EP2SGX130GF1508C5 - Stratix II GX FPGA 6627 LABs 734 I/O 1508-FBGA | Intel
MPN: EP2SGX130GF1508C5 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $850 | $850.00 |
| 10 | $795 | $7,950.00 |
| 100 | $720 | $72,000.00 |
| 250 | $680 | $170,000.00 |
| 500 | $645 | $322,500.00 |
EP2SGX130GF1508C5 Overview
An FPGA (Field-Programmable Gate Array) is a programmable logic device built from an array of configurable logic blocks (CLBs / LEs), embedded memory, DSP blocks, and routing resources that the designer configures after manufacturing using an HDL-defined bitstream. Within the broader semiconductor hierarchy, an FPGA sits as a specialized type of programmable logic IC, above fixed-function ASICs in flexibility but typically below them in per-unit cost at high volume. The Stratix II GX specifically targets applications that demand both parallel DSP throughput and serial-link connectivity, making it part of Intel's high-performance programmable logic family alongside later Stratix IV/V/10 generations.
Key features of the EP2SGX130GF1508C5 include 132,540 LEs, 6,627 LABs, approximately 6.7 Mbits of embedded RAM, 252 embedded 18x18 multipliers, and 734 maximum user I/Os. Up to 20 full-duplex transceiver channels support data rates from 600 Mbps to 6.375 Gbps. The device is fabricated on a 90 nm process and operates on a 1.2 V core supply. Speed grade C5 denotes a commercial temperature range with a mid-tier timing performance bin.
Architecturally, the Stratix II GX uses Altera's adaptive logic module (ALM), which can be configured as either combinational logic or arithmetic functions, providing higher effective density than traditional 4-input LUT architectures. The transceiver blocks include dedicated physical coding sublayer (PCS) and physical media attachment (PMA) layers, allowing direct interface to SERDES-based standards without external PHY chips. The 1508-ball FBGA package supports the high I/O count required for memory, transceiver, and general-purpose parallel interfaces.
Typical applications include high-speed serial interface bridging, telecom baseband processing, military radar signal processing, ASIC prototyping, test and measurement equipment, and high-performance DSP accelerators. The integrated transceivers eliminate the need for external SERDES chips in many designs. When designing with this FPGA, ensure adequate power decoupling with multiple bulk and ceramic capacitors, manage JTAG configuration via the dedicated MSEL pins for the selected configuration scheme, and verify thermal management because high logic utilization combined with active transceivers can exceed 10 W of dissipation.
Drop-in alternatives for EP2SGX130GF1508C5 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX130GF1508C5 (same form factor and footprint) β differing in Package, Operating Temperature, RoHS Status, Logic Elements, Family.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2SGX130GF1508C4N
β Drop-Inβ In Stock
$118 / Unit
View Datasheet βEP2SGX130GF1508C3N
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$1395 / Unit
View Datasheet βEP2SGX130GF1508C4
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$985 / Unit
View Datasheet βEP2SGX130GF1508C3
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$1380 / Unit
View Datasheet βEP2S130F1508C5
β Drop-Inβ In Stock
$345 / Unit
View Datasheet βEP2S180F1508C5
β Drop-Inβ In Stock
$4880 / Unit
View Datasheet βEP2SGX130GF1508C5 Maximum Ratings & Electrical Characteristics
| Series | Stratix II GX |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements | 132,540 LE |
| LABs (Logic Array Blocks) | 6,627 |
| Maximum User I/Os | 734 |
| Number of Transceivers | Up to 20 |
| Transceiver Data Rate | 600 Mbps to 6.375 Gbps |
| Embedded Multipliers | 252 (18x18) |
| Core Voltage | 1.2 V |
| Process Technology | 90 nm |
| Package | 1508-ball FBGA (FineLine BGA) |
| Speed Grade | C5 (commercial, mid-tier speed) |
| Operating Temperature | Commercial (0C to +85C) |
EP2SGX130GF1508C5 1508-ball fbga (fineline bga) Pin Configuration Guide
Pin configuration for EP2SGX130GF1508C5 (1508-ball fbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX130GF1508C5.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX130GF1508C5 is suitable for 7 applications: Multi-Gigabit Serial Interface Bridging, Telecom Baseband Signal Processing, Military Radar and Signal Processing, ASIC Prototyping and Emulation, Test and Measurement Equipment, High-Performance DSP Accelerator Card, Video Broadcast and Imaging Systems.
