EP2SGX130GF40C5NES - Stratix II GX FPGA 132K LEs 1508-FBGA | Intel
MPN: EP2SGX130GF40C5NES ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1745 | $17,450.00 |
| 100 | $1620 | $162,000.00 |
| 250 | $1530 | $382,500.00 |
EP2SGX130GF40C5NES Overview
A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon blocks such as block RAM, DSP slices, PLLs, and (in transceiver variants) multi-gigabit transceivers (MGTs). FPGAs belong to the broader category of programmable logic devices (PLDs) within the integrated circuits family. Compared to ASICs, FPGAs offer in-system reprogrammability and faster time-to-market at the cost of higher unit price and lower absolute performance-per-watt. The Stratix II GX architecture specifically extends the Stratix II family by adding 3.125 Gbps transceivers for protocols such as PCI Express, Serial RapidIO, XAUI, and Gigabit Ethernet.
Key features include 132,540 logic elements, 6.7 Mbits of on-chip RAM, 252 embedded 18x18 multipliers for DSP, 4 PLLs, and 16 global clock networks. The 1508-FBGA package exposes 734 user I/O pins organized into I/O banks that support multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL) and offer on-chip termination. The C5 speed grade, commercial extended temperature range, and lead-free / RoHS-compliant assembly suit this device to telecom, military-aero, and high-end test equipment.
Architecturally the Stratix II GX uses a row-and-column based adaptive logic module (ALM) fabric with DirectDrive and MultiTrack interconnect to reduce routing congestion and improve timing closure. Hard intellectual-property (IP) blocks including transceivers, memory interfaces, and DSP multipliers free programmable fabric for application logic, and the design entry is through the Quartus II design suite.
Typical applications include 10-Gigabit Ethernet line cards, Serial RapidIO switches, military secure-radio baseband processing, high-end medical imaging, and ASIC prototyping. Designers choose the EP2SGX130 when their design needs both high logic capacity and embedded multi-gigabit transceivers on a single die.
When designing with this device, plan for a 40x40mm PCB footprint with microvia-stack-up capable of routing the 1mm-pitch FBGA-1508 balls, and ensure decoupling capacitance of at least 1uF per power pin per Intel Stratix II GX hardware reference manual guidance. Quartus II PowerPlay early power estimation should be run before pin-out closure because the device can dissipate 15-25W in transceiver-heavy designs.
This page synthesizes drop-in alternatives in the same FBGA-1508 footprint, current distributor pricing as of 2026-09-09, and practical PCB and thermal design notes that complement the manufacturer datasheet.
Drop-in alternatives for EP2SGX130GF40C5NES — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX130GF40C5NES (same form factor and footprint) — differing in Operating Temperature, Package, RoHS Status, Transceivers, Core Voltage.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2SGX130GF1508C5
✅ Drop-In✓ In Stock
$645 / Unit
View Datasheet →EP2SGX130GF1508C4
✅ Drop-In✓ In Stock
$985 / Unit
View Datasheet →EP2SGX130GF1508I4
✅ Drop-In✓ In Stock
$2055 / Unit
View Datasheet →EP2SGX130GF1508C3
✅ Drop-In✓ In Stock
$1380 / Unit
View Datasheet →EP2SGX130GF1508C5N
✅ Drop-In✓ In Stock
$3890 / Unit
View Datasheet →EP2S130F1508C5
✅ Drop-In✓ In Stock
$345 / Unit
View Datasheet →EP2SGX130GF40C5NES Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Logic Elements | 132,540 |
| Embedded Memory | 6,747,840 bits (6.7 Mbits) |
| Embedded 18x18 Multipliers | 252 |
| Maximum User I/O | 734 |
| Package | 1508-ball FBGA, 40 x 40 mm, 1 mm pitch |
| Speed Grade | C5 |
| Operating Temperature | Commercial Extended (0C to +85C junction) |
| Transceivers | Multi-gigabit transceivers (up to 3.125 Gbps per channel) |
| PLLs | 4 |
| Global Clock Networks | 16 |
| Process Technology | 90 nm CMOS |
| Supply Voltage Core | 1.2 V (typical) |
| Mounting Type | Surface Mount |
| Lead Free / RoHS | Yes / Compliant |
EP2SGX130GF40C5NES 1508-ball fbga, 40 x 40 mm, 1 mm pitch Pin Configuration Guide
Pin configuration for EP2SGX130GF40C5NES (1508-ball fbga, 40 x 40 mm, 1 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX130GF40C5NES.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX130GF40C5NES is suitable for 6 applications: 10-Gigabit Ethernet Line Card, Serial RapidIO Switch Fabric, Military Secure-Radio Baseband, High-End Medical Imaging Back-End, ASIC Prototyping Platform, High-End Test and Measurement Instrumentation.
