EP2AGX95EF29I3N - 95KLE Arria II GX FPGA 780-FBGA | Intel
MPN: EP2AGX95EF29I3N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1550 | $155,000.00 |
| 250 | $1395 | $348,750.00 |
| 500 | $1280 | $640,000.00 |
EP2AGX95EF29I3N Overview
What is an FPGA? A Field-Programmable Gate Array is a semiconductor device containing configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard IP blocks (transceivers, memory controllers, DSP slices) that can be re-programmed post-manufacturing. FPGAs sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs), offering hardware-level parallelism and reconfigurability that CPUs cannot match. The Arria II GX family specifically targets applications requiring integrated multi-gigabit transceivers at lower cost than the high-end Stratix family.
Key features of the EP2AGX95EF29I3N include 372 user I/O pins, integrated 3.125 Gbps transceivers (per Arria II GX family specifications), on-chip DSP blocks for high-speed signal processing, and a 0.9V core supply. The industrial temperature grade (I3N suffix: I = industrial, 3 = speed grade, N = lead-free) makes this part suitable for harsh-environment deployments including industrial automation, military/aerospace subsystems, and outdoor telecommunications equipment.
The 40nm process technology delivers a favorable logic-to-power ratio for sustained DSP workloads, while the FBGA-780 package with 1.0mm ball pitch balances pin density and PCB manufacturability. Designers benefit from Altera's Quartus II design suite (now Intel Quartus Prime) for synthesis, place-and-route, and timing closure across this device family.
Typical applications include high-speed serial protocol bridging (PCIe Gen1/Gen2, Serial RapidIO, Gbps Ethernet), software-defined radio (SDR) baseband processing, video broadcast infrastructure, industrial machine vision, and test and measurement equipment. The 95K logic-element tier targets mid-complexity designs needing transceiver integration without the cost of the larger 125K, 190K, or 260K family members.
When designing with this part, plan for the FBGA-780 PCB land pattern and the multi-rail power architecture typical of Arria II GX devices. Use the Quartus II power estimator early in the design flow to size decoupling and thermal solutions.
This page synthesizes distributor pricing from DigiKey and Mouser, drop-in same-package alternatives within the Arria II GX family, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP2AGX95EF29I3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX95EF29I3N (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Embedded Memory Bits, Transceiver Data Rate.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2AGX95EF29C6N
✅ Drop-In✓ In Stock
$555.1 / Unit
View Datasheet →EP2AGX95EF29C5N
✅ Drop-In✓ In Stock
$990 / Unit
View Datasheet →EP2AGX95EF29C4N
✅ Drop-In✓ In Stock
$855 / Unit
View Datasheet →EP2AGX95EF29C3N
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EP2AGX95EF29I3G
✅ Drop-In✓ In Stock
$899 / Unit
View Datasheet →EP2AGX95EF29I3N Maximum Ratings & Electrical Characteristics
| Family | Arria II GX |
| Logic Elements (LE) | 89,178 |
| Logic Array Blocks (LABs) | 3,747 |
| Embedded Memory (bits) | 6,839,296 |
| User I/O Pins | 372 |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| Maximum Operating Frequency | 500 MHz |
| Package | FBGA-780 (29x29 mm, 1.0 mm pitch) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (Industrial) |
| RoHS Status | Compliant (lead-free) |
| Speed Grade | 3 |
EP2AGX95EF29I3N fbga-780 (29x29 mm, 1.0 mm pitch) Pin Configuration Guide
Pin configuration for EP2AGX95EF29I3N (fbga-780 (29x29 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX95EF29I3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX95EF29I3N is suitable for 6 applications: Software-Defined Radio (SDR) Baseband, High-Speed Serial Protocol Bridge, Video Broadcast Infrastructure, Industrial Machine Vision, Test and Measurement Equipment, Military and Aerospace Subsystems.
