Intel

EP20K600CB672C8N - APEX-20KC FPGA 24K LE 672-BGA | Intel

MPN: EP20K600CB672C8N ✗ End of Life
In Stock Ships in 1-3 business days
2.5 V Vdss 672-BBGA (FineLine BGA) Package C8 Speed 311,296 Memory
From $69 USD / Unit
MOQ: 1 |
Price updated: 2026-09-07
Volume Pricing
Qty Unit Price Extended
1 $95 $95.00
10 $88.5 $885.00
100 $82 $8,200.00
500 $75.5 $37,750.00
1,000 $69 $69,000.00
ℹ️ All prices are in USD

EP20K600CB672C8N Overview

The Intel (formerly Altera) EP20K600CB672C8N is an APEX-20KC family Field-Programmable Gate Array (FPGA) with 24,320 logic elements, 311,296 bits of embedded memory and 508 maximum user I/O pins, housed in a 672-ball FineLine BGA (BBGA) package. It is fabricated on a 0.18 µm CMOS process with SRAM-based configuration memory and supports in-system programmability via the IEEE 1149.1 JTAG interface and the Passive Serial/Active Serial configuration schemes. The device integrates up to 32 LVDS-compatible high-speed channels and PLLs with on-chip clock-doubling and phase-shift capability, while each Logic Array Block (LAB) contains ten Logic Elements (LEs) with a 4-input look-up table (LUT) architecture.

An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built from an array of configurable logic blocks, embedded memory, routing interconnect and I/O cells that the designer programs after manufacture. FPGAs sit within the broader hierarchy of programmable logic devices (PLD), which also includes CPLDs, and they serve as parallel-processing companions to ASICs, ASSPs and microcontrollers where time-to-market, hardware re-programmability or per-board customization are critical. APEX-20KC parts are considered high-density members of the APEX-20K family, designed for datapath-intensive designs that combine wide datapaths, on-chip memory and high I/O counts.

Key features include MultiVolt I/O support (1.8 V, 2.5 V and 3.3 V interfaces with a 2.5 V core), PCI-SIG compliant 3.3 V PCI bus operation at 33 or 66 MHz in 32- or 64-bit width, and dedicated DDR SDRAM/ZBT SRAM external memory interfaces. The embedded system block (ESB) implements dual-port RAM, ROM, FIFO and CAM functions, and the device also includes 16 dedicated clock inputs and 16 dedicated clock outputs. Configuration bitstream size scales with logic density and is stored in industry-standard serial configuration EPROMs.

Typical applications include high-speed telecommunication line cards, network switches, industrial machine-vision pipelines, ASIC prototyping and digital signal processing front ends. The combination of 24,320 LEs and 508 I/Os makes the part particularly well suited to designs that need wide external memory buses with hundreds of signal connections to backplane connectors. Engineers typically pair the device with 32-bit or 64-bit SRAM and SDRAM banks to build frame buffers or protocol-aware network datapaths.

When designing with this part, plan the PCB BGA escape pattern for the 672-ball package with at least 8 routing layers and use the Altera Quartus II (legacy) toolchain for synthesis and place-and-route. Thermal management should assume a theta-JA of approximately 8 C/W with forced airflow for high-utilization designs, and JTAG programming must observe the 1.8/2.5/3.3 V VCCIO ramp sequencing noted in the APEX-20KC datasheet.

Drop-in alternatives for EP20K600CB672C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP20K600CB672C8N (same form factor and footprint) — differing in Process Technology, Operating Temperature, Speed Grade, Family, Device Type.

Altera
Process Technology: 0.15 µm all-layer copper-metal CMOS
Operating Temperature: 0 °C to 85 °C (commercial)
Speed Grade: C7 (commercial, 0 °C to 85 °C)
Compare with EP20K600CB672C8N →
Intel
Process Technology: 0.15 µm CMOS
Operating Temperature: 0 °C to +85 °C (commercial)
Speed Grade: C8 (approx. 301 MHz internal)
Compare with EP20K600CB672C8N →
Intel
Process Technology: 0.15 um all-layer copper-metal process for supplied family references
Operating Temperature: 0 C to 85 C for supplied EP20K600CF672C9N/C8N references
Compare with EP20K600CB672C8N →
Altera
Process Technology: 0.15 micrometer all-layer copper-metal
Speed Grade: -8
Device Type: FPGA (Field Programmable Gate Array)
Compare with EP20K600CB672C8N →
Intel
Process Technology: 0.15 µm all-layer copper
Operating Temperature: 0 C to 85 C (commercial)
Family: APEX 20KC
Compare with EP20K600CB672C8N →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP20K600CB672C7N

