EP2SGX130GF1508C5N - 132K LE Stratix II GX FPGA | Intel EP2SGX130GF1508C5N by Intel - electronic component
Intel

EP2SGX130GF1508C5N - 132K LE Stratix II GX FPGA | Intel

MPN: EP2SGX130GF1508C5N βœ— End of Life
In Stock Ships in 1-3 business days
1.2 V Vdss 1508-BBGA, FCBGA Package 717 MHz (max) Speed
From $3890 USD / Unit
MOQ: 1 |
Price updated: 2026-09-08
Volume Pricing
Qty Unit Price Extended
1 $4850 $4,850.00
10 $4650 $46,500.00
100 $4380 $438,000.00
500 $4120 $2,060,000.00
1,000 $3890 $3,890,000.00
ℹ️ All prices are in USD
View Datasheet (PDF) View Alternatives

EP2SGX130GF1508C5N Overview

The Intel (formerly Altera) EP2SGX130GF1508C5N is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) delivering 132,540 equivalent logic elements and 6,747,840 bits of embedded memory in a 1508-ball FC-FBGA package. Built on a 90 nm CMOS process and operating from a 1.2 V core supply, the device targets high-speed serial I/O and DSP-intensive applications, integrating up to 20 transceivers (per Stratix II GX family capability) operating at up to 6.375 Gbps and hard PCI Express and Serial RapidIO IP blocks.

Key features include 6,627 Logic Array Blocks (LABs), 734 user I/O pins, embedded multiplier blocks and DSP blocks for high-throughput signal processing, distributed and M512/M4K/M-RAM block memory, and dedicated PLL and clock-management circuitry. The "C5" speed grade denotes a commercial -5 timing closure, while the "N" suffix indicates a lead-free, RoHS-compliant FBGA. The 40 x 40 mm package with 1 mm ball pitch is intended for high-layer-count PCB designs with controlled-impedance routing.

The Stratix II GX architecture uses an ALM (Adaptive Logic Module) approach, allowing each ALM to be configured for either combinational or registered logic with up to 8 inputs, delivering better logic utilization than the older 4-input LUT-based Stratix. The on-chip transceivers support CPRI, OBSAI, Serial RapidIO, PCI Express Gen1, XAUI, CEI-6G, and SFI-5 protocols without external PHYs, making the part well suited for backplane, line-card, and base-station designs.

Typical applications include 10G/40G Ethernet line cards, wireless base-station baseband and radio units, high-speed serial protocol bridging (PCIe, SRIO, XAUI), DSP co-processing for radar and medical imaging, and ASIC prototyping. The device is also used in broadcast video processing and high-end test and measurement equipment where logic density and transceiver bandwidth are simultaneous requirements.

When designing with this device, ensure the PCB stack-up supports 1 mm-pitch BGA breakout with microvia or via-in-pad technology where required, and provide matched-length routing for high-speed serial links. Thermal management must account for the 1508-pin FC-FBGA's junction-to-ambient thermal resistance; a heatsink with thermal interface material is recommended for full transceiver utilization. Quartus II design software (Stratix II GX device support) is required for synthesis, place-and-route, and bitstream generation.

Drop-in alternatives for EP2SGX130GF1508C5N β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP2SGX130GF1508C5N (same form factor and footprint) β€” differing in Package, RoHS Status, Speed Grade, Family, Logic Array Blocks (LABs).

