EP2AGX95DF25C4G - 95KLE Arria II GX FPGA, 572-FCBGA | Intel
MPN: EP2AGX95DF25C4G β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $460 | $4,600.00 |
| 100 | $425 | $42,500.00 |
| 500 | $395 | $197,500.00 |
| 1,000 | $360 | $360,000.00 |
EP2AGX95DF25C4G Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnect, and dedicated I/O and memory resources that can be re-programmed to implement any digital logic function. FPGAs sit in the system hierarchy below ASICs and above general-purpose microcontrollers, offering hardware-level parallelism and deterministic timing for compute-intensive, high-throughput applications such as signal processing, protocol bridging, and high-speed serial I/O.
Key features of the EP2AGX95DF25C4G include up to 8 multi-gigabit transceivers supporting data rates suitable for PCI Express Gen1/Gen2 and Serial RapidIO, dedicated DSP blocks for high-throughput arithmetic, and on-chip memory that supports true dual-port and FIFO operations at hundreds of MHz. The device uses SRAM-based configuration cells and supports encrypted bitstream loading.
Architecturally, the EP2AGX95DF25C4G implements an 8-input adaptive logic module (ALM) fabric with 8.058 Kbits per ALM, full per-LAB carry chains, and hard IP for memory controllers and SERDES. The 572-ball FCBGA package provides a large pin-count matrix suitable for designs requiring many LVDS pairs and multiple transceiver channels.
Typical applications include wireless baseband processing, high-definition video broadcast equipment, high-speed serial protocol bridging (PCIe, SRIO, Gbps Ethernet), industrial imaging, and military/aerospace signal processing. The combination of high logic density and integrated transceivers makes it well suited for systems that previously required an FPGA plus an external PHY.
When designing with this device, use the Altera Quartus II design suite for synthesis, place-and-route, and timing closure. Pay particular attention to transceiver reference-clock routing and decoupling on the FCBGA power rails. Estimated: power dissipation at maximum toggle rate in the 572-ball package typically requires forced-air thermal management above 6 W of internal power.
Drop-in alternatives for EP2AGX95DF25C4G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX95DF25C4G (same form factor and footprint) β differing in Package, Speed Grade, Operating Temperature, Embedded Memory Bits, Mounting Type.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2AGX95DF25C4N
β Drop-Inπ Reference alternative (not in catalog)
EP2AGX95DF25C5G
β Drop-Inβ In Stock
$768.9 / Unit
View Datasheet βEP2AGX95DF25I5G
β Drop-Inβ In Stock
$760 / Unit
View Datasheet βEP2AGX95DF25C6G
β Drop-Inβ In Stock
$290 / Unit
View Datasheet βEP2AGX95DF25C4G Maximum Ratings & Electrical Characteristics
| Series | Arria II GX |
| Logic Elements | 89178 |
| Total RAM Bits | 6839296 |
| Number of Logic Array Blocks (LABs/CLBs) | 1137 |
| Number of I/O | 260 |
| Supply Voltage - Core | 0.87 V to 1.03 V |
| Operating Temperature | 0C to +85C |
| Mounting Type | Surface Mount |
| Package / Case | 572-BGA, FCBGA |
| Supplier Device Package | 572-FCBGA |
| Transceivers | Up to 8 multi-gigabit transceivers |
| DSP Blocks | Dedicated 18x18 multipliers |
| Configuration | SRAM-based, encrypted bitstream support |
| RoHS Status | Compliant |
EP2AGX95DF25C4G 572-fcbga Pin Configuration Guide
Pin configuration for EP2AGX95DF25C4G (572-fcbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX95DF25C4G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX95DF25C4G is suitable for 6 applications: PCIe Gen2 Endpoint Card, Wireless Baseband Processing, High-Definition Video Broadcast, Serial RapidIO Switch Bridge, Industrial Imaging and Machine Vision, Military and Aerospace Signal Processing.
PCIe Gen2 Endpoint Card
The Intel EP2AGX95DF25C4G is well-suited for PCI Express Gen2 endpoint card designs that need up to x4 lane configurations. The device integrates hard PCIe IP supporting endpoint and root-port modes at Gen1 2.5 Gbps and Gen2 5.0 Gbps without an external PHY, reducing BOM cost and PCB area. With 89,178 logic elements, 6.84 Mbits of embedded SRAM, and dedicated 18x18 multipliers, the FPGA can implement protocol state machines, scatter-gather DMA engines, and on-card data processing. Designers typically instantiate the PCIe Compiler wizard in Quartus II and assign transceiver reference-clock pins per the Arria II GX pin-out file for clean jitter performance.
Recommended
Wireless Baseband Processing
The EP2AGX95DF25C4G fits wireless baseband subsystems that need high DSP throughput alongside high-speed serial I/O. Each 18x18 multiplier block plus the ALM fabric delivers tens of GMACs of processing power, sufficient for LTE PHY channels, digital up/down conversion, and Crest Factor Reduction (CFR) algorithms. The integrated transceivers handle CPRI/OBSAI fronthaul links up to 3.075 Gbps to remote radio heads. Designers should allocate 1-2 transceiver channels for CPRI, leaving the remainder for backhaul Ethernet or Interlaken connectivity, while meeting the Arria II GX power-tree decoupling guidelines.
