EP2A70B652C7 - 67200 LEs FPGA BGA-652 | Intel (Altera)
MPN: EP2A70B652C7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $11.815 | $11.82 |
| 10 | $11.252 | $112.52 |
| 100 | $10.717 | $1,071.70 |
| 1,000 | $10.506 | $10,506.00 |
| 10,000 | $10.506 | $105,060.00 |
EP2A70B652C7 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that contains an array of programmable logic blocks, configurable interconnects, and embedded resources such as memory blocks, DSP blocks, and high-speed transceivers. FPGAs sit in the programmable-logic segment of the digital IC hierarchy (FPGA -> programmable logic -> ASIC alternative -> digital integrated circuit -> semiconductor). Unlike fixed-function ASICs, FPGAs are post-fabrication reconfigured by the designer using HDL synthesis and place-and-route tools, accelerating prototyping and time-to-market for high-complexity designs.
Key features of the EP2A70B652C7 include up to 336 user I/O pins distributed across multiple I/O banks, embedded SRAM blocks totaling several megabits, dedicated PLL clock management blocks for frequency synthesis and skew control, and support for high-speed LVDS signaling on selected pins. The APEX II architecture combines look-up-table (LUT) based logic with dedicated routing and memory resources to balance logic density, speed grade, and predictable timing closure in mid-to-large designs.
The device uses a multi-voltage I/O structure with separate VCCIO banks, allowing mixed-voltage interfacing (1.5V, 1.8V, 2.5V, 3.3V) on the same die. It also supports in-system programmability via JTAG and passive serial configuration, enabling rapid board-level bring-up. The BGA-652 FineLine package provides a compact 27x27 mm footprint suitable for high-density PCB layouts in telecom, networking, and industrial control applications.
Typical applications include high-throughput data-path processing in telecommunications line cards, glue-logic and protocol bridging in industrial controllers, image and video preprocessing for surveillance systems, and DSP co-processing in test and measurement instruments. The APEX II family was EOL'd by Altera/Intel and is now widely sourced through authorized distributors for legacy system support.
When designing with this device, verify that your Quartus II design toolchain version supports the APEX II device family and that the chosen speed grade (C7 = commercial, 7th speed grade) meets timing closure requirements. Plan for thermal management because high utilization at elevated toggle rates can dissipate several watts; refer to the APEX II datasheet thermal management section for θJA values. Also confirm configuration memory and JTAG chain compatibility before board bring-up.
This page synthesizes distributor pricing (DigiKey, AIChipLink, Bitfoic), drop-in same-family alternatives from the APEX II family, pinout references, and practical design notes not aggregated on a single manufacturer page.
Drop-in alternatives for EP2A70B652C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A70B652C7 (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Logic Elements, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A40B652C7
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View Datasheet →EP2A40B652C8
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$94.3 / Unit
View Datasheet →EP2A40B652C9
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$92.4 / Unit
View Datasheet →EP20K600CB652I7
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$149 / Unit
View Datasheet →EP20K600CB652I8
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$92 / Unit
View Datasheet →EP20K600CB652I9
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$165 / Unit
View Datasheet →EP2A70B652C7 Maximum Ratings & Electrical Characteristics
| Manufacturer | Intel (formerly Altera) |
| Series | APEX II |
| Family | APEX II (Field-Programmable Gate Array) |
| Logic Elements (LEs) | 67200 |
| Typical Gates | 1140000 |
| Maximum User I/Os | 336 |
| Package Type | BGA-652 (FineLine BGA) |
| Package Size | 27 mm x 27 mm (approximate) |
| Mounting Type | Surface Mount |
| Operating Temperature Grade | Commercial (C) |
| Speed Grade | 7 |
| Core Voltage | 1.8 V |
| I/O Bank Voltage (VCCIO) | 1.5V / 1.8V / 2.5V / 3.3V (bank-dependent) |
| Configuration Interface | JTAG, Passive Serial |
| Memory Type | Embedded SRAM blocks (ESBs) |
| PLL / Clock Management | Yes, dedicated PLL blocks |
EP2A70B652C7 27 mm x 27 mm (approximate) Pin Configuration Guide
Pin configuration for EP2A70B652C7 (27 mm x 27 mm (approximate) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2A70B652C7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2A70B652C7 is suitable for 6 applications: Telecom Line-Card Data-Path Processing, Industrial Controller Glue Logic and Protocol Bridging, Video and Image Preprocessing for Surveillance, Test and Measurement Instrument DSP Co-Processing, Medical Imaging Front-End Processing, Aerospace and Defense Legacy Avionics.
