EP2A40B652C9 - APEX II FPGA 1.5M Gates 652-Pin BGA | Intel
MPN: EP2A40B652C9 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $118.75 | $11,875.00 |
| 500 | $105.2 | $52,600.00 |
| 1,000 | $92.4 | $92,400.00 |
EP2A40B652C9 Overview
An FPGA (Field-Programmable Gate Array) is a programmable logic device that allows engineers to implement custom digital circuits by configuring an array of configurable logic blocks (CLBs), interconnect, and I/O cells. APEX II FPGAs extend this concept with embedded system blocks that provide dedicated dual-port RAM, ROM, and CAM (content-addressable memory) resources, while the MultiCore interconnect combines LUT-based fine-grained logic with embedded megablocks. This places APEX II FPGAs in the broader hierarchy of programmable logic devices (PLDs) -> FPGAs -> high-density FPGAs -> embedded-block FPGAs.
Key features of the EP2A40B652C9 include up to 1.5 million system gates, embedded system blocks for memory and special functions, MultiCore interconnect architecture, support for multiple I/O standards (LVTTL, LVCMOS, PCI, GTL+, SSTL, LVDS), and PLLs for clock management. The 652-pin BGA package provides ample I/O for memory-intensive and bus-intensive designs, while supporting JTAG boundary-scan configuration via the IEEE 1149.1 standard interface.
The device is configured via the serial or parallel configuration scheme typical of the APEX II family, with configuration data stored in SRAM cells. This means the device must be reconfigured at each power-up using an external configuration memory or a configuration controller, making it suitable for prototyping, system-level testing, and production designs that benefit from field-upgradeable logic.
Typical applications include telecommunications infrastructure, DSP co-processing, high-speed data acquisition, network switches and routers, and embedded industrial controllers. The wide I/O count also supports multi-channel memory interfaces and high-bandwidth bus bridging.
When designing with this device, ensure adequate power-rail decoupling with 0.1 µF ceramic capacitors placed close to each power pin. Thermal management should account for the BGA thermal resistance; a multi-layer PCB with thermal vias under the BGA is recommended for full industrial-temperature operation.
Drop-in alternatives for EP2A40B652C9 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A40B652C9 (same form factor and footprint) — differing in Speed Grade, Logic Elements, Operating Temperature, Package, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A40B652C8
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$94.3 / Unit
View Datasheet →EP2A40B652C7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
Contact for price
View Datasheet →EP2A25B652C9
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$105 / Unit
View Datasheet →EP2A40B652C9 Maximum Ratings & Electrical Characteristics
| Family | APEX II |
| Maximum System Gates | 1.5 M (40K logic elements) |
| Logic Elements | 40,160 |
| Embedded System Blocks | Yes (dual-port RAM, ROM, CAM) |
| Package | 652-pin BGA |
| Process Technology | 0.18 µm CMOS |
| Core Voltage | 1.5 V |
| Supply Voltage (I/O) | 3.3 V (multi-standard I/O supported) |
| Operating Temperature | -40C to +85C (industrial, C9 suffix) |
| Configuration Method | SRAM-based, serial/parallel, JTAG IEEE 1149.1 |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, GTL+, SSTL, LVDS |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 (168 hours floor life) |
| RoHS Status | unknown |
EP2A40B652C9 652-pin bga Pin Configuration Guide
Pin configuration for EP2A40B652C9 (652-pin bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2A40B652C9.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2A40B652C9 is suitable for 7 applications: Telecommunications Infrastructure, DSP Co-Processing Accelerator, High-Speed Data Acquisition Back-End, Network Switch and Router Line Cards, Industrial Embedded Controllers, Aerospace and Defense Prototyping, Test and Measurement Instrumentation.
Telecommunications Infrastructure
The EP2A40B652C9's 1.5 M system gates and embedded system blocks make it suitable for telecom line-card designs including channelized TDM processing, framing, and protocol termination. The MultiCore interconnect sustains high-fanout paths typical of telecom datapaths, while LVDS and SSTL I/O standards allow direct interface to serializer/deserializer (SERDES) companion chips. The 652-pin BGA exposes enough I/O for 16- to 32-bit wide data buses plus JTAG, clock, and management pins, supporting multi-port switch fabrics. Compared with older SRAM-lookup solutions, the APEX II architecture integrates routing tables and traffic-shaping logic in a single device, reducing board area and BOM cost.
Recommended
DSP Co-Processing Accelerator
With 40,160 logic elements and embedded system blocks for dual-port RAM, the EP2A40B652C9 functions as a hardware accelerator for FFT, FIR, and video pipeline operations. Designers can pipeline multiplier-accumulator trees across the MultiCore interconnect, achieving DSP-class throughput that would otherwise require a dedicated DSP chip. The SRAM-based configuration also lets designers upgrade algorithms in the field via JTAG, accelerating time-to-market for evolving codecs. The 1.5 V core and 0.18 µm process keep dynamic power manageable for sustained computation workloads, while LVDS I/O simplifies connection to high-speed ADC/DAC converters in mixed-signal front-ends.
Recommended
High-Speed Data Acquisition Back-End
The EP2A40B652C9's 652-pin BGA supplies ample I/O for aggregating multiple parallel data streams from high-speed ADCs in scientific instrumentation, radar receivers, or medical imaging front-ends. Embedded system blocks store deep capture buffers in dual-port RAM while logic elements implement real-time triggering, decimation, and channel-skew correction. Multi-standard I/O including LVDS lets the FPGA receive LVDS-ADC data without external transceivers. Industrial temperature grade (-40C to +85C) supports deployment in field-enclosure instrumentation. The JTAG boundary-scan port and SRAM-based configuration also simplify board-level test and field firmware updates in deployed systems.
