EP2S130F1020C4N - 132K LE Stratix II FPGA, 1020-BGA | Intel
MPN: EP2S130F1020C4N β Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3435 | $3,435.00 |
| 10 | $3290 | $32,900.00 |
| 25 | $3120 | $78,000.00 |
| 50 | $2980 | $149,000.00 |
| 100 | $2850 | $285,000.00 |
EP2S130F1020C4N Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built from an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnects that engineers can re-program after manufacturing to implement custom digital logic. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) and bridge the gap between fixed-function ASICs and software-driven microprocessors, offering hardware-level parallelism with software-level flexibility. The Stratix II family specifically introduced an adaptive logic module (ALM) architecture that replaced older 4-input LUT designs with 8-input fracturable LUTs, improving logic efficiency for DSP-heavy and register-rich designs.
Key specifications of the EP2S130F1020C4N include 6,627 LABs (Logic Array Blocks), embedded multiplier blocks for DSP, support for multiple high-speed serial transceivers, and a dedicated configuration circuitry for in-system programmability via JTAG or passive/active serial modes. The device integrates up to 4 Mb of TriMatrix embedded SRAM distributed in MRAM, M512, and M4K blocks. The 1020-ball FC-FBGA package provides high I/O density suited to multi-channel memory interfaces and parallel processor buses.
The Stratix II architecture uses a 90 nm 1.2 V core, with separate VCCIO banks supporting mixed-voltage I/O standards such as LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The C4 speed grade balances timing margin against power consumption; industrial variants exist in I-grade temperature ranges. The flip-chip BGA provides low-inductance power delivery and superior thermal performance for high-utilization designs.
Typical applications include high-end telecommunications line cards, high-performance digital signal processing (DSP) pipelines, ASIC prototyping, military and aerospace signal processing, and high-speed serial protocol bridging. The device is also used in medical imaging front-ends and broadcast video processing where deterministic latency and parallel datapath throughput are critical.
When designing with this part, pay close attention to power planning - the 1.2 V core can draw substantial current at high toggle rates, so a multi-rail decoupling strategy and thermal management (heatsink or airflow) are essential. Use the Quartus II design software for synthesis, place-and-route, and timing closure; the device is supported by legacy Quartus II versions up to 13.0sp1 and not by newer Quartus Prime Pro editions.
This page synthesizes distributor pricing, drop-in same-brand alternatives, and practical design notes not found in a single manufacturer datasheet, helping engineers evaluate the EP2S130F1020C4N against modern FPGA families and plan second-source supply strategies.
Drop-in alternatives for EP2S130F1020C4N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S130F1020C4N (same form factor and footprint) β differing in Operating Temperature, Speed Grade, Package, RoHS Status, Mounting Type.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2S130F1020C3N
β Drop-Inβ In Stock
$1095 / Unit
View Datasheet βEP2S130F1020C5
β Drop-Inβ In Stock
$4100 / Unit
View Datasheet βEP2S130F1020C3
β Drop-Inβ In Stock
$1295 / Unit
View Datasheet βEP2S130F1020C4
β Drop-Inβ In Stock
$2800 / Unit
View Datasheet βEP2S130F1020C3NRB
β Drop-Inβ In Stock
$1245 / Unit
View Datasheet βEP2S130F1020C4N Maximum Ratings & Electrical Characteristics
| Family | Stratix II |
| Logic Elements | 132,540 |
| Total Memory Bits | 6,747,840 |
| Logic Array Blocks (LABs) | 6,627 |
| Maximum User I/O | 742 |
| Process Technology | 90 nm CMOS |
| Core Voltage (VCCINT) | 1.2 V |
| Package | 1020-ball FC-FBGA |
| Speed Grade | C4 (commercial) |
| Operating Temperature | 0C to +85C (commercial, inferred from C grade) |
| Maximum Internal Frequency | 711.24 MHz |
| Configuration Method | JTAG / Passive Serial / Active Serial |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 (per JEDEC J-STD-020, typical for FC-BGA) |
| RoHS Status | Compliant |
| Design Tool | Quartus II (legacy, up to v13.0sp1) |
EP2S130F1020C4N 1020-ball fc-fbga Pin Configuration Guide
Pin configuration for EP2S130F1020C4N (1020-ball fc-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2S130F1020C4N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2S130F1020C4N is suitable for 6 applications: High-End Telecommunications Line Cards, High-Performance DSP Pipelines, ASIC Prototyping and Emulation, Military and Aerospace Signal Processing, Medical Imaging Front-End Processing, Broadcast Video Processing.
