EP2AGX65CU1713N - Arria II GX FPGA 65K LE BGA-1713 | Altera
MPN: EP2AGX65CU1713N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $147.016 | $147.02 |
| 10 | $138.5 | $1,385.00 |
| 100 | $125 | $12,500.00 |
| 500 | $110 | $55,000.00 |
| 1,000 | $95 | $95,000.00 |
EP2AGX65CU1713N Overview
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, programmable I/O, and dedicated hard-IP blocks such as transceivers, memory controllers, and DSP slices. The Arria II GX family belongs to the mid-range tier of Altera's FPGA portfolio, positioned below the high-end Stratix series and above the low-power Cyclone series, and optimized for cost-sensitive applications that still demand integrated transceivers and DSP capability.
Key features include 2,620 Kbit of embedded SRAM, 12 PLLs, 8 transceiver channels supporting data rates from 600 Mbps to 3.125 Gbps, hard IP for PCI Express Gen1 (x1, x4) and Gen2 (x1, x4), and dedicated 6x9-bit to 36x36-bit hardware multipliers for DSP. The device supports up to 612 user I/Os arranged across multiple I/O banks with LVDS, LVPECL, HSTL, SSTL, and LVCMOS standards. Configuration is supported via JTAG, AS, PS, and FPP modes, with on-chip 8-bit CRC and bitstream encryption (AES-128/256).
The Arria II GX architecture features dedicated transceiver physical coding sublayer (PCS) blocks, dynamic reconfiguration support via Partial Reconfiguration, and SignalTap II embedded logic analyzer capability. The 1713-ball BGA package uses flip-chip technology with a 40 mm x 40 mm body, providing high I/O count and excellent thermal performance.
Typical applications include wireless baseband processing, video broadcast equipment, industrial imaging, military radar signal processing, and PCI Express endpoint cards. The integrated transceivers make it particularly suitable for serial backplane interfaces, SRIO, CPRI, and Aurora protocol applications.
When designing with this device, pay close attention to transceiver reference clock jitter, PCB laminate selection for SerDes channels, and thermal management of the 1713-ball BGA. The BGA package requires X-ray inspection during PCB assembly.
This page synthesizes distributor pricing, drop-in alternatives from the Arria II GX family, and practical design notes that complement the manufacturer datasheet for procurement and engineering decisions.
Drop-in alternatives for EP2AGX65CU1713N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX65CU1713N (same form factor and footprint) β differing in Operating Temperature, Package, Logic Elements (LE), Transceiver Channels, Process Technology.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2AGX65CU1717N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP2AGX65CU1713G
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP2AGX65CU1713I
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP2AGX65CU1715N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP2AGX65CU1713ES
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP2AGX65CU1713N Maximum Ratings & Electrical Characteristics
| Family | Arria II GX |
| Logic Elements (LE) | 65,210 |
| Embedded Memory (bits) | 2,620,800 (2,560 Kb M9K + 130 Kb MLAB) |
| Multi-Gigabit Transceivers | 8 |
| Transceiver Data Rate | 600 Mbps to 3.125 Gbps |
| PLLs | 12 |
| Hardware Multipliers (18x18) | 312 |
| Maximum User I/O | 612 |
| PCI Express Hard IP | Yes (Gen1/Gen2 x1, x4) |
| Process Technology | 40 nm |
| Package | 1713-ball FCBGA, 40 mm x 40 mm |
| Operating Temperature | 0C to +85C (commercial, suffix N) |
| Configuration | JTAG / AS / PS / FPP |
| Bitstream Encryption | AES-128 / AES-256 |
| RoHS Status | Compliant |
| Supply Voltage | 0.9 V core / 1.1 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) |
EP2AGX65CU1713N 1713-ball fcbga, 40 mm x 40 mm Pin Configuration Guide
Pin configuration for EP2AGX65CU1713N (1713-ball fcbga, 40 mm x 40 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX65CU1713N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX65CU1713N is suitable for 6 applications: Wireless Baseband Processing, Video Broadcast Equipment, PCI Express Endpoint Cards, Industrial Imaging and Machine Vision, Serial RapidIO Backplane Switching, Test and Measurement Instrumentation.
Wireless Baseband Processing
The EP2AGX65CU1713N's 8 multi-gigabit transceivers (up to 3.125 Gbps) and 312 18x18 hardware multipliers make it ideal for wireless baseband signal processing in LTE small cells and picocells. The 65k logic elements support wide datapath parallelism for FFT/iFFT engines and channel coding (Turbo/Viterbi/LDPC), while the 2,620 Kbit embedded memory enables sample buffering on-chip. Transceiver PCS hard IP supports CPRI and OBSAI protocols for direct connection to RF front-end cards. The 1713-ball BGA provides high I/O count for parallel antenna interface data and high-speed serial backhaul links.
Recommended
Video Broadcast Equipment
The EP2AGX65CU1713N supports professional video broadcast applications including SDI (Serial Digital Interface) at 270 Mbps, HD-SDI at 1.485 Gbps, and 3G-SDI at 2.97 Gbps, all of which fit comfortably within the 3.125 Gbps transceiver capability. The 312 dedicated 18x18 multipliers accelerate video processing kernels such as deinterlacing, scaling, and color space conversion. The on-chip memory and 612 user I/Os enable simultaneous processing of multiple video streams. The 1713-ball BGA package's thermal performance is suitable for broadcast equipment chassis with forced-air cooling.
Recommended
PCI Express Endpoint Cards
The EP2AGX65CU1713N integrates PCI Express Gen1 (x1, x4) and Gen2 (x1, x4) hard IP blocks, enabling direct implementation of PCIe endpoint cards without external PHY. The 8 transceivers can simultaneously drive PCIe x4 plus additional serial links such as SATA or Aurora. With 65k LE and 2,620 Kbit memory, the device accommodates DMA engines, descriptor processing, and protocol stack implementation. The 1713-ball BGA supports the lane and sideband signal count required for PCIe x4 plus reference clock, JTAG, and configuration pins.
