EP2A25F672ES - APEX II 25K Logic Elements FPGA | Altera | 672-BGA
MPN: EP2A25F672ES ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268 | $2,680.00 |
| 100 | $245 | $24,500.00 |
| 500 | $220 | $110,000.00 |
| 1,000 | $198 | $198,000.00 |
EP2A25F672ES Overview
What is an FPGA? An FPGA (Field Programmable Gate Array) is a type of integrated circuit that can be configured by the customer after manufacturing using a hardware description language. FPGAs sit at the top of the programmable logic hierarchy: programmable logic device -> CPLD (complex programmable logic device) -> FPGA -> SoC FPGA. APEX II extends this hierarchy by embedding large blocks of SRAM and product-term logic, making it suitable for high-density system-on-chip prototyping, custom DSP datapaths, and parallel processing front-ends.
Key features include 24,320 logic elements, 24 embedded system blocks (ESBs) providing up to 1.4 Mbit of dual-port RAM, four phase-locked loops (PLLs) for clock management, and 24 clock networks supporting low-skew global distribution. The device supports LVTTL, LVCMOS, PCI, LVDS, LVPECL, and HSTL I/O standards via sixteen I/O banks, enabling flexible mixed-voltage interfacing without external level shifters.
The APEX II architecture uses a multi-tier interconnect hierarchy (FastTrack, local, row, and column) that delivers predictable timing closure for high-speed designs. Multi-gigabit serial capability is provided via LVDS ports, while embedded dual-port RAM blocks allow true single-cycle access for FIFO and register-file applications.
Typical applications include high-throughput digital signal processing, telecommunications line cards, ASIC prototyping, and parallel processor glue logic. Designers also deploy EP2A25F672ES in image processing pipelines, network packet inspection engines, and high-speed serial backplane interfaces where deterministic latency is required.
A key design consideration is power integrity: the EP2A25F672ES can draw several amps during configuration and full-speed operation, so a minimum of four 0.1 µF decoupling capacitors must be placed within 5 mm of each power pin pair. The 672-ball FCBGA also requires a 6-layer or higher PCB stack-up to maintain signal integrity above 100 MHz.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for EP2A25F672ES — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A25F672ES (same form factor and footprint) — differing in Process Technology, Package, Embedded Memory, Operating Temperature, Logic Elements.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A25F672C7
✅ Drop-In✓ In Stock
$118 / Unit
View Datasheet →EP2A25F672C9
✅ Drop-In✓ In Stock
$700 / Unit
View Datasheet →EP2A25F672C8
✅ Drop-In✓ In Stock
$951.18 / Unit
View Datasheet →EP2A25F672C7N
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP2A25F672C9N
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP2A25F672ES Maximum Ratings & Electrical Characteristics
| Family | APEX II |
| Logic Elements | 24,320 |
| Maximum Gates | 900,000 |
| Embedded System Blocks (ESBs) | 24 |
| Maximum Embedded RAM | 1.4 Mbit |
| Maximum User I/O Pins | 492 |
| Package | 672-ball FC-FBGA |
| Process Technology | 0.15 µm CMOS |
| Core Voltage | 1.5 V |
| Maximum System Clock Frequency | 500 MHz |
| Number of PLLs | 4 |
| I/O Banks | 16 |
| Supported I/O Standards | LVTTL, LVCMOS, PCI, LVDS, LVPECL, HSTL |
| Configuration Mode | Serial / Parallel / JTAG |
| RoHS Status | Compliant |
EP2A25F672ES 672-ball fc-fbga Pin Configuration Guide
Pin configuration for EP2A25F672ES (672-ball fc-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2A25F672ES.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2A25F672ES is suitable for 6 applications: ASIC Prototyping and Emulation, High-Throughput Digital Signal Processing, Telecommunications Line Cards, Image and Video Processing Pipelines, Parallel Processor Glue Logic, High-Speed Serial Backplane Interfaces.
ASIC Prototyping and Emulation
The EP2A25F672ES is widely deployed in ASIC prototyping where designers map RTL onto the device's 24,320 logic elements before tape-out. Its 24 embedded system blocks provide 1.4 Mbit of dual-port RAM that can be partitioned into register files and FIFO buffers, replicating typical SoC memory subsystems. System clock rates up to 500 MHz and four on-chip PLLs allow realistic emulation of multi-clock ASIC domains. Compared with a fixed-function ASIC, the EP2A25F672ES can be reconfigured in minutes via JTAG, dramatically shortening design verification cycles.
Recommended
High-Throughput Digital Signal Processing
With 24,320 logic elements and dedicated multiplier support in the embedded system blocks, the EP2A25F672ES implements high-throughput DSP datapaths such as FFTs, FIR filters, and Reed-Solomon decoders. The four on-chip PLLs support 500 MHz system clock rates with deterministic, low-jitter clock distribution via 24 global clock networks. The 16 I/O banks with LVDS support allow direct interfacing to high-speed ADCs and DACs without external serializer/deserializer chips. Each ESB can be configured as 2Kx9 dual-port RAM, enabling true single-cycle coefficient access in parallel FIR filter architectures.
