EP2A25B652C7 - APEX II FPGA, 652-pin BGA | Intel / Altera
MPN: EP2A25B652C7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $398 | $3,980.00 |
| 100 | $365 | $36,500.00 |
| 500 | $320 | $160,000.00 |
| 1,000 | $285 | $285,000.00 |
EP2A25B652C7 Overview
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can reconfigure after manufacturing. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), above simple CPLDs in density and below ASICs in per-unit cost at high volume. APEX II is Altera's mid-to-high density family targeted at ASIC prototyping, high-speed datapath glue logic, and embedded system bus bridging. EP2A25B652C7 supports LVTTL, LVCMOS, SSTL, and LVDS I/O standards with up to 16 LVDS channels per bank.
Key features of EP2A25B652C7 include approximately 40,960 RAM bits distributed across embedded system blocks, four phase-locked loops for clock multiplication and deskew, JTAG IEEE 1149.1 boundary-scan support, and on-chip pull-up resistors configurable per pin. The 652-ball FineLine BGA exposes up to 488 user I/O pins across multiple I/O banks with independent VCCIO rails, allowing mixed-voltage interfacing on a single die. Boundary-scan and SignalTap-style embedded logic analysis are supported via Altera's Quartus II design software.
The APEX II architecture combines a MultiCore interconnect with look-up-table based logic elements, ESBs that can be configured as either dual-port SRAM, single-port SRAM, ROM, or CAM, and dedicated high-speed carry chains for arithmetic-intensive datapaths. The four PLLs provide clock multiplication, division, phase shifting, and external clock feedback, enabling precise timing alignment in multi-clock domain designs. Compared to the original APEX family, APEX II doubles the available ESBs and improves interconnect speed by approximately 30 percent.
Typical applications for EP2A25B652C7 include ASIC prototyping and emulation, telecommunications line cards, high-speed bridge and protocol converter logic, DSP co-processing front-ends, and industrial control glue logic. The 652-pin BGA package supports the high I/O count required for parallel bus interfaces such as 64-bit PCI, UTOPIA, and POS-PHY, as well as LVDS-based SERDES companion chips. It is also commonly used in legacy telecom backplane designs and military/aerospace prototypes where the APEX II family's long-term availability through industrial distributors is valued.
When designing with EP2A25B652C7, ensure that PCB layout follows Altera's FineLine BGA escape and decoupling guidelines: at least one 0.1 microfarad ceramic capacitor per VCC pin pair, four 10 microfarad bulk capacitors under the package, and a continuous power plane on inner layers. Verify JTAG chain ordering against the BSDL file before production programming, and derate I/O timing by 10 to 15 percent to compensate for board-level skew on high-fanout nets.
This page synthesizes distributor stock levels, the same-family APEX II alternative MPNs already indexed on XAIPART, and practical design notes not aggregated in the manufacturer datasheet alone, enabling faster sourcing decisions for engineering teams working on legacy or long-life-cycle designs.
Drop-in alternatives for EP2A25B652C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A25B652C7 (same form factor and footprint) — differing in Speed Grade, Logic Elements, Operating Temperature, Package, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A15B652C7
✅ Drop-In✓ In Stock
$82.4 / Unit
View Datasheet →EP2A15B652C8
✅ Drop-In✓ In Stock
$99.5 / Unit
View Datasheet →EP2A15B652C9
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP2A25B652C7 Maximum Ratings & Electrical Characteristics
| Family | APEX II |
| Logic Elements | Approximately 25,000 LE |
| Maximum User I/O Pins | 488 |
| Package | 652-ball FineLine BGA |
| Speed Grade | -7 |
| Core Voltage | 1.5 V |
| I/O Bank Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| RAM Bits (approx.) | 40,960 |
| PLLs | 4 |
| Supported I/O Standards | LVTTL, LVCMOS, SSTL, LVDS |
| Configuration Method | JTAG / Passive Serial / Active Serial |
| Boundary Scan | IEEE 1149.1 compliant |
| Design Software | Quartus II |
| Operating Temperature | Commercial 0C to +85C |
EP2A25B652C7 652-ball fineline bga Pin Configuration Guide
Pin configuration for EP2A25B652C7 (652-ball fineline bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2A25B652C7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2A25B652C7 is suitable for 6 applications: ASIC Prototyping and Emulation, Telecom Line Card Interface Logic, DSP Co-Processing Front-End, Industrial Control and Machine Automation, Legacy Avionics and Military Systems, High-Speed Protocol Bridge and Converter.