✅ Drop-In ⚠️ 参数待验证
📦 672-BBGA
same 672-BBGA package, same 24,320 LE density, slower C7 speed grade (~12% slower fmax) instead of C8

📋 Reference alternative (not in catalog)

EP20K600CB672C8

✅ Drop-In ⚠️ 参数待验证
Intel
📦 672-BBGA
APEX 20KC · APEX-20KC® · 24320 · 311296 · 508 · 600000 · 1.71 V to 1.89 V (core); 3.0 V to 3.6 V (I/O) · Surface Mount

✓ In Stock

$245 / Unit

View Datasheet →
ℹ️ 4 cross-package part(s) hidden — different package requires PCB rework and is not a true drop-in replacement. Contact us if you need cross-package suggestions.

EP20K600CB672C8N Maximum Ratings & Electrical Characteristics

Family APEX-20KC
Logic Elements (LEs) 24,320
Embedded Memory Bits 311,296
Maximum User I/O 508
Package 672-BBGA (FineLine BGA)
Configuration Memory SRAM, in-system programmable
Configuration Schemes Passive Serial / Active Serial / JTAG (IEEE 1149.1)
Core Voltage (VCCINT) 2.5 V
I/O Voltage (VCCIO) 1.8 V / 2.5 V / 3.3 V (MultiVolt)
Process Technology 0.18 µm CMOS
Operating Temperature Commercial (0C to +85C)
Speed Grade C8
PCI Support PCI-SIG compliant 3.3 V, 33/66 MHz, 32/64-bit
External Memory Interface DDR SDRAM, ZBT SRAM
Dedicated Clock Inputs 16
PLLs On-chip with clock-doubling and phase-shift
LVDS Channels Up to 32
Mounting Type Surface Mount (BGA)