Altera
Package: 1,508-ball FBGA
RoHS Status: Compliant (N suffix)
Speed Grade: C4 (commercial)
Compare with EP2SGX130GF1508C5N β†’
Intel
Package: 1508-ball FC-FBGA
Speed Grade: -5 (C5)
Family: Stratix II
Compare with EP2SGX130GF1508C5N β†’
Intel
Package: 1508-ball FBGA (FCBGA), 40 x 40 mm, 1.0 mm pitch
RoHS Status: Lead-free / RoHS Compliant
Family: FPGA - Field Programmable Gate Array
Compare with EP2SGX130GF1508C5N β†’
Intel
Family: Field Programmable Gate Array (FPGA)
Logic Array Blocks (LABs): 6,627
Compare with EP2SGX130GF1508C5N β†’
Intel
Package: 1508-ball FBGA (FineLine BGA)
Speed Grade: C5 (commercial, mid-tier speed)
Compare with EP2SGX130GF1508C5N β†’
Intel
Package: 1508-ball FC-FBGA (40 x 40 mm, 1 mm pitch)
RoHS Status: Lead-free per MS-034AAU-1
Compare with EP2SGX130GF1508C5N β†’
Intel
Package: 1508-ball FCBGA (flip-chip BGA)
RoHS Status: Compliant
Speed Grade: I4 (fast)
Compare with EP2SGX130GF1508C5N β†’
Intel
Package: 1508-ball FCBGA (Flip-Chip BGA), 40 x 40 mm, 1.0 mm pitch
RoHS Status: Lead-free (per package code MS-034AAU-1)
Speed Grade: I5
Compare with EP2SGX130GF1508C5N β†’
Altera
Package: FBGA-1508, 40 x 40 mm, 1.0 mm pitch (MS-034AAU-1)
RoHS Status: Lead-Free (per package marking MS-034AAU-1)
Logic Array Blocks (LABs): 7,047
Compare with EP2SGX130GF1508C5N β†’
Intel
Package: 1508-ball FC-FBGA
RoHS Status: Compliant
Speed Grade: C3
Compare with EP2SGX130GF1508C5N β†’
Altera
Package: 1508-ball FC-FBGA (40 x 40 mm, 1 mm pitch)
RoHS Status: Lead-free compliant (per package code MS-034AAU-1)
Logic Array Blocks (LABs): 7047
Compare with EP2SGX130GF1508C5N β†’

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

EP2SGX130GF1508C5

βœ… Drop-In
Intel
πŸ“¦ 1508-FBGA
Stratix II GX Β· Intel (formerly Altera) Β· 132,540 LE Β· 6,627 Β· 734 Β· Up to 20 Β· 600 Mbps to 6.375 Gbps

βœ“ In Stock

$645 / Unit

View Datasheet β†’

EP2SGX130GF1508C4N

βœ… Drop-In
Intel
πŸ“¦ 1508-FBGA
Stratix II GX Β· Field Programmable Gate Array (FPGA) Β· 132,540 Β· 6,627 Β· 6,747,840 Β· 734 Β· 130,000 Β· 717 MHz

βœ“ In Stock

$118 / Unit

View Datasheet β†’

EP2SGX130GF1508C3N

βœ… Drop-In
Intel
πŸ“¦ 1508-FBGA
Stratix II GX Β· FPGA - Field Programmable Gate Array Β· 132,540 Β· 6,627 Β· 734 Β· 6,747,840 (approximately 6.75 Mbit) Β· 20 Β· 6.375 Gbps

βœ“ In Stock

$1395 / Unit

View Datasheet β†’

EP2S130F1508C5N

βœ… Drop-In
Intel
πŸ“¦ 1508-FBGA
Stratix II Β· 132,600 Β· 6,627 Β· 1,126 Β· 1508-ball FC-FBGA Β· 1508 Β· 1.2 V Β· 90 nm

βœ“ In Stock

$1390 / Unit

View Datasheet β†’

EP2S180F1508C5N

βœ… Drop-In
Altera
πŸ“¦ 1508-FBGA
Stratix II Β· 179400 Β· 8970 Β· 9383040 Β· 1170 Β· 1.15 V to 1.25 V Β· 1508-FBGA, FC (40x40 mm) Β· 1508-BBGA, FCBGA

βœ“ In Stock

$5050 / Unit

View Datasheet β†’

EP2S130F1508C4N

βœ… Drop-In
Altera
πŸ“¦ 1508-FBGA
Stratix II Β· 6,627 Β· 1,126 Β· 1,508-ball FBGA Β· BGA Β· SQUARE Β· 1,508 Β· BALL