Multi-Gigabit Serial Interface Bridging
The EP2SGX130GF1508C5 is purpose-built for bridging between high-speed serial protocols such as PCI Express, Gigabit Ethernet, XAUI, and Serial RapidIO. With up to 20 transceiver channels at 600 Mbps to 6.375 Gbps, the device can implement protocol converters, protocol-aware bridges, and custom SERDES-based interfaces without external PHY chips. The 132,540 LEs and 252 DSP blocks provide ample logic for state-machine-based protocol handling and packet processing. Place the FPGA between a host ASIC and a backplane serial link, with the on-chip PCS/PMA handling 8b/10b encoding and clock recovery. Compared to discrete SERDES plus FPGA solutions, integrating transceivers saves board space and BOM cost while reducing signal-integrity risk on high-speed serial traces.
Recommended
Telecom Baseband Signal Processing
The EP2SGX130GF1508C5 suits telecom baseband DSP applications including channel cards, base station controllers, and signal aggregation nodes. Its 252 embedded 18x18 multipliers and abundant embedded RAM enable high-throughput FFT, FIR filtering, and channel decoding in software-defined radio architectures. The 734 user I/Os support wide parallel data paths to companion ADCs, DACs, and memory. Pair with external high-speed ADCs for digital predistortion loops; the FPGA's combinational logic fabric handles the feedback computation while transceivers send corrected signals upstream. A key performance consideration: at high utilization the device can exceed 10 W, requiring thermal management via heatsink or forced airflow to maintain junction temperature within commercial limits.
Recommended
Military Radar and Signal Processing
The EP2SGX130GF1508C5 is well suited to defense radar, electronic warfare, and SIGINT applications where high logic density plus multi-gigabit I/O are required. Its 132,540 LEs and embedded DSP blocks enable real-time beamforming, pulse compression, and Doppler processing at high sample rates. The transceivers support direct connection to digital receiver chips and high-speed data recorders, while 734 user I/Os interface to legacy parallel backplane architectures. Compared to processor-only DSP solutions, this FPGA delivers deterministic latency and parallel throughput essential for phased-array beam steering. When using in rugged environments, pair with industrial-temperature companion parts and ensure the commercial-grade 0-85C junction limit is observed through adequate heatsinking.
Recommended
ASIC Prototyping and Emulation
The EP2SGX130GF1508C5 functions as an ASIC prototype platform for verifying complex SoC designs before tape-out. Its 132,540 LEs can map substantial portions of an ASIC's random logic, while 252 embedded multipliers accelerate DSP verification. Transceivers enable prototyping of high-speed serial interfaces identical to the target ASIC's SERDES. Compared to software simulation, hardware prototyping runs orders of magnitude faster, allowing full-chip validation at near-real-time speeds. Partition large ASIC designs across multiple Stratix II GX FPGAs using known techniques; the device's abundant I/Os facilitate inter-FPGA pin multiplexing. Quartus II supports multi-FPGA partitioning for designs that exceed a single chip's capacity.
Recommended
Test and Measurement Equipment
The EP2SGX130GF1508C5 is used in high-end oscilloscopes, protocol analyzers, and bit-error-rate testers where real-time data capture and pattern generation demand both logic and serial-link bandwidth. Transceivers capture multi-gigabit data streams directly, while 132,540 LEs implement triggering logic, protocol decoding, and statistical analysis. The 734 user I/Os interface to display controllers, memory subsystems, and external probe heads. Compared to ASIC-based testers, FPGA-based instruments can be reprogrammed for new protocols without board respins. Key trade-off: FPGA fabric is more expensive per logic cell than fixed ASICs at high volume, so this approach is best suited to low-volume, multi-protocol T&M equipment where flexibility dominates cost.
Recommended
High-Performance DSP Accelerator Card
The EP2SGX130GF1508C5 serves as a co-processor accelerator in HPC and signal-processing compute clusters. Its 252 embedded 18x18 multipliers and 6,627 LABs deliver high multiply-accumulate throughput for FFT, convolution, and matrix operations. Transceivers connect to host CPUs via PCI Express or Serial RapidIO links, while the parallel I/Os interface to DDR memory for high-bandwidth data streaming. Compared to GPU-based acceleration, FPGA DSP offers deterministic latency and lower power per operation for fixed-precision arithmetic. Deploy the FPGA on a standard PCIe card with external DRAM; the on-chip transceivers handle the host link without needing a separate PCIe bridge chip.
