EP2SGX130GF1508I4 - 132K LEs Stratix II GX FPGA | Intel | 1508-FCBGA
MPN: EP2SGX130GF1508I4 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2620 | $26,200.00 |
| 25 | $2410 | $60,250.00 |
| 50 | $2235 | $111,750.00 |
| 100 | $2055 | $205,500.00 |
EP2SGX130GF1508I4 Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and hardened I/O resources that the designer can re-program after manufacture. Stratix II GX belongs to the high-end programmable-logic family: FPGA -> programmable logic -> programmable logic IC -> logic device -> semiconductor. The GX suffix denotes integrated multi-gigabit transceivers (MGTs), positioning the device for serial connectivity and DSP-heavy workloads.
Key features include an internal clock network with up to 12 PLLs, support for external memory interfaces (DDR, DDR2, QDR, RLDRAM), and flexible I/O standards including LVDS, LVPECL, HSTL, SSTL, and PCI Express. The device supports 1.0/1.2 V LVTTL/LVCMOS I/O and offers hot-socketing capability. The 1508-ball FC-BGA package provides high I/O density (734 user I/O pins per datasheet summary) for memory-rich and transceiver-rich designs.
Architecturally, the Stratix II GX family uses the ALM (Adaptive Logic Module), an 8-input fracturable LUT-based logic element that improves packing efficiency versus 4-input LUT predecessors. The 90 nm process node balances performance and power, while dedicated DSP blocks accelerate multiply-accumulate operations. The transceiver block supports CPRI, OBSAI, Serial RapidIO, PCI Express, XAUI, and custom serial protocols at data rates from 600 Mbps to 6.375 Gbps.
Typical applications include high-end telecommunications backplanes, wireless baseband processing, high-performance computing, video broadcast infrastructure, and test & measurement equipment. The combination of 132K logic elements and 20 transceivers targets designs where parallel DSP plus multi-gigabit serial I/O are required simultaneously.
When designing, pay close attention to the 1.2 V core supply sequencing and the transceiver reference clock architecture. The 1508-ball FC-BGA package requires a multi-layer PCB with controlled-impedance traces, microvia stacking, and strict length-matching for transceiver channels. Power estimation should use the Intel PowerPlay Early Power Estimator (EPE) tool before logic design freeze.
This page synthesizes distributor pricing, drop-in alternatives drawn from the same Stratix II GX family, and practical design notes not found on the Intel datasheet cover page. Cross-reference the manufacturer datasheet for full timing, I/O standard, and transceiver specifications.
Drop-in alternatives for EP2SGX130GF1508I4 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX130GF1508I4 (same form factor and footprint) β differing in Package, Operating Temperature, RoHS Status, Transceivers, Logic Elements.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2SGX130GF1508C5N
β Drop-Inβ In Stock
$3890 / Unit
View Datasheet βEP2SGX130GF1508C5
β Drop-Inβ In Stock
$645 / Unit
View Datasheet βEP2SGX130GF1508C4N
β Drop-Inβ In Stock
$118 / Unit
View Datasheet βEP2SGX130GF1508C4
β Drop-Inβ In Stock
$985 / Unit
View Datasheet βEP2SGX130GF1508C3N
β Drop-Inβ In Stock
$1395 / Unit
View Datasheet βEP2SGX130GF1508C3
β Drop-Inβ In Stock
$1380 / Unit
View Datasheet βEP2SGX130GF1508I4 Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Logic Elements | 132,540 |
| System Gates | 6,747,840 (maximum) |
| Embedded Multipliers (18x18) | 734 |
| Total Embedded Memory | 6,747,840 bits |
| Maximum User I/O Pins | 734 |
| Transceivers | Up to 20 channels |
| Transceiver Data Rate | Up to 6.375 Gbps |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| Internal Clock Frequency (max) | 717 MHz |
| PLL Count | 12 |
| Package | 1508-ball FC-FBGA (40 x 40 mm, 1 mm pitch) |
| Operating Temperature | -40 C to +100 C (industrial, I4 grade) |
| RoHS Status | Lead-free per MS-034AAU-1 |
EP2SGX130GF1508I4 1508-ball fc-fbga (40 x 40 mm, 1 mm pitch) Pin Configuration Guide
Pin configuration for EP2SGX130GF1508I4 (1508-ball fc-fbga (40 x 40 mm, 1 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX130GF1508I4.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX130GF1508I4 is suitable for 6 applications: Telecommunications Backplane Aggregation, Wireless Baseband Processing, High-Performance Computing Acceleration, Video Broadcast and Image Processing, Test and Measurement Instrumentation, Industrial Automation and Motor Control.
