EP2AGZ300FF35I3N - 298K LE Arria II GZ FPGA, 554 I/O, FC-FBGA-1152
MPN: EP2AGZ300FF35I3N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4370.51 | $4,370.51 |
| 10 | $4150 | $41,500.00 |
| 100 | $3900 | $390,000.00 |
| 500 | $3700 | $1,850,000.00 |
| 1,000 | $3500 | $3,500,000.00 |
EP2AGZ300FF35I3N Overview
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that belongs to the broader semiconductor hierarchy of integrated circuits. FPGAs contain an array of configurable logic blocks (CLBs), programmable interconnects, embedded memory, and hardened IP blocks such as transceivers and DSP slices that engineers can reconfigure after manufacture. The Arria II GZ family sits between the lower-cost Cyclone series and the high-end Stratix series in the Altera/Intel portfolio, targeting mid-to-high bandwidth applications that need transceivers and DSP but where the absolute highest logic density or transceiver count is not required.
Key differentiating features of the EP2AGZ300FF35I3N include its 298,000 logic elements, 11,920 Logic Array Blocks (LABs), dedicated on-chip transceivers capable of multi-gigabit serial I/O, embedded DSP blocks for high-throughput signal processing, and 18.85 Mbits of distributed and block RAM. The 40 nm process node balances static and dynamic power, while the FC-FBGA-1152 package provides the high pin count required to expose 554 user I/O plus the dedicated configuration, power, and JTAG pins.
Architecturally, Arria II GZ devices combine a fabric of adaptive logic modules (ALMs) with hard IP for transceivers, external memory interfaces (DDR3 controllers), and PCI Express Gen2 endpoints. The 35 in FF35 indicates a 35 mm x 35 mm package body with a 1.0 mm ball pitch, which is the largest package option in this family and is required to accommodate the 554 I/O count.
Typical applications include high-speed data acquisition, wireless baseband processing, radar and electronic warfare front-ends, broadcast video processing, military and aerospace signal processing, and high-performance computing accelerators. Designers choose this part when they need a large logic and memory budget with industrial-grade temperature support.
When designing with the EP2AGZ300FF35I3N, pay close attention to PCB layer stack-up and BGA breakout routing because the 1.0 mm ball pitch demands HDI technology (microvias, sequential lamination). Use the Altera Quartus II design suite (or its modern equivalent for legacy device support) for synthesis, place-and-route, and bitstream generation. The 0.9 V core must be supplied by a multi-rail PMIC or DC-DC solution with adequate decoupling.
This page synthesizes distributor inventory, lifecycle context, drop-in same-package alternatives drawn from the same Arria II GZ family, and practical design notes not consolidated in a single manufacturer document.
Drop-in alternatives for EP2AGZ300FF35I3N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGZ300FF35I3N (same form factor and footprint) β differing in Package, Transceivers, Logic Elements (LE), Logic Elements, Operating Temperature.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2AGZ225FF35I3N
β Drop-Inβ In Stock
$2655 / Unit
View Datasheet βEP2AGZ300FF35I3G
β Drop-Inβ In Stock
$1230 / Unit
View Datasheet βEP2AGZ300FF35C4N
β Drop-Inβ In Stock
$1350 / Unit
View Datasheet βEP2AGZ300FF35C3N
β Drop-Inβ In Stock
$1480 / Unit
View Datasheet βEP2AGZ300FF35C3G
β Drop-Inβ In Stock
$1395 / Unit
View Datasheet βEP2AGZ300FF35I3N Maximum Ratings & Electrical Characteristics
| Family | Arria II GZ |
| Logic Elements | 298000 |
| Number of LABs/CLBs | 11920 |
| Total RAM Bits | 18854912 |
| Number of I/O | 554 |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm |
| Maximum Operating Frequency | 500 MHz |
| Package Type | 1152-BBGA, FCBGA (Flip-Chip) |
| Package Code | FF35 (35 mm body) |
| Mounting Type | Surface Mount |
| Operating Temperature Grade | Industrial (-40C to +100C) |
EP2AGZ300FF35I3N ff35 (35 mm body) Pin Configuration Guide
Pin configuration for EP2AGZ300FF35I3N (ff35 (35 mm body) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGZ300FF35I3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGZ300FF35I3N is suitable for 7 applications: High-Speed Data Acquisition Systems, Wireless Baseband Processing, Military and Aerospace Signal Processing, Broadcast Video Processing and Routing, Medical Imaging Acceleration, Industrial Motor Control and Robotics, High-Performance Computing Accelerator.