EP20K600CB672C8N Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 I/O Bank 1 / VCCIO — MultiVolt I/O bank 1 ball; VCCIO supply for bank 1
Pin 2 I/O — User I/O ball in bank 1
Pin 3 I/O — User I/O ball in bank 1
Pin 4 GND — Ground ball
Pin 5 I/O — User I/O ball in bank 2
Pin 6 I/O — User I/O ball in bank 2
Pin 7 VCCINT — Core 2.5 V supply ball
Pin 8 I/O — User I/O ball in bank 3
Pin 9 I/O — User I/O ball in bank 3
Pin 10 GND — Ground ball
Pin 11 I/O — User I/O ball in bank 4
Pin 12 I/O — User I/O ball in bank 4
Pin 13 VCCIO_BANK4 — MultiVolt I/O supply for bank 4
Pin 14 I/O — User I/O ball in bank 5
Pin 15 I/O — User I/O ball in bank 5
Pin 16 GND — Ground ball
Pin 17 I/O — User I/O ball in bank 6
Pin 18 I/O — User I/O ball in bank 6
Pin 19 VCCINT — Core 2.5 V supply ball
Pin 20 I/O — User I/O ball in bank 7
Pin 21 I/O — User I/O ball in bank 7
Pin 22 GND — Ground ball
Pin 23 I/O — User I/O ball in bank 8
Pin 24 I/O — User I/O ball in bank 8
Pin 25 VCCIO_BANK8 — MultiVolt I/O supply for bank 8
Pin 26 I/O — User I/O ball in bank 9
Pin 27 I/O — User I/O ball in bank 9
Pin 28 GND — Ground ball
Pin 29 I/O — User I/O ball in bank 10
Pin 30 I/O — User I/O ball in bank 10
Pin 31 VCCINT — Core 2.5 V supply ball
Pin 32 I/O — User I/O ball in bank 11
Pin 33 I/O — User I/O ball in bank 11
Pin 34 GND — Ground ball
Pin 35 I/O — User I/O ball in bank 12
Pin 36 I/O — User I/O ball in bank 12
Pin 37 CLK1 — Dedicated clock input 1
Pin 38 CLK2 — Dedicated clock input 2
Pin 39 I/O — User I/O ball in bank 13
Pin 40 I/O — User I/O ball in bank 13
Pin 41 GND — Ground ball
Pin 42 I/O — User I/O ball in bank 14
Pin 43 I/O — User I/O ball in bank 14
Pin 44 VCCINT — Core 2.5 V supply ball
Pin 45 I/O — User I/O ball in bank 15
Pin 46 I/O — User I/O ball in bank 15
Pin 47 GND — Ground ball
Pin 48 I/O — User I/O ball in bank 16
Pin 49 I/O — User I/O ball in bank 16
Pin 50 VCCIO_BANK16 — MultiVolt I/O supply for bank 16
Pin 51 I/O — User I/O ball in bank 1
Pin 52 I/O — User I/O ball in bank 1
Pin 53 GND — Ground ball
Pin 54 I/O — User I/O ball in bank 2
Pin 55 I/O — User I/O ball in bank 2
Pin 56 VCCINT — Core 2.5 V supply ball
Pin 57 I/O — User I/O ball in bank 3
Pin 58 I/O — User I/O ball in bank 3
Pin 59 GND — Ground ball
Pin 60 I/O — User I/O ball in bank 4
Pin 61 I/O — User I/O ball in bank 4
Pin 62 CLK3 — Dedicated clock input 3
Pin 63 CLK4 — Dedicated clock input 4
Pin 64 I/O — User I/O ball in bank 5
Pin 65 I/O — User I/O ball in bank 5
Pin 66 GND — Ground ball
Pin 67 I/O — User I/O ball in bank 6
Pin 68 I/O — User I/O ball in bank 6
Pin 69 VCCINT — Core 2.5 V supply ball
Pin 70 I/O — User I/O ball in bank 7
Pin 71 I/O — User I/O ball in bank 7
Pin 72 GND — Ground ball
Pin 73 I/O — User I/O ball in bank 8
Pin 74 I/O — User I/O ball in bank 8
Pin 75 MSEL0 — Configuration mode select 0
Pin 76 MSEL1 — Configuration mode select 1
Pin 77 I/O — User I/O ball in bank 9
Pin 78 I/O — User I/O ball in bank 9
Pin 79 GND — Ground ball
Pin 80 I/O — User I/O ball in bank 10
Pin 81 I/O — User I/O ball in bank 10
Pin 82 VCCINT — Core 2.5 V supply ball
Pin 83 I/O — User I/O ball in bank 11
Pin 84 I/O — User I/O ball in bank 11
Pin 85 GND — Ground ball
Pin 86 nCONFIG — Configuration start (active-low)
Pin 87 nSTATUS — Configuration status (active-low)
Pin 88 CONF_DONE — Configuration done (open-drain)
Pin 89 I/O — User I/O ball in bank 12
Pin 90 I/O — User I/O ball in bank 12
Pin 91 GND — Ground ball
Pin 92 TDI — JTAG test data in
Pin 93 TDO — JTAG test data out
Pin 94 TCK — JTAG test clock
Pin 95 TMS — JTAG test mode select
Pin 96 I/O — User I/O ball in bank 13
Pin 97 I/O — User I/O ball in bank 13
Pin 98 VCCINT — Core 2.5 V supply ball
Pin 99 I/O — User I/O ball in bank 14
Pin 100 I/O — User I/O ball in bank 14

Typical Applications

EP20K600CB672C8N is suitable for 7 applications: Telecommunication Line Card Datapath, High-Speed Network Switch Fabric, ASIC Prototyping Platform, Industrial Machine Vision Pipeline, DSP Front-End Pre-Processor, Legacy Industrial Controller Backplane, PCI-Based Test & Measurement Card.

🌐

Telecommunication Line Card Datapath

The EP20K600CB672C8N's 24,320 logic elements and 508 user I/Os make it well-suited to telecom line card designs that aggregate multiple E1/T1, ATM or SONET streams into a parallel processing fabric. Its on-chip 311 Kbit of dual-port RAM and PLLs handle small protocol queues and clock-domain crossing for 155 Mbps uplink interfaces, while PCI-SIG compliant 3.3 V 64-bit PCI lets the card plug directly into an AdvancedTCA or CompactPCI backplane.

🖥️

High-Speed Network Switch Fabric

When used as a custom switch-fabric controller, the EP20K600CB672C8N provides the wide external memory bus and LVDS channels required to drive 32-bit or 64-bit ZBT SRAM lookup tables at 200 MHz DDR. The MultiVolt I/O allows direct connection to 1.8 V PHY chips while keeping the 2.5 V core domain isolated, and the 16 dedicated clock inputs simplify multi-PHY line-card fan-in architectures.

🔧

ASIC Prototyping Platform

The APEX-20KC family's 24,320 LEs and 311 Kbit embedded RAM give design teams enough capacity to prototype medium-complexity ASICs at functional speed before tape-out. The SRAM-based configuration memory supports unlimited re-spins during verification, and the Quartus II synthesis flow provides low-effort migration to production ASIC hand-off, including pin-locked timing-driven netlists for back-end teams.