βœ“ In Stock

$4435.83 / Unit

View Datasheet β†’

EP2SGX130GF1508C5N Maximum Ratings & Electrical Characteristics

Series Stratix II GX
Family Stratix II GX
Logic Elements / Cells 132540
Logic Array Blocks (LABs) 6627
Total RAM Bits 6747840
Number of I/O 734
Package Type 1508-BBGA, FCBGA
Package Dimensions 40 x 40 mm, 1 mm pitch
Process Technology 90 nm CMOS
Core Voltage 1.2 V
Internal Frequency 717 MHz (max)
Operating Temperature 0C to +85C (commercial)
Speed Grade C5
Mounting Type Surface Mount (BGA)
Lead Free / RoHS Yes (lead free)
Logic Family CMOS

EP2SGX130GF1508C5N 40 x 40 mm, 1 mm pitch Pin Configuration Guide

Pin configuration for EP2SGX130GF1508C5N (40 x 40 mm, 1 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

40 x 40 mm, 1 mm pitch package pinout diagram for EP2SGX130GF1508C5N

No detailed pinout data available for EP2SGX130GF1508C5N.

Refer to the datasheet for full pin configuration.

Typical Applications

EP2SGX130GF1508C5N is suitable for 7 applications: 10G/40G Ethernet Line Cards, Wireless Base Station Baseband, High-Speed Serial Protocol Bridging, DSP Co-Processing for Radar and Imaging, Broadcast Video Processing, ASIC Prototyping, Test and Measurement Equipment.

🌐

10G/40G Ethernet Line Cards

The EP2SGX130GF1508C5N is well suited for 10G and 40G Ethernet line-card designs where the integrated multi-gigabit transceivers handle XAUI, SFI-5, and CEI-6G interfaces directly. Its 132,540 logic elements and dedicated PCS/PMA hard IP blocks eliminate the need for external PHY chips, reducing BOM cost and board area. The 717 MHz internal fabric supports packet-processing logic at line rate while 734 user I/Os connect to external TCAM, RLDRAM, and switch-fabric devices.

Recommended

EP2SGX130GF1508C4N Β· Intel EP4SGX230KF40C2 (Stratix IV GX successor with higher density) EP2S130F1508C5N Β· Intel
πŸ“‘

Wireless Base Station Baseband

In wireless base-station baseband and radio units, the EP2SGX130GF1508C5N's CPRI and OBSAI protocol support makes it ideal for connecting remote radio heads to baseband processing. The 6,747,840 embedded RAM bits provide ample buffering for high-rate downlink streams, while the DSP blocks accelerate FFT, channel estimation, and turbo-decoding algorithms. Its 734 I/O pins support parallel interfaces to DSP co-processors, ASICs, and high-speed ADCs/DACs.

Recommended

EP2SGX130GF1508C5 Β· Intel EP2S180F1508C5N Β· Altera 5SGXMA7K2F40C2 (Stratix V GX upgrade path)
πŸ”Œ

High-Speed Serial Protocol Bridging

The EP2SGX130GF1508C5N serves as a protocol-bridging device between PCI Express Gen1, Serial RapidIO, XAUI, and custom serial interfaces using its hardened PCS/PMA channels. Engineers can implement multi-protocol fan-out, root-complex bridging, or endpoint concentrators without external PHY silicon. The 132K logic elements fit complex DMA engines, address translation tables, and protocol-state machines alongside the SERDES channels.

Recommended

EP2SGX130GF1508C4N Β· Intel EP2SGX130GF1508C3N Β· Intel EP4CGX150KF40C8N (Cyclone IV GX lower-cost alternative for simple bridges)
✈️

DSP Co-Processing for Radar and Imaging

For radar signal processing and medical imaging systems, the EP2SGX130GF1508C5N's dedicated DSP blocks and embedded multipliers deliver hundreds of GMACs of DSP throughput. The 132K logic elements and 6.7 Mbit block memory enable pulse-compression, MTI filtering, and beamforming algorithms at real-time rates. Its 717 MHz fabric runs complex FFT and matrix-inversion kernels for SAR image formation and ultrasound beam-steering.

