EP2SGX130GF40I4GA - Stratix II GX FPGA, 132K LE, 1508-FCBGA | Intel
MPN: EP2SGX130GF40I4GA ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4850 | $4,850.00 |
| 10 | $4500 | $45,000.00 |
| 100 | $4150 | $415,000.00 |
| 250 | $3850 | $962,500.00 |
| 500 | $3600 | $1,800,000.00 |
EP2SGX130GF40I4GA Overview
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) within the broader integrated circuit hierarchy (programmable logic -> semiconductor -> IC) that allows designers to configure hardware functionality after manufacturing. FPGAs sit between ASICs and general-purpose processors in the design flexibility/performance trade-off, offering hardware-timed parallelism, reconfigurability, and high-speed I/O without the NRE cost of an ASIC. The Stratix II GX family is positioned as a high-performance transceiver-enabled tier above the logic-only Stratix II family.
Key features include 132,540 logic elements organized into 6,627 Logic Array Blocks (LABs), 734 dedicated input pins and 734 dedicated output pins, 6.7 Mbits of embedded RAM, embedded DSP blocks, and 1.00 mm ball pitch for the FCBGA-1508 package. The device integrates up to 20 transceivers that support PCI Express, Serial RapidIO, XAUI, and other high-speed serial standards. Industrial temperature grade (-40C to +100C ambient) supports deployment in harsh environments beyond commercial-grade parts.
Architecturally, the Stratix II GX uses Altera's adaptive logic module (ALM) architecture, which replaces the traditional 4-input LUT with an 8-input fracturable LUT, yielding higher logic utilization and faster clocking networks. Multi-gigabit transceivers feature clock-data recovery, transmit pre-emphasis, and receive equalization to maintain signal integrity over backplane and cable channels at multi-gigabit data rates.
Typical applications include high-end telecommunications line cards, broadcast video routers, military radar signal processing, ASIC prototyping, and PCI Express endpoint cards. The integrated transceivers also suit Fibre Channel switches, Serial RapidIO bridges, and 10 Gigabit Ethernet MAC implementations in networking line cards.
When designing with this device, ensure the PCB has matched-length differential routing for the transceiver channels and a solid reference plane under the BGA footprint for power delivery. Plan FPGA configuration carefully - the device requires a configuration device or JTAG chain for in-system programming, and thermal management at industrial temperatures is critical given the FCBGA package's thermal resistance.
This page synthesizes distributor inventory, same-package Stratix II GX drop-in alternatives, and practical design guidance not available in the manufacturer datasheet alone.
Drop-in alternatives for EP2SGX130GF40I4GA — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX130GF40I4GA (same form factor and footprint) — differing in Package, RoHS Status, Family, Package Type, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2SGX130GF1508I4N
✅ Drop-In✓ In Stock
$2050 / Unit
View Datasheet →EP2SGX130GF1508I4
✅ Drop-In✓ In Stock
$2055 / Unit
View Datasheet →EP2SGX130GF1508I5N
✅ Drop-In✓ In Stock
$372 / Unit
View Datasheet →EP2SGX130GF1508C5N
✅ Drop-In✓ In Stock
$3890 / Unit
View Datasheet →EP2SGX130GF1508C4N
✅ Drop-In✓ In Stock
$118 / Unit
View Datasheet →EP2SGX130GF1508C4
✅ Drop-In✓ In Stock
$985 / Unit
View Datasheet →EP2SGX130GF1508C3N
✅ Drop-In✓ In Stock
$1395 / Unit
View Datasheet →EP2SGX130GF40I4GA Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Logic Elements | 132,540 |
| Logic Array Blocks (LABs) | 6,627 |
| Total Memory Bits | 6,747,840 |
| Dedicated Input Pins | 734 |
| Dedicated Output Pins | 734 |
| Transceivers | Up to 20 (multi-gigabit, 600 Mbps to 6.375 Gbps) |
| Process Technology | 90 nm |
| Package | 1508-ball FCBGA (Fine-pitch Ball Grid Array) |
| Ball Pitch | 1.00 mm |
| Operating Temperature Grade | Industrial |
| Configuration Method | JTAG or Altera configuration device |
| Mounting Type | Surface Mount |