High-Speed Data Acquisition Systems
The EP2AGZ300FF35I3N fits high-speed data acquisition front-ends because its 298K logic elements and 18.85 Mbits of embedded RAM give plenty of headroom for deep FIFO buffering between ADCs and a host processor, while the multi-gigabit transceivers stream data off-board at multiple Gbps. Industrial temperature grading allows deployment in factory-floor instrumentation where ambient swings from -40C to +100C. Use the device between a bank of JESD204B ADCs and a PCIe Gen2 host link, where its hard PCIe and transceiver IP eliminate soft-IP timing closure risk.
Recommended
Wireless Baseband Processing
The EP2AGZ300FF35I3N's hard DSP blocks deliver tens of GMACs of multiply-accumulate throughput per second, which directly suits LTE and small-cell baseband baseband processing where engineers implement FFT/iFFT, channelization, and crest-factor reduction. The 554 user I/O expose multiple antenna data paths plus CPRI or OBSAI links to a radio unit, while the 0.9 V core keeps board-level power manageable. Industrial temperature grading permits outdoor small-cell deployments. Drop the device into a baseband card alongside a network processor and you have a flexible multi-mode platform.
Recommended
Military and Aerospace Signal Processing
With 298K logic elements, 18.85 Mbits of embedded RAM, hardened DSP blocks, and industrial temperature support, the EP2AGZ300FF35I3N is well suited to military and aerospace signal-processing payloads such as radar front-ends, electronic countermeasures, and secure communications. The FC-FBGA-1152 package exposes enough I/O for parallel ADC/DAC interfaces plus SpaceWire or MIL-STD-1553 bridges. Although not on the official MIL-PRF-38535 QML list, many defense integrators qualify this part through their own reliability flows for non-space applications.
Recommended
Broadcast Video Processing and Routing
Broadcast video routers and processing blades benefit from the EP2AGZ300FF35I3N's 554 user I/O and abundant DSP blocks, which can sustain multi-channel SD/HD/3G-SDI aggregation, color-space conversion, and on-the-fly scaling. The 18.85 Mbits of embedded RAM acts as line buffers for cross-point switching, while the 500 MHz fabric clock keeps latency low for live production. Industrial temperature grading supports the heat-soaked interior of broadcast equipment racks. Designers commonly pair the FPGA with external SDI equalizers and HDMI transmitters.
Recommended
Medical Imaging Acceleration
CT, MRI, and ultrasound imaging systems use the EP2AGZ300FF35I3N to accelerate beamforming, image reconstruction (such as filtered back-projection), and real-time image enhancement. The 298K logic elements and DSP slices implement parallel pipeline processing at line rates that a host CPU cannot sustain, while the 18.85 Mbits of embedded RAM holds intermediate image frames. The industrial temperature range supports the regulated thermal environment of medical equipment cabinets. The FC-FBGA-1152 package exposes enough LVDS pairs to interface with high-channel-count ADC arrays.
Recommended
Industrial Motor Control and Robotics
Multi-axis industrial robots and CNC machines use the EP2AGZ300FF35I3N to execute multi-axis field-oriented control loops in hardware, offloading the real-time processor. The DSP blocks implement Park and Clarke transforms, SVPWM generation, and current-loop math at sub-microsecond latency. With 554 I/O the part can drive many PWM channels, encoder interfaces, and EtherCAT or SERCOS III links simultaneously, while the industrial temperature grade tolerates factory-floor heat. The FC-FBGA-1152 footprint integrates well on HDI control boards with high-isolation creepage requirements.
