EP2AGX65DF25C4G - Arria II GX FPGA 65K LE 572-FCBGA | Intel
MPN: EP2AGX65DF25C4G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $215 | $215.00 |
| 10 | $198.5 | $1,985.00 |
| 100 | $178 | $17,800.00 |
| 500 | $162 | $81,000.00 |
| 1,000 | $149.5 | $149,500.00 |
EP2AGX65DF25C4G Overview
A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable interconnect, allowing designers to implement custom digital circuits after fabrication. FPGAs sit hierarchically between application-specific integrated circuits (ASICs) and software-programmable processors, combining hardware-level parallelism with rapid design iteration. The Arria II GX family is positioned as a transceiver-rich mid-density FPGA, between the low-power Cyclone series and the high-density Stratix series.
Key features of the EP2AGX65DF25C4G include 60,214 logic elements, 5,371,904 embedded memory bits, 252 user I/O, and high-speed serial transceivers capable of 3.75 Gbps. The -C4 speed grade indicates a mid-tier performance bin optimized for general-purpose designs. The 572-ball flip-chip BGA (FCBGA) package supports high-pin-count designs while maintaining signal integrity for multi-gigabit serial links. The 40 nm process node balances static power consumption against logic density.
Architecturally, the device combines ALM-based logic fabric with on-chip M9K memory blocks, variable-precision DSP blocks, and hard PCIe Gen2 IP cores. Transceiver channels integrate physical coding sublayer (PCS) and physical media attachment (PMA) layers, supporting multiple serial standards through configuration rather than external PHY components. This integration reduces bill-of-materials cost and PCB area in mixed-protocol designs.
Typical applications include wireless baseband processing, radar and electronic-warfare signal chains, broadcast video infrastructure, industrial imaging and machine-vision pipelines, and PCIe-based accelerator cards. Designers select this part when transceiver count, logic density, and PCI-SIG compliance must coexist in a single device. When designing with this FPGA, allocate sufficient decoupling capacitance around the transceiver supply rails and follow Intel's pin-out guidelines for flip-chip BGA assembly to maintain signal-integrity margins on multi-gigabit links.
Drop-in alternatives for EP2AGX65DF25C4G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX65DF25C4G (same form factor and footprint) — differing in Package, Speed Grade, Transceivers, DSP Blocks, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2AGX65DF25C4
✅ Drop-In📋 Reference alternative (not in catalog)
EP2AGX65DF25C5G
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP2AGX65DF25I5G
✅ Drop-In✓ In Stock
$378 / Unit
View Datasheet →EP2AGX95DF25C4G
✅ Drop-In✓ In Stock
$360 / Unit
View Datasheet →EP2AGX125DF25C4G
✅ Drop-In✓ In Stock
$399.95 / Unit
View Datasheet →XC7K70T-1FBG484C
✅ Drop-In📋 Reference alternative (not in catalog)
EP2AGX65DF25C4G Maximum Ratings & Electrical Characteristics
| Manufacturer | Intel (formerly Altera) |
| Series | Arria II GX |
| Family | Arria II GX |
| Logic Elements | 60,214 |
| Embedded Memory | 5,371,904 bits |
| User I/O Count | 252 |
| Operating Frequency (Max) | 500 MHz |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| Speed Grade | C4 |
| Number of Transceivers | 8 (max, per family) |
| Transceiver Data Rate | Up to 3.75 Gbps |
| Package | 572-ball FCBGA |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
EP2AGX65DF25C4G Pin Configuration
| Pin A1 | GXB_TX_CH0p — Transceiver channel 0 TX positive |
| Pin A2 | GXB_RX_CH0p — Transceiver channel 0 RX positive |
| Pin B1 | VCC — Core supply |
| Pin B2 | GND — Ground |
| Pin C1 | IO_0 — General-purpose I/O bank 0 |
| Pin C2 | IO_1 — General-purpose I/O bank 0 |
| Pin D1 | CLKIN0 — Differential clock input positive |
| Pin D2 | CLKIN0n — Differential clock input negative |
| Pin E1 | TCK — JTAG test clock |
| Pin E2 | TMS — JTAG test mode select |
Typical Applications
EP2AGX65DF25C4G is suitable for 6 applications: Wireless Baseband Processing, PCIe Accelerator Card, Broadcast Video Processing, Industrial Imaging and Machine Vision, Radar and Electronic Warfare Signal Processing, Test and Measurement Instrumentation.
Wireless Baseband Processing
The EP2AGX65DF25C4G's 60,214 logic elements plus dedicated variable-precision DSP blocks make it ideal for LTE and small-cell baseband physical-layer processing where parallel arithmetic and on-chip buffering are critical. With up to eight 3.75 Gbps transceivers, it can connect directly to RF front-end DACs/ADCs via CPRI or OBSAI, eliminating external SerDes ICs and reducing board area. The 0.9 V core and 40 nm low-power process keep total power under 8W in typical CPRI fronthaul configurations. Designers benefit from hard PCIe Gen2 IP for backhaul connectivity to baseband cards.
Recommended
PCIe Accelerator Card
With hard PCIe Gen2 x4/x8 endpoint IP and 60K logic elements, the EP2AGX65DF25C4G fits PCIe accelerator cards for financial trading, machine-learning inference, and data-compression offload. The 572-ball FCBGA supports the high pin count needed for PCIe lanes plus DDR3 memory interface, while the M9K memory blocks deliver sub-100ns access latency for cache structures. Compared to a soft PCIe IP solution, the hard IP reduces latency by ~30% and frees logic resources for the actual acceleration pipeline.