10-Gigabit Ethernet Line Card
The EP2SGX130GF40C5NES is well suited to 10-Gigabit Ethernet line cards because its embedded multi-gigabit transceivers operate up to 3.125 Gbps per channel and can be aggregated for the 10G XAUI interface (4x 3.125 Gbps lanes). The 132,540 logic elements plus 252 18x18 multipliers provide the fabric for MAC-layer processing, encryption engines, and traffic management without off-chip ASICs. The 6.7 Mbits of on-chip RAM is sufficient for several thousand packet descriptors. Place the FPGA between the PHY and the network processor; the 734 user I/O pins comfortably support multi-port SPI-4.2 interfaces to the NPU. Designers should use the Stratix II GX hardware reference manual XAUI reference design as the starting point to shorten development time and validate signal integrity on the 1mm-pitch FBGA.
Recommended
Serial RapidIO Switch Fabric
Serial RapidIO switches and endpoint bridges benefit from the EP2SGX130GF40C5NES because each embedded transceiver lane delivers up to 3.125 Gbps, and the GX family includes dedicated physical coding sublayer hard IP for Serial RapidIO. With 16 transceivers on this device a designer can implement an 8-port Serial RapidIO switch with non-blocking fabric. The 132K logic elements and 252 multipliers handle packet scheduling and congestion management. The 1508-FBGA exposes enough I/O for parallel RapidIO parallel-side legacy bridging. Compared to a discrete SERDES plus ASIC solution, this single-chip integration reduces BOM cost and PCB area in high-port-count switch designs, though designers should budget for 18-22W power dissipation in fully loaded switch configurations.
Recommended
Military Secure-Radio Baseband
The EP2SGX130GF40C5NES is widely deployed in military secure-radio baseband processing because the commercial-extended temperature range (0C to +85C junction) suits ground-mobile enclosures, and the 132K logic elements plus 252 DSP multipliers accelerate waveform processing such as SINCGARS, HAVE QUICK, and modern software-defined waveforms. Embedded transceivers route IF samples to digital up/down converters implemented in fabric. The 1508-FBGA package is compatible with the ruggedized PCB stack-ups used in defense electronics, and Intel/legacy Altera has long supported defense customers with extended-lifecycle contracts. For SWaP-C-constrained designs, designers often pair this FPGA with a discrete cryptographic co-processor and DDR2 memory controller implemented in fabric.
Recommended
High-End Medical Imaging Back-End
The EP2SGX130GF40C5NES serves as the image-processing back-end in CT, MRI, and ultrasound systems where its 132K logic elements and 252 18x18 multipliers deliver real-time 3D reconstruction, beamforming, and image-fusion pipelines. The multi-gigabit transceivers ingest raw RF data from front-end ADCs at lane rates up to 3.125 Gbps, while the 6.7 Mbits of block RAM serve as line buffers and filter coefficient storage. Designers choose the C5 speed grade to meet the tightest beamforming deadlines and exploit the parallel DSP fabric for FIR and Hilbert transforms. Compared to GPU-based approaches, the deterministic latency of FPGA fabric is preferred in real-time diagnostic imaging where image-stability must be guaranteed. Plan for 15-18W power dissipation and provide 1 oz copper pours on all inner layers.
Recommended
ASIC Prototyping Platform
The EP2SGX130GF40C5NES is used as a building block in multi-FPGA ASIC prototyping platforms because its 132K logic elements combined with embedded transceivers and 734 user I/O enable partitioning of large ASIC designs across multiple FPGAs. Designers map ASIC blocks into the FPGA fabric, use the MGT channels to bridge between FPGAs at 3.125 Gbps, and exercise the design at near-real-time speed before tape-out. The 1508-FBGA footprint is widely supported by prototyping vendors such as Synopsys HAPS and S2C, which offer daughter cards and pin-out adaptations for the Stratix II GX family. Quartus II incremental compile flows further accelerate bring-up. Compared to ASIC emulation systems, this approach is significantly lower cost and faster to deploy for software-driven verification.
