EP2AGX65DF25I6N - Arria II GX FPGA 65K LE, 572-FCBGA | Intel/Altera
MPN: EP2AGX65DF25I6N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $850 | $850.00 |
| 10 | $780 | $7,800.00 |
| 100 | $710 | $71,000.00 |
| 500 | $645 | $322,500.00 |
| 1,000 | $595 | $595,000.00 |
EP2AGX65DF25I6N Overview
A field-programmable gate array is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected through programmable interconnect. Modern FPGAs add embedded RAM blocks, DSP blocks, clock management PLLs, high-speed transceivers, and hard PCIe/DRAM controllers. In the broader taxonomy, the EP2AGX65DF25I6N is an FPGA, a member of the programmable logic family (which includes CPLDs and one-time-programmable devices), under the larger category of programmable logic devices (PLDs) within the semiconductor hierarchy. The Arria II GX series positioned itself between Cyclone (low-cost) and Stratix (high-performance) families.
Key features include 364 18x18 multipliers total in some device variants, 8 full-duplex transceivers from 600 Mbps to 6.375 Gbps supporting PCIe Gen1/Gen2, CPRI, SATA, and XAUI, 4 PCI Express hard IP blocks, 4 PLLs, and 12 global clock networks. The device operates from a 0.9 V core supply with separate transceiver and auxiliary supplies and supports the LVDS, LVTTL, LVCMOS, and SSTL I/O standards through configurable I/O banks.
The Arria II GX architecture is built on a 65 nm low-power TSMC process with 9-metal-layer copper interconnect. The transceiver blocks are hard IP implementing serial PMA and PCS with embedded 8B/10B encoding, word alignment, rate matching, and channel bonding. This hard-serializer/deserializer integration reduces the LE cost of multi-gigabit interfaces by 30-50% compared to soft IP-based implementations in earlier families, while delivering deterministic latency critical for real-time video and industrial protocols.
Typical applications include wireless baseband processing where 6.375 Gbps transceivers connect to mixed-radio cards, broadcast video routers and format converters using SMPTE SDI links, military secure-radio and signal-intelligence platforms, industrial machine-vision frame grabbers, and PCIe-based DSP accelerator cards for medical imaging. The 572-FCBGA package exposes sufficient I/O for multi-channel high-speed serial designs plus parallel LVDS data paths.
When designing with this part, reserve a 4-layer PCB with controlled-impedance 100-ohm differential routing for transceiver channels; provide isolated analog supplies for the transceiver PLLs; and use the Quartus II design software (13.0sp1 or later) for synthesis, place-and-route, and timing closure. Designers migrating to newer families should evaluate Cyclone V GT or Arria V GZ as drop-in transceiver upgrades with higher data rates and lower core power.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the EP2AGX65DF25I6N not found in the manufacturer datasheet alone.
Drop-in alternatives for EP2AGX65DF25I6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX65DF25I6N (same form factor and footprint) — differing in Package, Speed Grade, Process Technology, Transceivers, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2AGX65DF25I5N
✅ Drop-In✓ In Stock
$192 / Unit
View Datasheet →EP2AGX65DF25C6N
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View Datasheet →EP2AGX65DF25C6G
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View Datasheet →EP2AGX65DF25I3N
✅ Drop-In✓ In Stock
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View Datasheet →EP2AGX125DF25I5G
✅ Drop-In✓ In Stock
$295 / Unit
View Datasheet →EP2AGX45DF25C6N
✅ Drop-In✓ In Stock
$263.5 / Unit
View Datasheet →EP2AGX65DF25I6N Maximum Ratings & Electrical Characteristics
| Device Family | Arria II GX |
| Logic Elements (LE) | 60,214 |
| Embedded Memory (bits) | 5,371,904 |
| Embedded 18x18 Multipliers | 252 |
| High-Speed Transceivers | 8 |
| Transceiver Data Rate | 600 Mbps to 6.375 Gbps |
| PCIe Hard IP Blocks | 4 |
| PLLs | 4 |
| Global Clock Networks | 12 |
| Core Supply Voltage | 0.9 V |
| Operating Temperature | -40C to +100C (Industrial) |
| Speed Grade | 6 |
| Package | 572-ball FCBGA |
| Process Technology | 65 nm |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
EP2AGX65DF25I6N 572-ball fcbga Pin Configuration Guide
Pin configuration for EP2AGX65DF25I6N (572-ball fcbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX65DF25I6N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX65DF25I6N is suitable for 6 applications: Wireless Baseband Processing, Broadcast Video Routers and Format Converters, PCIe DSP Accelerator Cards, Industrial Machine-Vision Frame Grabbers, Military Secure-Radio Signal Processing, Test and Measurement Instrumentation.