Recommended
Broadcast Video Processing
Broadcast video routers and format converters leverage the EP2AGX65DF25C4G's transceiver-rich architecture to ingest 3G-SDI, HDMI, and DisplayPort streams at up to 3.75 Gbps per channel. The 5.37 Mbit embedded memory acts as a line buffer for format conversion between SD, HD, and 4K resolutions without external SRAM. Designers use the FPGA's DSP blocks for chroma resampling and frame-rate conversion at full broadcast resolutions. JTAG-based debug via SignalTap simplifies bring-up of multi-channel video pipelines.
Recommended
Industrial Imaging and Machine Vision
Machine-vision frame grabbers and industrial cameras use the EP2AGX65DF25C4G to receive CoaXPress, Camera Link, or GigE Vision streams from multiple sensors simultaneously via the integrated transceivers. The 60K LE and 252 user I/O enable real-time image preprocessing such as Bayer demosaicing, defect detection, and histogram equalization at line rates exceeding 1 Gpixel/s. Industrial-grade variants (EP2AGX65DF25I5G) extend the temperature range to -40C to +100C for factory-floor deployments.
Recommended
Radar and Electronic Warfare Signal Processing
Defense and aerospace designers select the EP2AGX65DF25C4G for phased-array radar and electronic-warfare subsystems where eight transceivers connect directly to ADCs and DACs at IF frequencies. The 500 MHz maximum fabric frequency plus DSP slices support pulse compression, MTI filtering, and FFT-based direction-finding in real time. With 5.37 Mbit of embedded memory, the device holds multiple range-Doppler maps without external QDR SRAM. Extended-temperature and military-grade screening options are available through Intel's defense supply chain.
Recommended
Test and Measurement Instrumentation
Protocol analyzers, BERT testers, and oscilloscope front-ends use the EP2AGX65DF25C4G to capture and re-transmit multi-gigabit serial traffic at 3.75 Gbps per channel. Hard PCIe IP provides a high-throughput host interface for streaming capture buffers to host memory at 4 GB/s. The 252 user I/O pins accommodate parallel LVDS buses from high-speed ADC front-ends while the FPGA performs real-time pattern matching, error counting, and protocol decoding. On-chip SignalTap logic analysis accelerates bring-up of complex test sequences.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX65DF25C4G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX65DF25C4 | EP2AGX65DF25C5G | EP2AGX65DF25I5G | EP2AGX95DF25C4G | EP2AGX125DF25C4G |
|---|---|---|---|---|---|---|
| Package | 572-ball FCBGA (DF25) | 572-ball FCBGA (DF25) - same | 572-ball FCBGA (DF25) - same | 572-ball FCBGA (DF25) - same | 572-ball FCBGA (DF25) - same | 572-ball FCBGA (DF25) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 60,214 | 60,214 | 60,214 | 60,214 | 92,888 | 118,347 |
| Embedded Memory (bits) | 5,371,904 | 5,371,904 | 5,371,904 | 5,371,904 | 8,388,608 | 10,485,760 |
| User I/O | 252 | 252 | 252 | 252 | 252 | 252 |
| Transceivers | Up to 8 | Up to 8 | Up to 8 | Up to 8 | Up to 8 | Up to 8 |
| Speed Grade | C4 | C4 | C5 (lower fMAX) | I5 (industrial) | C4 | C4 |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
Key Differentiators
- Higher logic density without PCB redesign (vs EP2AGX95DF25C4G)
- Industrial temperature range option (vs EP2AGX65DF25I5G)
- RoHS-compliant lead-free finish (vs EP2AGX65DF25C4)
Design Notes
The 572-ball FCBGA requires a multi-layer PCB with controlled-impedance routing (50 ohm single-ended, 100 ohm differential) and microvia or stacked-via escape for the inner rows. Intel recommends a minimum of 10 layers with dedicated ground and power planes directly beneath the package BGA field to provide a low-impedance return path for the high-speed transceivers.
Estimated core power: 60,214 LE x 0.9 V x typical logic toggle density yields 4-6W at 500 MHz in typical designs, but transceiver-heavy designs can reach 8W. Decoupling must include 100 nF X7R capacitors every 10 power balls plus 10 uF bulk caps on each supply rail. VCCPD and VCCIO each require independent filtering to prevent logic-supply noise from coupling into transceiver channels.
Transceiver channels operating at 3.75 Gbps require matched-length routing (delta less than 150 mil on TX pairs), AC-coupling capacitors on TX outputs, and a continuous reference plane under all traces. Maintain 100 ohm differential impedance with 4-8 mil trace width and 4-6 mil spacing; use Intel's Transceiver Toolkit to pre-emphasize and tune channel pre-emphasis for backplane reach.
Flip-chip BGA packages require a heatsink attached via thermal interface material (TIM) to the package lid. Estimated theta-JA without heatsink is 12 C/W; at 8W total dissipation the junction temperature rises approximately 96 C above ambient. Add a 6 C/W heatsink for industrial applications to keep Tj under 100 C at 70 C ambient.
Compliance Information
RoHS compliance indicated by G suffix per Intel ordering information. Industrial temperature variants (I5/I6 suffix) available; AEC-Q100 not applicable as this is an industrial/commercial FPGA.