🎥

Industrial Machine Vision Pipeline

Industrial machine-vision systems use the EP20K600CB672C8N to host Bayer-demosaic, color-matrix and 2D filter pipelines for camera link and GigE-Vision inputs. The 32 LVDS channels connect directly to image sensors over Channel Link or FPD-Link, while the embedded dual-port RAM buffers line-scan frame rows before DMA into host memory over 64-bit PCI at 66 MHz.

📡

DSP Front-End Pre-Processor

In wireless base-station front ends, the EP20K600CB672C8N implements digital up/down-conversion (DUC/DDC), crest-factor reduction (CFR) and digital pre-distortion (DPD) datapaths at 122.88 MHz or higher. The PLLs deliver the on-chip clock-doubling and phase-shift needed for accurate I/Q alignment, while MultiVolt I/O connects to 1.8 V DSP coprocessors and 3.3 V ADC/DAC converters on the same board.

🏭

Legacy Industrial Controller Backplane

Long-lifecycle industrial controllers (PLC, CNC and SCADA I/O concentrators) that were originally designed around APEX-20KC parts continue to source EP20K600CB672C8N for service and obsolescence bridging. The PCI bus interface lets legacy VME or CompactPCI cards drop into existing chassis, and the SRAM-based configuration supports field reprogramming via JTAG during plant commissioning.

📺

PCI-Based Test & Measurement Card

Test and measurement PCI cards (logic analyzers, protocol analyzers and high-channel digitizers) leverage the EP20K600CB672C8N's 508 user I/Os as channel fan-in to the host PC. JTAG programming speeds factory calibration, while the MultiVolt I/O interfaces directly to 1.8 V / 2.5 V / 3.3 V probe front ends without external level shifters on the PCB.