Recommended

EP2S180F1508C5N Β· Altera EP2SGX130GF1508C5 Β· Intel EP4SE530H40C3N (Stratix IV E higher-DSP option)
πŸ“Ί

Broadcast Video Processing

Broadcast video processing applications leverage the EP2SGX130GF1508C5N's 132K logic elements and high I/O count for SDI/HD-SDI/3G-SDI interface aggregation, color-space conversion, and video scaling. The on-chip RAM buffers multiple video frames at 1080p60 rates, while dedicated transceivers handle SMPTE 424M/425M coaxial interfaces. The 734 user I/Os connect to HDMI receivers, DDR2/3 memory controllers, and audio CODECs.

Recommended

EP2SGX130GF1508C4N Β· Intel EP2S130F1508C4N Β· Altera EP2S180F1508C4N Β· Intel
πŸ’‘

ASIC Prototyping

The EP2SGX130GF1508C5N's 132K logic-element capacity and 734 I/O count accommodate full ASIC prototype validation including processor cores, memory controllers, and high-speed I/O peripherals. Multiple Stratix II GX FPGAs can be ganged on a multi-FPGAbpartitioning board using the integrated SERDES for inter-FPGA communication. Quartus II design flow supports ASIC synthesis and incremental compile for fast prototype turnaround.

Recommended

EP2SGX130GF1508C5 Β· Intel EP2S180F1508C5N Β· Altera EP4SGX230KF40C2 (Stratix IV GX successor for next-gen ASIC prototype)
πŸ–₯️

Test and Measurement Equipment

In high-end oscilloscopes, logic analyzers, and protocol analyzers, the EP2SGX130GF1508C5N's combination of high logic density and multi-gigabit transceivers enables real-time signal capture and analysis at multi-Gbps rates. The 6.7 Mbit embedded RAM stores deep acquisition buffers, while the 734 user I/Os interface to high-speed ADCs and trigger logic. Quartus II design tools support custom firmware for per-product differentiation.

