EP2S15F484C3 - Stratix II FPGA, 15600 LE, 484-FBGA | Intel
MPN: EP2S15F484C3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $142 | $14,200.00 |
| 500 | $128 | $64,000.00 |
| 1,000 | $118 | $118,000.00 |
EP2S15F484C3 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a matrix of configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard-IP blocks such as block RAM, DSP multipliers, PLLs, and high-speed transceivers. FPGAs belong to the broader category of programmable logic devices (PLDs), which sit between fixed-function ASICs and software-programmable processors. Stratix II placed particular emphasis on adaptive logic modules (ALMs), each containing a fractured look-up table (LUT) structure that improves logic packing density versus earlier Stratix devices.
Key features of this part include 780 LABs/CLBs, 6,240 ALMs, 156 DSP blocks capable of up to 384 GMACs of DSP throughput, four embedded PLLs for clock management, and up to 12 phase-locked loops with up to 16 global clock networks. The device supports a wide variety of I/O standards including LVDS, LVPECL, SSTL, HSTL, PCI, PCI-X, and LVTTL, and integrates 419 Kbits of embedded RAM block memory plus additional logic-array distributed memory.
Architecturally, Stratix II introduced the TriMatrix memory hierarchy with three block RAM sizes (M512, M4K, M-RAM) and a row-based architecture that places memory and DSP columns adjacent to the logic array. This provides predictable timing for high-throughput data paths in applications such as wireless baseband, video processing, and high-speed serial interfaces. The 90 nm process node combined with a 1.2 V core voltage gives the device a balance of performance and power efficiency for mid-density designs.
Typical applications include telecommunications infrastructure, software-defined radio, high-speed imaging and video pipelines, ASIC prototyping, and industrial control. The device is also frequently used in test and measurement equipment where its DSP blocks and large memory are well matched to real-time signal processing.
When designing with this FPGA, engineers must supply multiple voltage rails (core, PLL, I/O banks) and observe strict PCB layout requirements for the FBGA substrate, including microvia or via-in-pad construction to break out the 1.0 mm pitch BGA. Quartus II is the canonical design toolchain for programming and configuring this device family.
This page synthesizes distributor pricing, same-family and cross-package alternatives, and practical design notes not collated in any single manufacturer document.
Drop-in alternatives for EP2S15F484C3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S15F484C3 (same form factor and footprint) — differing in Package, Speed Grade, RoHS Status, Adaptive Logic Modules (ALMs), Configuration Method.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2S15F484C5
✅ Drop-In✓ In Stock
$185 / Unit
View Datasheet →EP2S15F484C4
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$205 / Unit
View Datasheet →EP2S15F484I4
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$253.03 / Unit
View Datasheet →EP2S15F484C3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$155 / Unit
View Datasheet →EP2S15F484I4N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
Contact for price
View Datasheet →EP2S30F484C5N
✅ Drop-In✓ In Stock
$367.48 / Unit
View Datasheet →EP2S15F484C3 Maximum Ratings & Electrical Characteristics
| Series | Stratix II |
| Family | FPGA - Field Programmable Gate Array |
| Number of Logic Elements (LE) | 15600 |
| Number of LABs/CLBs | 780 |
| Adaptive Logic Modules (ALMs) | 6240 |
| Total RAM Bits | 419328 |
| Number of I/Os | 342 |
| Package / Case | 484-BBGA, FBGA |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +85C (commercial) |
| Speed Grade | C3 (-3) |
| Packaging | Tray |
| Process Node | 90 nm |
| Status | Obsolete |
EP2S15F484C3 484-bbga, fbga Pin Configuration Guide
Pin configuration for EP2S15F484C3 (484-bbga, fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2S15F484C3.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2S15F484C3 is suitable for 6 applications: Telecommunications Infrastructure, Software-Defined Radio (SDR), High-Speed Video and Imaging Pipelines, ASIC Prototyping, Industrial Control and Automation, Test and Measurement Instrumentation.
Telecommunications Infrastructure
The EP2S15F484C3 fits telecom line-card and baseband designs because its 15,600 logic elements and 156 DSP blocks can implement multi-channel packet processing, CRC engines, and forward-error-correction (FEC) accelerators in a single chip. The 419 Kbits of block RAM plus distributed LUT memory provides packet buffer headroom, while four embedded PLLs generate the multiple clock domains required for fabric, SERDES, and backplane interfaces. The 342 user I/Os accept LVDS and LVPECL signaling used in telecom backplanes, allowing direct connection to PHY devices without external buffering.
Recommended
Software-Defined Radio (SDR)
For SDR platforms, the EP2S15F484C3's 156 DSP blocks deliver up to ~384 GMACs of multiply-accumulate throughput, suitable for FFT cores, channelizers, and digital down-converters. The Stratix II TriMatrix memory hierarchy (M512/M4K/MRAM) lets designers place large coefficient tables close to DSP columns to maintain timing closure on high-sample-rate data paths. The LVDS-capable I/Os interface directly to ADC/DAC front ends, and the four PLLs generate the multiple clock phases needed for sample-rate conversion.