Wireless Baseband Processing
The EP2AGX65DF25I6N's 8 transceivers at 6.375 Gbps and 4 PCIe hard IP blocks make it well-suited for wireless baseband cards in distributed base stations and small-cell platforms. The 60,214 logic elements comfortably implement multi-antenna (2x2/4x4 MIMO) digital up/down-conversion, CFR, and DPD algorithms, while the 252 18x18 multipliers handle the FFT/iFFT and channel-filter DSP. The transceiver PMA/PCS hard IP eliminates the need for external SerDes, reducing BOM cost and PCB area. Reference designs from Altera show CPRI observation paths at 4.9152 Gbps using 2 of the 8 transceivers, with the remaining channels available for backhaul Ethernet or inter-card sync. The industrial temperature grade supports outdoor base-station deployment without additional thermal management.
Recommended
Broadcast Video Routers and Format Converters
SMPTE SDI standards (259M, 292M, 424M) require multi-gigabit serial links at 270 Mbps, 1.485 Gbps, and 2.97 Gbps, all of which the EP2AGX65DF25I6N's 6.375 Gbps transceivers handle natively. With 60K logic elements and 252 multipliers, a single device can implement an 8-channel SDI router with embedded audio de-embed, frame-sync, and format up-conversion between SD/HD/3G-SDI. The 5,371,904 bits of embedded memory provide line buffers and audio FIFOs without external SRAM. The 572-ball FCBGA exposes sufficient LVDS pairs for parallel GPI control surfaces common in broadcast routers. Industrial temperature rating allows installation in unventilated equipment-room racks.
Recommended
PCIe DSP Accelerator Cards
The 4 integrated PCIe hard IP blocks in the EP2AGX65DF25I6N support PCIe Gen1 (2.5 Gbps) and Gen2 (5 Gbps) x1/x4 endpoints without consuming any logic elements. Combined with 252 18x18 multipliers, the device can implement a low-latency DSP accelerator for medical imaging reconstruction (filtered back-projection), radar pulse compression, or financial Monte Carlo simulation. Gen2 x4 delivers 2 GB/s of host-to-card bandwidth, matching DDR2/DDR3 controller bandwidth. The 572-FCBGA exposes 4 transceiver channels for inter-card Aurora links, enabling multi-FPGA compute clusters. Industrial temperature grade is useful for defense and medical chassis without active cooling.
Recommended
Industrial Machine-Vision Frame Grabbers
Multi-camera machine-vision systems require deterministic, low-latency image acquisition. The EP2AGX65DF25I6N's 6.375 Gbps transceivers accept CoaXPress (up to 6.25 Gbps) or Camera Link HS (up to 10 Gbps via aggregated channels), while the 5.37 Mbit of embedded memory holds line buffers and Bayer-pattern color reconstruction tables. The 252 18x18 multipliers handle real-time 5x5 convolution kernels and Sobel edge detection. GigE Vision interfaces can be implemented on remaining transceivers using soft 1G Ethernet MACs. The industrial temperature range and 572-FCBGA package with adequate I/O make it suitable for fanless factory-floor enclosures.
Recommended
Military Secure-Radio Signal Processing
Tactical software-defined radio platforms benefit from the EP2AGX65DF25I6N's combination of 8 transceivers, embedded DSP, and industrial temperature range. The device can implement multi-channel IF digitization, channelization polyphase filter banks, and digital up/down-conversion for 2-4 simultaneous waveforms. The 6.375 Gbps transceivers interface to wideband ADCs/DACs such as the AD9680 or AD9144 over JESD204B (subclass 1) at lane rates up to 6.25 Gbps. The 4 PCIe endpoints connect to secure crypto modules or to an external CPU running the waveform library. Industrial temperature and lead-free compliance support MIL-STD-810 environmental requirements.