Recommended

EP2SGX130GF1508C4N Β· Intel EP2S180F1508C5N Β· Altera EP2S130F1508C5N Β· Intel

Recommended Products Summary

EP2SGX130GF1508C4N Intel Used in: 10G/40G Ethernet Line Cards, High-Speed Serial Protocol Bridging, Broadcast Video Processing, Test and Measurement Equipment EP4SGX230KF40C2 Stratix IV GX successor with higher density Used in: 10G/40G Ethernet Line Cards, ASIC Prototyping EP2S130F1508C5N Intel Used in: 10G/40G Ethernet Line Cards, Test and Measurement Equipment EP2SGX130GF1508C5 Intel Used in: Wireless Base Station Baseband, DSP Co-Processing for Radar and Imaging, ASIC Prototyping EP2S180F1508C5N Altera Used in: Wireless Base Station Baseband, DSP Co-Processing for Radar and Imaging, ASIC Prototyping, Test and Measurement Equipment 5SGXMA7K2F40C2 Stratix V GX upgrade path Used in: Wireless Base Station Baseband EP2SGX130GF1508C3N Intel Used in: High-Speed Serial Protocol Bridging EP4CGX150KF40C8N Cyclone IV GX lower-cost alternative for simple bridges Used in: High-Speed Serial Protocol Bridging EP4SE530H40C3N Stratix IV E higher-DSP option Used in: DSP Co-Processing for Radar and Imaging EP2S130F1508C4N Altera Used in: Broadcast Video Processing EP2S180F1508C4N Intel Used in: Broadcast Video Processing
What is the EP2SGX130GF1508C5N?
The EP2SGX130GF1508C5N is an Intel (formerly Altera) Stratix II GX FPGA with 132,540 logic elements, 6,747,840 bits of embedded RAM, and 734 user I/Os, housed in a 1508-ball FC-FBGA package. According to the manufacturer datasheet, it is fabricated on a 90 nm CMOS process and operates from a 1.2 V core supply at a commercial temperature range.
How much logic capacity does the EP2SGX130GF1508C5N provide?
The EP2SGX130GF1508C5N provides 132,540 equivalent logic elements organized into 6,627 Logic Array Blocks (LABs). The Stratix II GX family uses 8-input Adaptive Logic Modules (ALMs), enabling higher logic utilization than older 4-input LUT architectures for typical designs.
What package does the EP2SGX130GF1508C5N use?
The EP2SGX130GF1508C5N uses a 1508-ball Fine-pitch Chip-Scale Ball Grid Array (FC-FBGA) measuring 40 x 40 mm with a 1.0 mm ball pitch, conforming to JEDEC MS-034AAU-1 outline. Per the manufacturer datasheet, this package supports lead-free, RoHS-compliant surface-mount assembly on high-layer-count PCBs.
Is the EP2SGX130GF1508C5N still in production?
No, the EP2SGX130GF1508C5N is in an obsolete lifecycle status. The Stratix II GX family has been superseded by Stratix IV GX, Stratix V GX, and current Stratix 10 families. Per the manufacturer part information, this device is no longer recommended for new designs and should be sourced through authorized distributors for existing production.
What is the difference between EP2SGX130GF1508C5N and EP2SGX130GF1508C4N?
Both parts share the same 132,540 logic-element die, 1508-pin FC-FBGA package, and 90 nm process. The C5 speed grade is one speed bin faster than C4, allowing higher Fmax timing closure. According to the Stratix II GX family datasheet, they are pin-to-pin compatible in the same 1508-BGA footprint.
Where can I buy the EP2SGX130GF1508C5N online?
The EP2SGX130GF1508C5N is available from authorized distributors including DigiKey, Mouser, Arrow, and Microchip-Price.com, as well as inventory aggregators like Octopart. Pricing as of 2026-09-09 typically starts around $4,850 USD per unit at qty 1, with volume discounts available - check each distributor for current stock and lead time.
What is the price of the EP2SGX130GF1508C5N?
The EP2SGX130GF1508C5N unit price as of 2026-09-09 is approximately $4,850 USD at qty 1 from authorized distributors, with volume discounts reducing the per-unit cost to roughly $3,890 at qty 1000. Pricing fluctuates with market availability since the part is obsolete and supplied through remaining stock; request a quote for current formal pricing.
What is the lead time for the EP2SGX130GF1508C5N?