Recommended
Network Switch and Router Line Cards
The EP2A40B652C9 fits network line-card applications where 1.5 M system gates can implement packet classifiers, QoS schedulers, and traffic-management tables in a single chip. Embedded CAM resources accelerate longest-prefix-match and ACL lookups, while LVTTL/LVCMOS/PCI I/O standards bridge to network processors and switch fabrics. The 652-pin BGA delivers I/O for multi-gigabit Ethernet MAC interfaces plus console, management, and expansion buses. Compared with ASIC-based designs, the APEX II reduces NRE cost and allows late-binding feature changes before tape-out, which is valuable for evolving protocols and customer-specific feature sets.
Recommended
Industrial Embedded Controllers
The industrial-grade EP2A40B652C9 (operating -40C to +85C) is well suited to embedded industrial controllers that integrate motion-control loops, PLC-style logic, and fieldbus interfaces (PROFIBUS, CANopen, Modbus) in one device. Logic elements host the safety logic and state machines, embedded system blocks provide deterministic cycle buffers, and the JTAG boundary-scan chain simplifies in-system test for high-reliability deployments. The BGA-652 package supports enough I/O for multi-axis servo interfaces plus parallel bus connections to operator panels. SRAM-based configuration supports field upgrades to fix bugs or add new fieldbus protocols without board rework, which is critical for long-lifecycle industrial equipment.
Recommended
Aerospace and Defense Prototyping
The EP2A40B652C9 is used in legacy aerospace and defense prototyping applications where radiation-tolerant or extended-temperature FPGAs are not required and the design must reuse existing Altera/Intel toolchain IP. Designers leverage the 1.5 M system gates for interface conversion (MIL-STD-1553, ARINC 429, RS-485/422), sensor fusion, and signal-conditioning datapaths, while embedded system blocks implement FIFO buffers and protocol-state tables. The SRAM-based configuration allows rapid design iteration in lab environments. For flight-qualified production, however, designers should migrate to Rad-Hard-by-Design families, but APEX II remains common in lab, ground-test, and engineering-model builds.
Recommended
Test and Measurement Instrumentation
The EP2A40B652C9's high logic density and embedded system blocks make it appropriate for digital test instruments such as logic-analyzer capture boards, protocol exercisers, and bit-error-rate testers. The MultiCore interconnect implements deep pattern generators and signature analyzers while ESBs provide capture-memory buffers. JTAG-based configuration lets test engineers swap personalities on the fly to support multiple protocols or test patterns without changing boards. The wide I/O count supports parallel stimulus/response buses, while LVDS I/O enables high-speed inter-board connections in multi-slot tester chassis. Industrial temperature grade also supports bench-to-rack deployment in production test cells.
Recommended
Recommended Products Summary
Engineering reference data for EP2A40B652C9 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A40B652C8 | EP2A40B652C7 | EP2A25B652C9 |
|---|---|---|---|---|
| Package | 652-pin BGA | 652-pin BGA (same) | 652-pin BGA (same) | 652-pin BGA (same) |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Family | APEX II | APEX II | APEX II | APEX II |
| Logic Elements | 40,160 | 40,160 | 40,160 | 25,160 |
| Speed Grade | C9 (fastest industrial) | C8 (slower than C9) | C7 (slowest) | C9 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest speed grade (C9) in the APEX II 652-BGA family (vs EP2A40B652C8)
- Full 1.5 M system gates vs the smaller-die 652-BGA variant (vs EP2A25B652C9)
- Drop-in compatible with EP2A40B652C8 and EP2A40B652C7 (vs EP2A40B652C8)
Design Notes
Estimated: the EP2A40B652C9 in a 652-pin BGA requires a multi-layer PCB (typically 8+ layers) with a dedicated ground/power plane pair under the device. Place 0.1 µF X7R decoupling capacitors within 3 mm of every power pin, plus bulk 10-100 µF tantalum or polymer capacitors at board entry. Thermal vias must be stitched directly under the BGA die-attach area to reduce theta-JA; without them, the junction can exceed 100 °C in worst-case industrial-temperature designs at full toggle rate.
APEX II devices require a configuration memory or controller at every power-up - leaving the device unconfigured results in all I/O in high-impedance and unknown logic. Per the APEX II handbook, an EPC2 or EPC16 configuration PROM is recommended for production, with the nCONFIG, nSTATUS, and CONFIG_DONE pins pulled correctly per the datasheet. Failure to monitor nSTATUS leaves the device stuck if configuration fails - always include a watchdog reset.
Estimated: at full utilization (40 K logic elements toggling at 100 MHz), the EP2A40B652C9 can dissipate 2-4 W depending on switching activity factor. Designers should budget theta-JA of approximately 12-15 °C/W for a properly stitched BGA footprint, giving a junction-temperature rise of 24-60 °C above ambient. Industrial-temperature operation (-40 °C to +85 °C ambient) keeps junction well within the 125 °C limit if thermal vias are present; without them, derate the operating frequency or ambient ceiling.
Per the APEX II datasheet, LVDS and GTL+ I/O standards have specific placement rules: LVDS pairs must be routed length-matched within 150 mil and adjacent pins on the same bank. SSTL Class-II requires external series-resistor calibration and a reference-voltage (VREF) distribution plane. PCI I/O must use 3.3 V VCCIO with the clamp diode enabled. Mixing standards across banks is supported, but VCCIO must be unique per bank - keep bank boundaries on layer changes to simplify plane splits.
Compliance Information
APEX II family predates modern Intel Altera compliance documentation; RoHS/REACH/lead-free status not explicitly stated in the datasheet or on distributor pages surveyed. AEC-Q100 not applicable (FPGA, not automotive discrete).
