EP2AGX95DF25I3G - Arria II GX FPGA, 95K LE, 572-FCBGA | Intel
MPN: EP2AGX95DF25I3G ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1222.1 | $1,222.10 |
| 10 | $1180 | $11,800.00 |
| 50 | $1140 | $57,000.00 |
| 100 | $1100 | $110,000.00 |
| 500 | $1020 | $510,000.00 |
EP2AGX95DF25I3G Overview
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit whose digital logic fabric, routing interconnect, and I/O behavior are configured by the end user after manufacture. Within the broader semiconductor hierarchy, an FPGA sits alongside ASICs as a programmable logic device, offering hardware-level parallelism that microcontrollers and DSPs cannot match for high-throughput, low-latency workloads. The Arria II GX family specifically targets transceiver-rich applications in communications, broadcast, and high-end industrial imaging.
Key features of the EP2AGX95DF25I3G include a high logic-to-I/O ratio suitable for parallel interface bridging, embedded memory blocks capable of buffering multi-gigabit data streams, hard IP for PCI Express and multiple high-speed serial protocols, and the FCBGA package's flip-chip thermal path that enables higher sustained junction temperatures under transceiver load. The 'I3G' suffix denotes the industrial temperature range (-40C to +100C ambient for transceiver-grade parts) and lead-free, RoHS-compliant terminal finish.
The device's architecture combines a fine-grained logic fabric with hard silicon IP for transceivers, memory controllers, and DSP blocks, allowing deterministic timing closure at multi-hundred-megahertz system clock rates. Power consumption scales with toggle rate and transceiver utilization, and the FCBGA package's exposed-die flip-chip construction provides a low thermal resistance path to the board for heatsink attachment in high-duty-cycle designs.
Typical applications include 10G Ethernet line cards, wireless baseband processing, high-speed data acquisition front-ends, broadcast video routing matrices, and PCIe Gen1/Gen2 endpoint cards. The wide transceiver count and rich memory make it well suited to systems where soft logic alone would not close timing on parallel-to-serial conversion paths.
When designing with this device, ensure the PCB uses a high-layer-count stack-up to fan out the 572-ball grid and that thermal vias under the package die are properly sized to extract heat from the flip-chip BGA. Power-supply decoupling requires dedicated regulator sequencing because Arria II GX transceivers demand sub-millivolt ripple on their analog supply rails. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for EP2AGX95DF25I3G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX95DF25I3G (same form factor and footprint) — differing in Package, Operating Temperature, Logic Elements, Speed Grade, DSP Blocks.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2AGX95DF25I5G
✅ Drop-In✓ In Stock
$760 / Unit
View Datasheet →EP2AGX95DF25I5N
✅ Drop-In✓ In Stock
$636.37 / Unit
View Datasheet →EP2AGX95DF25C6N
✅ Drop-In✓ In Stock
$1750 / Unit
View Datasheet →EP2AGX95DF25C6G
✅ Drop-In✓ In Stock
$290 / Unit
View Datasheet →EP2AGX95DF25C5G
✅ Drop-In✓ In Stock
$768.9 / Unit
View Datasheet →EP2AGX95DF25C4G
✅ Drop-In✓ In Stock
$360 / Unit
View Datasheet →EP2AGX125DF25I3G
✅ Drop-In✓ In Stock
$895 / Unit
View Datasheet →EP2AGX65DF25I3G
✅ Drop-In✓ In Stock
$920 / Unit
View Datasheet →EP2AGX95DF25I3G Maximum Ratings & Electrical Characteristics
| Family | Arria II GX |
| Logic Elements | 89,178 |
| Embedded Memory Bits | 6,839,296 |
| User I/O Count | 260 |
| Package | 572-ball FCBGA |
| Speed Grade | I3 |
| Temperature Grade | Industrial |
| Operating Temperature | -40C to +100C |
| Mounting Type | Surface Mount (Flip-Chip BGA) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Configuration Method | Serial/Parallel via Altera Quartus II |
EP2AGX95DF25I3G 572-ball fcbga Pin Configuration Guide
Pin configuration for EP2AGX95DF25I3G (572-ball fcbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX95DF25I3G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX95DF25I3G is suitable for 6 applications: 10G Ethernet Line Card, Wireless Baseband Processing, High-Speed Data Acquisition Front-End, Broadcast Video Routing Matrix, PCIe Gen1/Gen2 Endpoint Card, Industrial Imaging and Machine Vision.
10G Ethernet Line Card
The EP2AGX95DF25I3G's integrated multi-gigabit transceivers and PCI Express hard IP make it a strong fit for 10G Ethernet line cards in switch and router platforms. With 89,178 logic elements and 6,839,296 bits of embedded memory, it can implement MAC, PCS, and traffic-management blocks alongside the soft logic for QoS queues. Placed as the main fabric between PHY and switch ASIC, it closes timing at the 156.25 MHz reference clock required for 10GBASE-R. The I3 industrial speed grade supports line-card chassis operating at 0-55C ambient with internal airflow.
Recommended
Wireless Baseband Processing
The EP2AGX95DF25I3G suits wireless baseband processing in small-cell and LTE/3G picocell base stations where its logic density and DSP blocks handle PHY-layer scrambling, channel coding, and FFT/iFFT datapaths. Its embedded memory (6,839,296 bits) buffers OFDM symbols between FFT and channel-decoder stages, while integrated transceivers interface to RF front-end ADCs/DACs and CPRI/OBSAI links to baseband units. The -40C to +100C industrial temperature range supports outdoor small-cell deployments. Quartus II DSP Builder accelerates the floating-to-fixed-point conversion.