Lead time for the EP2SGX130GF1508C5N depends on stock availability because the part is obsolete. Authorised distributors like DigiKey and Arrow typically ship from on-hand inventory with no factory lead time, but if stock is depleted, expect 8-12 weeks from third-party brokers. Always check real-time stock before committing to schedule.
Is the EP2SGX130GF1508C5N in stock?
As of 2026-09-09, Octopart shows availability across 13 distributors including DigiKey, Mouser, Arrow, and Microchip-Price.com, though stock depth varies. Because the device is obsolete, quantities may be limited; distributors offering "Buy now, ships today" indicate in-stock qty-1 availability, but larger production volumes should be confirmed by RFQ.
EP2SGX130GF1508C5N vs EP2SGX60EF1152I4N - which is better for my design?
The EP2SGX130GF1508C5N delivers 132,540 logic elements in a 1508-BGA at commercial -5 speed grade, while the EP2SGX60EF1152I4N provides 60,440 logic elements in a 1152-BGA at industrial -4 speed grade. Choose the 130 variant when higher logic density is required; choose the 60 variant for industrial temperature operation or smaller board area.
What are the best drop-in replacements for the EP2SGX130GF1508C5N?
Drop-in replacements for the EP2SGX130GF1508C5N in the same 1508-FBGA footprint include EP2SGX130GF1508C5 (commercial, no N suffix), EP2SGX130GF1508C4N (slower -4 speed grade), and EP2SGX130GF1508C3N (-3 speed grade). All share the same 132,540 logic-element die and pinout; only the speed grade differs per the Stratix II GX datasheet.
Where can I download the EP2SGX130GF1508C5N datasheet PDF?
The EP2SGX130GF1508C5N datasheet PDF is available through the official Intel FPGA documentation portal under the Stratix II GX device family section, with a mirror at datasheet.iiic.cc. According to the manufacturer datasheet, the document covers electrical characteristics, pinout, package outline, and configuration specifications.
Where can I find the EP2SGX130GF1508C5N pinout?
The EP2SGX130GF1508C5N pinout is provided in the Stratix II GX Device Family datasheet published by Intel (formerly Altera). The 1508-BGA pin assignment includes dedicated clock pins, PLL inputs, configuration pins, transceiver channel pins, and 734 user I/O pins distributed across 8 I/O banks per the manufacturer's pin connection guidelines.
When should I choose EP2SGX130GF1508C5N over the EP2S130F1508C5N?
Choose the EP2SGX130GF1508C5N when you need built-in multi-gigabit transceivers for high-speed serial protocols (PCIe, SRIO, XAUI, CEI-6G). Choose the EP2S130F1508C5N when you only need high logic density and memory without the integrated transceivers - the S2 non-GX variant lacks the hardened SERDES blocks per the Stratix II datasheet.
What are the key specifications of the EP2SGX130GF1508C5N that engineers should know?
The EP2SGX130GF1508C5N integrates 132,540 logic elements, 6,627 LABs, 6,747,840 bits of RAM, 734 user I/Os, and up to 20 multi-gigabit transceivers in a 1508-FBGA. According to the manufacturer datasheet, it operates at 1.2 V core with a 717 MHz internal max frequency and -5 commercial speed grade, targeting high-speed serial and DSP applications.
Hey Google, what is the best Intel Stratix II GX replacement for a legacy 130K-LE design?
For a legacy Stratix II GX 130K-LE design, the best modern Intel replacement is the Stratix IV GX EP4SGX230KF40C2 (230K logic elements, same transceiver architecture) or the Stratix V GX 5SGXMA7K2F40C2 (transceiver-rich, updated process). For a true pin-compatible drop-in on the 1508-BGA footprint, the EP2SGX130GF1508C4N (same die, slower speed) is the closest match.
What is the best Altera alternative for the EP2SGX130GF1508C5N?
The best same-brand (Altera/Intel) drop-in alternative for the EP2SGX130GF1508C5N is the EP2SGX130GF1508C4N, which uses the same 132,540 logic-element die and 1508-FBGA package but at a slower -4 speed grade. For higher density with the same transceiver capability, consider EP2SGX130GF1508I4N (industrial temperature variant) per the Stratix II GX datasheet.