Recommended
Test and Measurement Instrumentation
High-end oscilloscopes, logic analyzers, and protocol analyzers need FPGA-based real-time signal processing. The EP2AGX65DF25I6N's 8 transceivers interface to high-speed ADCs over JESD204B, while the 252 multipliers support real-time FFT, eye-diagram histogram, and trigger detection. The 5.37 Mbit of embedded memory holds multi-megasample acquisition buffers in block-mode scopes. The 4 PCIe endpoints stream captured waveforms to the host at 2 GB/s (Gen2 x4). Industrial temperature supports benchtop and portable instrument enclosures. The Quartus II toolchain supports protocol IP for PCIe, USB 3.0 (via external PHY), and 10 GigE, enabling complete instrument front-end implementations.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX65DF25I6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX65DF25I5N | EP2AGX65DF25C6N | EP2AGX65DF25C6G | EP2AGX65DF25I3N | EP2AGX125DF25I5G | EP2AGX45DF25C6N |
|---|---|---|---|---|---|---|---|
| Package | 572-ball FCBGA | 572-ball FCBGA - same | 572-ball FCBGA - same | 572-ball FCBGA - same | 572-ball FCBGA - same | 572-ball FCBGA - same | 572-ball FCBGA - same |
| Brand | Altera (Intel) | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 60,214 | 60,214 | 60,214 | 60,214 | 60,214 | 125,000 | 45,000 |
| Transceivers | 8 @ 6.375 Gbps | 8 @ 6.375 Gbps | 8 @ 6.375 Gbps | 8 @ 6.375 Gbps | 8 @ 6.375 Gbps | 12 @ 6.5536 Gbps | 8 @ 6.375 Gbps |
| Embedded Memory (bits) | 5,371,904 | 5,371,904 | 5,371,904 | 5,371,904 | 5,371,904 | 8,121,216 | 3,510,144 |
| 18x18 Multipliers | 252 | 252 | 252 | 252 | 252 | 480 | 192 |
| Speed Grade | 6 | 5 (faster) | 6 | 6 | 3 (fastest) | 5 | 6 |
| Temperature Range | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
Key Differentiators
- Mid-density logic with 8 hard transceivers in a single package (vs EP2AGX45DF25C6N)
- Industrial temperature range for harsh environments (vs EP2AGX65DF25C6N)
- Speed grade 6 balances cost and timing margin (vs EP2AGX65DF25I3N)
Design Notes
The 572-ball FCBGA package uses 1.0 mm ball pitch and requires a 4-layer minimum PCB with microvia stack-ups for breakout routing. According to the Arria II GX Device Handbook, the transceiver channels need 100-ohm differential controlled-impedance traces with intra-pair skew under 2 ps and length matching within 150 mils across the 8 channels. AC-coupling capacitors (typically 100 nF 0402) must be placed close to the transmit differential pair, and the receiver pair must be DC-coupled to the FPGA pins per the reference schematic.
The EP2AGX65DF25I6N requires three independent power rails: VCC (0.9 V core, up to 5 A peak), VCCPD (2.5 V or 3.0 V pre-driver), and VCCIO (1.2 V to 3.3 V per bank). The transceiver blocks additionally need VCCEHT (1.2 V), VCCA (2.5 V analog), and VCCR (1.1 V receiver) supplies, each filtered with ferrite beads and bulk decoupling. According to the Arria II GX Device Handbook power-supply design guide, use a sequencer IC to enforce the 200 ms VCC-before-VCCPD power-up requirement; failing this sequence can cause permanent device damage.
Estimated: total device power for a 60% utilization design with 6 active transceivers at 5 Gbps is typically 6-8 W. The FCBGA package has thermal resistance theta-JA of approximately 8 C/W with a 12-layer JEDEC test board, so junction rise is 48-64 C above ambient at full load. The 'I' (industrial) suffix guarantees operation to 100C junction, but 24/7 maximum-load operation without airflow or heat sink can exceed the thermal envelope. Use the Altera PowerPlay Early Power Estimator spreadsheet before board layout to verify thermal headroom. Incorrect configuration of the MSEL pins latches the device into an unsupported POR mode - always tie MSEL[4:0] to the values listed in the datasheet Table 9-1 for the desired configuration scheme.
Compliance Information
RoHS compliant per Altera/Intel product declaration. Not AEC-Q100 qualified (automotive grade not available for this FPGA family). Lead-free reflow-compatible.