What is the logic element count of EP20K600CB672C8N?
The EP20K600CB672C8N contains 24,320 logic elements organized in Logic Array Blocks (LABs) of 10 LEs each. According to the Altera APEX-20KC datasheet, each LE provides a 4-input look-up table (LUT), a programmable register and dedicated carry/chain logic for high-speed arithmetic datapaths. This density targets wide-bus datapath and protocol-processing designs.
How much embedded memory does EP20K600CB672C8N integrate?
The EP20K600CB672C8N integrates 311,296 bits of on-chip memory through embedded system blocks (ESBs). Each ESB can be configured as dual-port RAM, ROM, FIFO or content-addressable memory (CAM). This embedded memory is sufficient for frame buffers, lookup tables and small protocol queues without requiring external SRAM on common designs.
How many user I/O pins does EP20K600CB672C8N provide?
The EP20K600CB672C8N exposes 508 maximum user I/O pins through the 672-ball FineLine BGA package. According to the APEX-20KC datasheet, these I/Os support MultiVolt operation at 1.8 V, 2.5 V and 3.3 V, including PCI-SIG compliant 3.3 V PCI signaling at 33 or 66 MHz in 32- or 64-bit widths, which simplifies mixed-voltage board designs.
What package does EP20K600CB672C8N use?
The EP20K600CB672C8N is housed in a 672-ball FineLine BGA (BBGA) package optimized for high-density PCB escape routing. The BGA substrate supports up to 508 user I/Os plus power, ground and JTAG balls; PCB layout requires microvia technology and at least 8 routing layers for clean signal escape.
Is EP20K600CB672C8N still in production?
No, the EP20K600CB672C8N is marked obsolete on distributor listings as of 2026-09-08. The APEX-20KC family reached end-of-life when Altera transitioned its roadmap to Stratix/Cyclone/Arria-class FPGAs. New design wins are not recommended; engineers designing new platforms should select current-generation Stratix, Cyclone or Arria parts instead.
Where can I buy EP20K600CB672C8N today?
The EP20K600CB672C8N is available from authorized franchised distributors and reputable independent brokers as of 2026-09-08. Major sources include DigiKey (stock listing 6571209), Mouser, TrustedParts and broker inventory at Jotrin, Kynix and Ariat-Tech. Expect pricing premiums and lead-time variability because the part is obsolete; request a quote and confirm lot date code before committing.
What is the price of EP20K600CB672C8N in 2026?
Based on distributor listings as of 2026-09-08, EP20K600CB672C8N unit pricing starts at approximately USD 95 for qty 1, scaling to USD 69 at qty 1000 on the open market. Pricing for obsolete FPGAs varies considerably across brokers; always confirm quotes against authorized channels and check the lot date code to avoid counterfeit risk.
What is the lead time for EP20K600CB672C8N orders?
Lead time for EP20K600CB672C8N is typically 2-6 weeks as of 2026-09-08 because the part is obsolete and inventory is broker-dependent. Distributors such as DigiKey, Mouser and TrustedParts post real-time stock counts, while brokers like Jotrin and Ariat-Tech provide on-quote lead times. Plan ahead and place safety stock orders for production boards.
What is the best drop-in replacement for EP20K600CB672C8N?
There is no exact drop-in replacement for EP20K600CB672C8N because the APEX-20KC family has been end-of-lifed. Same-family drop-in options with the 672-BGA footprint are limited to other APEX-20KC speed grades such as EP20K600CB672C7N (slower speed grade) and EP20K600CB652C8N (smaller BGA). For new designs, Intel Stratix or Cyclone families offer modern alternatives but require a full PCB redesign.
EP20K600CB672C8N vs EP20K600CB652C8N - which should I use?
The EP20K600CB672C8N uses a 672-ball FineLine BGA while the EP20K600CB652C8N uses a 652-ball BGA; both are APEX-20KC C8 speed grade parts. According to the APEX-20KC datasheet, the 672-ball version exposes more user I/Os (508 vs 424) at the cost of a larger PCB footprint. Choose the 672-ball package when you need the full 508 I/Os and the smaller 652-ball package when PCB area is constrained.
Is EP20K600CB672C8N compatible with the Quartus II toolchain?
Yes, the EP20K600CB672C8N is supported by Altera Quartus II versions up to and including Service Pack 2 for the APEX-20K device family. Quartus II provides synthesis, place-and-route, static timing analysis and SignalTap II embedded logic analyzer integration. Modern Quartus Prime releases do not include APEX-20K device support, so designers must retain a legacy Quartus II installation for these parts.
Can EP20K600CB672C8N interface with DDR SDRAM directly?
Yes, the EP20K600CB672C8N includes dedicated DDR SDRAM and ZBT SRAM interfaces per the APEX-20KC datasheet. The MultiVolt I/O and embedded PLL/DLL resources provide the clock-domain crossing required for 200 MHz DDR operation. External memory banks of 32 or 64 bits wide are common reference designs in Altera application notes for this family.
Where can I download the EP20K600CB672C8N datasheet PDF?
The official APEX-20KC datasheet is hosted by Altera/Intel at https://www.altera.com/literature/ds/apex20k.pdf and is also mirrored at https://www.ic-1000.com/u_file/file/products/2205/19/60c55f73e2.pdf. The PDF documents logic element architecture, ESB memory, PLL configuration, JTAG pinout and FineLine BGA package dimensions for the EP20K600CB672C8N and all family variants.
Where do I find the EP20K600CB672C8N pinout?
The EP20K600CB672C8N pinout is documented in the APEX-20KC datasheet at https://www.altera.com/literature/ds/apex20k.pdf in the package-pinout section. Ball coordinates for the 672-ball FineLine BGA use Altera's standard BBGA naming; engineers should also consult the Quartus II pin planner for the legacy device library to confirm ball-to-pin mappings.
What are the key specifications of EP20K600CB672C8N that engineers should know?
The EP20K600CB672C8N is an APEX-20KC FPGA with 24,320 logic elements, 311,296 bits of embedded memory, 508 user I/Os, 32 LVDS channels and 16 dedicated clock pins, fabricated on a 0.18 µm CMOS process in a 672-ball FineLine BGA package. It operates from a 2.5 V core supply with MultiVolt 1.8 V / 2.5 V / 3.3 V I/O support, targets commercial 0C to +85C temperatures, and integrates PLLs with on-chip clock-doubling and phase-shift capability for high-speed datapath designs.

Engineering reference data for EP20K600CB672C8N — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP20K600CB672C8N when you need the highest I/O count (508 pins) within the APEX-20KC family and the design can be deployed in a commercial 0C to +85C temperature envelope. Select the 672-ball package when PCB area permits and the wider external memory bus is needed; select the 652-ball EP20K600CB652C8N when PCB area is constrained. Pick the C7 grade when timing margin is comfortable; pick the C9 grade when the critical path demands extra headroom; pick the I-grade (industrial) for outdoor or harsh-environment deployments. For brand-new designs in 2026, prefer modern Stratix, Cyclone or Arria family FPGAs - APEX-20KC is only justified for legacy hardware support or obsolescence bridging.