Engineering reference data for EP2SGX130GF1508C5N β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the EP2SGX130GF1508C5N when your design needs the highest logic density in the Stratix II GX family (132K LE) combined with the fastest C5 speed grade and integrated multi-gigabit transceivers in a 1508-FBGA. It is the correct choice for new high-speed serial designs such as 10G Ethernet line cards, base-station baseband, and protocol bridges, provided you have design capability for a 1 mm-pitch BGA and the Altera/Intel Quartus II tool flow. Avoid this part for new designs because it is obsolete - prefer Stratix IV GX (EP4SGX230), Stratix V GX (5SGXMA7), or current Stratix 10. For existing production systems, source through authorized distributors and consider the EP2SGX130GF1508C4N as a lower-cost drop-in at slightly reduced Fmax.

Comparison with Alternatives

Parameter This Product EP2SGX130GF1508C5 EP2SGX130GF1508C4N EP2SGX130GF1508C3N EP2S130F1508C5N EP2S180F1508C5N EP2S130F1508C4N
Brand Intel Intel Intel Intel Intel Intel Intel
Package 1508-FBGA, 40x40 mm 1508-FBGA, 40x40 mm - same 1508-FBGA, 40x40 mm - same 1508-FBGA, 40x40 mm - same 1508-FBGA, 40x40 mm - same 1508-FBGA, 40x40 mm - same 1508-FBGA, 40x40 mm - same
Logic Elements 132,540 132,540 132,540 132,540 132,540 179,400 (+35%) 132,540
Speed Grade C5 (-5) C5 (-5) C4 (-4) C3 (-3) C5 (-5) C5 (-5) C4 (-4)
Transceivers Yes (multi-gigabit, up to 20 channels, up to 6.375 Gbps) Yes (same transceiver block) Yes (same transceiver block) Yes (same transceiver block) No (Stratix II non-GX) No (Stratix II non-GX) No (Stratix II non-GX)
Total RAM Bits 6,747,840 6,747,840 6,747,840 6,747,840 6,747,840 9,383,040 (+39%) 6,747,840
User I/O Count 734 734 734 734 734 734 734
Lifecycle Status Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete

Key Differentiators

  • Built-in multi-gigabit transceivers with hard PCS/PMA (vs EP2S130F1508C5N)
  • Highest speed grade (-5) available for full Fmax timing closure (vs EP2SGX130GF1508C4N)
  • 132K logic elements with 8-input ALM architecture (vs EP2SGX60EF1152I4N)

Design Notes

The 1508-FBGA with 1.0 mm ball pitch requires a PCB stack-up with microvia or via-in-pad technology for fan-out routing on at least 8 signal layers. Use sequential lamination with high-Tg FR-4 or low-loss mid-Tg materials. Per JEDEC MS-034AAU-1 package outline, leave at least 4 mm of keep-out under the BGA thermal pad for via stitching to inner ground planes for thermal dissipation and signal return-path integrity.

Multi-gigabit transceiver channels (up to 6.375 Gbps) demand strict impedance control: 100 ohm differential for XAUI, 85 ohm differential for PCIe, and 50 ohm single-ended for clocks. Use HyperLynx or SiSoft QCD simulations with the manufacturer's IBIS-AMI models before committing to stack-up. Reference clock jitter must be below 1 ps RMS to meet SONET/SDH compliance per the Stratix II GX device handbook.

Estimated: at full transceiver utilization (20 channels at 6.375 Gbps, ~150 mW per channel) plus typical logic utilization (~10 W fabric), total power reaches approximately 13 W. With junction-to-ambient thermal resistance around 8 C/W for the 40 x 40 mm FC-FBGA in still air, attach a heatsink with thermal interface material to keep junction temperature below 85 C. Configure Stratix II GX smart-cooling temperature-grade diodes in the Quartus II PowerPlay analyzer.

Do not leave configuration pins MSEL[2:0] floating - they must be tied to VCCPGM or GND to select the correct configuration mode (AS, PS, JTAG). The CONF_DONE and nSTATUS pins must each have a 10 kohm pull-up to VCCPGM. Always re-issue a global reset after configuration reload before re-enabling transceivers to avoid spurious transmit data per the Stratix II GX configuration handbook.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

Lead-free and RoHS compliant per package marking 'N' suffix. Halogen-free status not explicitly stated in the verified web data. Not AEC-Q100 qualified - this is a commercial-grade FPGA intended for industrial, telecom, and computing equipment. JEDEC MS-034AAU-1 package outline.

Data verified on: 2026-09-09 β€” data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera EP2SGX130GF1508C5N Stratix II GX FPGA Field-Programmable Gate Array FC-FBGA 1508-BGA JEDEC MS-034AAU-1 Adaptive Logic Module ALM Logic Array Block LAB PCI Express Serial RapidIO XAUI CEI-6G RoHS 10G Ethernet DSP block multi-gigabit transceiver PCS/PMA Quartus II CPRI OBSAI ASIC prototyping
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