Recommended
High-Speed Video and Imaging Pipelines
The EP2S15F484C3 is well suited to real-time video processing pipelines including deinterlacing, scaling, color-space conversion, and overlay composition. Its 419 Kbits of block RAM implement line buffers for HD resolutions, and the 156 DSP blocks accelerate pixel-rate convolution and motion-estimation operations. The 342 LVDS/LVCMOS I/Os accept uncompressed DVI/HDMI/SDI streams via serializer/deserializer chips. Speed grade C3 supports the high toggle rates needed for 1080p60 and beyond at single-board integration.
Recommended
ASIC Prototyping
Designers use the EP2S15F484C3 to prototype mid-complexity ASICs because the 484-FBGA package exposes enough I/Os (342) to emulate realistic ASIC pad counts, and Quartus II synthesis lets you target the same RTL that will be migrated to silicon. The 15,600 LE density accommodates most sub-million-gate ASICs in a single device, and the DSP/PLL features let you validate clocking and arithmetic blocks early. Migration to a Stratix III or IV device (e.g., EP3S25F484 or EP4SGX70F484) gives more capacity for the final pre-silicon validation.
Recommended
Industrial Control and Automation
In industrial control systems, the EP2S15F484C3 hosts real-time motion-control loops, custom fieldbus protocols (EtherCAT, Profinet, SERCOS), and safety logic that cannot be served by microcontrollers alone. Speed grade C3 (commercial 0C to 85C) suits cabinet-mounted control equipment; for harsher environments migrate to the industrial-grade variant EP2S15F484I4 (-40C to 100C). The LVDS I/Os connect to high-precision encoders and sigma-delta ADCs, while the DSP blocks implement PID and state-space controllers at high loop rates.
Recommended
Test and Measurement Instrumentation
The EP2S15F484C3's combination of DSP blocks, embedded RAM, and 342 high-speed I/Os makes it well suited to digital oscilloscopes, logic analyzers, and protocol analyzers. The FPGA pre-processes samples at full ADC rate - decimation, trigger detection, and storage control - while a host processor handles display and command. Speed grade C3 ensures timing closure on the most demanding trigger paths, and the PLLs generate the multiple related clock domains needed for ADC/DDR memory interfaces.
Recommended
Recommended Products Summary
Engineering reference data for EP2S15F484C3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S15F484C5 | EP2S15F484C4 | EP2S15F484I4 | EP2S15F484C3N | EP2S15F484I4N | EP2S30F484C5N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-FBGA | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Logic Elements | 15600 | 15600 | 15600 | 15600 | 15600 | 15600 | 33880 |
| Number of LABs/CLBs | 780 | 780 | 780 | 780 | 780 | 780 | 1694 |
| Total RAM Bits | 419328 | 419328 | 419328 | 419328 | 419328 | 419328 | 1369728 |
| Number of I/Os | 342 | 342 | 342 | 342 | 342 | 342 | 342 |
| Temperature Grade | Commercial (0C to 85C) | Commercial (0C to 85C) | Commercial (0C to 85C) | Industrial (-40C to 100C) | Commercial (0C to 85C) | Industrial (-40C to 100C) | Commercial (0C to 85C) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest speed grade in Stratix II EP2S15 family (vs EP2S15F484C5)
- Commercial temperature grade (vs EP2S15F484I4)
- Identical silicon die to EP2S15 family siblings (vs EP2S30F484C5N)
Design Notes
Estimated: the 484-ball FBGA at 1.0 mm ball pitch requires microvia or via-in-pad PCB technology for a clean breakout. Use a 1.6 mm or thinner PCB stack-up with sequential lamination to escape the inner rows; standard through-vias cannot fit between balls. Provide a continuous ground plane directly under the BGA for return-path integrity and to suppress SSN.
The Stratix II EP2S15 requires at least four separate supply rails: VCCINT (1.2 V core), VCCIO per I/O bank (1.2 V to 3.3 V), VCCAUX (2.5 V) for PLLs and configuration, and VCCPD (3.3 V) for pre-drivers. Decoupling must follow the manufacturer reference design: at least 24 x 0.1 uF and 4 x 10 uF low-ESR ceramics around the BGA, with bulk capacitance sized so that worst-case load transient does not collapse any rail more than 50 mV.
Do not substitute the EP2S15F484 family for Stratix III or Stratix IV without re-targeting the Quartus project - the bank assignments, PLL pin maps, and configuration pin names all differ even when the package code is shared. A common design pitfall is assuming 'F484' means drop-in across generations; verify against the device-specific pin table in the Stratix II Handbook before committing to a PCB revision.
Estimate: for LVDS outputs above 400 Mbps, route the LVDS pair with 100 ohm differential impedance, length-matched to within 20 ps, and keep at least 3W (W = trace width to nearest reference plane) spacing from other high-speed signals. Use the Stratix II ALM-aware fitter to constrain the placement of LVDS I/O pins adjacent to clock PLL inputs to avoid jitter coupling.
Place configuration flash (EPCS16/EPCS64) within 2 inches of the FPGA DATA0/DCLK/nCSO pins. Keep JTAG (TCK/TMS/TDO/TDI) trace lengths under 4 inches and add a 4.7 kohm pull-up on TCK/DATA0 and a 4.7 kohm pull-down on TMS/nCONFIG for clean boundary-scan operation. Reserve a 4-pin header for Quartus programmer access on production boards.
Compliance Information
The Stratix II family pre-dates the widespread adoption of public RoHS declarations; lot-specific material declarations must be requested from brokers. Not AEC-Q100 qualified - this is a logic device for industrial/commercial embedded use, not automotive safety.
