EP2AGX95DF25I5N - Arria II GX 95K LEs FPGA, 260 I/O 572-FCBGA
MPN: EP2AGX95DF25I5N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1060.62 | $1,060.62 |
| 10 | $954.56 | $9,545.60 |
| 100 | $848.5 | $84,850.00 |
| 500 | $742.44 | $371,220.00 |
| 1,000 | $636.37 | $636,370.00 |
EP2AGX95DF25I5N Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnects, and dedicated silicon IP blocks (memory, DSP, transceivers, PLLs). In the broader taxonomy, FPGAs belong to the programmable logic device (PLD) family, which itself is a sub-category of digital integrated circuits used for hardware-level parallel processing. Designers select FPGAs over ASICs for low-to-mid volume production, prototyping, and applications requiring post-deployment reconfigurability.
Key differentiators of the Arria II GX family include integrated transceivers that eliminate the need for external PHY chips, embedded PCI Express hard IP blocks, and DSP blocks for high-throughput signal-pipeline acceleration. The EP2AGX95 specifically targets mid-range applications requiring a balance of logic density, memory bandwidth, and serial connectivity. The DF25 package designation indicates a 25 mm x 25 mm FCBGA body with exposed-die lid for thermal management.
Power architecture uses 0.9 V core supply plus separate VCCPD (pre-driver), VCCIO (I/O bank), VCCR_GXB and VCCT_GXB (transceiver analog supplies), and PLL analog rails. Designers must implement a sequencing strategy documented in the Arria II GX Device Handbook to prevent latch-up. The 572-FCBGA package offers a typical theta_JA around 10-14 C/W with adequate airflow, but junction temperatures must stay below 100C for industrial-grade reliability.
Typical applications include wireless baseband processing, software-defined radio (SDR), video broadcast and pro-AV infrastructure, military radar signal chains, test and measurement ASIC prototyping, and PCIe Gen2 endpoint cards. The integrated transceivers make this part especially attractive for protocol-bridge and aggregation designs.
When designing with the EP2AGX95DF25I5N, designers must install the Quartus II design software (legacy support required because the Arria II family is end-of-life on newer Quartus Prime Pro releases). Plan for power-rail sequencing, multiple decoupling capacitor values on every supply, and thermal relief on inner PCB layers tied to the package substrate balls.
This page synthesizes distributor pricing, drop-in alternatives drawn from the same Arria II GX 95K logic-density bin, and practical design considerations compiled from Intel/Altera device handbooks and reference designs - information that complements the official datasheet with cross-vendor purchasing guidance.
Drop-in alternatives for EP2AGX95DF25I5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX95DF25I5N (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Embedded Memory Bits, Transceiver Data Rate.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2AGX95DF25I5G
✅ Drop-In✓ In Stock
$760 / Unit
View Datasheet →EP2AGX95DF25C6N
✅ Drop-In✓ In Stock
$1750 / Unit
View Datasheet →EP2AGX95DF25C5G
✅ Drop-In✓ In Stock
$768.9 / Unit
View Datasheet →EP2AGX95DF25C6G
✅ Drop-In✓ In Stock
$290 / Unit
View Datasheet →EP2AGX95DF25C5G
✅ Drop-In✓ In Stock
$768.9 / Unit
View Datasheet →EP2AGX95DF25C4G
✅ Drop-In✓ In Stock
$360 / Unit
View Datasheet →EP2AGX95DF25I5N Maximum Ratings & Electrical Characteristics
| Family | Arria II GX |
| Logic Elements | 89,178 |
| Logic Array Blocks (LABs) | 3,747 |
| Embedded Memory (M9K blocks) | 4,486 Kbits |
| Maximum User I/O | 260 |
| Process Node | 40 nm |
| Core Voltage | 0.9 V |
| Maximum Internal Clock Frequency | 500 MHz |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Package | 572-ball FCBGA (DF25), 25x25 mm |
| Mounting Type | Surface Mount |
| RoHS Status | RoHS Compliant |
| Lead Free Status | Lead Free |
| Design Software | Quartus II (legacy) |
EP2AGX95DF25I5N Pin Configuration
| Pin Bank 1A-1C | User I/O / LVDS — User I/O banks 1A-1C (top side of package, varies by pin) |
| Pin Bank 2A-2C | User I/O / LVDS — User I/O banks 2A-2C |
| Pin Bank 3A-3C | User I/O / LVDS — User I/O banks 3A-3C |
| Pin Bank 4A-4C | User I/O / LVDS — User I/O banks 4A-4C |
| Pin Bank 5A-5C | User I/O / LVDS — User I/O banks 5A-5C |
| Pin Bank 6A-6C | User I/O / LVDS — User I/O banks 6A-6C |
| Pin Bank 7A-7C | User I/O / LVDS — User I/O banks 7A-7C |
| Pin Bank 8A-8C | User I/O / LVDS — User I/O banks 8A-8C |
| Pin GXB_TX/RX | Transceiver TX/RX — Multi-gigabit transceiver channel TX/RX pairs (up to 6) |
| Pin VCC | Core Voltage — 0.9 V core supply |
| Pin VCCPD | Pre-Driver Voltage — I/O pre-driver supply (2.5V/3.0V/3.3V) |
| Pin VCCIO | I/O Voltage — I/O bank supply (1.2V to 3.3V depending on I/O standard) |