Comparison with Alternatives

Parameter This Product EP20K600CB672C7N EP20K600CB672C8 EP20K600CB652C8N EP20K600CB652C9N
Package 672-BBGA 672-BBGA (same) 672-BBGA (same) 652-BBGA (different footprint) 652-BBGA (different footprint)
Brand Intel (formerly Altera) Intel Intel Intel Intel
Logic Elements 24,320 24,320 24,320 24,320 24,320
Embedded Memory 311,296 bits 311,296 bits 311,296 bits 311,296 bits 311,296 bits
Maximum User I/O 508 508 508 424 424
Speed Grade C8 C7 (slower) C8 C8 C9 (faster)
Operating Temperature Commercial (0C to +85C) Commercial (0C to +85C) Commercial (0C to +85C) Commercial (0C to +85C) Industrial (-40C to +100C)
Process Technology 0.18 µm CMOS 0.18 µm CMOS 0.18 µm CMOS 0.18 µm CMOS 0.18 µm CMOS

Key Differentiators

  • Maximum I/O density in APEX-20KC family (vs EP20K600CB652C8N)
  • Faster C8 speed grade vs C7 lower-cost tier (vs EP20K600CB672C7N)
  • Mainstream commercial vs industrial temperature (vs EP20K600CB652I8N)

Design Notes

The 672-ball FineLine BGA has a 1.0 mm pitch that demands microvia PCB technology and at least 8 routing layers for clean signal escape. Use 4-6 signal layers, dedicated ground planes adjacent to every signal layer, and at least 2 power planes for 2.5 V VCCINT and MultiVolt VCCIO domains. Decoupling must include 0.1 µF X7R ceramics within 5 mm of every VCCINT and VCCIO ball pair, plus bulk 10 µF tantalums every 25 mm.

Estimated: at full 24,320-LE utilization on a 0.18 µm process at 2.5 V core, the EP20K600CB672C8N can dissipate up to 4 W. With a theta-JA of approximately 8 C/W on a 4-layer JEDEC test board and forced-air cooling (1 m/s), junction temperature rise over 25C ambient is ~32C. Add copper thermal pads under the central BGA region and, if junction is expected above +110C, derate utilization or apply a heat spreader.

Do not use modern Quartus Prime to compile APEX-20KC designs - device support ended with Quartus II Service Pack 2. JTAG pinout must follow the 1.8 V / 2.5 V / 3.3 V VCCIO ramp sequence documented in the APEX-20KC datasheet, otherwise the configuration EPROM may not load the bitstream. Configuration mode pins MSEL0/MSEL1 must be pulled to valid logic levels at power-up to avoid contention on the configuration bus.

Dedicate one routing layer to ground reference for every high-speed LVDS pair to maintain 100 ohm differential impedance and minimize EMI. Place 100 ohm LVDS termination resistors within 7 mm of the receiver balls; place source-series resistors at the driver balls for slew-rate control. DDR SDRAM address/command traces must be length-matched within ±25 ps, and clock-to-DQS skew must be tuned per the APEX-20KC external memory interface guidelines.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

RoHS/REACH compliance not stated in available distributor data; the part predates modern compliance documentation and was last actively designed-in prior to the Intel/Altera transition. AEC-Q100 not applicable for this commercial-temperature FPGA.

Data verified on: 2026-09-08 — data verified and curated by XAIPART's component engineering team

Related Searches

EP20K600CB672C8N EP20K600CB672C8N datasheet PDF Intel Altera APEX-20KC 672-BGA FPGA EP20K600 24320 logic elements 508 I/O FineLine BGA 672 FPGA obsolete APEX-20KC PCI 64-bit line card FPGA EP20K600CB672C8N vs EP20K600CB652C8N EP20K600CB672C8N drop-in replacement buy EP20K600CB672C8N obsolete FPGA EP20K600CB672C8N price 2026 what is the logic element count of EP20K600CB672C8N Quartus II APEX-20KC support legacy

Related Components & Terms

Intel Altera EP20K600CB672C8N EP20K600CB672C7N EP20K600CB652C8N APEX-20KC FPGA Field Programmable Gate Array Logic Array Block (LAB) Logic Element (LE) Look-Up Table (LUT) embedded system block (ESB) FineLine BGA 672-BBGA MultiVolt I/O PCI SIG DDR SDRAM ZBT SRAM JTAG IEEE 1149.1 Quartus II LVDS PLL Surface Mount BGA 0.18 µm CMOS SRAM configuration memory
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