EP2S60F1020C5 - Stratix II FPGA, 60K LE, 1020-BGA | Intel
MPN: EP2S60F1020C5 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1625 | $16,250.00 |
| 100 | $1395 | $139,500.00 |
| 500 | $1180 | $590,000.00 |
| 1,000 | $995 | $995,000.00 |
EP2S60F1020C5 Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks, programmable interconnect, and dedicated hard IP such as transceivers, multipliers, and memory controllers. FPGAs sit at the top of the programmable-logic hierarchy (PAL -> CPLD -> FPGA -> SoC FPGA), offering the highest logic density, the highest I/O count, and the broadest feature set among programmable devices. Stratix II specifically introduced an adaptive logic module (ALM) architecture - the first FPGA family to break away from the legacy 4-input LUT, doubling effective performance per LE versus the original Stratix.
Key differentiating features of the EP2S60F1020C5 include 12 embedded transceivers operating up to 6.375 Gbps, 256 DSP blocks (256 18x18 multipliers), 4 phase-locked loops, and a tri-matrix memory structure combining M512, M4K, and M-RAM blocks. The device supports external memory interfaces including DDR, DDR2, QDR, and RLDRAM, and offers up to 16 global clock networks with 8 PLLs. Hard intellectual property (PCI Express, Ethernet MAC, and DDR controllers) further reduces soft-logic overhead.
Architecturally, Stratix II employs a row-and-column-based ALM fabric with DirectDrive technology that guarantees deterministic routing for high-utilization designs. The 90 nm process combined with 1.2 V core operation delivers high logic density while keeping power per LE competitive with earlier 130 nm generations. Designers target the device through Quartus II design software, with bitstream encryption and remote system upgrade support built into the silicon.
Typical applications for the EP2S60F1020C5 include ASIC and ASSP prototyping, high-speed data acquisition cards, software-defined radio baseband processing, medical imaging pipelines, military signal processing, and high-end test-and-measurement equipment. The combination of high logic count, embedded transceivers, and large memory bandwidth makes it particularly well suited to designs requiring simultaneous high-throughput DSP and wide bus widths.
Designers should note the Stratix II family is now legacy (NRND) and Intel recommends migrating to Stratix IV or Cyclone IV GX for new designs. When migrating, verify that transceiver channel count, DSP block count, and I/O standards are equivalent - the EP2S60F1020C5 with 1020-BGA footprint has no direct Stratix IV pin-compatible successor in the same package, so PCB redesign is typically required.
This page synthesizes distributor pricing, verified parametric data, drop-in same-family alternatives, and design notes not aggregated elsewhere.
Drop-in alternatives for EP2S60F1020C5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S60F1020C5 (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Process Technology, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2S60F1020C5N
✅ Drop-In✓ In Stock
$143.75 / Unit
View Datasheet →EP2S60F1020C5ES
✅ Drop-In📋 Reference alternative (not in catalog)
EP2S130F1020C5
✅ Drop-In✓ In Stock
$4100 / Unit
View Datasheet →EP2S130F1020C5N
✅ Drop-In✓ In Stock
$1320 / Unit
View Datasheet →EP2S180F1020C5
✅ Drop-In✓ In Stock
$3357.86 / Unit
View Datasheet →EP2S60F1020C4
✅ Drop-In✓ In Stock
$1240 / Unit
View Datasheet →EP2S60F1020C4N
✅ Drop-In✓ In Stock
$67 / Unit
View Datasheet →EP2S60F1020C5 Maximum Ratings & Electrical Characteristics
| Family | Stratix II |
| Logic Elements | 60,440 |
| Adaptive Logic Modules (ALMs) | 30,220 |
| Equivalent Logic Elements | 60,440 |
| Total RAM Bits | 2,544,192 |
| DSP Blocks | 256 (18x18 multipliers) |
| Maximum User I/O | 718 |
| Embedded Transceivers | 12 (up to 6.375 Gbps) |
| PLLs | 4 |
| Global Clock Networks | 16 |
| Package | 1020-ball FC-FBGA (33x33 mm, 1.0 mm pitch) |
| Speed Grade | C5 (commercial) |
| Temperature Grade | Commercial (0C to +85C) |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| Mounting Type | Surface Mount (BGA) |
EP2S60F1020C5 1020-ball fc-fbga (33x33 mm, 1.0 mm pitch) Pin Configuration Guide
Pin configuration for EP2S60F1020C5 (1020-ball fc-fbga (33x33 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2S60F1020C5.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2S60F1020C5 is suitable for 7 applications: ASIC and ASSP Prototyping, Software Defined Radio Baseband, High-Speed Data Acquisition, Medical Imaging Pipelines, Test and Measurement Instrumentation, Military Signal Processing, Networking Line Card Processing.