| Pin VCCR_GXB | Transceiver RX Analog — Transceiver receiver analog supply (1.1V) |
| Pin VCCT_GXB | Transceiver TX Analog — Transceiver transmitter analog supply (1.1V) |
| Pin VCCA_PLL | PLL Analog Supply — PLL analog supply (2.5V) |
| Pin VCCD_PLL | PLL Digital Supply — PLL digital supply (0.9V) |
| Pin GND | Ground — Common ground reference |
| Pin nCONFIG | Configuration Pin — Device configuration control (active-low reset) |
| Pin nSTATUS | Configuration Status — Configuration status output (active-low) |
| Pin DCLK | Configuration Clock — Configuration clock input for parallel AS/PS modes |
| Pin DATA[0..15] | Configuration Data — Configuration data bus for PS/PP modes |
| Pin MSEL[0..2] | Mode Select — Configuration mode select pins (AS/PS/PP/JTAG) |
| Pin TCK | JTAG Clock — IEEE 1149.1 JTAG test clock |
| Pin TMS | JTAG Mode Select — IEEE 1149.1 JTAG mode select |
| Pin TDI | JTAG Data In — IEEE 1149.1 JTAG test data in |
| Pin TDO | JTAG Data Out — IEEE 1149.1 JTAG test data out |
| Pin NC | Not Connected — Not connected (per datasheet) |
| Pin DNU | Do Not Use — Do not connect (reserved per datasheet) |
Typical Applications
EP2AGX95DF25I5N is suitable for 6 applications: Wireless Baseband Signal Processing, Software-Defined Radio (SDR) Platforms, PCI Express Endpoint Cards, Video Broadcast and Pro-AV Infrastructure, Test and Measurement ASIC Prototyping, Industrial Automation and Motor Drives.
Wireless Baseband Signal Processing
The EP2AGX95DF25I5N fits wireless baseband designs through its combination of 89K logic elements, embedded DSP blocks, and up to 6 multi-gigabit transceiver channels operating to 3.75 Gbps. Designers use this part to implement CPRI fronthaul aggregation, LTE PHY layer functions, and digital predistortion feedback paths. The 4,486 Kbits of M9K embedded memory buffer incoming IQ samples between the RF front end and the DSP pipeline, while the transceiver channels carry CPRI data at rates compatible with 3G/4G base station links. Industrial temperature grade allows deployment in outdoor base-station cabinets where ambient temperatures can exceed 70C.
Recommended
Software-Defined Radio (SDR) Platforms
The integrated transceivers and high logic density of the EP2AGX95DF25I5N make it a strong fit for software-defined radio platforms where reconfigurability is mandatory. Designers route ADC/DAC data through the FPGA's transceiver channels and perform channelization, modulation/demodulation, and protocol-layer processing in programmable logic. The 40 nm process balances power consumption against the high toggle rates required for wideband SDR processing, while the FCBGA package provides the thermal headroom needed for sustained full-bandwidth operation. Industrial temperature rating extends deployment to field-grade SDR equipment used in electronic warfare and SIGINT.
Recommended
PCI Express Endpoint Cards
The EP2AGX95DF25I5N includes hard PCI Express IP blocks that support PCIe Gen1 x4 and Gen2 x4 endpoint functionality without consuming fabric logic. Designers implement the PCIe transaction layer, DMA engines, and application logic in the 89K LEs while the hard IP block handles the PHY and data link layers. This combination delivers 4 Gbps aggregate bandwidth for high-throughput endpoint applications like data-acquisition cards, FPGA co-processing accelerators, and protocol-bridge cards. The 572-FCBGA package supports the necessary board real-estate for PCIe edge-finger connectors and reference-clock routing.
Recommended
Video Broadcast and Pro-AV Infrastructure
The transceiver-rich architecture of the EP2AGX95DF25I5N supports SMPTE SDI, HDMI, DisplayPort, and other broadcast standards through SerDes and protocol IP. The 89K logic elements enable multi-channel SDI processing (up to 4 HD-SDI or 1 3G-SDI stream with full audio embedding/de-embedding), while the M9K memory blocks act as line buffers for scaling, deinterlacing, and color-space conversion. Industrial temperature grade ensures reliable operation in broadcast studio equipment racks and outdoor event-production vehicles where ambient temperatures vary widely.
Recommended
Test and Measurement ASIC Prototyping
Engineers use the EP2AGX95DF25I5N for ASIC prototyping because it offers 89K logic elements - sufficient to fit many mid-complexity ASIC RTL designs - plus embedded transceivers to mimic high-speed serial ASIC interfaces. Designers map ASIC RTL to FPGA using Quartus II synthesis, then validate functional behavior, firmware, and inter-chip connectivity at near-real-time speeds. The industrial temperature grade allows prototype validation under stress-temperature testing, and the FCBGA package supports the same BGA breakout layout used in production ASIC packages to simplify bring-up.