Telecom Line-Card Data-Path Processing
The EP2A70B652C7 fits telecom line-card data-path processing where ~67000 LEs enable multi-channel framers, traffic managers, and HDLC/PPP aggregation on a single die. The device's 336 user I/Os in BGA-652 provide ample LVTTL/LVDS lanes to interface with network processors, TDM framers, and SERDES devices, while dedicated PLL blocks synthesize the multiple clock domains required by SONET/SDH or Ethernet backplane designs. Compared with smaller FPGAs, the EP2A70B652C7 absorbs the entire data-path without requiring a companion CPLD, simplifying board layout. The part is now obsolete, so it is best reserved for sustaining engineering of legacy telecom systems rather than new platforms.
Recommended
Industrial Controller Glue Logic and Protocol Bridging
The EP2A70B652C7 suits industrial controller hubs where it implements glue logic between microcontrollers, ASICs, and fieldbus transceivers (Profibus, CAN, RS-485). Its 67200 LEs accommodate custom register interfaces, deterministic state machines, and protocol conversion firmware in a single device, eliminating several discrete logic ICs from the BOM. The BGA-652 package supports the dense mixed-signal PCB layout typical of PLC backplanes, while per-bank VCCIO allows direct interfacing with both 3.3V legacy ASICs and 1.8V modern microcontrollers on the same board. Designers must verify Quartus II toolchain support because the APEX II family is now obsolete.
Recommended
Video and Image Preprocessing for Surveillance
The EP2A70B652C7 is well matched to image preprocessing pipelines in surveillance camera and DVR subsystems where its embedded SRAM blocks store line buffers and frame histograms. The 67200 LEs implement Bayer demosaicing, noise reduction filters, and motion-detection engines at CIF/D1 resolutions in real time, offloading the host DSP. Its up-to-336 user I/Os accept multiple parallel video input ports (BT.656, LVDS camera link) and drive DDR memory controllers and PCI bridges simultaneously. For modern replacements, designers often migrate to Cyclone V or Lattice ECP5, but the EP2A70B652C7 remains in service in installed surveillance infrastructure.
Recommended
Test and Measurement Instrument DSP Co-Processing
The EP2A70B652C7 serves as a DSP co-processor in oscilloscopes, signal analyzers, and protocol testers where its logic capacity accelerates FFT, FIR filtering, and trigger-decision logic alongside a host CPU. Dedicated PLL blocks generate the precise sampling clocks and trigger latencies required by high-bandwidth digitizers, while embedded SRAM enables deep capture buffers for transient analysis. The BGA-652 FineLine package fits the dense mixed-signal front-end boards typical of bench-top instruments. New designs should evaluate modern Cyclone V or Stratix 10 families, but legacy instruments still rely on the EP2A70B652C7 for sustaining engineering.
Recommended
Medical Imaging Front-End Processing
The EP2A70B652C7 supports medical imaging front-end boards such as ultrasound beamformers and endoscopy controllers where real-time data-path processing is required. Its 67200 LEs handle beam summation, RF signal conditioning, and image reconstruction pipelines at clinical frame rates, while embedded SRAM buffers raw transducer data. The commercial temperature grade (0C to 85C) covers most clinical equipment thermal envelopes; for higher-grade applications the APEX 20K industrial variants in the same BGA-652 footprint offer -40C to +100C support. The part's obsolete lifecycle status requires careful long-term supply planning for medical device manufacturers.