Recommended
High-Performance Computing Accelerator
The EP2AGZ300FF35I3N serves as a co-processor in high-performance computing nodes by accelerating finance, genomics, or scientific workloads through parallel kernels mapped onto DSP blocks and distributed RAM. The PCIe Gen2 hard IP connects directly to a host CPU root complex, while the multi-gigabit transceivers provide low-latency chip-to-chip links to neighboring FPGAs in a coherent fabric. Industrial temperature grading supports dense server-rack environments. Use the device as a drop-in accelerator on OpenCL or RTL-developed compute pipelines.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGZ300FF35I3N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGZ225FF35I3N | EP2AGZ300FF35I3G | EP2AGZ300FF35C4N | EP2AGZ300FF35C3N | EP2AGZ300FF35C3G |
|---|---|---|---|---|---|---|
| Package | FC-FBGA-1152 (FF35) | FC-FBGA-1152 (FF35) - same | FC-FBGA-1152 (FF35) - same | FC-FBGA-1152 (FF35) - same | FC-FBGA-1152 (FF35) - same | FC-FBGA-1152 (FF35) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Family | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ |
| Logic Elements | 298000 | 224000 (-25%) | 298000 (same) | 298000 (same) | 298000 (same) | 298000 (same) |
| Number of LABs | 11920 | 8960 (-25%) | 11920 (same) | 11920 (same) | 11920 (same) | 11920 (same) |
| Total RAM Bits | 18854912 | 14286848 (-24%) | 18854912 (same) | 18854912 (same) | 18854912 (same) | 18854912 (same) |
| Number of I/O | 554 | 554 (same) | 554 (same) | 554 (same) | 554 (same) | 554 (same) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) - same | Industrial (-40C to +100C) - same | Commercial (0C to +85C) - lower | Commercial (0C to +85C) - lower | Commercial (0C to +85C) - lower |
| Speed Grade | I3 | I3 (same) | I3 (same) | C4 (slower) | C3 (slowest) | C3 (slowest) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest-density Arria II GZ variant in the FF35 package (vs EP2AGZ225FF35I3N)
- Industrial temperature grade support in a 1152-ball FC-FBGA (vs EP2AGZ300FF35C4N)
- Mid-speed-grade I3 balance of performance and power (vs EP2AGZ300FF35C3N)
Design Notes
The EP2AGZ300FF35I3N's FC-FBGA-1152 package at 1.0 mm pitch requires HDI PCB technology with laser-drilled microvias and a sequential lamination stack-up. Designers should plan for at least 10 PCB layers to fan out the 1152 balls to escape routes while maintaining 50 ohm impedance on high-speed transceiver and DDR3 channels. Reference the Altera Arria II GZ device handbook pin-out appendix for the FF35 ball map and ensure the PCB design rule check (DRC) accommodates the package's keep-out zones.
The 0.9 V core on a 298K-LE Arria II GZ can draw several amps under full utilization, so allocate a multi-phase DC-DC converter plus extensive bulk and high-frequency decoupling. Use the Altera PowerPlay Early Power Estimator (EPE) spreadsheet to model VCC, VCCPD, VCCPT, and VCCA currents before committing to a PMIC. Place decoupling capacitors directly adjacent to each power pin group and provide a low-impedance ground plane on layer 2 to control simultaneous switching noise (SSN) across the 554 I/O.
While the EP2AGZ300FF35I3N is industrial-temperature graded, the FC-FBGA-1152 package dissipates significant heat under heavy DSP utilization. Estimated: at 85% resource utilization and 500 MHz fabric clock, total on-die power can exceed 15 W, requiring a heatsink or thermal pad bonded to the package top and adequate airflow. Reference the Arria II GZ thermal management application note for junction-to-ambient (theta_JA) and junction-to-case (theta_JC) values when sizing your cooling solution.
Place configuration, JTAG, and reference clock pins on the same PCB side as the FPGA to minimize stub lengths and signal reflections. Use 100 ohm differential routing for LVDS pairs from the FPGA I/O banks, and isolate high-speed transceiver channels from lower-speed control signals with a ground wall. Per the Arria II GZ handbook, length-match DDR3 address and command traces within 25 mils and clock-to-DQS within 10 mils to meet the DDR3-1600 tDS/tDH timing budget.
Compliance Information
RoHS, REACH, lead-free, halogen-free, and conflict-mineral status were not present in the Verified Web Data and are flagged as [DATA_NEEDED] in the specs array. AEC-Q100 is not applicable because this is a high-density FPGA, not an automotive-grade IC.