Recommended
Industrial Automation and Motor Drives
The EP2AGX95DF25I5N suits industrial automation designs that combine deterministic control loops with high-bandwidth communication. Designers implement EtherCAT, PROFINET, or SERCOS III master controllers in the FPGA fabric, while the transceiver channels handle the real-time Ethernet PHY. The 89K logic elements allow multiple motor-control axes to be processed in parallel, and the embedded DSP blocks implement field-oriented control (FOC) algorithms with sub-microsecond loop times. Industrial temperature grade ensures reliable operation in factory-floor cabinets and motor-drive enclosures with ambient temperatures up to 100C.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX95DF25I5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX95DF25I5G | EP2AGX95DF25C6N | EP2AGX95DF25C5G | EP2AGX95DF25C6G | EP2AGX95DF25C5 | EP2AGX95DF25C4G |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 572-FCBGA (DF25) 25x25 mm | 572-FCBGA (DF25) - same | 572-FCBGA (DF25) - same | 572-FCBGA (DF25) - same | 572-FCBGA (DF25) - same | 572-FCBGA (DF25) - same | 572-FCBGA (DF25) - same |
| Logic Elements | 89,178 | 89,178 | 89,178 | 89,178 | 89,178 | 89,178 | 89,178 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | 5 | 5 | 6 | 5 | 6 | 5 | 4 |
| RoHS Compliance | RoHS Compliant, Lead Free | RoHS Compliant, Lead Free | RoHS Compliant, Lead Free | RoHS Compliant, Lead Free | RoHS Compliant, Lead Free | RoHS Compliant, Lead Free | RoHS Compliant, Lead Free |
| Logic Array Blocks (LABs) | 3,747 | 3,747 | 3,747 | 3,747 | 3,747 | 3,747 | 3,747 |
| Embedded Memory (M9K) | 4,486 Kbits | 4,486 Kbits | 4,486 Kbits | 4,486 Kbits | 4,486 Kbits | 4,486 Kbits | 4,486 Kbits |
| Maximum User I/O | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
Key Differentiators
- Industrial temperature grade with same die and pinout as commercial variants (vs EP2AGX95DF25C6N)
- Mid-tier speed grade 5 balances Fmax and power for general-purpose use (vs EP2AGX95DF25C6G (speed grade 6))
- Same logic capacity as the smaller Arria II GX EP2AGX65 in larger package (vs EP2AGX65DF29I5N (65K LEs in DF29 780-ball))
Design Notes
The EP2AGX95DF25I5N requires a multi-rail power architecture with separate supplies for VCC (0.9V core), VCCPD (2.5V/3.0V/3.3V pre-driver), VCCIO (per-bank I/O voltage), VCCR_GXB and VCCT_GXB (1.1V transceiver analog), and VCCA_PLL/VCCD_PLL (PLL analog/digital). According to the Arria II GX Device Handbook, supplies must be sequenced to prevent latch-up - typically VCC first, then VCCR_GXB/VCCT_GXB, then VCCA_PLL, then VCCIO/VCCPD. Use a multi-rail sequencer IC and verify ramp rates match the datasheet maximum (typically 100 mV/us for core). Decoupling: place 0402 0.1uF X7R capacitors every 8-10 balls, plus bulk 10-47uF tantalums per supply island.
The 572-FCBGA package dissipates 5-15 W under typical load (varies by toggle rate, transceiver utilization, and I/O switching). Estimated: at 15W dissipation with no airflow and standard 4-layer PCB, theta_JA is approximately 14 C/W yielding a 210C junction rise - far above the 100C industrial limit. Required mitigations: (1) inner-layer copper pours tied to the central ground balls, (2) a top-side heatsink with thermal interface material, or (3) forced-air cooling at 1-2 m/s. Use the Arria II GX PowerPlay Early Power Estimator (EPE) spreadsheet to validate thermal design before PCB layout.
PCB layout for the 572-FCBGA DF25 (25x25 mm, 1.0 mm pitch) requires HDI stackup with laser-drilled microvias and stacked via structures. Use 8+ layer stackup with dedicated ground and power planes adjacent to the outer BGA row. Match trace lengths for transceiver differential pairs to within 150 um and 90 ohm differential impedance per the device handbook. Configure JTAG chain with TCK pull-down, TMS pull-up, TDI pull-up, and TDO left open per IEEE 1149.1.
Common mistakes when designing with the EP2AGX95DF25I5N: (1) using Quartus Prime Pro Edition (does not support Arria II - use Quartus II 13.1 or Quartus Prime Standard); (2) ignoring the 1.0 mm BGA pitch which requires HDI PCB fabrication; (3) failing to power-cycle the device properly when reconfiguration is needed (use nCONFIG pulse); (4) leaving MSEL pins floating - they must be tied to logic 0 or 1 per the configuration mode select table; (5) omitting pull-ups on nCONFIG/nSTATUS when using JTAG-only configuration mode.
Compliance Information
RoHS Compliant and Lead Free per DigiKey listing. AEC-Q100 is not applicable for FPGAs - automotive qualification is at the OEM design level. Halogen-free per Intel/Altera product marking. REACH compliance documented via Intel material declaration certificates.