Recommended
Industrial Imaging and Machine Vision
The EP2AGX65CU1713N's 65k logic elements and 612 user I/Os are well-suited for multi-camera machine vision systems processing Camera Link, CoaXPress, or GigE Vision streams. The 8 transceivers support CoaXPress up to 3.125 Gbps per link, enabling connection of multiple high-resolution cameras. The 312 hardware multipliers accelerate image preprocessing such as Bayer demosaicing, color correction, and edge detection. Industrial temperature variants (I-suffix) of the same die extend deployment to factory floor environments. The 1713-ball BGA package provides robust thermal performance for continuous operation.
Recommended
Serial RapidIO Backplane Switching
The EP2AGX65CU1713N's transceiver PCS supports Serial RapidIO (SRIO) at 1.25 Gbps, 2.5 Gbps, and 3.125 Gbps, making it suitable for embedded computing backplanes in military and aerospace systems. With 8 transceiver channels, the device can implement multi-port SRIO switches or endpoint bridging to PCIe and Aurora. The 65k logic elements handle packet processing, DMA, and protocol stack implementation. Hardware multipliers accelerate DSP preprocessing for radar or signal intelligence payloads sharing the same backplane.
Recommended
Test and Measurement Instrumentation
The EP2AGX65CU1713N serves as a flexible processing core in test and measurement equipment such as protocol analyzers, logic analyzers, and high-speed digitizers. The 8 transceivers enable multi-lane data capture and generation across protocols (PCIe, USB 3.0, SRIO, SATA, custom). The 2,620 Kbit embedded memory provides deep sample buffer support, and the 312 hardware multipliers enable real-time DSP for trigger detection, pattern matching, and statistical analysis. SignalTap II logic analyzer hard IP allows internal signal visibility without external probing.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX65CU1713N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX65CU1717N | EP2AGX65CU1713G | EP2AGX65CU1713I | EP2AGX65CU1715N | EP2AGX125EF35I5N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Package | 1713-ball FCBGA (40x40 mm) | 1713-ball FCBGA (40x40 mm) | 1713-ball FCBGA (40x40 mm) | 1713-ball FCBGA (40x40 mm) | 1713-ball FCBGA (40x40 mm) | 1152-ball FCBGA - DIFFERENT |
| Logic Elements | 65,210 | 65,210 | 65,210 | 65,210 | 65,210 | 125,000 (+92%) |
| Transceivers | 8 (up to 3.125 Gbps) | 8 (up to 3.125 Gbps) | 8 (up to 3.125 Gbps) | 8 (up to 3.125 Gbps) | 8 (up to 3.125 Gbps) | 12 (+50%) |
| Embedded Memory | 2,620 Kbit | 2,620 Kbit | 2,620 Kbit | 2,620 Kbit | 2,620 Kbit | 5,140 Kbit (+96%) |
| Hardware Multipliers (18x18) | 312 | 312 | 312 | 312 | 312 | 576 (+85%) |
| Speed Grade | -3 (C3, slowest) | -7 (faster) | -3 (C3) | -3 (I3) | -5 (faster) | -5 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
Key Differentiators
- Mid-range density with full transceiver capability in 1713-ball BGA (vs EP2AGX45DF25C6N)
- Lower density but same 1713-ball footprint as higher-tier parts (vs EP2AGX125EF35I5N)
- PCI Express hard IP eliminates external PHY cost (vs Discrete PCIe implementation)
Design Notes
The 1713-ball FCBGA package requires careful thermal management. Estimated: at full utilization (65k LE @ 100% toggle, 8 transceivers at 3.125 Gbps), total power dissipation may reach 10-15W. A multi-layer PCB with dedicated thermal vias under the BGA and forced-air cooling of at least 2 m/s airflow is recommended. Without thermal vias and a heatsink, junction temperature can exceed 100C under load. Refer to Altera's PowerPlay Early Power Estimator for design-specific thermal analysis.
PCB design for the 1713-ball FCBGA must use high-density interconnect (HDI) with microvia technology. The 1.0 mm ball pitch requires laser-drilled microvias in the top layers and stacked microvia structures for escape routing. Use a low-loss laminate (Df < 0.005 at 1 GHz) such as Megtron 6 or Rogers RO4350B for transceiver channels. Maintain 100 ohm differential impedance for SerDes pairs with length matching within 5 mils. X-ray inspection is mandatory after BGA assembly to verify solder joint integrity.
Transceiver channels require AC-coupled routing with 0.1 uF capacitors at the transmitter outputs per Altera reference design. Reference clock jitter must be kept below 0.7 ps RMS for 3.125 Gbps operation. Use a dedicated low-noise clock source such as a SiLabs Si530 or Skyworks SKY72310. Power supply decoupling requires 0.1 uF + 10 uF capacitors within 5 mm of each transceiver power pin, with ferrite beads separating analog and digital transceiver supplies.
Do not assume the 1713-ball BGA is pin-compatible with other Arria II GX packages - the EP2AGX65 is also offered in 780-ball and 1152-ball BGA packages with different pin assignments. When migrating between speed grades, re-run Quartus II timing analysis since Fmax differs between -3, -5, and -7 grades. Industrial temperature (I) suffix is mandatory for outdoor or industrial deployments; commercial (N) parts may fail outside 0C to +85C.
Compliance Information
RoHS and lead-free compliant per Altera/Intel PSG product declarations. NRND status per 2026-09-08 vendor information - not recommended for new designs but supported for existing customers.
