EP2AGX95EF29C5N - Arria II GX FPGA 89KLE, 780-FCBGA | Intel
MPN: EP2AGX95EF29C5N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1380 | $1,380.00 |
| 10 | $1295 | $12,950.00 |
| 100 | $1190 | $119,000.00 |
| 500 | $1085 | $542,500.00 |
| 1,000 | $990 | $990,000.00 |
EP2AGX95EF29C5N Overview
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect, allowing hardware designers to implement custom digital circuits and parallel processing architectures after silicon fabrication. The Arria II GX family sits between the low-power Cyclone and the high-end Stratix families, targeting mid-range applications that require a balance of logic density, DSP performance, and high-speed serial transceivers without the cost of premium high-end FPGAs.
Key features include 372 maximum user I/O pins, embedded transceiver PMA/PCS blocks with CPRI/OBSAI/PIPE/PCIe protocol support, dedicated hard memory controllers, and configurable fractional PLLs for clock management. Hard IP blocks reduce logic utilization and improve timing closure for memory and connectivity interfaces. The 6.375 Gbps transceivers provide robust signal integrity for chip-to-chip and backplane links.
The Arria II GX architecture combines a high-performance logic fabric with on-chip transceivers, supporting protocols such as PCIe Gen1/Gen2, Gigabit Ethernet, CPRI, and OBSAI. The design targets mid-range applications including wireless baseband processing, broadcast video equipment, and military/aerospace systems that need deterministic latency and high data throughput.
Typical applications include wireless infrastructure (baseband and radio card processing), broadcast video processing and routing, industrial imaging and machine vision, test and measurement instrumentation, and high-speed serial backplane bridging. The integrated transceivers simplify designs that require multi-gigabit serial links.
Design consideration: When using the embedded transceivers, refer to the Arria II GX Device Handbook for PCB layout guidelines for the FCBGA-780 package. Power supply sequencing and decoupling are critical; use the Altera/Intel PowerPlay early power estimator before layout to plan thermal management.
This page synthesizes distributor pricing, drop-in Arria II GX alternatives from the same Intel FPGA family, and practical design notes that go beyond what is published in the device datasheet.
Drop-in alternatives for EP2AGX95EF29C5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX95EF29C5N (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Transceivers, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2AGX95EF29C5G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1305 / Unit
View Datasheet →EP2AGX95EF29C4N
✅ Drop-In✓ In Stock
$855 / Unit
View Datasheet →EP2AGX95EF29C3N
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EP2AGX95EF29I5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1320 / Unit
View Datasheet →EP2AGX95DF25I5N
✅ Drop-In✓ In Stock
$636.37 / Unit
View Datasheet →EP2AGX95EF29C5N Maximum Ratings & Electrical Characteristics
| Series | Arria II GX |
| Logic Elements (LE) | 89,178 |
| Total RAM Bits | 6,839,296 |
| Embedded Memory (Kbits) | 4,488 |
| Maximum User I/O | 372 |
| Package | 780-FCBGA (FBGA-780, FineLine BGA) |
| Mounting Type | Surface Mount |
| Supply Voltage | 0.9 V core (per datasheet) |
| Operating Temperature | Commercial (0C to +85C) |
| Speed Grade | 5 |
| Device Type | FPGA |
| Transceivers | Up to 12 channels, up to 6.375 Gbps |
| Pin Count | 780 |
EP2AGX95EF29C5N Pin Configuration
| Pin BGA ball | Multiple I/O banks — 780-ball FCBGA array; refer to Arria II GX Device Handbook pin-out files (CSV/BSD) for exact ball-to-signal mapping; user I/O organized into 8 I/O banks supporting LVDS, LVTTL, LVCMOS, SSTL, HSTL I/O standards. |
Typical Applications
EP2AGX95EF29C5N is suitable for 6 applications: Wireless Baseband Processing, Broadcast Video Processing and Routing, Industrial Imaging and Machine Vision, Test and Measurement Instrumentation, High-Speed Serial Backplane Bridging, Military and Aerospace Signal Processing.
Wireless Baseband Processing
The EP2AGX95EF29C5N fits wireless baseband channel card designs due to its integrated transceivers supporting CPRI up to 6.144 Gbps and OBSAI up to 6.144 Gbps - the dominant baseband-to-radio interface standards in LTE and 3G networks. The 89,178 logic elements combined with dedicated DSP blocks can implement uplink/downlink baseband processing for 1-2 LTE sectors, including FFT/iFFT, channel coding, and MIMO processing. The 4,488 Kbits of embedded memory supports symbol-rate buffering without external SRAM, reducing BOM cost and board area in compact remote radio head (RRH) and baseband unit (BBU) designs.
Recommended
Broadcast Video Processing and Routing
The EP2AGX95EF29C5N is well matched to broadcast video routers and processing frames because its 372 maximum user I/Os can interface directly with SDI (Serial Digital Interface) receivers and transmitters for SD/HD/3G-SDI video streams. The embedded transceivers support up to 6.375 Gbps rates, sufficient for 3G-SDI (2.97 Gbps) and 6G-SDI proposals, while the FPGA fabric performs matrix switching, format conversion, and overlay processing. In broadcast studio routers, this Arria II GX device typically replaces multiple discrete crosspoint ICs while adding format-conversion capability.