ASIC Prototyping and Emulation
The EP2A25B652C7's 25,000 logic elements and 652-ball BGA I/O capacity make it well suited for ASIC prototyping, where engineers map multi-million-gate ASIC RTL onto multiple FPGAs and validate functionality before tape-out. The APEX II MultiCore interconnect preserves timing across partition boundaries with predictable skew, critical for accurate gate-level emulation. The 488 user I/O pins expose enough parallel bandwidth for chip-to-chip emulation links, and JTAG-based configuration lets prototypes be reprogrammed in seconds during bring-up. Compared to CPLD-based prototypes, EP2A25B652C7 supports deeper logic hierarchies and embedded RAM blocks that mirror ASIC datapath memories.
Recommended
Telecom Line Card Interface Logic
The EP2A25B652C7 was extensively deployed in telecom line cards implementing UTOPIA, POS-PHY, and custom parallel bus glue logic between network processors and PHYs. Its 488 user I/O pins accommodate 64-bit-wide buses plus status and sideband signals without external bus drivers. The four on-chip PLLs generate multiple clock domains required by ATM, SONET, and Ethernet MAC subsystems, while per-bank VCCIO rails allow mixed-voltage interfacing (e.g., 3.3 V LVTTL control plane and 2.5 V SSTL datapath) on one device. The LVDS capability also supports high-speed serial backplane links with companion SERDES chips.
Recommended
DSP Co-Processing Front-End
In DSP front-end subsystems, the EP2A25B652C7 implements high-speed filtering, FFT preprocessing, and protocol framing ahead of dedicated DSP processors. Its embedded system blocks (ESBs) configured as dual-port RAM store FFT twiddle factors and window coefficients with single-cycle access, eliminating off-chip memory fetches that bottleneck real-time signal processing. The four PLLs derive the multiple sample clocks required by parallel A/D converter arrays, while the 652-ball BGA provides the wide parallel data paths needed for 16-bit or wider ADC interfaces running at 100+ MHz.
Recommended
Industrial Control and Machine Automation
The EP2A25B652C7 is used in industrial PLCs, motion controllers, and machine vision systems where deterministic logic and multiple protocol interfaces coexist. Its ability to instantiate custom parallel protocols (e.g., camera link, quadrature decoders, stepper pulse trains) on the same die eliminates the multiple discrete logic ICs that legacy designs required. The 1.5 V core plus independent VCCIO banks support 5 V tolerant inputs (with external resistor dividers) and 3.3 V sensor buses simultaneously. Industrial-grade temperature screening and the long-term availability of APEX II family members through distributors suit long-life factory automation equipment.
Recommended
Legacy Avionics and Military Systems
Defense and avionics programs that began development in the late 1990s and 2000s standardized on APEX II for radar signal preprocessing, mission computer I/O expansion, and MIL-STD-1553 bus bridging. EP2A25B652C7's 652-ball BGA exposes the wide parallel LVDS interfaces used by legacy radar data converters, while its radiation-tolerant CMOS process variants are screened for space applications. Long-term support through defense distributors and the stability of the APEX II architecture across decades make it a practical choice for systems with 20+ year field life where redesign costs outweigh migration to newer FPGA families.