EP2SGX130GF40I4GA Pin Configuration
| Pin 1 | GXB_RX_CH0_P — Transceiver channel 0 receive positive (ball position per datasheet pin table) |
| Pin 2 | GXB_RX_CH0_N — Transceiver channel 0 receive negative |
| Pin 3 | GXB_TX_CH0_P — Transceiver channel 0 transmit positive |
| Pin 4 | GXB_TX_CH0_N — Transceiver channel 0 transmit negative |
| Pin 5 | REFCLK_P — Transceiver reference clock positive |
| Pin 6 | REFCLK_N — Transceiver reference clock negative |
| Pin 7 | VCC — Core supply voltage |
| Pin 8 | VCCA — Transceiver analog supply |
| Pin 9 | VCCIO — I/O supply voltage |
| Pin 10 | GND — Common ground |
| Pin 11 | IO_BANK_1A — I/O bank 1A pin (representative) |
| Pin 12 | IO_BANK_1B — I/O bank 1B pin (representative) |
| Pin 13 | IO_BANK_2A — I/O bank 2A pin (representative) |
| Pin 14 | IO_BANK_2B — I/O bank 2B pin (representative) |
| Pin 15 | TCK — JTAG test clock |
| Pin 16 | TMS — JTAG test mode select |
| Pin 17 | TDI — JTAG test data in |
| Pin 18 | TDO — JTAG test data out |
| Pin 19 | nCONFIG — Configuration control (active low) |
| Pin 20 | nSTATUS — Configuration status (active low) |
| Pin 21 | DCLK — Configuration clock |
| Pin 22 | DATA0 — Configuration data input |
| Pin 23 | CONF_DONE — Configuration done indicator |
| Pin 24 | MSEL0 — Configuration mode select 0 |
| Pin 25 | MSEL1 — Configuration mode select 1 |
| Pin 26 | MSEL2 — Configuration mode select 2 |
| Pin 27 | DEV_OE — Device-wide output enable |
| Pin 28 | DEV_CLRn — Device-wide clear (active low) |
| Pin 29 | CLK0 — Dedicated clock input 0 |
| Pin 30 | CLK1 — Dedicated clock input 1 |
Typical Applications
EP2SGX130GF40I4GA is suitable for 7 applications: 10 Gigabit Ethernet Line Cards, PCI Express Endpoint Cards, Serial RapidIO Switches, Broadcast Video Routing Switchers, ASIC Prototyping Platforms, Fibre Channel Switches, Radar Signal Processing.
10 Gigabit Ethernet Line Cards
The EP2SGX130GF40I4GA's 20 multi-gigabit transceivers operating at 6.375 Gbps support four XAUI (4x3.125 Gbps) or two XGMII interfaces directly, eliminating external PHY chips. Its 132,540 logic elements implement MAC, PCS, and switch fabric logic at line rate. Industrial temperature grade suits telecom central office deployments. Reference design: Altera 10GbE MAC reference design.
Recommended
PCI Express Endpoint Cards
The EP2SGX130GF40I4GA integrates hard PCI Express IP blocks supporting Gen1 (2.5 Gbps) and Gen2 (5 Gbps) with x1/x4/x8 lane configurations. The 6.7 Mbits of embedded RAM handle packet buffering at line rate without external memory for short payloads. Designers implement DMA engines, MSI-X, and BAR mapping in fabric logic. Industrial temperature grade fits server backplane deployments.
Recommended
Serial RapidIO Switches
The EP2SGX130GF40I4GA's transceivers support Serial RapidIO at 1.25, 2.5, 3.125, and 5 Gbps with hard PCS support, enabling embedded computing backplane switches. Its high logic density (132,540 LE) implements multi-port switch logic and DMA bridges for DSP farms. Industrial temperature grade is required for military/aerospace embedded systems per VITA standards.
Recommended
Broadcast Video Routing Switchers
The EP2SGX130GF40I4GA's high logic density and integrated transceivers support SDI (Serial Digital Interface) routers, video format converters, and uncompressed HD-SDI routing matrices. Transceivers handle 270 Mbps, 1.485 Gbps, and 3 Gbps SDI rates natively. Embedded RAM buffers enable line-rate switching without dropped frames. Industrial temperature grade suits studio and outside-broadcast deployments.
Recommended
ASIC Prototyping Platforms
The EP2SGX130GF40I4GA's 132,540 logic elements can prototype large ASIC designs before tape-out, with industrial temperature grade matching target ASIC operating conditions. The 1508-ball FCBGA package supports high I/O count required for ASIC verification. Multi-gigabit transceivers emulate ASIC SerDes channels directly. Quartus II software supports ASIC prototype bring-up and incremental compilation.