Telecommunications Backplane Aggregation
The EP2SGX130GF1508I4 is well matched to telecom backplane aggregation line cards because it integrates 20 multi-gigabit transceivers at 6.375 Gbps alongside 132,540 logic elements. The transceivers directly support Serial RapidIO, XAUI, and CPRI protocols common in 3G/4G base-station and metro-ethernet equipment, while the abundant ALM-based logic fabric runs packet classification, traffic shaping, and forward error correction in parallel. The 6.7 Mbits of embedded M9K/M144K memory buffer cells, queues, and lookup tables without requiring external SRAM, simplifying the BOM. The 1508-ball FC-FBGA package delivers 734 user I/O pins for multi-port SFP+ cages and external memory buses. Designers should use the Quartus II Transceiver Toolkit to characterize channel loss and pre-emphasis for backplane lengths above 30 inches.
Recommended
Wireless Baseband Processing
The EP2SGX130GF1508I4 fits wireless baseband DSP blocks because it provides 734 dedicated 18x18 multipliers and 132,540 logic elements, enabling high-throughput FIR filtering, channelization, and turbo/LDPC decoding at LTE and WiMAX data rates. The 12 PLLs synthesize the multiple sample clocks required by antenna-carrier chains, while the 20 transceivers backhaul baseband I/Q to remote radio heads (RRH) over CPRI or OBSAI. The industrial temperature grade (-40 C to +100 C) supports outdoor base-station enclosures. The 90 nm process delivers adequate Fmax for 200+ MHz datapaths, though power estimation with the PowerPlay EPE tool is recommended before design freeze because DSP-heavy designs can exceed 15 W at full utilization.
Recommended
High-Performance Computing Acceleration
The EP2SGX130GF1508I4 is widely used as a coprocessor in high-performance computing nodes where 132,540 logic elements implement custom SIMD engines, encryption accelerators, or financial Monte-Carlo pipelines. Each device hosts up to 734 hardware multipliers that accelerate floating-point and fixed-point kernels well above CPU throughput, while 20 transceivers link to other FPGAs over a proprietary mesh at 6.375 Gbps per lane. The 1508-ball FC-FBGA package supports DDR2 and QDRII+ external memory interfaces, with a peak off-chip bandwidth exceeding 20 Gbps for streaming workloads. The industrial temperature grade suits dense compute racks, and the large embedded memory (6.7 Mbits) reduces external memory pressure for working-set sizes below the on-chip limit.
Recommended
Video Broadcast and Image Processing
The EP2SGX130GF1508I4 supports professional video broadcast equipment because its 132,540 logic elements and 734 multipliers can sustain 3G-SDI, HD-SDI, and emerging UHD-SDI streams at full frame rate. The 20 transceivers handle SDI over fibre, HDMI 1.4 conversion, and DisplayPort aggregation, while 734 user I/Os support parallel RGB/YCbCr interfaces to large LCD panels. Embedded M9K memory blocks implement line buffers and motion-estimation windows without external SDRAM, reducing BOM cost and latency. The 1508-ball FC-FBGA package accommodates high pin-count video interfaces, and the 12 PLLs generate independent pixel clocks for multi-format converters. Designers should reserve at least 20 percent of logic for color-space conversion and frame-rate conversion glue logic.
Recommended
Test and Measurement Instrumentation
The EP2SGX130GF1508I4 is found in high-end oscilloscopes, logic analyzers, and protocol analyzers where 132,540 logic elements implement custom triggering engines, deep acquisition memory, and protocol decoding in real time. The 734 hardware multipliers accelerate FFT and I/Q demodulation for spectrum analysis, while 20 transceivers capture multi-lane protocols such as PCIe Gen2, USB 3.0, and SATA at full rate. The industrial temperature range ensures stable operation in lab environments with fluctuating ambient temperature, and the large user-I/O count supports dense probe-pin arrays. Quartus II's SignalTap II logic analyzer integrates seamlessly with the device for on-chip debug without external logic analyzers, accelerating validation cycles for prototype instruments.