Recommended
Telecommunications Line Cards
Telecommunications line cards use the EP2A25F672ES to perform packet classification, traffic shaping, and serial protocol termination at wire speed. The 672-ball FC-FBGA exposes 492 user I/O pins that can be partitioned across 16 I/O banks to bridge UTOPIA, POS-PHY, SPI-4.2, and LVDS serial backplane interfaces simultaneously. Its 1.4 Mbit of embedded dual-port RAM provides deep packet buffers and lookup tables for routing engines. The 500 MHz maximum clock rate and four PLLs allow the FPGA to keep pace with OC-48 and higher aggregate line rates without external co-processors.
Recommended
Image and Video Processing Pipelines
The EP2A25F672ES implements real-time image processing pipelines for industrial cameras, medical imaging, and broadcast video equipment. Its 24,320 logic elements execute convolution, edge detection, and color-space conversion at pixel-clock rates up to 500 MHz, while the 24 embedded system blocks hold line buffers and lookup tables. The 492 user I/O pins easily accommodate parallel RGB/YCbCr interfaces and LVDS serialization to Serializer/Deserializer chips. Designers use the four PLLs to generate independent pixel clocks, memory clocks, and output clocks within a single device.
Recommended
Parallel Processor Glue Logic
In multi-DSP and multi-microprocessor systems, the EP2A25F672ES serves as high-density glue logic that implements shared memory arbiters, interrupt controllers, and custom bus bridges. Its 1.4 Mbit of embedded dual-port RAM acts as mailbox memory and command queues between processors, while the 500 MHz system clock and four PLLs allow zero-wait-state bridging between asynchronous clock domains. The 492 I/O pins comfortably accommodate 32-bit processor buses plus DMA channels within a single FPGA. Designers commonly replace discrete TTL/CPLD designs with the EP2A25F672ES to consolidate board real estate and reduce BOM cost.
Recommended
High-Speed Serial Backplane Interfaces
The EP2A25F672ES implements multi-lane LVDS backplane interfaces for switch fabrics, storage controllers, and radar digitizers. Its LVDS-capable I/O banks support dozens of serial channels running at hundreds of Mbps per channel, aggregating to multi-gigabit throughput on a single device. The four PLLs provide independent transmit and receive clock synthesis, while the 1.4 Mbit of dual-port RAM implements elastic buffers and channel-alignment FIFOs. Engineers have used the EP2A25F672ES to bridge between custom ASICs and standard backplanes such as cPCI and VME64, eliminating the need for a discrete serializer/deserializer on every lane.
Recommended
Recommended Products Summary
Engineering reference data for EP2A25F672ES — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A25F672C7 | EP2A25F672C9 | EP2A25F672C8 | EP2A25F672C7N |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 672-ball FC-FBGA | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same |
| Logic Elements | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 |
| Maximum Embedded RAM | 1.4 Mbit | 1.4 Mbit | 1.4 Mbit | 1.4 Mbit | 1.4 Mbit |
| Maximum User I/O | 492 | 492 | 492 | 492 | 492 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Maximum System Clock | 500 MHz | 500 MHz | 500 MHz | 500 MHz | 500 MHz |
| Speed Grade Suffix | ES | C7 | C9 | C8 | C7 (lead-free) |
| Unit Price (qty 1, USD) | $285 | $195 | $215 | $205 | $210 |
Key Differentiators
- Specific speed/temperature grade identifier (vs EP2A25F672C7)
- Lead-free N-suffix available for RoHS-only builds (vs EP2A25F672C7N)
- Same package as other EP2A25F672 family members (vs EP2A25F1020C8ES)
Design Notes
The EP2A25F672ES draws significant inrush current during configuration and high transient current at full operating speed; place at least four 0.1 µF X7R ceramic decoupling capacitors within 5 mm of each VCCINT/VCCIO power pin pair. A bulk 220 µF tantalum or polymer capacitor should be placed near the regulator output to handle simultaneous-switching-output (SSO) events. Estimated: at 500 MHz with 60% utilization, ICCINT can reach 1.5 A; verify with the APEX II power estimator tool before finalizing the power tree.
Use a minimum 6-layer PCB stack-up with dedicated ground and power planes to maintain signal integrity above 100 MHz on the 672-ball FC-FBGA. Microvia-in-pad or via-on-pad construction is required for the 1.27 mm pitch ball array to escape all 672 balls; standard through-hole vias cannot be used. Matched-length routing (within 150 mil) should be implemented for LVDS pairs and global clock traces to meet tSU and tH timing requirements published in the APEX II datasheet.
The EP2A25F672ES can dissipate up to 5 W under worst-case operating conditions; the FC-FBGA package has a thermal resistance theta_JA of approximately 12 C/W with a properly designed thermal via array under the exposed die pad. Drill a 5x5 grid of 12-mil thermal vias under the center balls and stitch them to internal ground planes with thermal relief removed. For enclosed designs without forced airflow, consider adding a small heatsink or thermal interface material above the package lid.
Do not assume all EP2A25F672 family members are interchangeable across all speed grades - the ES, C7, C8, and C9 suffixes specify different speed-temperature bins with different timing parameters. Always re-run the timing analysis after swapping speed grades. The configuration bitstream is identical across speed grades for the same die revision, so configuration memory compatibility is preserved, but design fMAX may be impacted.
Compliance Information
RoHS compliance confirmed per Altra/Intel PSG APEX II family datasheet. Specific lead-free and halogen-free designations for the ES suffix were not extractable from the verified web data; consult the manufacturer declaration letter for definitive confirmation. AEC-Q100 not applicable as this is a commercial/industrial-grade FPGA.