Software-Defined Radio (SDR) Baseband
The EP2AGX95EF29I3N's 89,178 logic elements, integrated 3.125 Gbps transceivers, and on-chip DSP blocks make it well-suited for software-defined radio baseband processing at the industrial -40C to +100C temperature range. The 6.8 Mbit embedded memory supports FFT buffers and channelization tables, while the parallel DSP fabric enables real-time modulation/demodulation algorithms for signals up to several hundred MHz bandwidth. Compared to discrete DSP+FPGA architectures, the integrated transceiver IP reduces board area by roughly 30 percent and simplifies PCB layout by eliminating high-speed serial routing between chips. SDR applications in tactical comms, signal intelligence, and private LTE benefit from the FBGA-780 package's ability to support many high-speed SERDES channels simultaneously.
Recommended
High-Speed Serial Protocol Bridge
With integrated multi-gigabit transceivers supporting PCIe Gen1/Gen2, Serial RapidIO, and Gbps Ethernet, the EP2AGX95EF29I3N is commonly used as a protocol bridge card between legacy and modern high-speed serial interfaces. The 372 user I/O pins provide ample LVDS and single-ended I/O for legacy parallel buses, while the transceivers handle the modern serial links. Industrial temperature grade suits deployment in factory automation and outdoor telecom. A typical bridge design consumes 60-70 percent of the 89K logic elements, leaving 25-30 percent for value-add features like protocol offload, error handling, and statistics counters.
Recommended
Video Broadcast Infrastructure
The EP2AGX95EF29I3N supports HD/3G-SDI processing, video format conversion, and on-the-fly color-space transformation in broadcast equipment. The 89K logic elements handle real-time video pipelines, while the embedded memory provides line buffers and frame stores. Industrial temperature grade allows deployment in uncontrolled equipment-room environments. The integrated transceivers support SMPTE 2022 IP video transport and the 372 user I/O can interface to HDMI, DisplayPort, or legacy analog video. Power consumption is roughly 8-10W at typical utilization, manageable with the FBGA-780 package's thermal performance.
Recommended
Industrial Machine Vision
The EP2AGX95EF29I3N's combination of 89K logic elements, embedded memory, and SERDES transceivers is well-suited for high-speed machine vision applications including line-scan camera interfaces, multi-camera aggregation, and real-time image preprocessing. Camera Link, CoaXPress, and GigE Vision protocols can be implemented using the integrated transceivers. The 6.8 Mbit embedded memory supports frame buffers for inspection algorithms, and the 372 user I/O can interface to encoders, lighting controllers, and reject mechanisms. Industrial temperature grade handles factory floor deployment from -40C cold-start to +100C cabinet temperatures.
Recommended
Test and Measurement Equipment
The EP2AGX95EF29I3N is widely used in oscilloscopes, logic analyzers, and protocol analyzers where its high-speed transceivers, abundant logic, and embedded memory enable real-time signal processing. Applications include deep-memory waveform capture, high-speed serial protocol triggering, and on-FPGA FFT for spectrum analysis. The industrial temperature rating suits portable/field test equipment. The 372 user I/O supports multi-channel acquisition, and the SERDES links aggregate data from front-end ADCs. Design margins of 30-40 percent logic utilization are typical to support future feature additions.
