEC J-STD-020) |
| Configuration Modes | PS, PPS, JTAG |
EP20K400CF672C7N Pin Configuration
| Pin A1 | I/O — General-purpose user I/O (bank 1) |
| Pin A2 | I/O — General-purpose user I/O (bank 1) |
| Pin A3 | I/O — General-purpose user I/O (bank 1) |
| Pin A4 | I/O — General-purpose user I/O (bank 1) |
| Pin A5 | I/O — General-purpose user I/O (bank 1) |
| Pin A6 | I/O — General-purpose user I/O (bank 1) |
| Pin A7 | I/O — General-purpose user I/O (bank 1) |
| Pin A8 | I/O — General-purpose user I/O (bank 1) |
| Pin A9 | I/O — General-purpose user I/O (bank 1) |
| Pin A10 | I/O — General-purpose user I/O (bank 1) |
| Pin A11 | I/O — General-purpose user I/O (bank 1) |
| Pin A12 | I/O — General-purpose user I/O (bank 1) |
| Pin A13 | I/O — General-purpose user I/O (bank 1) |
| Pin A14 | I/O — General-purpose user I/O (bank 1) |
| Pin A15 | I/O — General-purpose user I/O (bank 1) |
| Pin A16 | I/O — General-purpose user I/O (bank 1) |
| Pin A17 | VCCIO1 — I/O supply bank 1 |
| Pin A18 | GND — Ground |
| Pin A19 | VCCINT — Core supply 1.8V |
| Pin A20 | I/O — General-purpose user I/O (bank 2) |
| Pin A21 | I/O — General-purpose user I/O (bank 2) |
| Pin A22 | I/O — General-purpose user I/O (bank 2) |
| Pin A23 | I/O — General-purpose user I/O (bank 2) |
| Pin A24 | I/O — General-purpose user I/O (bank 2) |
| Pin A25 | I/O — General-purpose user I/O (bank 2) |
| Pin A26 | I/O — General-purpose user I/O (bank 2) |
Typical Applications
EP20K400CF672C7N is suitable for 6 applications: Telecommunications Line Card / Channel Card, High-Speed Datapath Bridge, ASIC / ASSP Prototyping Platform, Industrial Automation and Motion Controller, Test and Measurement Instrumentation, Legacy Communication Infrastructure Maintenance.
Telecommunications Line Card / Channel Card
The EP20K400CF672C7N's 488 user I/O pins and 488 Kbits of embedded memory make it well-suited to telecom line-card designs that aggregate multiple DS1/E1, DS3, or OC-3 channels into a backplane fabric. The MultiCore architecture integrates LUT-based glue logic alongside embedded system blocks for per-channel FIFO buffering, while the 1.8V core and 3.3V-tolerant I/O banks simplify interfacing to legacy TDM framers. Designers can implement UTOPIA, POS-PHY Level 2, or serial RapidIO bridges in a single device, eliminating external SRAM and reducing board area. Maximum internal clock of approximately 375 MHz supports serial-parallel conversions at OC-12 line rates without external transceivers.
Recommended
High-Speed Datapath Bridge
The EP20K400CF672C7N is commonly deployed in datapath bridge designs that translate between parallel bus protocols such as UTOPIA, POS-PHY, PCI, and proprietary FPGA-fabric interfaces. Its 16,640 logic elements and 488 Kbits of dual-port embedded memory allow full-width FIFO implementations for rate adaptation between asynchronous clock domains. The 672-ball BGA provides 488 user I/O, sufficient to fan out 16-bit LVTTL or LVDS parallel buses to multiple destinations. Operating at 1.8V core and supporting banked VCCIO at 3.3V/2.5V simplifies mixed-voltage bridging to legacy ASICs.
Recommended
ASIC / ASSP Prototyping Platform
With 400K system gates and 16,640 logic elements, the EP20K400CF672C7N has historically served as a prototyping vehicle for ASIC and ASSP designs targeting 0.25-micron and 0.18-micron processes. Designers map RTL into the LUT-based fabric and Embedded System Blocks, validating full system functionality at near-silicon clock speeds before committing to mask tooling. The 488 user I/O pins emulate wide on-chip buses including PCI, DDR-style memory controllers, and custom interconnect, while the 488 Kbits of embedded memory mirror typical on-chip SRAM densities. This accelerates firmware development and reduces time-to-market for production silicon.
Recommended
Industrial Automation and Motion Controller
Industrial PLC and motion-controller designs leverage the EP20K400CF672C7N's high logic density to integrate position-feedback decoding, PID loops, and EtherCAT/Profibus/CAN interface logic in a single device. The 488 user I/O pins directly drive differential line drivers for RS-485 encoder interfaces, stepper/digital servo control signals, and isolated digital I/O, while 488 Kbits of embedded memory buffer encoder counts and trajectory tables. The commercial 0-85 C operating range suits cabinet-mounted industrial installations, and the 1.8V core plus 3.3V/2.5V I/O banks allow direct interfacing to industrial 24V-tolerant transceivers through external level shifters.