Recommended
High-Definition Video Broadcast
Broadcast video systems handling SDI, HDMI, or DisplayPort streams at 3G-SDI and above benefit from the 89,178 LE capacity and 260 user I/O pins of the EP2AGX95DF25C4G. The device can ingest multiple SDI streams at 1080p60, perform color-space conversion and scaling using its dedicated DSP blocks, and output via integrated transceivers to a SMPTE 2022 IP network. Memory bandwidth from 6.84 Mbits of on-chip SRAM plus external DDR3 controllers suffices for line-buffering multiple HD frames simultaneously. Quartus II megafunctions provide ready-made SDI/HDMI IP to shorten design cycles.
Recommended
Serial RapidIO Switch Bridge
Serial RapidIO (SRIO) systems with multiple endpoints require a bridging device capable of switching up to four 1x or one 4x link. The EP2AGX95DF25C4G integrates SRIO Gen1 at 1.25/2.5/3.125 Gbps and supports endpoint and switch implementations natively. The 572-ball FCBGA package exposes enough transceiver pairs and general-purpose I/O for fan-out to multiple SRIO ports plus a control-plane processor interface. Designers implementing a 4x SRIO switch typically close timing in Quartus II at 80-85% logic utilization, leaving headroom for hot-spot mitigation.
Recommended
Industrial Imaging and Machine Vision
Machine vision systems employing Camera Link, CoaXPress, or GigE Vision interfaces benefit from the EP2AGX95DF25C4G's combination of transceivers and DSP blocks. The device can preprocess up to 4 Camera Link streams running at 85 MHz, performing Bayer demosaicing, white balance, and edge detection on-the-fly before forwarding to a host processor over PCIe. The 6.84 Mbit block memory buffer line data at gigabit rates without external memory contention. Industrial temperature-grade variants of the same package (EP2AGX95DF25I5G) extend operation to -40C to +100C for harsh factory environments.
Recommended
Military and Aerospace Signal Processing
Defense signal-processing applications requiring secure, deterministic hardware benefit from the EP2AGX95DF25C4G's encrypted bitstream support, SRAM-based configuration, and operational range that can be extended using industrial-grade variants. Typical implementations include radar pulse compression, electronic-warfare channelization, and SIGINT pre-processing. The 89K LE fabric plus 8 integrated transceivers is sufficient for a single-channel wideband receiver front-end at 1-2 GHz analog bandwidth. Designers requiring wider temperature ranges should select the I5 speed grade and validate thermal performance against MIL-STD-810 requirements.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX95DF25C4G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX95DF25C4N | EP2AGX95DF25C5G | EP2AGX95DF25I5G | EP2AGX95DF25C6G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 572-FCBGA | 572-FCBGA - same | 572-FCBGA - same | 572-FCBGA - same | 572-FCBGA - same |
| Logic Elements | 89178 | 89178 - same | 89178 - same | 89178 - same | 89178 - same |
| Total RAM Bits | 6839296 | 6839296 - same | 6839296 - same | 6839296 - same | 6839296 - same |
| User I/O | 260 | 260 - same | 260 - same | 260 - same | 260 - same |
| Speed Grade | C4 (fastest) | C4 (fastest) - same | C5 (-1) | I5 (industrial -1) | C6 (-3, 10% higher fmax) |
| Temperature Grade | Commercial 0C to +85C | Commercial 0C to +85C - same | Commercial 0C to +85C - same | Industrial -40C to +100C | Commercial 0C to +85C - same |
| Bitstream Encryption | Yes (AES-128) | No | Yes (AES-128) | Yes (AES-128) | Yes (AES-128) |
| Transceivers | Up to 8 | Up to 8 - same | Up to 8 - same | Up to 8 - same | Up to 8 - same |
Key Differentiators
- Bitstream encryption available in commercial temperature grade (vs EP2AGX95DF25C4N)
- Fastest speed grade C4 for maximum Fmax (vs EP2AGX95DF25C5G)
- Industrial temperature range available in identical package (vs EP2AGX95DF25I5G)
Design Notes
Estimated: at typical Arria II GX toggle rates around 25% the EP2AGX95DF25C4G in the 572-FCBGA package dissipates approximately 4-6 W of internal power from the core rail alone. Add 1-2 W for the transceiver analog supply when 4 channels are active. Designers must follow the Altera power-tree reference design: separate rails for VCC, VCCPD, VCCPT, VCCA, and per-bank VCCIO with extensive bulk decoupling (470 uF polymer plus 0.1 uF/10 nF ceramics).
The 572-ball FCBGA package has a theta_JA of approximately 8-10 C/W on a 4-layer JEDEC test board with airflow. Estimated: at 6 W internal dissipation and 1 m/s airflow, the junction-to-ambient temperature rise is about 48 C, leaving roughly 37 C of margin against the +85C commercial limit. Industrial variants must be re-evaluated against the +100C ceiling. Use a heatsink with thermal interface material for high-toggle-rate designs.
Route all eight transceiver differential pairs with controlled-impedance (100 ohm differential) traces and length matching to within 5 mils. Place the transceiver reference clock at a dedicated clock buffer and route it on inner-layer stripline to avoid coupling. The 572-FCBGA package requires via-in-pad or dog-bone fan-out with micro-vias below the BGA; minimum 0.5 mm pitch mandates ENIG finish with precise solder volume control.
Do not enable the bitstream encryption option on EP2AGX95DF25C4G and then attempt to use a non-encrypted C4N device in production - the encrypted configuration bitstream will not load. Always select the matching encryption option in the Quartus II Convert Programming Files step. Also, when migrating between speed grades, re-run timing closure for ALL corners; C4 vs C5 vs C6 timing models differ by up to 15%.
Compliance Information
RoHS compliant per Intel product page. AEC-Q100 not applicable - this is a commercial-grade FPGA. Industrial-grade I5 variants available for harsh-temperature environments but are not AEC-Q100 qualified.