High-End Telecommunications Line Cards
The EP2S130F1020C4N suits telecom line cards because of its 132,540 logic elements and 6,747,840 memory bits, which are sufficient to implement multi-channel framer/mapper functions, packet classification engines, and traffic management datapaths in a single device. The 742 user I/O pins support wide parallel backplane buses and multiple SFI/XFI interfaces through the Stratix II high-speed transceiver blocks. Compared to ASSPs of its era, the FPGA's reprogrammability allowed telecom OEMs to deploy multi-standard line cards (SONET/SDH, Ethernet, OTN) from a single hardware platform, reducing SKUs. The 1.2 V core and 90 nm process deliver adequate speed for 622 Mbps to 2.5 Gbps interfaces, though modern 10G+ designs would migrate to Arria 10 or Stratix V. Designers should verify I/O timing closure using Quartus II TimeQuest and budget for thermal management at sustained high toggle rates.
Recommended
High-Performance DSP Pipelines
The EP2S130F1020C4N's embedded multiplier blocks and TriMatrix memory make it well suited for high-throughput DSP pipelines such as radar baseband processing, software-defined radio channelization, and multi-channel digital filtering. The 8-input fracturable ALM architecture introduced with Stratix II improved logic efficiency for DSP-heavy designs, allowing more multiply-accumulate operations per logic element than 4-LUT families. Each DSP block in Stratix II supports up to 18x18 multipliers with accumulation, ideal for FIR filters and FFT butterfly stages. The 1020-ball FC-FBGA package supports wide memory buses to external DDR or QDR SRAM, critical for streaming DSP workloads. Designers targeting Stratix II DSP should use the MegaCore DSP Builder library and pay attention to pipeline depth vs. fMAX trade-offs.
Recommended
ASIC Prototyping and Emulation
The EP2S130F1020C4N's high logic density makes it a candidate for ASIC prototyping and pre-silicon emulation of large SoC designs. Multi-FPGA prototyping systems such as the Synopsys HAPS and older Cadence Palladium XP boards often used Stratix II devices to map partitioned RTL before tape-out, leveraging the ALM architecture for fast synthesis turnaround. The 6,747,840 memory bits per device approximate 4 Mb of distributed and block SRAM, enough to emulate moderately sized on-chip memories. Multi-device partitioning tools such as Certify and Synplify Premier are designed to handle Stratix II multi-FPGA flows. Engineers should note that the device is now in last-time-buy, so new prototyping investments should target Stratix V, Arria 10, or Kintex UltraScale families with active long-term supply.
Recommended
Military and Aerospace Signal Processing
The EP2S130F1020C4N's high logic density and flip-chip BGA package enable its use in military and aerospace signal-processing applications such as electronic countermeasures (ECM), synthetic aperture radar (SAR) preprocessing, and secure communications baseband. The commercial C4 temperature grade is suitable for benign environments, but military programs typically specify the industrial or military-grade variant. The 1020-ball FC-FBGA supports high-bandwidth sensor interfaces, including LVDS and LVPECL links to high-speed ADCs and DACs. Designers in this segment value the device's deterministic latency and parallel datapath, which are critical for real-time beamforming and spectral analysis. Note that military programs should consult the latest Altera/Intel military product roadmap, as Stratix II is mature and defense programs may require extended-temperature or ceramic-packaged equivalents.
Recommended
Medical Imaging Front-End Processing
The EP2S130F1020C4N suits medical imaging systems such as ultrasound beamformers, MRI gradient controllers, and CT image reconstruction pipelines, where real-time parallel processing is essential. Its embedded multipliers and TriMatrix memory enable efficient implementation of beamforming delay-and-sum operations in ultrasound, with deterministic per-channel latency. The 1020-ball FC-FBGA allows integration of multiple analog-front-end LVDS interfaces into a single FPGA, reducing board area and BOM cost. Compared to GPU-based medical imaging, FPGAs offer lower latency and deterministic timing critical for diagnostic imaging. The 90 nm process and 1.2 V core keep power consumption manageable in fan-cooled medical chassis. Designers should follow IEC 60601-1 safety isolation requirements and consider modern migration paths such as Cyclone V or Arria V for new medical platforms.
