EP2AGX65DF25C6G - 60K Logic Elements FPGA | Altera | Arria II GX
MPN: EP2AGX65DF25C6G β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $184.6758 | $184.68 |
| 10 | $184.6758 | $1,846.76 |
| 100 | $184.6758 | $18,467.58 |
| 500 | $184.6758 | $92,337.90 |
| 1,000 | $184.6758 | $184,675.80 |
EP2AGX65DF25C6G Overview
An FPGA is a semiconductor device whose digital logic functions are defined through configuration rather than fixed fabrication. In the system hierarchy, an FPGA sits between processors, application-specific integrated circuits, and conventional programmable logic devices. Its configurable logic elements, embedded memory, and I/O resources let designers implement data paths, control logic, interfaces, and parallel processing functions in one device. The Arria II GX family extends this programmable architecture toward bandwidth-oriented communications and signal-processing applications.
The verified specifications identify 60,214 cells, 5,371,904 bits of embedded memory, and 252 I/O. The device is also described as a 400 MHz FPGA in distributor data. These characteristics make the part suitable where a design needs substantial parallel logic and local memory while retaining the ability to update or reconfigure hardware behavior. The 252-I/O capacity supports many parallel buses, control signals, and external interface connections.
EP2AGX65DF25C6G uses a 572-BGA, FCBGA construction. BGA packages provide high pin-count interconnect density but require careful solder-mask, via, reflow, inspection, and thermal-layout controls. The Arria II GX architecture is relevant to communications, industrial control, test equipment, image processing, and embedded systems requiring deterministic parallel processing. The verified data does not provide detailed transceiver count, operating voltage, temperature grade, speed-grade electrical limits, or configuration memory specifications.
A typical application may use the FPGA as a central processing and interface device, with configuration data loaded from external nonvolatile memory and I/O banks connected to memory, converters, or high-speed communication circuitry. Designers should verify bank-specific voltage limits, clocking resources, power sequencing, signal-integrity constraints, and thermal requirements against the manufacturer datasheet before releasing a board.
Pricing is distributor-dependent. DigiKey search data states that the part ships today, while LCSC displays a price from $184.6758 and IC-System-Inc.com displays an out-of-stock reference price of $791.86 for a quantity of 44 or more. These figures are not equivalent quotations and should not be combined as a single price list. Buyers should confirm current stock, packaging, and quantity pricing directly with the distributor.
This page consolidates the verified distributor specifications, package information, commercial availability signals, and practical implementation guidance for engineers sourcing and evaluating EP2AGX65DF25C6G.
Drop-in alternatives for EP2AGX65DF25C6G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX65DF25C6G (same form factor and footprint) β differing in Speed Grade, Package, Operating Temperature, RoHS Status, Process Technology.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2AGX65DF25C5N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$198.95 / Unit
View Datasheet βEP2AGX65DF25C5G
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View Datasheet βEP2AGX65DF25C4G
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$149.5 / Unit
View Datasheet βEP2AGX45DF29C6N
β Drop-Inβ In Stock
$175 / Unit
View Datasheet βEP2AGX125EF35C6N
β Drop-Inπ Reference alternative (not in catalog)
EP2AGX65DF25C6G Maximum Ratings & Electrical Characteristics
| Product Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Arria II GX |
| Logic Cells | 60214 cells |
| Embedded Memory | 5371904 bits |
| User I/O | 252 I/O |
| Maximum Frequency | 400 MHz |
| Package | 572-BGA, FCBGA |
| Package Ball Count | 572 balls |
| Mounting Type | Surface Mount |
| Manufacturer | Altera |
| Product Category | FPGA - Field Programmable Gate Array |
| RoHS Status | RoHS Compliant |
| Configuration Technology | SRAM-based FPGA |
EP2AGX65DF25C6G 572 balls Pin Configuration Guide
Pin configuration for EP2AGX65DF25C6G (572 balls package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX65DF25C6G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX65DF25C6G is suitable for 6 applications: Communications Interface Aggregation, Industrial Control and Automation, Test and Measurement Equipment, Image and Video Processing, Embedded Processing and Protocol Bridging, High-Density Digital Signal Processing.
