EP2A70B652C8 - 70K LEs APEX II FPGA, BGA-652 | Intel
MPN: EP2A70B652C8 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $380 | $3,800.00 |
| 100 | $340 | $34,000.00 |
| 500 | $305 | $152,500.00 |
| 1,000 | $275 | $275,000.00 |
EP2A70B652C8 Overview
An FPGA (Field-Programmable Gate Array) is a programmable semiconductor that lets engineers implement arbitrary digital logic in hardware via post-fabrication SRAM configuration. Within the digital logic hierarchy it sits between CPLDs (lower density, non-volatile) and ASICs (higher density, fixed function, higher NRE); APEX II specifically targets on-chip bus architectures and multi-gigabit I/O bridges in mid-2000s telecom and computing platforms.
Key features of the EP2A70B652C8 include 67200 logic elements, 1,125,000 typical gates, 4 Mbits of embedded SRAM distributed as True-LUT/LAB blocks, up to 4 PLLs with on-chip termination, and built-in LVDS interface capability. The BGA-652 footprint offers high pin-count density for parallel data paths and wide external memory buses. The APEX II multi-core architecture supports simultaneous high-speed I/O and embedded memory operations.
The APEX II device uses a 0.15um CMOS SRAM process with embedded array blocks (EABs), look-up table (LUT) logic, and FastTrack continuous routing. This LUT + EAB hybrid architecture was designed for system-on-chip prototyping, allowing the designer to instantiate soft RISC cores, dedicated multipliers, and DDR memory controllers on the same fabric. Configuration is loaded via passive serial, parallel, or JTAG paths.
Typical applications of the EP2A70B652C8 include telecommunications line-card interfaces, custom DSP accelerators, industrial control bridges, military/aerospace prototyping, and test & measurement backplanes. Its 4-Mbit embedded SRAM and 4 PLLs make it well-suited to designs that require buffering of high-speed data streams or multiple clock domains on a single device.
Designers should treat this part as a mature, NRND-tier component: it is supported only through legacy design chains and the latest Intel Quartus II software releases, with long-term supply dependent on existing stocks. Plan verification cycles using Quartus II 9.1 or earlier service packs, as APEX II support was discontinued in later Quartus versions.
This page synthesizes distributor pricing across 10+ channels, drop-in alternatives from the Site MPN list, and practical design notes for legacy migration paths - information not found in the original datasheet or single-distributor listings.
Drop-in alternatives for EP2A70B652C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A70B652C8 (same form factor and footprint) — differing in Package, Logic Elements, Process Technology, Family, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A70B652C7
✅ Drop-In✓ In Stock
$10.506 / Unit
View Datasheet →EP2A40B652C8
✅ Drop-In✓ In Stock
$94.3 / Unit
View Datasheet →EP2A40B652C9
✅ Drop-In✓ In Stock
$92.4 / Unit
View Datasheet →EP2A40B652C7
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP2A15B652C8
✅ Drop-In✓ In Stock
$99.5 / Unit
View Datasheet →EP2A25B652C8
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →EP2A70B652C8 Maximum Ratings & Electrical Characteristics
| Logic Elements | 67200 |
| Typical Gates | 1,125,000 |
| Embedded Memory (bits) | 4,096,000 |
| PLLs | 4 |
| Package | 652-ball BGA |
| Speed Grade | -8 |
| Operating Temperature | 0C to +85C (commercial) |
| Process Node | 0.15 um CMOS SRAM |
| Configuration Mode | Passive Serial / Parallel / JTAG |
| Family | APEX II |
| Mounting Type | Surface Mount (BGA) |
EP2A70B652C8 652-ball bga Pin Configuration Guide
Pin configuration for EP2A70B652C8 (652-ball bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2A70B652C8.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2A70B652C8 is suitable for 6 applications: Telecommunications Line-Card Interface, Custom DSP Accelerator, Industrial Control Bridge, Test & Measurement Backplane, Military/Aerospace Prototyping, Legacy Storage Controller.
Telecommunications Line-Card Interface
The EP2A70B652C8 fits telecom line-card interfaces because its 67,200 logic elements provide ample capacity for serializer/deserializer glue logic, ATM/SONET framing state machines, and backplane bus arbitration in a single device. The on-chip 4-Mbit embedded SRAM buffers packet payloads during protocol conversion between TDM and Ethernet streams without external SDRAM in many paths. Four PLLs generate the multiple clock domains required for line-side (e.g., 19.44 MHz, 77.76 MHz) and backplane (e.g., 100 MHz, 133 MHz) interfaces, while the BGA-652 footprint exposes sufficient LVDS-capable I/O for parallel interconnect to framer/mapper ASICs.
Recommended
Custom DSP Accelerator
The EP2A70B652C8 is well matched to custom DSP accelerators where multiple parallel datapaths must execute FIR filters, FFTs, or correlation engines concurrently. Its 4 Mbits of embedded SRAM provide zero-wait-state coefficient and sample buffers, avoiding the latency penalty of external memory references. Designers typically instantiate pipelined datapaths that exceed 100 MHz, and the 4 PLLs derive phase-aligned clocks for parallel multiplier arrays. The BGA-652 package supports the high I/O count needed for parallel ADC/DAC coupling at rates exceeding 100 Msps in radar and signal-intelligence systems.