Recommended
Military and Aerospace Subsystems
The EP2AGX95EF29I3N's industrial -40C to +100C temperature grade, high logic density, and integrated transceivers support defense applications including radar signal processing, electronic warfare subsystems, and avionics databuses. The FBGA-780 package withstands high-vibration environments when properly PCB-mounted with underfill or corner staking. Embedded memory supports radar range-bin and Doppler processing, while transceivers handle sensor data links. Note that for full MIL-STD-810 qualification, the part should be procured through defense-grade supply chains and may require upscreening. New defense designs should evaluate newer Intel FPGAs with built-in radiation tolerance.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX95EF29I3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX95EF29C6N | EP2AGX95EF29C5N | EP2AGX95EF29C4N | EP2AGX95EF29C3N | EP2AGX95EF29I3G |
|---|---|---|---|---|---|---|
| Package | FBGA-780 (29x29 mm, 1.0 mm pitch) | FBGA-780 (29x29 mm) - same | FBGA-780 (29x29 mm) - same | FBGA-780 (29x29 mm) - same | FBGA-780 (29x29 mm) - same | FBGA-780 (29x29 mm) - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 89,178 | 89,178 - same | 89,178 - same | 89,178 - same | 89,178 - same | 89,178 - same |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) - NOT drop-in for industrial | Commercial (0C to +85C) - NOT drop-in for industrial | Commercial (0C to +85C) - NOT drop-in for industrial | Commercial (0C to +85C) - NOT drop-in for industrial | Industrial (-40C to +100C) - same |
| Speed Grade | 3 | 6 (faster) | 5 (faster) | 4 (faster) | 3 - same | 3 - same |
| User I/O Pins | 372 | 372 - same | 372 - same | 372 - same | 372 - same | 372 - same |
| Embedded Memory (bits) | 6,839,296 | 6,839,296 - same | 6,839,296 - same | 6,839,296 - same | 6,839,296 - same | 6,839,296 - same |
| RoHS Compliance | Yes (N suffix = lead-free) | Yes - same | Yes - same | Yes - same | Yes - same | Yes (G suffix = Pb-free) - same |
Key Differentiators
- Only 95K LE Arria II GX with speed grade 3 in industrial temp (vs EP2AGX95EF29I5N)
- Lead-free N-suffix matches the most common industry standard (vs EP2AGX95EF29I3G (G-suffix))
- Same die across all EP2AGX95 variants simplifies migration (vs EP2AGX125EF29I3N (125K LE))
Design Notes
The FBGA-780 29x29 mm package with 1.0 mm ball pitch requires a multi-layer PCB (typically 8-12 layers) with microvia or via-in-pad technology. The transceiver reference clock and SERDES routing demand controlled-impedance differential pairs (100 ohm differential) with length matching within 5-10 mils. Use the Intel Arria II GX Pin Connection Guidelines document to map every ball to its required power rail, decoupling, and special handling. Skim the FBGA breakout escape routing in your stackup before committing to PCB fabrication - a 1.0 mm pitch BGA with 780 balls is challenging to escape on 4-layer boards.
Estimated: The EP2AGX95EF29I3N can dissipate 8-12W at typical utilization with transceivers active. The FBGA-780 package theta_JA is approximately 12-15 C/W with a standard 4-layer JEDEC test board, yielding a 100-180 C junction temperature rise above ambient at full load. For continuous industrial-temperature operation, design for at least 2-3 square inches of internal copper thermal pad connection to the BGA's central balls, and consider a heatsink with thermal interface material if the enclosure is sealed. Use the Quartus II PowerPlay early estimator before final board layout to size the thermal solution accurately.
Arria II GX devices require multiple power rails: 0.9V core (VCC), 1.1V/1.5V/2.5V/3.0V auxiliary rails (VCCAUX, VCCPD, VCCIO), and analog supply rails for transceivers and PLLs. Decoupling must follow the device-specific Power Distribution Network (PDN) guidelines - typically 100 nF + 10 nF + 4.7 uF per power pin cluster. Use a sequencer or power management IC to enforce proper power-up/power-down sequencing (VCC before VCCAUX, VCCAUX before VCCIO, etc.) - failure to sequence correctly can cause latch-up or permanent damage. Bulk capacitance budget 200-400 uF on the 0.9V core rail.
Common pitfalls when migrating between Arria II GX speed grades: timing closure issues when downgrading from a faster speed grade (e.g., -6) to a slower one (-3) without re-running TimeQuest timing analysis. Industrial-temperature parts (I-suffix) and commercial-temperature parts (C-suffix) share the same die, but the commercial part is NOT a drop-in for industrial applications. The 'G' suffix variants (Pb-free) and 'N' suffix variants are functionally identical - the difference is terminal finish, not electrical. Always verify the exact ordering code on the label matches what was ordered; 95K vs 125K LE confusion is a frequent BOM error.
Compliance Information
RoHS compliant per FindIC and DigChip datasheet extracts (lead-free N suffix terminal finish). AEC-Q100 not applicable (FPGA, not automotive-grade IC). REACH compliance assumed from Intel's standard product compliance statements but not explicitly confirmed in the provided data - verify with Intel REACH declaration if required. Halogen-free status not specified in provided data.