Recommended
Video Broadcast and Imaging Systems
The EP2SGX130GF1508C5 supports professional video broadcast infrastructure including format converters, video routers, and real-time image processing pipelines. Its 734 user I/Os accept multi-stream SDI inputs, while transceivers drive high-speed uplink connections to broadcast routers. 252 DSP blocks accelerate deinterlacing, scaling, and color-space conversion in real time at full 1080p60 frame rates. The 1.2 V core and 90 nm process balance logic density with power consumption suitable for broadcast chassis. Key consideration: SDI video requires dedicated clock recovery and equalization; leverage the FPGA's transceivers with external SDI transceiver companion chips for uncompressed HD-SDI and 3G-SDI interfaces.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX130GF1508C5 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX130GF1508C4N | EP2SGX130GF1508C3N | EP2S130F1508C5 | EP2S180F1508C5 |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1508-ball FBGA | 1508-ball FBGA - same | 1508-ball FBGA - same | 1508-ball FBGA - same | 1508-ball FBGA - same |
| Logic Elements | 132,540 LE | 132,540 LE (same) | 132,540 LE (same) | 132,540 LE (same) | 179,400 LE (+35%) |
| Transceivers | Up to 20 channels | Up to 20 (same) | Up to 20 (same) | 0 (Stratix II, no GX) | 0 (Stratix II, no GX) |
| Transceiver Data Rate | 600 Mbps to 6.375 Gbps | 600 Mbps to 6.375 Gbps | 600 Mbps to 6.375 Gbps | N/A (no transceivers) | N/A (no transceivers) |
| Speed Grade | C5 | C4 (slower) | C3 (slowest) | C5 (same) | C5 (same) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Same-footprint speed grade flexibility (vs EP2SGX130GF1508C4N)
- Transceiver integration versus non-GX variants (vs EP2S130F1508C5)
- Higher logic density with same package (vs EP2S180F1508C5)
Design Notes
The EP2SGX130GF1508C5 requires multiple power rails: 1.2 V core (VCC), 2.5 V/3.3 V I/O banks (VCCIO), and 1.2 V/2.5 V PLL analog supplies (VCCA_PLL, VCCD_PLL). Decoupling must include multiple bulk capacitors (47-220 uF tantalum or polymer) plus 0.1 uF and 0.01 uF ceramics placed adjacent to each power pin. Transceiver channels each draw approximately 100-150 mA from their dedicated VTTR rails; insufficient decoupling causes jitter and link errors. Estimated: with 20 active transceivers at 6.375 Gbps and 80% logic utilization, total power can reach 12-15 W - design the VRM with at least 20% margin.
At typical operating loads (12-15 W), the 1508-ball FBGA package requires active thermal management. Theta_JA for this package is approximately 12-15 C/W with proper PCB layout (full inner ground plane, thermal vias under the BGA). Without a heatsink, junction temperature rise above ambient at 15 W approaches 225 C, far exceeding the 85 C commercial limit. Attach a pin-fin or extruded heatsink with thermal interface material; alternatively use forced airflow at 200 LFM minimum. Monitor junction temperature via the on-chip ALT_VOLTAGE and ALT_TEMP sensor outputs accessible through JTAG or core logic.
PCB layout for the 1508-FBGA requires microvia technology on at least the top two signal layers; standard through vias cannot fan out the 1.0 mm ball pitch. Maintain 100 ohm differential impedance on transceiver pairs with length matching to within 150 mil. Place AC-coupling capacitors (0.01 uF) within 100 mil of the FPGA transceiver pins. Keep reference planes continuous under high-speed serial traces; stitch vias around the perimeter at 200 mil spacing to suppress edge radiation. Use the Quartus II Pin Planner early in layout to assign transceiver pins per bank before committing to stackup.
Common pitfalls with the EP2SGX130GF1508C5 include: (1) using the wrong configuration mode (select MSEL pins correctly for AS, PS, JTAG, or FPP modes); (2) failing to instantiate the ALTPLL_RECONFIG or ALTGXB_RECONFIG megafunctions during transceiver calibration, which causes link-up failures; (3) omitting the external 100 MHz reference clock with proper jitter performance (use a TCXO or OCXO with phase noise below -110 dBc/Hz at 10 kHz offset); (4) leaving unused transceiver channels powered down via the ALTGXB power-down signals to save 50-80 mA per disabled channel.
Compliance Information
RoHS/REACH status not explicitly stated in verified data; consult the original Altera product declaration document. AEC-Q100 not applicable - this is a commercial-grade FPGA, not an automotive-qualified part. Part is obsolete.