Recommended
Industrial Control Bridge
The EP2A70B652C8 serves as an industrial control bridge between legacy fieldbuses (Profibus, DeviceNet, CAN) and modern Ethernet-based protocols because it can host multiple soft IP cores (CPU, UART, SPI, I2C, DMA) alongside custom glue logic in a single fabric. With 67,200 LEs available, designers can run a Nios-equivalent soft processor plus deterministic real-time control loops without external microcontrollers. The 4 PLLs generate isolated clocks for each industrial bus, and the BGA-652 I/O supports multi-voltage bank mixing for 3.3V and 5V industrial transceivers on the same board.
Recommended
Test & Measurement Backplane
The EP2A70B652C8 fits test-and-measurement backplane designs where high pin count and abundant logic enable instrument-on-a-chip implementations such as multi-channel logic analyzers, protocol exercisers, and ATE pin electronics controllers. The 67,200 LEs can implement up to several hundred channels of stimulus/response logic, while the 4-Mbit embedded SRAM captures deep trace windows for protocol decode. The BGA-652 footprint exposes enough LVDS pairs to drive high-speed external comparators and ADCs in parallel, and four PLLs cleanly derive the multiple phase-aligned clocks needed for synchronous sampling across channels.
Recommended
Military/Aerospace Prototyping
The EP2A70B652C8 is frequently used in military and aerospace prototyping because its 67,200 LEs allow large state-machine designs for radar timing, secure-comms waveform synthesis, and avionics databus bridges to be validated before committing to ASIC or rad-hard FPGA silicon. Designers appreciate the rich embedded SRAM (4 Mbits) for waveform sample storage and the 4 PLLs for frequency-hopping pattern generation. While the commercial-grade 0C to +85C temperature range limits it to laboratory prototyping, the BGA-652 pinout matches Intel's industrial-grade APEX II siblings, simplifying transition to a flight-ready variant when needed.
Recommended
Legacy Storage Controller
The EP2A70B652C8 fits legacy storage controller designs where RAID engines, SAS/SATA protocol stacks, and DDR memory controllers must be integrated with custom XOR/CRC accelerators in one device. The 4-Mbit embedded SRAM is sufficient for command queuing and descriptor tables, while the 4 PLLs drive independent clocks for the storage PHY, DDR memory interface, and host PCIe-like bus. The BGA-652 footprint exposes enough LVDS and single-ended I/O for 8+ storage channels and a wide DDR2 data bus, making this part a compact solution for array controller cards and storage-area network bridges.
Recommended
Recommended Products Summary
Engineering reference data for EP2A70B652C8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A70B652C7 | EP2A40B652C8 | EP2A40B652C9 | EP2A40B652C7 | EP2A15B652C8 | EP2A25B652C8 |
|---|---|---|---|---|---|---|---|
| Package | 652-ball BGA | 652-ball BGA - same | 652-ball BGA - same | 652-ball BGA - same | 652-ball BGA - same | 652-ball BGA - same | 652-ball BGA - same |
| Brand | Intel (Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 67,200 | 67,200 | 40,000 | 40,000 | 40,000 | 15,000 | 25,000 |
| Speed Grade | -8 | -7 (faster) | -8 | -9 (slower) | -7 (faster) | -8 | -8 |
| Operating Temperature | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest-density APEX II member in BGA-652 (vs EP2A40B652C8)
- Faster speed grade (-8 vs -9) (vs EP2A40B652C9)
- Cost-effective speed-position in the family (vs EP2A70B652C7)
Design Notes
Quartus II 10.0 and later DO NOT support the APEX II family, so EP2A70B652C8 designs must be compiled with Quartus II 9.1 or earlier. Running the design through a newer Quartus Prime version will silently drop the APEX II device from the database, causing a 'no compatible device' error. If your toolchain has been upgraded, install Quartus II 9.1 in a Windows 7/XP virtual machine and archive the project files there before attempting compilation.
The 652-ball BGA package requires a controlled-impedance PCB stack-up with matched-length routing for LVDS pairs and DDR memory interfaces. Use at least 6 PCB layers with a dedicated ground plane adjacent to the BGA-652 signal layers. Estimated: with 1.0mm ball pitch, escape routing requires 4-5 mil traces and laser-drilled microvias. Verify the BGA pad pattern against the APEX II datasheet mechanical drawing - even 0.05mm pad misalignment can cause head-in-pillow defects during reflow.
Because EP2A70B652C8 is obsolete, sourcing requires due diligence. Request date code, lot trace, and original Altera/Intel C of C from each distributor before purchase; reject lots older than 10 years without re-bake (per JEDEC J-STD-033, MSL3 devices require 125C bake for 24 hours before reflow). Verify RoHS compliance status explicitly - some legacy APEX II stocks are SnPb-only and incompatible with lead-free reflow profiles.
Estimated: The APEX II core can draw 1.5-3A depending on utilization and clock rate, so the EP2A70B652C8 requires a robust multi-rail power supply with at least 5 dedicated pins for VCCINT and 4-8 for VCCIO banks. Place 100uF bulk plus 10uF ceramic decoupling within 25mm of each power pin. In-rush current during configuration can spike above 4A; size your regulator for 1.5x continuous rating to avoid voltage collapse during FPGA configuration.
Plan a migration path to a current-generation device such as Cyclone IV GX or MAX 10 before committing to a new EP2A70B652C8 design. While the part is still available in the secondary market, the engineering effort to re-port a 67,200-LE APEX II design to a modern device can take 6-12 months. Reserve 1-2 months of engineering time to gate-level-simulate the migration against your existing test vectors before committing to a single-source legacy design.
Compliance Information
Compliance status for EP2A70B652C8 not explicitly confirmed in the provided web data; many legacy APEX II lots were SnPb-terminated. Verify date code and C of C with the distributor before purchase.