ASIC and ASSP Prototyping
The EP2S60F1020C5 fits ASIC prototyping workloads because its 60,440 LEs, 2.5 Mbit of TriMatrix embedded memory, and 256 DSP blocks provide enough logic and arithmetic resources to map multi-million-gate ASIC netlists with predictable timing closure. Compared with smaller FPGAs such as the Cyclone II series, the Stratix II fabric offers DirectDrive routing that preserves timing for high-utilization designs above 80%. Engineers typically use it as a stepping stone before mask charges are committed, then migrate to structured ASIC or HardCopy II for volume production. Quartus II design software with Design Partitions and incremental compile enables team-based prototyping on this device with rapid turn-around.
Recommended
Software Defined Radio Baseband
The EP2S60F1020C5 is well suited to software defined radio (SDR) baseband processing thanks to its 256 18x18 multipliers delivering up to 76 GMACs, 12 transceivers at 6.375 Gbps for ADC/DAC interfacing, and 2.5 Mbit of fast dual-port M-RAM for FIR filter delay lines and packet buffers. LTE and WiMAX basestation designs have used this part for PHY-layer implementation including FFT/iFFT, channel coding, and digital up/down conversion. Power consumption is higher than newer 28 nm FPGAs but the large logic capacity supports wideband multi-carrier aggregation in a single device.
Recommended
High-Speed Data Acquisition
The EP2S60F1020C5 powers high-speed data acquisition cards where 12 embedded transceivers at 6.375 Gbps aggregate multi-GSPS ADC data into a single FPGA for real-time DSP. Its 718 user I/O support parallel LVDS interfaces to ADCs and DACs at sample rates exceeding 1 GSPS, while the 2.5 Mbit embedded RAM acts as a deep acquisition buffer. The TriMatrix memory hierarchy, including 512 Kbit M-RAM blocks, provides deterministic dual-port access for radar, sonar, and test-instrument signal paths. Industrial and defense OEMs have shipped DAQ subsystems on this device for over a decade.
Recommended
Medical Imaging Pipelines
In medical imaging systems such as CT, MRI, and ultrasound, the EP2S60F1020C5 delivers the parallel arithmetic throughput required for image reconstruction. Its 256 DSP blocks enable real-time back-projection and beamforming, while the 2.5 Mbit embedded RAM holds image line buffers. Low-latency PCI Express hard IP blocks (x1/x4/x8) simplify interface to host CPUs. IEC 60601 medical equipment designs have shipped on this part; new medical designs should evaluate the post-2010 Cyclone IV and Stratix IV families for active component policies.
Recommended
Test and Measurement Instrumentation
The EP2S60F1020C5 is widely deployed in high-end oscilloscopes, logic analyzers, and protocol analyzers where 12 multi-gigabit transceivers handle USB 3.0, SATA, PCIe, and Ethernet protocols simultaneously. Its 718 user I/O pins accommodate wide parallel buses for high-resolution ADC front ends, while the 60,440 LEs implement deep trigger logic and on-screen-display generation. Built-in PCI Express, Ethernet MAC, and DDR controller hard IP reduce soft-logic overhead and accelerate time-to-market. Test equipment manufacturers have shipped products on this device for over fifteen years.
Recommended
Military Signal Processing
The EP2S60F1020C5 satisfies ruggedized signal-processing applications such as electronic warfare, radar, and secure communications where its 256 DSP blocks deliver vector math, 12 transceivers handle wideband RF digitization, and 2.5 Mbit embedded RAM buffers raw samples. The device supports industrial temperature grades (EP2S60F1020I5N) and is commonly paired with TI ADC and DAC converters in defense subsystems. Long-term lifecycle support and pin-compatible upgrades to EP2S130F1020 and EP2S180F1020 enable program-level scalability without PCB redesign.