Recommended
High-Speed Data Acquisition Front-End
The EP2AGX95DF25I3G is well-suited to high-speed data acquisition front-ends that digitize signals from multi-gigasample ADCs and route them into host memory via PCI Express. Its 89,178 logic elements handle waveform preprocessing, digital down-conversion, and trigger logic, while the embedded memory buffers bursts between ADC sample bursts and PCIe DMA transfers. The FCBGA package's flip-chip thermal path supports continuous high-toggle-rate operation at full transceiver utilization, important for 24/7 acquisition systems in test and measurement.
Recommended
Broadcast Video Routing Matrix
The EP2AGX95DF25I3G supports broadcast video routing matrices where SDI and HDMI streams must be switched, processed, and re-multiplexed under broadcast-house timing constraints. Its high logic count and embedded memory let it implement crosspoint switching fabrics with embedded audio de-embed/embed, frame-store, and color-space conversion. Multi-gigabit transceivers carry 3G-SDI and UHD-SDI streams while general-purpose I/O drives HDMI ports. The industrial temperature rating suits studio equipment racks where ambient can drift above commercial limits.
Recommended
PCIe Gen1/Gen2 Endpoint Card
The EP2AGX95DF25I3G includes hard PCI Express IP that accelerates endpoint card development for Gen1/Gen2 x4 or x8 lanes. The 89K logic elements implement DMA engines, BAR mapping, MSI/MSI-X interrupt handling, and the device-specific payload while the transceiver-based PHY delivers compliant Gen2 signaling at 5 Gbps. Designers can use Quartus II's PCIe IP Compiler to configure endpoint or rootport modes. The F25 FCBGA package integrates well on standard server-card PCB stack-ups.
Recommended
Industrial Imaging and Machine Vision
The EP2AGX95DF25I3G fits industrial imaging and machine vision pipelines where Camera Link, CoaXPress, or GigE Vision streams must be ingested and preprocessed before forwarding to a host. Its transceivers handle CoaXPress up to 6.25 Gbps per lane, while logic elements implement Bayer demosaicing, lens-distortion correction, and basic object classification. Embedded memory stores frame buffers for temporal filtering. Industrial -40C to +100C rating allows deployment on factory floors with elevated ambient temperatures.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX95DF25I3G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX95DF25I5G | EP2AGX95DF25C6N | EP2AGX125DF25I3G | EP2AGX65DF25I3G |
|---|---|---|---|---|---|
| Package | 572-ball FCBGA (F25) | 572-ball FCBGA (F25) - same | 572-ball FCBGA (F25) - same | 572-ball FCBGA (F25) - same | 572-ball FCBGA (F25) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 89,178 | 89,178 | 89,178 | ~125,000 | ~60,000 |
| Embedded Memory (bits) | 6,839,296 | 6,839,296 | 6,839,296 | ~8,000,000 | ~4,500,000 |
| User I/O Count | 260 | 260 | 260 | 260 | 260 |
| Speed Grade | I3 (industrial, mid) | I5 (faster) | C6 (commercial, fastest) | I3 | I3 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| RoHS / Lead-Free | RoHS, lead-free (G suffix) | RoHS, lead-free | RoHS, non-lead-free | RoHS, lead-free | RoHS, lead-free |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Larger embedded memory capacity than EP2AGX65DF25I3G (vs EP2AGX65DF25I3G)
- Drop-in higher-density upgrade available in same F25 footprint (vs EP2AGX125DF25I3G)
- Industrial temperature grade for harsh environments (vs EP2AGX95DF25C6N)
Design Notes
The 572-ball FCBGA package requires a high-layer-count PCB stack-up (typically 10+ layers) to fan out the dense ball grid. Use microvia or stacked-via technology for inner-row balls to break out signals to inner layers. Decoupling requires dozens of 0402/0201 capacitors placed directly beneath the package on the opposite side of the BGA balls, with short traces to the power/ground balls. Estimated: at 1 Oz copper, the FCBGA thermal pad requires at least 100 thermal vias of 0.3 mm diameter to extract full-power transceiver heat.
Arria II GX transceivers demand sub-millivolt ripple on their analog supply rails (e.g., VCCA, VCCR) to meet jitter specifications at multi-gigabit data rates. Place low-noise LDOs (e.g., TI TPS7A47xx series) within 25 mm of the analog supply balls, with pi-filter ferrite beads isolating from digital switching noise. Power-on sequencing is mandatory: VCCINT must ramp before VCCA/VCCR to avoid latch-up. Estimated: at full transceiver utilization, expect 8-15W total device power dissipation depending on toggle rate.
The flip-chip BGA's exposed die provides a low thermal resistance path (~0.5 C/W junction-to-case) but requires a thermal interface material and heatsink for high-duty-cycle designs. Without a heatsink, junction temperature can exceed 100C at moderate toggle rates. Use the Intel PowerPlay early power estimator in Quartus II to model power dissipation across logic, transceiver, and I/O utilization, then verify with on-board thermal probes. Industrial-temp grades must keep junction below 100C for rated operation.
Do not confuse the F25 FCBGA package (572 balls) with the FF35 or EF29 packages (larger BGA footprints) - they have different ball maps despite sharing the Arria II GX family name. The DF25 vs CU17 vs FF35 suffixes signal different mechanical packages, not different speed grades. Always cross-reference the device pinout file against your PCB layout before fabrication, and validate signal integrity on transceiver channels with IBIS-AMI or Quartus II TimeQuest timing closure.
Compliance Information
RoHS compliant per 'G' suffix in part number. Halogen-free per Intel Arria II GX family datasheet. Not AEC-Q100 qualified (FPGA typically used in industrial, not automotive direct). Conflict minerals compliance per Intel corporate policy.