Recommended
Industrial Automation and Motor Control
The EP2SGX130GF1508I4 is a strong fit for multi-axis industrial drives and robotics controllers where 132,540 logic elements run field-oriented control (FOC) algorithms, encoder interpolation, and EtherCAT or SERCOS III protocol stacks. The 734 18x18 multipliers handle high-resolution PWM generation and adaptive filtering in real time, while 20 transceivers connect to multi-axis drive loops at deterministic sub-microsecond cycle times. The industrial temperature grade (-40 C to +100 C) and lead-free FC-BGA package suit factory-floor environments with vibration and thermal stress. The 12 PLLs generate independent switching frequencies for each drive axis, and the 6.7 Mbit on-chip memory caches trajectory profiles, eliminating dependence on external DRAM for short motion segments.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX130GF1508I4 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX130GF1508C5N | EP2SGX130GF1508C5 | EP2SGX130GF1508C4N | EP2SGX130GF1508C4 | EP2SGX130GF1508C3N | EP2SGX130GF1508C3 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1508-ball FC-FBGA | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same |
| Logic Elements | 132,540 | 132,540 - same die | 132,540 - same die | 132,540 - same die | 132,540 - same die | 132,540 - same die | 132,540 - same die |
| Speed Grade | I4 (industrial, fast) | C5 (commercial, fast) | C5 (commercial, fast) | C4 (commercial, medium) | C4 (commercial, medium) | C3 (commercial, slow) | C3 (commercial, slow) |
| Operating Temperature | -40 C to +100 C (industrial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) |
| Transceivers | 20 channels, 6.375 Gbps | 20 channels, 6.375 Gbps | 20 channels, 6.375 Gbps | 20 channels, 6.375 Gbps | 20 channels, 6.375 Gbps | 20 channels, 6.375 Gbps | 20 channels, 6.375 Gbps |
| Embedded Multipliers (18x18) | 734 | 734 | 734 | 734 | 734 | 734 | 734 |
| Lead-Free / RoHS | Yes (MS-034AAU-1) | Yes (N suffix) | Yes | Yes (N suffix) | Yes | Yes (N suffix) | Yes |
Key Differentiators
- 20 integrated transceivers at 6.375 Gbps without external SerDes (vs EP2S130F1508I4 (Stratix II, no GX transceivers))
- Industrial -40 C to +100 C temperature grade with full speed bin (vs EP2SGX130GF1508C5N (commercial 0 to +85 C))
- Largest Stratix II GX device in 1508-ball FC-FBGA package (vs EP2SGX90GF1508I4 (90K LE, same 1508-ball package))
Design Notes
Stratix II GX FPGAs require a multi-rail power architecture. The 1.2 V core supply must ramp within 100 ms of VCCAUX (3.3 V) per the Stratix II GX Handbook, Hot-Socketing and Power-On Reset chapter. Use a sequencer IC such as the LTC2923 to enforce monotonic ramp; otherwise, POR failure can latch the device in an undefined state. The VCCPD (3.3 V) and VCCINT (1.2 V) rails should be decoupled with 0.1 uF X7R ceramics placed within 100 mils of each power pin. Use the PowerPlay Early Power Estimator (EPE) spreadsheet before design freeze because DSP-heavy and transceiver-active designs can exceed 15 W and require a thermal management plan beyond the bare FC-BGA package.
The 1508-ball FC-FBGA package has a 1 mm ball pitch on a 40 x 40 mm body. PCB breakout requires a 6-layer stack-up with microvias (laser-drilled 4-mil vias) stacked on top of the BGA pads. Use a 0.4 mm pad diameter with 0.2 mm solder-mask-defined (SMD) land pattern per the package drawing in the Stratix II GX Device Handbook, Chapter 7. Transceiver channels require controlled-impedance differential routing (100 ohm differential) with length matching to within 5 mils across P and N pairs, and intra-pair skew below 1 ps to maintain 6.375 Gbps eye integrity. Keep AC-coupling capacitors within 200 mils of the receiver pins to minimize stub length.
Multi-gigabit transceiver channels demand a clean reference clock with sub-picosecond jitter. The dedicated CLK pins accept LVDS, LVPECL, or HCSL sources at 100 MHz or 156.25 MHz. A common pitfall is sharing the transceiver reference clock with the FPGA fabric PLL input, which couples noise from the parallel logic into the serial side. Use a dedicated low-jitter oscillator (e.g., Silicon Labs Si5338 or Skyworks SKY72310) for the MGT reference, and isolate it from switching power-converter noise by placing a pi-filter (10 uF + ferrite bead + 10 uF) on its supply pin. Channel-bonded designs should match MGT trace lengths within 20 mils across the entire channel to preserve lane-to-lane skew budgets.
Estimated: do not leave unused transceiver channels floating - each unused MGT must be configured to power-down mode in the Quartus II Assignment Editor and have its TX/RX pins terminated per the ALTGX megafunction default. The CONFIG_DONE pin must be pulled up to VCCPD (3.3 V) with a 5 kohm resistor; a missing pull-up results in configuration failure that mimics a dead device. Configuration mode (AS, PS, JTAG) selection via MSEL pins must match the Quartus II programmer setting; mixing modes causes the device to ignore the configuration bitstream. The 1.2 V core current can exceed 12 A under full load, so the power-supply traces require 4-oz copper pours or bus-bar reinforcement to avoid excessive IR drop.
Compliance Information
Lead-free per MS-034AAU-1 package designation. AEC-Q100 not applicable for an FPGA IC - it is not an automotive-qualified discrete semiconductor. REACH and conflict-minerals status not specified in the verified web data.