Recommended
High-End Test and Measurement Instrumentation
The EP2SGX130GF40C5NES is deployed inside high-end oscilloscopes, logic analyzers, and protocol analyzers where its 132K logic elements implement deep acquisition memory, trigger engines, and protocol decoding. The 252 18x18 multipliers accelerate FFT and channel-equalization math for signal-integrity analysis, and the multi-gigabit transceivers capture and generate high-speed serial protocols including PCI Express, SATA, and 10G Ethernet for compliance testing. The 734 user I/O pins expose enough LVDS pairs for parallel front-end digitizers. Compared to processor-only architectures, FPGA-based processing delivers deterministic latency and the throughput required for real-time eye-diagram display. Designers should plan a 12-layer PCB stack-up to route the 1mm-pitch FBGA cleanly and isolate analog and digital ground domains.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX130GF40C5NES — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX130GF1508C5 | EP2SGX130GF1508C4 | EP2SGX130GF1508I4 | EP2S130F1508C5 |
|---|---|---|---|---|---|
| Package | 1508-FBGA (40x40mm) | 1508-FBGA (same) | 1508-FBGA (same) | 1508-FBGA (same) | 1508-FBGA (same) |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Family | Stratix II GX | Stratix II GX | Stratix II GX | Stratix II GX | Stratix II (non-GX) |
| Logic Elements | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 |
| Embedded Transceivers | Yes, up to 3.125 Gbps | Yes, up to 3.125 Gbps | Yes, up to 3.125 Gbps | Yes, up to 3.125 Gbps | No (Stratix II non-GX) |
| Embedded Memory | 6.7 Mbits | 6.7 Mbits | 6.7 Mbits | 6.7 Mbits | 6.7 Mbits |
| Speed Grade | C5 | C5 | C4 | I4 | C5 |
| Temperature Range | Commercial Extended (0C to +85C) | Commercial Extended | Commercial Extended | Industrial | Commercial Extended |
Key Differentiators
- Embedded multi-gigabit transceivers in 1508-FBGA (vs EP2S130F1508C5)
- Higher logic density within Stratix II GX family (vs EP2SGX90GF1508 series)
- Commercial-extended vs industrial temperature option (vs EP2SGX130GF1508I4)
Design Notes
The 1508-FBGA package uses 1 mm ball pitch and 40x40 mm body. Plan a 12-layer PCB with stacked microvias to fan out the inner rows; a 6-6-6 build-up is the minimum recommended. Use 1 oz copper on outer layers and 0.5 oz on inner layers to manage DC drop on the VCCINT and VCCPD rails, which together can source 15-25 A in transceiver-heavy designs.
Estimated: at 100% transceiver utilization the EP2SGX130 typically draws 15-25 W (input: 90nm CMOS core, 16 transceivers at 3.125 Gbps, 132K LEs at typical toggle rate). Use the Quartus II PowerPlay early power estimator before pin-out closure and budget for a 30W heatsink or airflow of 200 LFM. Place a 1uF X7R 0402 or 0201 decoupling cap on every VCCINT and VCCPD pin per the Stratix II GX hardware reference manual decoupling guidelines.
At commercial-extended upper limit (junction 85C) and 20W dissipation, the junction-to-ambient thermal resistance required is (85C - 55C) / 20W = 1.5 C/W with no heatsink. The FBGA-1508 has theta_JA around 12 C/W on a standard 12-layer board without airflow, so either a 25x25 mm heatsink or 200 LFM airflow is required. Place thermal vias in a 1.2 mm grid beneath the package thermal pad to pull heat into the inner copper planes.
MGT channels operating at 3.125 Gbps require AC-coupled differential traces with 100-ohm differential impedance, length-matched within 5 mils of each other, and tuned via the Stratix II GX transceiver toolkit. Keep MGT traces on the top layer over a continuous ground reference plane; vias introduce 0.5-1 dB loss per pair. Reference the AN 524 document for transceiver board-design guidelines.
Compliance Information
RoHS compliant and lead-free per Altera (now Intel) product page. AEC-Q100 not applicable because this is a programmable logic device, not an automotive-grade integrated circuit. Halogen-free status not explicitly stated in retrieved data.