Recommended
Broadcast Video Processing
The EP2S130F1020C4N is well-suited to broadcast video processing such as SD/HD/3G-SDI routing, video format conversion, and color-space transformation in professional broadcast equipment. The 742 user I/O pins enable integration of multiple SDI inputs and outputs alongside control and memory interfaces within a single device, reducing overall system cost. The 6,627 LABs and 6,747,840 memory bits provide ample resources for line-store buffers required by deinterlacing and frame-rate conversion algorithms. The flip-chip BGA package supports the high-speed SERDES needed for SDI at 270 Mbps, 1.485 Gbps, and 2.97 Gbps. Designers should evaluate the Stratix II transceiver reference designs and use Quartus II's ALTGX megafunction for SERDES instantiation. For new broadcast designs, consider Cyclone 10 GX or Arria 10 with 12G-SDI hard IP for 4K workflows.
Recommended
Recommended Products Summary
Engineering reference data for EP2S130F1020C4N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S130F1020C3N | EP2S130F1020C5 | EP2S130F1020C3 | EP2S130F1020C4 | EP2S130F1020C3NRB |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Logic Elements | 132,540 | 132,540 - identical | 132,540 - identical | 132,540 - identical | 132,540 - identical | 132,540 - identical |
| Speed Grade | C4 | C3 (slower Fmax, ~10-15% lower) | C5 (faster Fmax, ~10-15% higher) | C3 (slower Fmax) | C4 (identical speed) | C3 (slower Fmax) |
| Memory Bits | 6,747,840 | 6,747,840 - identical | 6,747,840 - identical | 6,747,840 - identical | 6,747,840 - identical | 6,747,840 - identical |
| LABs | 6,627 | 6,627 - identical | 6,627 - identical | 6,627 - identical | 6,627 - identical | 6,627 - identical |
| Maximum User I/O | 742 | 742 - identical | 742 - identical | 742 - identical | 742 - identical | 742 - identical |
| Core Voltage | 1.2 V | 1.2 V - identical | 1.2 V - identical | 1.2 V - identical | 1.2 V - identical | 1.2 V - identical |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Key Differentiators
- Identical die and 1020-BGA package across all speed grades (vs EP2S130F1020C3N)
- Lead-free NRB suffix explicitly confirms RoHS compliance (vs EP2S130F1020C4)
- C5 speed grade provides higher Fmax headroom (vs EP2S130F1020C5)
Design Notes
Estimated: at 1.2 V core with 132,540 logic elements running at 100 MHz with 20% toggle rate, the EP2S130F1020C4N core current draw is approximately 2-4 A depending on utilization. Designers must plan for VCCINT at 1.2 V with bulk decoupling (>= 220 uF bulk + 100 nF + 10 uF ceramics per VCC pin group), and use the Quartus II PowerPlay Analyzer to extract real worst-case ICCINT and ICCIO before finalizing the regulator design. The 1020-ball FC-FBGA provides adequate power/ground balls for low-inductance distribution, but PCB layer stack-up must allocate dedicated power planes.
Estimated: at full logic utilization and high toggle rate, the EP2S130F1020C4N junction temperature can approach 100C in still air with a 4-layer JEDEC test board. For sustained operation, attach a heatsink with thermal interface material and ensure airflow >= 1 m/s across the BGA. The flip-chip construction provides better thermal performance than wire-bond BGAs of similar ball count, but sustained >85C junction reduces device lifetime per Arrhenius model. Engineers should run thermal simulation using known theta_JB from the package datasheet plus board copper coverage.
The 1020-ball FC-FBGA requires microvia (HDI) PCB technology with 0.8 mm or 1.0 mm ball pitch. Stack-up should include 4-6 inner layers with continuous ground planes under the BGA to control return paths and reduce SSN. Use laser-drilled microvias (0.1 mm) from the top layer to inner signal layers, and 0.2 mm vias on inner layers. Pin-out files generated from Quartus II Pin Planner should drive via fan-out to avoid routing congestion. Reference the Altera Stratix II board design guidelines (AN 480) for recommended stack-up and decoupling topology.
Do not attempt to use Quartus Prime Pro or Standard for Stratix II designs - these newer editions do not include Stratix II device libraries. Retain Quartus II version 13.0sp1 or earlier for synthesis, fitting, and programming file generation. Also note that the EP2S130F1020C4N is in last-time-buy status, so design teams should plan migration paths to Cyclone V, Arria V, or Arria 10 for new programs. Mixing speed grades (C3/C4/C5) within the same design is allowed but timing closure analysis must use the slowest device on the board.
Compliance Information
RoHS compliance indicated by 'N' suffix in MPN. Lead-free per the N suffix and the explicit NRB variant marking. Halogen-free and conflict-minerals status not explicitly stated in available web data; consult Intel PCN documentation for verification.