Recommended
High-Speed Protocol Bridge and Converter
The EP2A25B652C7 bridges between incompatible parallel bus protocols (e.g., PCI to UTOPIA, RapidIO to proprietary DSP links) in networking and storage equipment. Its 25,000 logic elements implement full state machines and FIFOs for protocol conversion, while embedded dual-port RAM buffers data between asynchronous clock domains without external SRAM. The four PLLs synthesize the multiple clock frequencies required by source and destination buses, and JTAG-based in-system programming simplifies field upgrades when protocol revisions ship. The 652-ball BGA exposes the wide bus and sideband signals these bridges need without bus multiplexing.
Recommended
Recommended Products Summary
Engineering reference data for EP2A25B652C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A15B652C7 | EP2A15B652C8 | EP2A15B652C9 |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) - same brand | Intel (formerly Altera) - same brand | Intel (formerly Altera) - same brand |
| Package | 652-ball FineLine BGA | 652-ball FineLine BGA - same | 652-ball FineLine BGA - same | 652-ball FineLine BGA - same |
| Logic Elements | ~25,000 | ~15,000 (-40%) | ~15,000 (-40%) | ~15,000 (-40%) |
| Speed Grade | -7 | -7 (same) | -8 (slower) | -9 (slowest) |
| Family | APEX II | APEX II - same | APEX II - same | APEX II - same |
| Core Voltage | 1.5 V | 1.5 V - same | 1.5 V - same | 1.5 V - same |
| User I/O Pins | 488 | 488 - same | 488 - same | 488 - same |
| Lifecycle Status | Obsolete | Obsolete - same | Obsolete - same | Obsolete - same |
Key Differentiators
- Higher logic density at same footprint (vs EP2A15B652C7)
- Fastest speed grade at this density (vs EP2A15B652C8)
- APEX II architecture with 4 PLLs and ESBs (vs EP20K600CB652C7 (APEX 20K family))
Design Notes
The 652-ball FineLine BGA exposes its thermal pad through the center balls; design at least four thermal vias (0.3 mm drill, 1.0 mm pitch) under the die to a solid inner copper plane. For continuous operation above 70 percent of rated logic utilization in commercial temperature, derate ambient by 10 C or add forced airflow. At typical 1.5 V core and 488 active LVTTL outputs switching at 100 MHz, estimated power dissipation is approximately 4 to 6 W; verify with Quartus II PowerPlay early in design.
Follow Altera's FineLine BGA escape pattern: 0.5 mm pitch requires microvia or laser-drilled via stack-up with at least 4 signal layers plus dedicated power planes for VCCINT (1.5 V) and per-bank VCCIO. Place 0.1 microfarad X7R ceramic decoupling within 2 mm of every VCC/VCCIO pin pair, with four 10 microfaratd bulk capacitors under the package perimeter. JTAG chain ordering must be verified against the device BSDL file before any production programming step.
Estimated: this part is obsolete and only available through industrial distributors. Quoted lead times may slip when lot codes are specified; verify date code and factory seal at RFQ. Quartus II version 13.0 is the final release with APEX II support - newer Quartus Prime will NOT synthesize designs targeting this device, so preserve the legacy toolchain. Do not confuse EP2A25F672C7 (672-ball FBGA) with EP2A25B652C7 (652-ball BGA); they are NOT footprint compatible and require different PCB layouts.
On the 652-ball BGA, length-match LVDS pairs within 0.5 mm and route differential impedance at 100 ohms. For parallel buses wider than 32 bits, apply source-series termination (22 to 33 ohms) at the FPGA output to dampen reflections; do not rely on far-end termination alone for stubs longer than 25 mm. Use IBIS models from the Quartus II library for pre-layout signal integrity simulation, especially for clock-to-data skew on DDR-style interfaces.
Compliance Information
Compliance data not present in supplied web data; APEX II family predates widespread RoHS adoption. Most legacy inventory is lead-bearing per the original Altera datasheet. Marked [DATA_NEEDED] for compliance fields - verify with distributor lot documentation before use in RoHS-restricted markets.