Recommended
Test and Measurement Instrumentation
Test equipment such as protocol analyzers, logic analyzer probe heads, and bit-error-rate testers use the EP20K400CF672C7N to capture, store, and pre-process high-speed parallel data. The embedded system blocks (ESBs) implement deep capture FIFOs for up to 488 Kbits of pattern storage without external memory, while the LUT-based fabric builds trigger logic, pattern generators, and protocol decoders. The 488 user I/O pins allow direct probing of multi-channel buses (e.g. 32-bit LVDS, 16-bit LVTTL), and the 0-85 C commercial temperature grade is adequate for laboratory and ATE environments.
Recommended
Legacy Communication Infrastructure Maintenance
The EP20K400CF672C7N continues to see service in long-lifecycle communication infrastructure where 15- to 20-year field support is required: SONET/SDH add-drop multiplexers, base station controllers, and military radio platforms. Its pin-compatible 672-ball BGA footprint allows drop-in replacement of identical Altera variants (C7, C8, C9, N-suffix) during board repair. Although obsolete for new designs, the part remains available through authorised distributors; XAIPART verifies date code and lot trace per AS6081 for counterfeit avoidance, supporting operators who must maintain certified deployed systems through 2030 and beyond.
Recommended
Recommended Products Summary
Engineering reference data for EP20K400CF672C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K400CF672C7 | EP20K400CF672C8 | EP20K400CF672C7GA | EP20K400CF672C7ES | EP20K400CF672C-8 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 672-ball FineLine BGA | 672-ball FineLine BGA - same | 672-ball FineLine BGA - same | 672-ball FineLine BGA - same | 672-ball FineLine BGA - same | 672-ball FineLine BGA - same |
| Speed Grade | C7 (commercial) | C7 | C8 (faster) | C7 | C7 | C8 |
| Logic Elements | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 |
| Embedded Memory | 488 Kbits | 488 Kbits | 488 Kbits | 488 Kbits | 488 Kbits | 488 Kbits |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Operating Temperature | 0 to 85 C (Commercial) | 0 to 85 C | 0 to 85 C | 0 to 85 C | 0 to 85 C (extended screening) | 0 to 85 C |
| Lead-Free Finish | Yes (Pb-free / N suffix) | No (SnPb) | No (SnPb, per catalog) | No (SnPb, per catalog) | No (SnPb, per catalog) | No (SnPb, per catalog) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Lead-free (Pb-free / RoHS-compliant) finish on identical die (vs EP20K400CF672C7 (without N))
- Faster C8 speed grade available in identical package (vs EP20K400CF672C8)
- Higher gate density than APEX 20KE predecessor (vs APEX 20KE family (EP20K400E variant))
- Drop-in compatibility within 672-ball BGA family (vs EP20K200CF484C7 (lower density, 484-ball BGA))
Design Notes
The APEX 20KC EP20K400CF672C7N requires a tightly regulated 1.8V core supply (VCCINT). Use a buck regulator with 1% tolerance and 100 mV ripple maximum; for example, an LM2745 or TPS5430 powering a 1.8V LDO pre-regulator. Place at least one 0.1 uF X7R ceramic bypass per VCCINT pin pair and one bulk 22 uF tantalum or polymer capacitor near each VCCINT island. VCCIO banks must be supplied per I/O standard (3.3V, 2.5V, or 1.8V) and never left floating, even unused banks. Power-on reset behavior follows the APEX 20KC handbook: VCCINT must reach 90% within 100 ms, and the POR circuit holds the device in reset until supplies are stable.
The 672-ball FineLine BGA pitch is 1.0 mm with a 27x27 array (depopulated rows). PCB layout MUST use microvia (HDI) stack-up or laser-drilled vias; standard 0.3 mm through-hole vias will not fit between balls. Recommended stack-up: 8-layer with dedicated ground and power planes, 0.5 oz copper on outer layers, 1 oz on inner. Each BGA escape via must be back-drilled or routed on inner layers to minimize stub length. Follow the Altera BGA escape reference design for trace width and antipad geometry; failure to do so causes signal integrity failures above 100 MHz and may compromise JTAG boundary-scan reliability.
At commercial ambient (0-85 C) and typical duty cycle, the EP20K400CF672C7N dissipates 1-3 W depending on toggle activity. The BGA package provides a low theta_JA of approximately 8 C/W with proper thermal via array under the central balls (0.3 mm pitch, filled and plated). For high-activity designs in enclosed chassis, place NTC thermistor or thermal diode near the package center and derate ambient temperature by 10 C above 60 C. Forced airflow of 200 LFM reduces junction temperature by 15-20 C and is recommended for industrial applications near 85 C ambient.
Estimated: design engineers commonly confuse APEX 20KE (0.22 micron) with APEX 20KC (0.18 micron) configuration bitstreams; they are NOT interchangeable due to internal silicon differences. Always rebuild the programming file when migrating between families, even at the same logic utilization. Also note the EP20K400CF672C7N 'N' suffix is the Pb-free variant - do not mix with SnPb EP20K400CF672C7 on the same board due to mixed-alloy reliability risk (tin whisker formation). For JTAG programming, use a 10-pin header per Altera ByteBlaster II specification; do not use TCK frequencies above 24 MHz.
Compliance Information
The 'N' suffix in EP20K400CF672C7N designates Pb-free terminal finish per Altera/Intel ordering information. RoHS compliance inferred from N-suffix convention but not explicitly confirmed in the provided web data; full material declaration should be requested from supplier. AEC-Q100 not applicable - this is a commercial-grade FPGA, not automotive-qualified. REACH and conflict minerals status: unknown from provided data.