Recommended
Fibre Channel Switches
The EP2SGX130GF40I4GA supports 1G/2G/4G Fibre Channel rates natively through its integrated transceivers, enabling storage area network switches with embedded FC stack logic. Its 6.7 Mbits of embedded RAM buffer FC frames at line rate. Industrial temperature grade suits enterprise SAN environments. Altera's FC reference design supports FCP, FC-SP, and FC-SCSI protocols.
Recommended
Radar Signal Processing
The EP2SGX130GF40I4GA's DSP blocks handle radar baseband processing, FFTs, pulse compression, and CFAR detection at multi-hundred MHz clock rates. Transceivers digitize IF signals at 1-4 Gsps from external ADCs. Industrial temperature grade meets MIL-STD-810 environmental requirements. Embedded RAM accumulates coherent integration buffers for SAR and phased-array processing.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX130GF40I4GA — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX130GF1508I4N | EP2SGX130GF1508I5N | EP2SGX130GF1508C5N | EP2SGX130GF1508C3N |
|---|---|---|---|---|---|
| Package | 1508-ball FCBGA, 1.00 mm pitch | 1508-ball FCBGA - same | 1508-ball FCBGA - same | 1508-ball FCBGA - same | 1508-ball FCBGA - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Logic Elements | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 |
| Logic Array Blocks (LABs) | 6,627 | 6,627 | 6,627 | 6,627 | 6,627 |
| Total Memory Bits | 6,747,840 | 6,747,840 | 6,747,840 | 6,747,840 | 6,747,840 |
| Transceivers | Up to 20 (600 Mbps to 6.375 Gbps) | Up to 20 (same) | Up to 20 (same) | Up to 20 (same) | Up to 20 (same) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | 4 | 4 | 5 (slower timing) | 5 (slower timing) | 3 (faster timing) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Industrial temperature grade with 20 multi-gigabit transceivers (vs EP2SGX130GF1508C5N)
- Identical drop-in compatibility within Stratix II GX family (vs EP2SGX130GF1508I4N)
- Speed grade 4 balances performance and yield (vs EP2SGX130GF1508C3N)
Design Notes
The 1508-ball FCBGA package requires a PCB with microvia (HDI) stack-up because the 1.00 mm ball pitch exceeds standard 0.8 mm via pitch capabilities. Use a 1-2-1 or 2-2-2 stack-up with 0.1 mm laser-drilled microvias at the BGA fanout. Maintain a continuous reference plane (GND) under the entire BGA footprint to provide a low-impedance return path for transceiver and I/O signals. Decoupling capacitors must be placed directly under the BGA footprint on the opposite PCB side.
Multi-gigabit transceiver channels require matched-length differential routing (within 5 mils intra-pair, 50 mils inter-pair) with 100 ohm differential impedance. Use stripline or microstrip with continuous GND reference. Add AC-coupling capacitors (typically 100 nF) at the transmitter output for transceivers interfacing with external connectors. Route transceiver channels away from noisy power regions and isolate analog PLL supply pins (VCCA_PLL) with ferrite beads and local decoupling.
Do not confuse the GF40 (1.00 mm pitch) variant with other Stratix II GX 1508-ball variants that use different pitch or speed grades. Verify the exact MPN suffix before ordering - speed grade 5 parts are slower than grade 4, and grade 3 parts are faster. Quartus II software must be version-matched to the silicon revision for proper timing analysis. Configuration schemes differ between JTAG-only, fast passive parallel (FPP), and passive serial (PS) modes - MSEL pin strapping selects the mode and must match the board's configuration device.
Estimated: The 1508-ball FCBGA at industrial temperature grade with 20 transceivers running at full speed can dissipate 15-20 W depending on toggle rate. The FCBGA thermal resistance (theta_JB) is approximately 0.5 C/W with a properly designed PCB thermal via array (9 vias per package, 0.3 mm drill). A heatsink with thermal interface material is required for industrial temperature deployments to keep junction temperature below 100C. Use thermal simulation to validate your specific airflow and enclosure conditions.
Compliance Information
Lead-free per GA suffix in MPN. RoHS compliance confirmed by Element14 listing. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC. Halogen-free status not explicitly stated in the provided data.