Recommended
Industrial Imaging and Machine Vision
The EP2AGX95EF29C5N suits high-speed industrial camera and machine vision applications where multiple high-resolution image sensors (CoaXPress, Camera Link, GigE Vision) must be aggregated and pre-processed. Its transceiver channels support CoaXPress up to 6.25 Gbps per link, enabling aggregation of multiple high-resolution cameras. With 89K logic elements and embedded DSP, the device performs real-time image pre-processing - Bayer demosaicing, color correction, region-of-interest extraction - before forwarding compressed streams over Gigabit Ethernet or 10 GbE uplinks using the transceivers.
Recommended
Test and Measurement Instrumentation
The EP2AGX95EF29C5N works well in high-end test and measurement equipment such as protocol analyzers, logic analyzers, and BERT (bit-error-rate tester) instruments. Its 6.375 Gbps transceivers handle popular serial bus standards including PCIe Gen2, USB 3.0 (at 5 Gbps), SATA, and 10 GbE variants, while the 372 user I/Os provide ample test stimulus and capture channels. The combination of logic density and transceiver count supports multi-lane protocol analysis where multiple bus lanes must be captured and decoded in parallel within the FPGA fabric.
Recommended
High-Speed Serial Backplane Bridging
The EP2AGX95EF29C5N enables bridging between legacy backplanes and modern high-speed serial fabrics. Its 12 transceiver channels at 6.375 Gbps aggregate into multi-lane links such as PCIe Gen2 x4, 4x SATA, or proprietary chip-to-chip protocols. In ATCA/microTCA shelves and proprietary backplane designs, this Arria II GX device typically serves as the shelf manager or as a fabric switch bridging serial RapidIO or Ethernet traffic across the backplane. The 89K logic elements implement switching logic, while the transceivers handle the serial I/O.
Recommended
Military and Aerospace Signal Processing
The EP2AGX95EF29C5N supports defense and aerospace signal-processing subsystems where determinable latency and high compute density are required. Applications include radar front-end processing, electronic warfare (EW) receivers, and software-defined radio (SDR) baseband. The Arria II GX architecture delivers predictable timing closure on DSP-heavy signal chains (FFT, pulse compression, channelization) while the transceivers handle ADC/DAC interfacing. Note that defense applications typically require industrial or military temperature grades; the EP2AGX95EF29I5N is the appropriate drop-in for such designs.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX95EF29C5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX95EF29C5G | EP2AGX95EF29C4N | EP2AGX95EF29C3N | EP2AGX95EF29I5N | EP2AGX95DF25I5N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FCBGA (EF29) | 780-FCBGA (EF29) - same | 780-FCBGA (EF29) - same | 780-FCBGA (EF29) - same | 780-FCBGA (EF29) - same | 780-FCBGA (DF25) - same ball count, different ball map |
| Logic Elements | 89,178 | 89,178 | 89,178 | 89,178 | 89,178 | 89,178 |
| Speed Grade | 5 | 5 | 4 | 3 | 5 | 5 |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Transceivers (max) | 12 ch up to 6.375 Gbps | 12 ch up to 6.375 Gbps | 12 ch up to 6.375 Gbps | 12 ch up to 6.375 Gbps | 12 ch up to 6.375 Gbps | 12 ch up to 6.375 Gbps |
| Embedded Memory (Kbits) | 4,488 | 4,488 | 4,488 | 4,488 | 4,488 | 4,488 |
| Maximum User I/O | 372 | 372 | 372 | 372 | 372 | 372 |
Key Differentiators
- Speed grade 5 (fastest) within Arria II GX 95K family (vs EP2AGX95EF29C4N)
- Same-package industrial temperature drop-in option (vs EP2AGX95EF29I5N)
- Same-package Pb-free/RoHS variant (vs EP2AGX95EF29C5G)
Design Notes
The EP2AGX95EF29C5N in 780-FCBGA can dissipate 5-15W depending on transceiver utilization and logic activity. Use the Altera/Intel PowerPlay Early Power Estimator before PCB layout to size the thermal solution. A 4-layer PCB with 1 oz copper on outer layers and a 25-30 via thermal array under the central BGA balls typically keeps junction temperature within commercial limits at moderate toggle rates.
The 780-FCBGA package requires escape routing on at least 6 PCB layers (8 layers recommended). Match impedance-controlled differential pairs to 100 ohm differential for LVDS and 50 ohm single-ended for the transceivers. Place transceiver reference resistors and AC coupling capacitors within 200 mils of the corresponding BGA balls per the Arria II GX Handbook PCB layout guidelines.
Do not substitute the EP2AGX95EF29C5N (EF29 package) with an EP2AGX95DF25C5N (DF25 package) without re-laying-out the PCB - although both are 780-ball FCBGA, the ball map differs (different pinout), so balls map to different signals. Verify the suffix code matches your existing PCB footprint before ordering. Confirmed drop-in only within the same EF29 family of variants.
Arria II GX devices require multiple supply rails: core (typically 0.9V), I/O (1.2V/1.5V/1.8V/2.5V/3.3V per bank), PLL analog supplies, and transceiver supplies. Power sequencing per the Arria II GX Handbook is mandatory - failing to sequence supplies can damage the device. Use a dedicated FPGA power controller (such as the ISL6549 or similar) to enforce the required power-up sequence.
Separate high-speed transceiver channels from low-speed user I/O on different PCB layers to avoid coupling noise. Keep differential pair lengths matched within 150 mils and use ground stitching vias every lambda/4 along the route. Decouple each transceiver power pin with 0.1uF and 10uF capacitors as close to the BGA ball as physically possible.
Compliance Information
Compliance status not present in the verified distributor data; consult the Intel/Altera product page or the Arria II GX Device Handbook for definitive RoHS/REACH compliance information. For new designs requiring RoHS, choose the EP2AGX95EF29C5G variant explicitly.