Recommended
Aerospace and Defense Legacy Avionics
The EP2A70B652C7 remains in service in legacy avionics subsystems such as mission computers, display controllers, and radar data pre-processors. Its high logic density enables MIL-STD-1553 bus controllers, ARINC 429 interfaces, and display rendering pipelines within a single FPGA, while the commercial temperature grade supports temperature-controlled avionics bays. For harsh-environment aerospace applications the APEX 20K industrial variants in the same BGA-652 footprint (EP20K600CB652I7/I8/I9) provide extended temperature ranges and additional ruggedization. Long-term sustainment programs must address counterfeit risk and obsolescence through authorized distributors.
Recommended
Recommended Products Summary
Engineering reference data for EP2A70B652C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A40B652C7 | EP2A40B652C8 | EP2A40B652C9 | EP20K600CB652I7 | EP20K600CB652I8 | EP20K600CB652I9 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | BGA-652 (FineLine BGA) | BGA-652 - same | BGA-652 - same | BGA-652 - same | BGA-652 - same | BGA-652 - same | BGA-652 - same |
| Logic Elements | 67200 LEs | ~40000 LEs | ~40000 LEs | ~40000 LEs | ~60000 LEs | ~60000 LEs | ~60000 LEs |
| Family | APEX II | APEX II | APEX II | APEX II | APEX 20K | APEX 20K | APEX 20K |
| Temperature Grade | Commercial (0C to 85C) | Commercial | Commercial | Commercial | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | 7 | 7 | 8 | 9 | 7 | 8 | 9 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Higher logic density than BGA-652 alternatives within the same family (vs EP2A40B652C7)
- Faster speed grade than C8/C9 APEX II BGA-652 alternatives (vs EP2A40B652C9)
- Higher logic capacity than APEX 20K BGA-652 industrial alternatives (vs EP20K600CB652I7)
Design Notes
Estimated: at 50% logic utilization toggling at 100 MHz with the typical APEX II power coefficient (~20 uW/LE/MHz), the EP2A70B652C7 dissipates approximately 1.5 to 2.5 W. The BGA-652 FineLine package's theta_JA is typically 8 to 12 C/W on a 4-layer JEDEC test board with adequate thermal vias under the package. For high-utilization designs, place a 6x6 thermal via array (0.3 mm drill, 1.0 mm pitch) under the BGA die flag and connect to inner ground planes. Without thermal vias, junction temperature rise can exceed 25 C at full load, degrading timing margin.
Route the 1.8V VCCINT plane as a continuous solid pour on an inner layer with at least 4 decoupling capacitors (1 x 100 uF bulk + 4 x 0.1 uF + 4 x 10 nF) within 5 mm of the BGA. Each VCCIO bank must have its own decoupling network sized to the number of switching outputs in that bank. The JTAG TDI/TDO/TMS/TCK pins require 10 kohm pull-ups to VCCIO for reliable configuration; do not leave them floating. Match all high-speed LVDS pairs to 100 ohm differential impedance with length matching within 150 mils.
Do not assume that any APEX II or APEX 20K device in BGA-652 is software-drop-in compatible: the bitstream formats differ between APEX II and APEX 20K families, so a Quartus II recompile is mandatory when porting. Verify the configuration mode (Passive Serial vs JTAG) before board bring-up because a wrong MSEL setting bricks the device into an unconfigured state. Finally, source obsolete APEX II parts only from authorized distributors to avoid remarked date-code counterfeit devices; always inspect the lot trace and X-ray the BGA for reball evidence.
Compliance Information
RoHS, REACH, lead-free, and halogen-free status are not explicitly stated in the verified distributor data and should be verified against the original Altera/Intel PCN records. AEC-Q100 is not applicable because this is a commercial-grade FPGA.