Communications Interface Aggregation
EP2AGX65DF25C6G fits communications-interface aggregation because the verified listing provides 60,214 cells, 5,371,904 bits of embedded memory, and 252 I/O. Those resources allow parallel protocol processing, packet buffering, control logic, and multiple external bus or link interfaces in one programmable device. The Arria II GX family positioning supports communications-oriented designs, while the 400 MHz listing provides a useful preliminary performance reference. The FPGA can bridge processors, memory devices, converters, and line-interface circuitry while allowing logic changes late in development. Exact transceiver count, supported line rate, I/O voltage, and bank constraints are not included in the supplied data, so the designer must verify those parameters in the manufacturer datasheet before selecting the device for a production interface.
Recommended
Industrial Control and Automation
EP2AGX65DF25C6G is suitable for industrial control systems that need many deterministic digital inputs and outputs. Its verified 252 I/O count helps aggregate sensor buses, actuator controls, safety-interlock logic, machine-status signals, and communication interfaces without requiring several smaller programmable devices. The 60,214 cells and 5,371,904 bits of memory provide capacity for state machines, timing logic, protocol handlers, and local data buffering. The 572-BGA FCBGA package is appropriate for a dense control motherboard, but it requires controlled impedance, via escape, power integrity, and thermal design. The supplied data does not establish industrial temperature qualification, I/O voltage limits, or reliability certifications. Confirm those characteristics and perform timing closure for the worst-case clock and environmental conditions before release.
Recommended
Test and Measurement Equipment
EP2AGX65DF25C6G can support test and measurement equipment where multiple channels must be sampled, processed, timed, and forwarded with deterministic behavior. The verified 60,214 cells provide substantial logic capacity for trigger logic, counters, digital filters, encoders, and channel-control state machines. The 5,371,904 bits of embedded memory allow local buffering of measurement data, while 252 I/O support connections to converters, sensors, front-end devices, and high-speed data paths. A 400 MHz listing is available, but it should not be interpreted as a guaranteed application clock without reviewing the speed-grade timing model. The 572-ball FCBGA construction enables dense channel integration but demands careful power distribution, signal return paths, clock distribution, and thermal analysis. The manufacturer datasheet must confirm I/O standards, voltage ranges, and supported clocking resources.
Recommended
Image and Video Processing
EP2AGX65DF25C6G is a plausible platform for image and video preprocessing because it combines 60,214 logic cells, 5,371,904 bits of embedded memory, 252 I/O, and a listed 400 MHz frequency. Parallel pixel processing, line buffers, color-space conversion, filtering, and frame-control logic can be mapped across the FPGAβs programmable resources. The high I/O count helps connect camera interfaces, frame buffers, displays, processors, and test points. The Arria II GX family provides a programmable architecture for evolving video formats and customer-specific processing, but the verified data does not state supported memory interfaces, serializer/deserializer resources, transceiver count, or signal-integrity limits. Designers should estimate memory bandwidth, clock domains, and I/O utilization, then validate pin assignments and timing against the exact device documentation.
Recommended
Embedded Processing and Protocol Bridging
EP2AGX65DF25C6G can be used as an embedded processing and protocol-bridging device when a system needs custom hardware control alongside a host processor. The verified 60,214 cells support accelerators, interface controllers, protocol conversion, and glue logic, while 5,371,904 bits of memory provide local storage for FIFOs, lookup tables, and temporary data. The 252 I/O count allows connection to memory, sensors, converters, and multiple peripheral buses. A 400 MHz listed frequency provides a reference point for early planning, but actual performance depends on the implemented logic, clock resources, I/O standards, and timing constraints. The 572-BGA FCBGA package permits dense interconnect but creates assembly and signal-integrity challenges. Confirm the configuration method, supported I/O standards, power rails, and exact package ball map before schematic capture.