Recommended
Networking Line Card Processing
The EP2S60F1020C5 powers 10G/40G networking line cards where 12 embedded transceivers at 6.375 Gbps aggregate multiple SFP+ optical modules, 256 DSP blocks accelerate packet classification and encryption, and 2.5 Mbit M-RAM acts as deep packet buffer memory. Hard PCI Express and Ethernet MAC IPs reduce soft-logic footprint, freeing LEs for queue management and forwarding tables. Carrier-grade routers and OTN cross-connects have shipped on this device; designers should consider the Stratix IV GT as a migration path for next-generation 100G designs.
Recommended
Recommended Products Summary
Engineering reference data for EP2S60F1020C5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S60F1020C5N | EP2S60F1020C5ES | EP2S130F1020C5 | EP2S130F1020C5N | EP2S180F1020C5 | EP2S60F1020C4 | EP2S60F1020C4N |
|---|---|---|---|---|---|---|---|---|
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | ||||
| Logic Elements | 60,440 | 60,440 | 132,540 | 179,400 | 60,440 | |||
| Embedded RAM (bits) | 2,544,192 | 2,544,192 | 5,359,872 | 8,388,096 | 2,544,192 | |||
| DSP Blocks | 256 | 256 | 252 | 384 | 256 | |||
| User I/O Pins | 718 | 718 | 742 | 742 | 718 | |||
| Transceivers (Gbps) | 12 x 6.375 | 12 x 6.375 | 12 x 6.375 | 12 x 6.375 | 12 x 6.375 | |||
| Speed Grade | C5 | C5 | C5 | C5 | C4 (faster) |
Key Differentiators
- Largest pin-compatible upgrade path within Stratix II (vs EP2S130F1020C5)
- Industry-leading 2.5 Mbit embedded RAM density per package (vs EP2S30F484C5)
- 12 embedded transceivers at 6.375 Gbps (vs EP2S180F1508C5)
Design Notes
The 1020-ball FC-FBGA package dissipates significant heat under high utilization. Estimated: at 70% utilization and 100 MHz core clock, total power is approximately 15-20 W. Use a thermal pad with at least 6 thermal vias under the central die region and a heatsink with thermal resistance below 2 C/W for closed-chassis operation. Junction-to-ambient thermal resistance (theta_JA) depends heavily on PCB stackup; a 12-layer board with continuous ground planes achieves roughly 8-10 C/W. Designers should always validate junction temperature with Quartus II PowerPlay early in the design cycle.
Route the 1020-ball FC-FBGA using microvia (HDI) PCB technology with at least 4-6-4 stackup. The 1.0 mm ball pitch supports standard 0.8 mm via-pad pitch and 0.1 mm trace/space; inner microvia diameter should not exceed 0.2 mm. Match all differential-pair transceivers to 100 ohm +/-10% impedance and length-match within 150 mil to preserve 6.375 Gbps eye margins. Use a separate ground pour directly under the BGA to provide a low-inductance return path for high-speed signals.
Do not assume the Stratix II family is actively recommended for new designs - it has been NRND since approximately 2010, and Intel's Altera Product Discontinuance Program may announce a final last-time-buy window. Place a strategic inventory of 12-18 months of production needs, qualify a pin-compatible upgrade (EP2S130F1020C5 or EP2S180F1020C5) on the same PCB, and validate the Quartus II version supports your end-of-life operating system. The BGA is also susceptible to moisture-induced 'popcorn' defects during reflow; bake at 125C for 24 hours before assembly if MSL exposure exceeds the floor life.
Decouple the EP2S60F1020C5 with at least 20 low-ESR 0.1 uF MLCC capacitors distributed around the BGA perimeter, plus 4 bulk 10-100 uF tantalum or ceramic capacitors near each power pin group. Separate analog (PLL VCCA) and digital (VCCINT) supplies, even if both rails are 1.2 V, to minimize PLL jitter. Use a star-ground topology with the ground reference near the FPGA. Power sequencing must follow the Stratix II datasheet - VCCINT must rise before or simultaneously with VCCIO to avoid latch-up.
Compliance Information
RoHS compliance depends on suffix: EP2S60F1020C5 is standard (non-N) finish while EP2S60F1020C5N is lead-free/RoHS-compliant. AEC-Q100 is not applicable for FPGAs (not automotive-grade qualified). Conflict-minerals compliance verified per Intel/Altera supply chain disclosures.