Recommended
High-Density Digital Signal Processing
EP2AGX65DF25C6G can serve high-density digital signal processing designs that benefit from parallel arithmetic and configurable data paths. The verified 60,214 cells, 5,371,904 bits of embedded memory, and 252 I/O support filters, correlators, encoders, modulation functions, control logic, and multi-channel data movement. The 400 MHz listing can be used as a preliminary performance input for architecture studies, but the final clock rate must come from the manufacturer timing data and the selected speed grade. Memory bandwidth, pipeline depth, I/O placement, and thermal behavior can limit practical throughput even when logic capacity is sufficient. The 572-ball FCBGA package provides dense connectivity for multi-channel systems, while also requiring careful power integrity and thermal design. The supplied data does not specify DSP block count, transceiver resources, or maximum operating temperature, so those details remain datasheet-dependent.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX65DF25C6G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX65DF25C5N | EP2AGX65DF25C5G | EP2AGX65DF25C4G | EP2AGX45DF29C6N | EP2AGX125EF35C6N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Source Availability | DigiKey states buy now and ships today | Site MPN listed; stock not verified | Site MPN listed; stock not verified | Site MPN listed; stock not verified | Comparison result only; stock not verified | Comparison result only; stock not verified |
Key Differentiators
- Large verified logic capacity (vs EP2AGX45DF29C6N)
- High verified I/O count (vs EP2AGX45DF29C6N)
- Listed 400 MHz performance (vs EP2AGX65DF25C4G)
- Verified embedded-memory resource (vs EP2AGX125EF35C6N)
Design Notes
Start the PCB layout from the exact manufacturer package drawing because the verified listing identifies a 572-BGA FCBGA but does not provide a complete ball map. Confirm ball numbering, dimensions, land pattern, power pins, ground pins, configuration pins, and high-speed escape rules. Use the manufacturer-recommended via and solder-mask structure, preserve a continuous reference plane, and review differential-pair geometry before schematic release. The BGA package supports dense routing but makes layer transitions and return-path continuity critical.
Create a power-distribution budget before layout. The supplied data verifies 60,214 cells, 5,371,904 bits of memory, 252 I/O, and a 400 MHz listing, but it does not provide core voltage, I/O voltage, current consumption, or power sequencing. Use the manufacturer power-estimation flow for the synthesized design, then validate rail tolerances, decoupling placement, and startup behavior on the bench. Do not substitute nominal FPGA current limits for application-specific dynamic-current requirements.
Thermal validation is required for the 572-BGA FCBGA, especially when using many logic cells, memory resources, and 252 I/O at high switching activity. The retrieved data does not specify thermal resistance, maximum junction temperature, or recommended airflow. Perform a board-level thermal estimate using the actual power map, copper area, via structure, enclosure, and ambient temperature. Use the manufacturer package and thermal documentation to set the allowable temperature rise and cooling strategy before production release.
The 400 MHz listing is a preliminary device reference, not a guarantee that every logic path will operate at that frequency. Set timing constraints for each clock domain, verify setup and hold timing after place-and-route, and separate high-speed outputs from sensitive inputs where the board stack-up allows. Confirm the supported I/O standards, termination requirements, clock resources, and signal-integrity guidelines in the exact EP2AGX65DF25C6G datasheet. Measure critical lanes on prototypes rather than relying only on simulation.
Do not assume that a related Arria II ordering code is automatically a drop-in replacement. The supplied data identifies the target as 60,214 cells, 5,371,904 bits of memory, 252 I/O, 400 MHz, and a 572-BGA FCBGA, but the alternative search results do not establish complete ball maps or electrical equivalence. Check package dimensions, ball function, I/O-bank compatibility, configuration method, timing grade, power rails, and thermal specifications. Treat a distributor comparison page as a screening aid, not as a production approval record.
Compliance Information
RoHS compliance is identified in the verified IC-System-Inc.com result. REACH, AEC-Q100, lead-free, halogen-free, and conflict-minerals information is not supplied and remains unknown.
